JP2821733B2 - Manufacturing method of flat wiring body - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a flat wiring body used as an electric wiring material, wherein a wiring pattern composed of one or a plurality of narrow conductive wires is sandwiched between a pair of insulating films. The present invention relates to a method for manufacturing a flat wiring body.

[0002]

2. Description of the Related Art As a method for manufacturing such a flat wiring body, the present applicant has previously proposed a method as disclosed in Japanese Patent Application Laid-Open No. 6-68722. This method is illustrated in FIG.
As shown in FIG. 1, first, a conductor foil b is laminated on a carrier tape a via an adhesive layer, and only the conductor foil b is punched along a predetermined wiring pattern so as not to divide the carrier tape a. Are separated and divided into a wiring pattern portion c and a remaining conductor portion d which is a non-wiring portion other than the wiring pattern portion c. Next, of the conductor foil b on the carrier tape a,
Only the conductor remaining material portion d is peeled and removed so that only the wiring pattern portion c remains on the carrier tape a. By laminating a first insulating tape (not shown) having an adhesive layer on the carrier tape (a), the bonding force of the adhesive layer of the first insulating tape is superior to the bonding force of the adhesive layer of the carrier tape (a). Based on the wiring pattern c
Is transferred to the first insulating tape, and then the carrier tape a is wound up. Thereafter, a second insulating tape (not shown) having the same adhesive layer as the first insulating tape is laminated on the first insulating tape to which the wiring pattern portion c has been transferred, and a laminate including the wiring pattern portion is included. Is formed, and the outer shape is punched as necessary to obtain a flat wiring body.

If the carrier tape is not firmly held in a flat state in the above-mentioned conductor remaining material removing step, the wiring pattern may be pulled and peeled off. Japanese Patent Application Laid-Open No. 7-6640 proposes a method in which the rear surface of the carrier tape is vacuum-adsorbed to securely hold the carrier tape in a planar state, and the conductor remaining material portion is peeled off in this state.

[0004]

However, in the proposed method, the conductor remaining material portion d is formed by the wiring pattern portion a.
(See Fig. 17)
At the time of peeling, it is necessary to receive a relatively large adhesive resistance from the adhesive layer on the carrier tape side, and it is necessary to pull and peel the above-mentioned conductor remaining material portion with a relatively large tensile force against this adhesive resistance. For this reason, the conductor residual material portion may be broken at an intermediate position, and the carrier tape itself, which is vacuum-adsorbed by the tensile force, may be lifted. In addition, since such an adhesive resistance and a tensile force act on the peeling position of the conductor remaining material portion, the conductor remaining material portion is bent at an acute angle at the peeling position and plastic deformation occurs.
For this reason, there is a possibility that the remaining conductor portion may be broken at the peeling position, and if such a break occurs, the production line will be stopped. Furthermore, since the conductor residual material portion is warped or distorted due to the plastic deformation described above, when the collected conductor residual material portion is accumulated, the conductor residual material portion in the accumulated state is bulky and squeezes it. Compression is required. For this reason, an extra step for the compaction is required.

[0005] Here, since the adhesive strength of the above-mentioned adhesive layer decreases as it is heated, it is conceivable that the carrier tape is heated to reduce the adhesive resistance when the conductor remaining material is peeled off. Then, at the same time, the wiring pattern portion is also easily peeled more than the limit, and the wiring pattern portion is also peeled due to slight contact with the peeling of the remaining conductor material portion.

On the other hand, in the step of transferring the wiring pattern portion c to the first insulating tape, it is necessary to surely adhere the two to each other to prevent air bubbles from being enclosed between the two.

The present invention has been made in view of such circumstances, and it is an object of the present invention to ensure that only a wiring pattern portion is adhered to an insulating tape in a transfer step while a remaining conductor portion is connected to a wiring. The purpose is to ensure separation from the pattern portion and facilitate its removal.

[0008]

In order to achieve the above object, the invention according to claim 1 comprises a step of laminating a conductor foil, a step of punching, a step of removing a first conductor residual material portion, and a step of laminating an insulating tape. And a transfer step.
Here, the transfer step includes a step of bonding the wiring pattern portion to the insulating tape and a step of peeling and removing the carrier tape and the like. Then, in the conductor foil laminating step, a conductor foil is laminated on one side of the carrier tape via an adhesive layer. The laminated conductor foil is subjected to the wiring pattern portion and the entirety of the wiring pattern portion in the punching step. Along the boundary of each other so as to be separated into a first conductor remaining material portion in a region larger than the region surrounding the first conductor remaining portion and a second conductor remaining material portion excluding both the first conductor remaining material portion and the wiring pattern portion. Then, a cut is punched and formed only in the conductor foil so that the carrier tape is not divided. In the conductor foil after the punching step, only the first conductor remaining material portion is separated from the carrier tape in the first conductor remaining material removing step, and the first conductor remaining material portion is removed in the insulating tape laminating step. An insulating tape with an adhesive layer is overlapped on the removed carrier tape so that the adhesive layer and the conductive foil are in contact with each other to form a laminate. Then, in the step of adhering the wiring pattern portion in the transfer step, at least a region corresponding to the wiring pattern portion of the laminate is heated and pressed, and only the wiring pattern portion is adhered to the insulating tape. .

In the above configuration, in the punching step, the conductive foil is laminated with the wiring pattern portion and the first conductive residual material on the conductive foil laminated on the carrier tape through the adhesive layer in the conductive foil laminating step. A cut that separates and partitions the portion and the second conductor remaining material portion is punched and formed along the boundary between each other.
At this time, the cut is made only in the conductor foil, and the carrier tape itself is not divided, and functions as a carrier of the conductor foil portion partitioned into the wiring pattern portion and the like. Next, the first conductor remaining material portion is peeled and removed in the first conductor remaining material portion removing step, so that only the wiring pattern portion exists in a region larger than the region surrounding the entire wiring pattern portion.
At this time, the entire remaining conductor portion other than the wiring pattern portion is not peeled off, but only the first conductor remaining material portion having a relatively small area around the wiring pattern portion which is divided into first and second portions is separated. As a result, the adhesive resistance received from the adhesive layer of the carrier tape is also significantly reduced as compared with the case where the entire conductor remaining material is peeled off, and it is possible to easily peel off with a relatively small tensile force corresponding thereto. Become.

Then, an insulating tape is laminated via an adhesive layer on the wiring pattern portion and the second conductor remaining material portion on the carrier tape by an insulating tape laminating step. In addition, the second conductor remaining portion is sandwiched between the adhesive layer on the carrier tape side and the adhesive layer on the insulating tape side. In this state, the adhesive layer in the region corresponding to the wiring pattern portion is heated and pressed in the bonding step of the wiring pattern portion in the transfer process, so that only the wiring pattern portion is on the insulating tape side. While the adhesive layer is firmly adhered, the adhesive layer in contact with the second conductor remaining material remains in a solid state at room temperature, so that the second conductor remaining material is merely in contact with the insulating tape. Is maintained. That is, since the conductor foil portion other than the wiring pattern portion is removed in the region surrounding the wiring pattern portion in the first conductor remaining material portion removing step, the adhesive layer in the region corresponding to the wiring pattern portion is heated and pressed. Even if this is done, the conductor foil portion other than the wiring pattern portion will not be bonded to the insulating tape. Therefore, in the transfer step, generally, in the step of removing the carrier tape and the step of removing the second conductor residual material part performed after the step of bonding the wiring pattern part, the second step is performed while keeping the wiring pattern part integral with the insulating tape. The two conductor remaining materials are easily peeled and removed.

According to a second aspect of the present invention, the first conductor remaining material portion punched in the punching step in the first aspect of the present invention surrounds a region slightly larger than a region surrounding the entire wiring pattern portion. It is configured to have a shape.

In the case of the above configuration, since the first conductor remaining material portion punched in the punching step has a substantially contour shape surrounding a region slightly larger than the region surrounding the entire wiring pattern portion, In the first conductor residual material removing step, the area of the first conductor residual material removed and removed is minimized, and the adhesive resistance accompanying peeling is also minimized. In addition, since the remaining conductor portion is reliably removed from the conductive foil existing in the range of heating and pressing in the bonding process of the wiring pattern portion in the transfer process, the target to be bonded by the heating and pressing is only the wiring pattern portion. It becomes possible.

According to a third aspect of the present invention, in the first aspect of the present invention, the step of bonding the wiring pattern portion in the transfer step uses a heating plate having a shape corresponding to a region surrounding the entire wiring pattern portion. In this configuration, the board is pressed against the back surface of the insulating tape or carrier tape corresponding to the position of the wiring pattern, and the wiring pattern is bonded to the insulating tape.

In the above configuration, in the bonding step, the object to be bonded by heating and pressing from the wiring pattern portion and the second conductor remaining material portion interposed between the carrier tape and the insulating tape is securely wired. With only the pattern portion, it is possible to easily realize the non-adhesion of the second conductor remaining material portion without fail.

According to a fourth aspect of the present invention, in the first aspect of the present invention, the step of bonding the wiring pattern portion in the transferring step includes positioning the entire laminate including the wiring pattern portion in the chamber, In a reduced pressure state, and heating and pressurizing under the reduced pressure state.

In the case of the above configuration, the laminate is placed in a chamber in a predetermined reduced pressure state, and the laminate is heated and pressed in this state. Air bubbles are surely prevented from entering the boundary between the adhesive layer and the adhesive layer, and the wiring pattern portion and the insulating tape are securely adhered over the entire surface of the wiring pattern portion.

According to a fifth aspect of the present invention, the transfer step in the first aspect of the present invention is performed such that after the wiring pattern part bonding step of bonding only the wiring pattern part to the insulating tape, the laminate is peeled to the outer surface on the carrier tape side. The method includes a step of separating the carrier tape by separating the carrier tape from the laminate at an acute angle while pressing the bar.

In the case of the above configuration, since the carrier tape is separated at a steep angle by the peeling bar, the carrier tape can be easily and reliably peeled from the insulating tape. Prior to the separation of the carrier tape, the outer surface side of the carrier tape of the laminate is pressed against, for example, a heater roller or the like to weaken the adhesive force of the adhesive layer of the carrier tape by heating with the heater roller. The removal of the second conductor remaining material portion can be performed more easily.

According to a sixth aspect of the present invention, in the invention of the fifth aspect, a carrier tape peeling step of peeling the carrier tape in the laminate from the insulating tape, and a second conductor for removing the second conductor remaining material portion The remaining material portion removing step is sequentially performed.

In the case of the above configuration, the carrier tape in the laminate after the wiring pattern portion is adhered to the insulating tape is peeled off from the insulating tape in the carrier tape peeling step. The accompanying second conductor remaining material portion is removed from the insulating tape in the second conductor remaining material portion removing step. As a result, an insulating tape in which only the wiring pattern portion is adhered is obtained, and the transfer of the wiring pattern portion is completed. In addition, all the conductive foil is removed from the carrier tape, and the carrier tape can be reused.

According to a seventh aspect of the present invention, in the fifth aspect of the present invention, a separation step of simultaneously removing the carrier tape and removing the second conductor remaining material from the laminate to which the wiring pattern is adhered is performed. Configuration.

In the above configuration, in the separation step performed after the wiring pattern portion bonding step, the carrier tape is separated from the laminated body at an acute angle so that the carrier tape is peeled off from the insulating tape, On the other hand, the second conductor remaining material that is not adhered and hard to be bent is easily peeled off and removed. For example, if the carrier tape is separated downward at a steep angle, the separated second conductor remaining material portion falls down naturally and is automatically removed. When the carrier tape is to be separated upward at a steep angle, the separated second conductor remaining material portion may be removed. As a result, by both the wiring pattern part bonding step and the separation step, an insulating tape in which only the wiring pattern part is bonded is obtained, and the transfer step of the wiring pattern part is completed. The foil is removed, allowing the carrier tape to be reused.

According to an eighth aspect of the present invention, in the seventh aspect of the present invention, the carrier tape or the laminated body is fed forward by a predetermined one unit size in the moving direction, and a punching step and a first conductor remaining material removing step are performed. And the wiring pattern portion bonding step is performed in a state where the carrier tape or the laminate is temporarily stopped, and the separation step is performed by moving the laminate forward in the moving direction via a continuous feeding mechanism after the wiring pattern portion bonding step. This is done while continuously sending out to the user.

In the case of the above configuration, the carrier tape or the laminate is intermittently fed, and the punching step, the first conductor remaining material removing step, and the wiring pattern part bonding step temporarily store the carrier tape or the laminate. Since each step is performed in a stopped state, each step is reliably performed. Moreover, in the separation step, since the laminate is continuously fed by the continuous feeding mechanism, the carrier tape is peeled off, the second conductor remaining material is removed, and the insulating tape to which the wiring pattern is adhered is taken off. Are continuously performed, thereby improving the efficiency of the separation process and simplifying the apparatus.

According to a ninth aspect of the present invention, in the transfer step of the first aspect of the present invention, after the wiring pattern portion bonding step of bonding only the wiring pattern portion to the insulating tape, the second conductor remaining material portion is formed on the carrier tape. The carrier tape is peeled off from the laminated body in a state where the carrier tape is adhered, and then the second conductor remaining material portion is removed from the carrier tape by pressing the peeling bar against the outer surface of the carrier tape and bending the carrier tape at an acute angle. It is configured to include steps.

In the case of the above configuration, since the step of removing the second conductor residue is performed in a step different from the step of peeling the carrier tape, some trouble occurs in the step of removing the second conductor residue. Even if it occurs, it can be processed without affecting each step in the previous main line. Moreover, since the second conductor remaining material portion is adhered to the peeled carrier tape, the step of removing the second conductor remaining material portion is performed by, for example, heating the separated carrier tape. Can be performed after the adhesive force has been weakened. Therefore, the step of removing the second conductor remaining material portion can be reliably performed.

[0027]

Embodiments of the present invention will be described below with reference to the drawings.

<First Embodiment> FIG. 1 shows a manufacturing apparatus for carrying out a method for manufacturing a flat wiring body according to a first embodiment of the present invention, and reference numeral 10 denotes a conductor foil laminating step of performing a conductor foil laminating step P1. Means, 20 is a half-cut press for performing a punching step P2, 30 is a first conductor residual material removing means for performing a first conductive residual material removing step P3, and 40 is a first insulating material for performing a first insulating tape laminating step P4. Tape laminating means, 50 is a wiring pattern part bonding means for performing a wiring pattern part bonding step P5, 6
0 is a carrier tape peeling means for performing a carrier tape peeling step P6, 70 is a second conductor residual material removing means for performing a second conductor residual material removing step P7, and 80 is a second insulating material for performing a second insulating tape laminating step P8. Tape laminating means 90 is an outer shape punching machine for performing an outer shape punching step P9. The wiring pattern part bonding step P5, the carrier tape peeling step P6, the second
The transfer step according to claims 1 and 5 and 6 is constituted by the conductor residual material portion removing step P7. Hereinafter, for each of the processes P1 to P9, the configuration of the means 10 to 90 to be used and the contents of the processes P1 to P9 performed using these components will be described.

(Conductor Foil Laminating Step P1) The conductor foil laminating means 10 includes a drum 11 around which a long carrier tape 1 is wound, an adhesive layer forming machine 12, and a metal having excellent conductivity such as copper foil. And a drum 13 on which a conductive foil 2 elongated in a predetermined width by a material is wound. In the conductor foil laminating step P1, first, the carrier tape 1 is intermittently supplied from the drum 11 at a predetermined pitch in the direction of arrow A, and the supplied carrier tape 1 is adhered to the carrier tape 1 by the adhesive layer forming machine 12. An adhesive is applied on the upper surface, which is one surface of the carrier tape 1, as shown in detail in FIG.
To form Next, the adhesive layer 1a of the carrier tape 1
Then, the conductive foil 2 is supplied from the drum 13, and the conductive foil 2 is laminated as shown in FIG. 3 and the conductive foil 2 is adhered to the adhesive layer 1 a.

(Punching Step P2) The half-cut press machine 20 includes a punching blade (not shown) of a predetermined shape such as a Victoria blade (big blade).
2, every time the carrier tape 1 on which the conductor foil 2 is laminated is intermittently fed, the punching blade is lowered by a predetermined amount to punch only the conductor foil 2 laminated on the carrier tape 1. Then, a cut corresponding to the punching blade is made in the conductive foil 2 without dividing the carrier tape 1.
Then, due to the cuts made in the punching step P2, the conductor foil 2 forms a wiring pattern portion 21, a first conductor remaining material portion 22, and two second conductor remaining material portions 23a as shown in detail in FIG. , 23b (hereinafter, also collectively referred to as 23) and a positioning mark portion 24.

The wiring pattern portion 21 is a single unit of a plurality of (three in the illustrated example) narrow conductive wires 25, 25,..., And the first conductor remaining material portion 22 is formed of one unit. A residual material portion between the conductive wires between the adjacent conductive wires 25 of the wiring pattern portion 21 and a circumferential residual material portion surrounding the entire periphery of the unit wiring pattern portion 21 with the same width as the residual material portion between the conductive wires. And a remaining material portion surrounding the periphery of the positioning mark portion 24 are continuous and continuous. That is, the first conductor remaining material portion 22 has a substantially contour shape surrounding the entire wiring pattern portion 21 and the positioning mark portion 24.
In addition, the first conductor remaining material portion 22 is continuous with the other first conductor remaining material portion 22 surrounding the other adjacent wiring pattern portion 21 and the connecting portion 22a to form a series. Extension portions 22b and 22c are integrally formed for each first conductor remaining material portion 22, and the extension portions 22 on both sides in the width direction are formed.
b, 22c, the two second conductor residual material portions 23a, 2c
3b.

(First conductor residual material removing step P3)
As shown in detail in FIG.
A vacuum suction plate 31 for sucking the carrier tape 1 and holding the carrier tape 1 in a planar state; a heater 32 for heating the carrier tape 1 via the vacuum suction plate 31; A pair of clamp mechanisms 33, 33 disposed at each downstream position for intermittently feeding the carrier tape 1, and a bar-shaped pulley 34 disposed at a predetermined position above the vacuum suction plate 31; Peeled first
There is provided a pair of drive pulleys 35, 35 for holding the conductor remaining material portion 22 from the front and back surfaces and applying a predetermined tensile force in the peeling direction. In FIG. 5, the thicknesses of the carrier tape 1, the conductor foil 2, and the like are greatly exaggerated.
This is the same in FIGS. 8, 9, 11, and the like.

The vacuum suction plate 31 is made of a material having good heat conductivity in the form of a flat plate having substantially the same width as the carrier tape 1 and a predetermined length. On the upper surface of the vacuum suction plate 31, a lattice-shaped concave groove (not shown) and a large number of suction holes 31a, 31a,. Thereby, the back surface of the carrier tape 1 on the vacuum suction plate 31 is sucked and fixed in a planar state. The suction force of the blower is set to be larger than the adhesion force of the adhesive layer 1a to the first conductor remaining portion 22.

In the first conductor residual material removing step P3, first, the conductor foil laminated carrier tape 1 intermittently fed in the feed direction A is fixed in position by the clamp mechanisms 33, 33 on both sides. By driving the pair of driving pulleys 35 in a state where the vacuum suction plate 31 is operated to hold the carrier tape in a flat state and the adhesive layer 1a (see FIG. 3) is heated by the heater 32 to reduce the adhesive force. As shown in FIG. 6, a series of the first conductor remaining material portions 22, 22,... Are peeled from the carrier tape 1. In accordance with this peeling, the first conductor remaining material portion 22 after peeling is moved as shown by a one-dot chain line and a two-dot chain line in FIG.
3 and the wiring pattern portions 21, 21,... And the second conductor remaining material portion 23 on the carrier tape 1 as shown in FIG.
, and the positioning marks 24, 24,... are sent to the next step P4 in a state where the positioning marks 24, 24,. During the period from this step P3 to the next step P4, the wiring pattern portions 21 and
The carrier tape 1 on which 1, 2, etc. are adhered is turned upside down, and is sent to the next step P4 with the carrier tape 1 positioned on the upper side.

(First Insulating Tape Laminating Step P4)
The insulating tape laminating means 40 includes, as shown in detail in FIG.
A drum 41 around which a long first insulating tape 3 made of a polyethylene terephthalate film or the like is wound, and guide rollers 42, 42. The first insulating tape 3
Is made of a polyethylene terephthalate film or the like, and a hot melt layer 3a (see FIG. 9) in a solid state at room temperature is laminated on one surface thereof as an adhesive layer. Then, the first insulating tape laminating step P4
Then, the first insulating tape 3 is supplied from the drum 41,
The first insulating tape 3 and the carrier tape 1 sent from the previous step P3 are laminated. At this time, the wiring pattern portions 21, 21,... And the second conductor remaining material portions 23a, 23b,.
Are laminated between the hot melt layer 3a on the first insulating tape 3 side and the adhesive layer 1a on the carrier tape 1 side to form a laminated tape 4 as a laminated body.

(Wiring Pattern Part Bonding Step P5) As shown in FIG. 8, the wiring pattern part bonding means 50 includes a lower heating plate 53 supported by air cylinders 51 and 51 so as to be vertically movable with respect to a gantry 52. An upper heating plate 54 is provided so as to be vertically opposed to the lower heating plate 53 with the laminated tape 4 interposed therebetween.

As shown in FIG. 10, the lower heating plate 53
A heater 55 and a heater 55 that covers the upper surface of the heater 55
And a heat transfer plate 57 whose lower surface is in contact with the heater 55 and whose upper surface protrudes upward through the heat insulating plate 56. . The heat transfer plate 57 includes a first heat transfer plate 57a having a shape substantially matching the entire shape of the wiring pattern portion 21 and a second heat transfer plate 57b having a shape matching the shape of the positioning mark portion 24.
These are made of a material having good heat conductivity and are formed thicker than the heat insulating plate 56. The first and second heat transfer plates 57a and 57b are fitted into the heat insulating plate 56 and positioned. Further, as shown in FIG. 11, the upper heating plate 54 includes a heater 58,
The heater 58 is formed of a heat-resistant material such as a silicon material.
And a cushion plate 58a disposed on the lower surface of the. Then, when the predetermined positioning mark 24 of the laminated tape 4 is detected by the optical detector 59 (see FIG. 8), the laminated tape 4 is fixed in position by the clamp mechanism 100. The first
The heat transfer plate 57a is positioned below the wiring pattern portion 21 of the laminated tape 4, and the second heat transfer plate 57b is positioned
, Respectively.

In the wiring pattern portion bonding step P5, the laminated tape 4 is fed in the feed direction A, the predetermined positioning mark 24 is detected by the optical detector 59, and the position of the laminated tape 4 is fixed by the clamp mechanism 101. It is started by being done. Then, the lower heating plate 53 is moved upward from the lower position by the operation of the air cylinders 51, 51 to transfer the laminated tape 4 to the heat transfer plate 57 and the cushion plate 58 a of the upper heating plate 54.
Then, heating is performed at a predetermined temperature (for example, about 140 to 170 ° C. by a lower hot platen, and, for example, about 100 ° C. even for an upper hot platen) in this state. Thereby, only the area of the hot melt layer 3a of the first insulating tape 3 of the laminated tape 4 that covers the wiring pattern portion 21 and the positioning mark 24 is heated and pressed, and only the wiring pattern portion 21 and the positioning mark 24 are heated. Is adhered to the first insulating tape 3. At this time, the wiring pattern 2
1 and the positioning mark 24, that is, since the thermal effect on the second conductor remaining material portion 23 is blocked by the heat insulating plate 56, the hot melt layer 3 a in the region covering the second conductor remaining material portion 23 is removed. First insulating tape 3 without melting
Is maintained in a non-adhered state.

(Carrier Tape Peeling Step P 6) The carrier tape peeling means 60 is arranged with a flat heating plate 61 having substantially the same width as the carrier tape 1, and with a predetermined vertical interval above the heating plate 61. Peeling bar 62 and a collecting mechanism 6 for continuously collecting the peeled carrier tape 1
3 is provided.

In the carrier tape peeling step P6, the laminated tape 4 is intermittently fed after the wiring pattern part bonding step P5, and the hot plate 61 heats the adhesive layer 1a on the carrier tape 1 side with the hot plate 61. Decrease adhesive strength.
As a result, the laminated tape 4 is separated from the wiring pattern portion 21 and the second conductor remaining material portion 23 by the carrier tape 1 being separated at a sharp angle at the corner of the peeling bar 62, and the first tape is removed.
The wiring pattern portion 21 is laminated on the insulating tape 3 and the second conductor remaining material portion 23 is laminated without being adhered.

(Second conductor remaining material removing step P7) The second conductor remaining material removing means 70
A guide roller 71 for bending the first insulating tape 3 downward at a steep angle at a downstream position of the first tape 0, and a drum 7 for winding the first insulating tape 3 with the wiring pattern portion 21 adhered thereto
2 and a collection container 73 for collecting the second conductor remaining material portion 23. Then, the second conductor remaining material portion removing step P7 includes:
With the feeding movement of the laminated tape 4 after the completion of the carrier tape peeling step P6, the first insulating tape 3 is bent by the guide roller 71 and is placed on the first tape 3 in a non-adhered state. The two-conductor residual material portion 23 is dropped into the collection container 73 and collected.

(Second Insulating Tape Laminating Step P8) The second insulating tape laminating means 80 is a drum 81 around which the second insulating tape 5 having the same configuration as the first insulating tape 3 is wound (see FIG. 1).
And two pairs of upper and lower pressure rollers 82a, 82b, 82a, 8
2b, in the second insulating tape laminating step P8, while supplying the first insulating tape 3 wound from the drum 72 in the second conductor residual material removing step P7,
The second insulating tape 5 is supplied from the drum 81, and the hot melt layer of the second insulating tape 5 is opposed to the hot melt layer 3a of the first insulating tape 3 to which the wiring pattern portion 21 is adhered. The first and second insulating tapes 3 and 5 are adhered to each other and laminated with the wiring pattern portion 21 interposed therebetween while heating and passing between the pressure bonding rollers 82a and 82b.

(Outer Punching Step P9) Outer Punching Step P
9, the first and second insulating tapes 3 and 5 laminated in the above-described process P8 are punched into an outer shape corresponding to one unit wiring pattern portion 21 interposed therein by the outer shape punching machine 90, and finally Form a flat wiring body as a product.

(Operation by the manufacturing method of the first embodiment)
Effect) In the case of the manufacturing method according to each of the above steps P1 to P9,
The conductor foil 2 is connected to the wiring pattern portion 21 by the punching process P2.
And a first conductor remaining material portion 22 and a second conductor remaining material portion 23. That is, the conductor remaining material portion other than the wiring pattern portion 21 is divided into the first and second conductor remaining material portions 22. , 2
3, and the first conductor remaining material portion 22 around the wiring pattern portion 21 is removed before the wiring pattern portion bonding step P5 to the first insulating tape 3 among the two divided portions. The second conductor remaining portion 23 is removed after the wiring pattern portion bonding step P5.

Therefore, at the stage before the wiring pattern portion bonding step P5, the remaining conductor portion between the conductors 25 of the wiring pattern portion 21 is removed, and the wiring pattern portion bonding step P5 is performed. Even if the hot melt layer 3a in the entire area corresponding to the pattern portion 21 is heated and pressurized, the first insulating tape is surely applied only to the necessary portions such as the wiring pattern portion 21 without bonding the second conductor remaining material portion 23. 3 can be adhered. Then, in the wiring pattern portion bonding step P5, the second conductor remaining material portion 23 can be reliably maintained in a non-bonded state, and before the second conductor remaining material portion removing process P7, the second conductor remaining material portion 23 is removed. Since 23 is simply placed on the first insulating tape 3, the removal of the second conductor remaining material portion 23 in the second conductor remaining material portion removing step P7 is also easy and reliable. In addition, the carrier tape peeling process P
In No. 6, the carrier tape 1 is peeled off while being separated at a steep angle, so that the second conductor remaining material portion 23 is placed on the first insulating tape 3 while maintaining the planar state. Since the second conductor remaining material portion removing step P7 is performed while the tape 3 is being bent, the second conductor remaining material portion 23 is collected in the collection container 73 while maintaining the previous planar state, and is compactly integrated without being bulky. be able to. In addition, at this stage, since the wiring pattern portion 21 is securely bonded to the first insulating tape 3, the second conductor remaining material portion 2
Disturbance such as displacement of the wiring pattern portion 21 due to the removal of 3 can be reliably prevented.

On the other hand, the first conductor remaining material portion 22 punched in the punching step P2 has a substantially contoured shape surrounding a slightly enlarged region around the entire wiring pattern portion 21.
In the above-mentioned wiring pattern part bonding step P5, while satisfying the requirement of eliminating an extra conductor remaining material part in a region surrounding the entire wiring pattern part 21, the first conductor remaining material part removing step P3 removes and removes. The area of one conductor remaining material portion 22 can be minimized. For this reason, the first conductive remaining material portion 22 is separated from the adhesive layer 1a of the carrier tape 1 by the peeling.
The adhesive resistance force received from the conductive material can be greatly reduced as compared with the conventional case in which the entire conductor remaining material portion is peeled, and the peeling can be easily performed with a significantly smaller tensile force than the conventional case. In addition, the heating temperature for the adhesive layer 1a can be lowered corresponding to the above-mentioned peeling area, and the possibility of adverse effects such as co-peeling of the wiring pattern portion 21 can be eliminated.

<Second Embodiment> FIG. 12 shows a second embodiment of the present invention.
1 shows a manufacturing apparatus for performing a method for manufacturing a flat wiring body according to an embodiment, 110 is a conductor foil laminating means for performing a conductor foil laminating step P11, 120 is a half-cut press machine for performing a punching step P12, and 130 is a first cut-off press. A first conductor remaining material portion removing means for performing a conductor remaining material portion removing step P13, 140 is a masking means for performing a masking process P14, and 150 is a first masking means.
The first insulating tape laminating means for performing the insulating tape laminating step P15, the wiring pattern part bonding means 160 for performing the wiring pattern part bonding step P16, and the separating step P17 for separating the carrier tape and removing the second conductor residual material part Is a separating means. Then, as shown in FIG. 1, the second insulating tape laminating means 80 applies the second insulating tape to the first insulating tape 3 wound on the drum 176 of the separating means 170 and to which the wiring pattern portion 21 is adhered. The tape laminating step P8 is performed, and the contour punching step P9 is performed by the contour punching machine 90. Wiring pattern part bonding step P16
And the separation step P17, the transfer step according to claim 1 or claim 5 or 7 is constituted. Hereinafter, for each of the steps P11 to P17, means 110 to 170 to be used are used.
And each of steps P11 to P17 performed by using these components
Will be described. The following description is based on the wiring pattern portion 21 having the same shape as that of the first embodiment (FIG. 4).
Reference).

In the second embodiment, a conductor foil laminating step P11, a punching step P12, a first conductor residual material removing step P13, and a first insulating tape laminating step P15
In the conductor foil laminating step P in the first embodiment.
1. The punching step P2, the first conductor remaining material portion removing step P3, and the first insulating tape laminating step P4 are performed in the same manner as the masking step P1 before the wiring pattern part bonding step P16.
4, the wiring pattern part bonding step P16 is performed in a vacuum suction atmosphere, and the separation of the carrier tape and the removal of the second conductor remaining material part are simultaneously performed in the separation step P17. Therefore, the conductor foil laminating step P11, the punching step P12, the first conductor residual material portion removing step P13, and the first insulating tape laminating step P15 will be briefly described, and those having the same configuration as the first embodiment will be described. First
The same reference numerals as those in the embodiment denote the same parts, and a detailed description thereof will be omitted.

(Conductor Foil Laminating Step P11) The conductor foil laminating means 110 is used for the drum 1 on which the carrier tape 1 is wound.
1, an adhesive layer forming machine 12, a drum 13 around which the conductive foil 2 is wound, and a sizing feed device 14. And
In the conductor foil laminating step P11, first, the carrier tape 1 is intermittently supplied from the drum 11 in the direction of arrow A by a predetermined one-feed unit dimension by the operation of the sizing feeder 14, and the supplied carrier is supplied. An adhesive is applied to the tape 1 by the adhesive layer forming machine 12 to form an adhesive layer 1a (see FIG. 2) on the upper surface of the carrier tape 1. Next, the conductive foil 2 is supplied from the drum 13 to the adhesive layer 1a of the carrier tape 1, the conductive foil 2 is laminated, and the conductive foil 2 is adhered to the adhesive layer 1a (see FIG. 3). .

(Punching Step P12) The half-cut press machine 120 includes a punching blade (not shown) having a predetermined shape such as a Victoria blade (big blade). In the punching step P12, the conductor foils 2 are laminated. Carrier tape 1
Each time the sheet is intermittently fed, the punching blade is lowered by a predetermined amount so that the conductor foil 2 laminated on the carrier tape 1
Is cut out, and a cut corresponding to the punching blade is made in the conductive foil 2 without dividing the carrier tape 1. Due to the cut, the conductor foil 2 is divided into a wiring pattern portion 21 (see FIG. 4), a first conductor remaining material portion 22,
The second conductor remaining material portions 23a and 23b and the positioning mark portion 24 are separated from each other.

(First conductor remaining material removing step P13) The first conductor remaining material removing means 130 has the same configuration as the first conductor remaining material removing means 30 in the first embodiment. A vacuum suction plate 31 (see FIG. 5) for vacuum-sucking and holding the carrier tape 1 in a flat state, a heater 32 for heating the carrier tape 1, a pair of clamp mechanisms 33 for fixing the position of the carrier tape 1 intermittently fed, 33, a bar-shaped pulley 34, and a pair of drive pulleys 35, 35 for applying a predetermined tensile force to the first conductor remaining material portion 22 in the peeling direction.

In the first conductor remaining material removing step P13, first, the conductor foil laminated carrier tape 1 intermittently fed in the feeding direction A is fixed in position by the clamp mechanisms 33, 33 on both sides, and then. By driving the pair of driving pulleys 35 in a state where the vacuum suction plate 31 is operated to hold the carrier tape in a flat state and the adhesive layer 1a (see FIG. 3) is heated by the heater 32 to reduce the adhesive force. A series of first conductor remaining portions 22, 22,... Are peeled from the carrier tape 1 (see FIG. 6). According to this peeling, the first conductor remaining material portion 22
Move to actuate the detection sensor 36 (see FIG. 5) to complete the present process P13. On the carrier tape 1, the wiring pattern portions 21, 21,... (See FIG. 7) and the second conductor remaining material portion 23a, 23b, ..., positioning marks 24, 2
Are separated from the first conductor remaining material portions 22, 22,
The next process P1 is separated from each other by a width corresponding to.
4

(Masking Step P14) The masking means 140 includes a masking tape holder (not shown) containing a large number of masking tapes cut to a predetermined length, and a masking tape holder for the wiring pattern portion 21 on the carrier tape 1. A moving mechanism (not shown) for moving the masking tape one by one to the connection site by moving the masking tape to the connection site. Then, in the masking step P14, a masking tape is attached to the connection portion of the wiring pattern portion 21. The sticking of the masking tape is performed in order to facilitate connection work by brazing to other wiring by peeling off the masking tape when assembling a flat wiring body as a product. In addition, the masking means 140, together with the transfer means 160 described later, corresponds to the fixed-size feeding of the carrier tape 1 or the laminated tape 4 by a predetermined fixed-size feeding length along the carrier tape 1 or the laminated tape 4. Reciprocating movement is possible.

(First Insulating Tape Laminating Step P15) The first insulating tape laminating means 150 includes a drum 41 around which the first insulating tape 3 is wound and a guide roller 42, as shown in FIG. The drum 41 and the guide roller 42 are supported by a pedestal 162, which will be described later, of the wiring pattern part bonding means 160, and move integrally with the pedestal 162 along the carrier tape 1. In the first insulating tape laminating step P15, the first insulating tape 3 is supplied from the drum 41, and the first insulating tape 3 and the carrier tape 1 sent from the masking means 140 are laminated. At this time, the wiring pattern 2
, And the second conductor remaining material portions 23a, 23b,... Are composed of a hot melt layer 3a (see FIG. 9) formed on one surface of the first insulating tape 3 and an adhesive layer of the carrier tape 1. 1a to form a laminated tape 4 as a laminated body.

(Wiring pattern part bonding step P16) As shown in FIGS. 13 and 14, the wiring pattern part bonding means 160 is mounted on the base 16 by the first lifting cylinders 161 and 161.
2 and a lower plate 163 supported by the base 162 so as to be vertically opposed to the lower plate 163 with the laminated tape 4 interposed therebetween. A board 164 is provided. The lower plate 163 is formed in a flat box shape opened upward,
Numeral 64 has a lower surface that is the same as or wider than the opening edge 163a of the lower plate 163.
The elastic sheet 165 for sealing of No. 6 is integrally bonded. The lower plate 163 is connected to each of the first lifting cylinders 16.
When the elastic tape 165 is in close contact with the elastic sheet 165 of the upper plate 164 in a state where the laminated tape 4 is interposed therebetween by the ascending operation of the upper plate 1, the inner peripheral surface 163b of the lower plate 163 is
5 forms a chamber 166 which is a closed space.

The lower plate 163 has a hot plate 16 inside.
7 and one or more (four in the example shown) heat transfer plates 167a, 167 abutting on the upper surface of the heat plate 167.
67a, ... are provided. The upper and lower surfaces of the heat plate 167 are covered with heat insulating plates 167b and 167c (see FIG. 14), thereby shutting off the influence of heat upward and downward. Then, a predetermined position of the upper heat insulating plate 167b is cut out, and each of the heat transfer plates 167a is fitted into the cut-out portion, whereby each heat transfer plate 167a is cut.
Is performed.

Here, it is preferable that the upper heat insulating plate 167b has a two-layer structure in which, for example, a foamed silicon rubber sheet having good heat insulating property is adhered on a metal plate. Each of the heat transfer plates 167a is formed of a material having good heat conductivity, and has the same shape as the entire shape of each of the wiring pattern portions 21 (see FIG. 7) interposed in the laminated tape 4, and each of the heat transfer plates 167a has a positioning. It has the same shape as the mark portion 24, and is set at the same interval as the interval at which the wiring pattern portions 21 are arranged. That is, in the illustrated example, the wiring pattern part bonding step P16 is performed using the four heat transfer plates 167a, 167a,... With the four wiring pattern parts 21, 21,. The laminated tape 4 is intermittently fed for every length corresponding to 21, 21,. In addition,
The positioning of each heat transfer plate 167a and each wiring pattern portion 21 is performed by detecting a predetermined positioning mark 24 with an optical detector (not shown) and stopping the movement of the laminated tape 4.

In addition, mounted on the bottom of the lower plate 163 are second elevating cylinders 168, 168,... For raising and lowering the heat plate 167 together with the respective heat transfer plates 167a. Is the piston rod 168c
Is connected to the lower heat insulating plate 167c of the heat plate 167 through the bottom wall 163c of the lower plate 163. Then, by the lifting operation of each of the second lifting cylinders 168,
A pressing position where each heat transfer plate 167a is immersed in the lower plate 163 (a position indicated by a solid line in FIG. 14) and a position below each wiring pattern portion 21 of the laminated tape 4 and presses the lower surface of the carrier tape 1. The position (position indicated by a two-dot chain line in FIG. 14) is mutually changed. The cylinder body 168a of each of the second lifting cylinders 168 is fixed to the lower surface of the bottom wall 163c of the lower plate 163 via the outer cylinder 168b, and the outer cylinder 168b covers the entire outer periphery of the piston rod 168c. It is isolated from the outside space. An inner cylinder 168d is externally inserted into the piston rod 168c. This inner cylinder 168d is
While its upper end is fixed to the bottom wall 163c, a seal ring 168e is fitted between the inner peripheral surface of the lower end portion and the outer peripheral surface of the piston rod 168c. Chamber 1
66 is prevented from entering outside air.

Further, the lower plate 163 has a conduit 169.
a, a vacuum pump 169 is connected through
An opening / closing valve 169b and a leak valve 169c are interposed in 9a. When the chamber 166 is formed, the chamber 166 is operated by the operation of the vacuum pump 169.
The inside is evacuated to a predetermined vacuum state.

Then, the wiring pattern portion bonding step P1
Step 6 starts when the laminated tape 4 sent in the feed direction A is stopped at a predetermined position. First, lower board 16
3 is moved upward from the lower position (the position shown by the solid line in FIGS. 13 and 14) by the raising operation of each first lifting cylinder 161, and the laminated tape 4 is moved between the opening edge 163 a of the lower plate 163 and the elastic sheet 165. Press and press. Next, the inside of the formed chamber 166 is brought into a predetermined vacuum state by the operation of the vacuum pump 169. Then, in this vacuum state, each second elevating cylinder 168 is raised to raise each heat transfer plate 167a from the immersion position to the pressing position, and the heat of a predetermined temperature from the heat plate 167 is transferred to each heat transfer plate 167a. And acts on a predetermined area of the laminated tape 4 through the intermediary. As a result, only the regions of the hot melt layer 3a of the insulating tape 3 of the laminated tape 4 which cover the respective wiring pattern portions 21 and the respective positioning marks 24 are heated and pressurized.
1 and each positioning mark 24 are adhered to the first insulating tape 3. At this time, the thermal effect on the area other than the wiring pattern portions 21 and the positioning marks 24, that is, the second conductor remaining material portion 23 is blocked by the heat insulating plate 167b. The hot-melt layer 3 a in the region covering the first insulating tape 3 is not melted and is kept in a non-adhered state with the first insulating tape 3. Then, after a lapse of a predetermined time,
Each second elevating cylinder 168 is lowered to operate each heat transfer plate 16.
7a is lowered to the immersion position, the leak valve 169c is opened to bring the inside of the chamber 166 to an atmospheric pressure state, and then each of the first lifting / lowering cylinders 161 is lowered to return to the lower position. Next, the laminated tape 4 is relatively moved by the next one unit, and the above-described wiring pattern portion bonding step P16 is repeated.

(Separation Step P17) The separation means 170 is a continuous feeding mechanism for converting the intermittent movement of the laminated tape 4 by the fixed-size feed until the wiring pattern part bonding step P16 in the wiring pattern part bonding means 160 into a continuous movement. Accumulator 171 (see FIG. 13), guide roller 172 shown in FIG. 15, heater roller 173, peeling bar 1
74, a collecting drum 175 for continuously collecting the separated carrier tape 1, and a drum 1 for winding up the first insulating tape 3 to which the wiring pattern portions 21, 21,... Are adhered.
76.

The accumulator 171 has a first guide roller 171a for bending and guiding the laminated tape 4 sent from the wiring pattern portion bonding means 160 downward, and is folded upward at a position where the laminated tape 4 is extended to a lower position by a predetermined distance. Adjusting roller 171b and laminated tape 4 extending upward
Guide roller 171c that guides the sheet again in the horizontal direction
And a drive unit (not shown) for reciprocating the adjustment roller 171b in the vertical direction. Then, the driving unit is driven in synchronization with the intermittent movement of the laminated tape 4 accompanying the fixed-size feed, and the adjusting roller 171b reciprocates in the vertical direction, whereby the laminated tape 4 downstream from the second guide roller 171c is moved. Is moved continuously. That is, while the movement of the laminated tape 4 on the upstream side of the first guide roller 171a is stopped, the adjustment roller 17
1b moves at a predetermined speed from a lower position (a position shown by a solid line in FIG. 13) to an upper position (a position shown by a dashed line in the same figure),
Accordingly, while the laminated tape 4 on the downstream side is continuously fed out from the second guide roller 171c, while the laminated tape 4 on the upstream side is moving, the adjusting roller 171b is moved from the upper position to the lower position by a predetermined amount. At a speed lower than that of the second guide roller 171c.
As well as allowance for the next stop of movement.

The outer peripheral surface of the heater roller 173 is heated to a predetermined temperature (for example, about 100 ° C.) and is driven to rotate by a motor (not shown), and is laminated on the outer peripheral surface of the heater roller 173. When the tape 4 is wound and abutted, the laminated tape 4
The adhesive layer 1a of the carrier tape 1 is heated to reduce its adhesive strength. This heating temperature is set to the highest temperature at which the adhesive strength of the adhesive layer 1a of the carrier tape 1 can be weakened within a range where the adhesive layer 3a of the first insulating tape 3 is not melted.

The peeling bar 174 is supported by a support frame member 178 together with a guide roller 177 disposed below the peeling bar 174. The support frame member 178 is connected to a cylinder 179, and the operation of the cylinder 179 causes the peeling bar 174 to operate. 174 is moved up and down. And
By the raising operation of the cylinder 179 by a predetermined amount, the peeling bar 174 exerts a slight pressing force on the laminated tape 4 abutting on the peripheral surface at the lower end position of the heater roller 173, and a predetermined vertical direction with respect to the heater roller 173. It is designed to be held at a position that maintains the interval. As shown in detail in FIG. 16, the cross-sectional shape of the peeling bar 174 is such that a front corner 174a of the upper end has an arc surface with a small radius of curvature.
The carrier tape 1 is bent at a steep angle along a, and is separated from the laminated tape 4.

In the separating step P17, the continuously fed laminated tape 4 is heated by the heater roller 173 to weaken the adhesive strength of the adhesive layer 1a of the carrier tape 1 constituting the laminated tape 4. Then, the carrier tape 1 is bent at a sharp angle at the corner 174a of the peeling bar 174, and the carrier tape 1 is peeled from the wiring pattern portion 21, the second conductor remaining material portion 23, and the like. , 21,... Are adhered to the drum 176, and at the same time, the second conductor remaining portions 23, 2, which are not adhered to the first insulating tape 3, are collected.
Are dropped into the collection container 180 and collected. Thereby, the laminated tape 4 is separated, and the carrier tape 1 and the first insulating tape 3 with the wiring pattern portion 21 are individually collected, and the second conductor remaining portions 23, 23,... Are removed from the laminated tape 4. And recovery are performed simultaneously.

(Operation by the manufacturing method of the second embodiment)
Effect) In the case of the manufacturing method according to each of the above-described steps P11 to P17, the same effect as in the first embodiment can be obtained, and also the effect obtained by performing the wiring pattern portion bonding step P16 under reduced pressure can be obtained. . That is, the laminated tape 4 is placed in the chamber 166 in a predetermined vacuum state, and in this state, each heat transfer plate 167a and the elastic sheet 165 of the upper panel 164 have each wiring pattern portion 21 of the laminated tape 4. Since heat and pressure are applied across the portion, air bubbles are surely prevented from entering the boundary between each wiring pattern portion 21 to be bonded and the adhesive layer 3a of the first insulating tape 3 to which the wiring pattern portion 21 is bonded. Thus, the wiring pattern portions 21 and the first insulating tape 3 can be securely adhered over the entire surface of each wiring pattern portion 21.

In the separation step P17, the carrier tape 1 is peeled off using the heater roller 173 and the peeling bar 174, so that the second conductor remaining portions 23 and 2 are removed.
The removal and recovery of 3,... Can be performed simultaneously.

<Other Embodiments> The present invention relates to the first embodiment.
Alternatively, the present invention is not limited to the second embodiment but includes various other embodiments. That is,
In the above embodiment, the wiring pattern portion 21 is shown as having three conductors 25, 25,..., But is not limited to this. For example, one having one linear or curved conductor, or , And may further comprise a large number of conductive wires. In this case, the shape of the heat transfer plate in the wiring pattern portion bonding steps P5 and P16 may be changed according to the wiring pattern portion.

In the above embodiment, the first conductor remaining material portion 22 includes a portion surrounding the positioning mark 24. However, the present invention is not limited to this. For example, when the positioning mark is formed by a punched hole, etc. The surrounding part is unnecessary.

In the above embodiment, the first conductor remaining material portion 22 is configured to include the extending portions 22b and 22c, and the second conductor remaining material portion 23 is divided into two portions 2 for each unit of the wiring pattern portion 21.
Although it is divided into 3a and 23b, the present invention is not limited to this, and the extending portions 22b and 22c may be omitted. In this case, the second conductor remaining material portion removing step P7 or the separating step P1
The removal of the second conductor residual material portion at 7 may be performed by a winding drum or the like.

In the above embodiment, the first conductor remaining material portion 22 is set to a region slightly larger than the region surrounding the entire wiring pattern portion 21. However, the present invention is not limited to this. In order to obtain the effect of P16, it is sufficient that at least unnecessary conductor foil in the region surrounding the entire wiring pattern portion 21 can be removed, and the first conductor remaining material portion is formed to have a shape surrounding a larger region than that of the present embodiment. Is also good. Also in this case, the first conductor remaining material removing step P3, P1
In 3, the peeling can be easily performed with a smaller pulling force than in the conventional case where the entire remaining conductor is removed.

Further, in the first embodiment, in the wiring pattern portion bonding step P5, the lower heating plate is attached to the laminated tape 4 arranged so that the carrier tape 1 is on the upper side and the first insulating tape 3 is on the lower side. Although the first insulating tape 3 is heated by 53, the present invention is not limited to this. Conversely, by heating a predetermined area on the carrier tape 1 side, the wiring pattern portion 21 is bonded to the hot melt layer 3a in the corresponding area. You may make it do. In this case, the laminated tape 4 may be arranged upside down with respect to the equipment shown in FIG.

Further, in the first embodiment, the carrier tape peeling step P6 after the wiring pattern part bonding step P5
By removing only the carrier tape 1 and removing the second conductor remaining material 2
3 is left on the first insulating tape 3 in a non-adhered state, but the present invention is not limited to this. In the carrier tape peeling step, the second conductor remaining material portion is adhered to the carrier tape. In this state, the carrier tape is peeled off from the laminate, and then the carrier tape is separated from the carrier tape in a separate step.
A step of removing the remaining conductor material may be performed. In this case, the peeling of the carrier tape from the laminate in a state where the second conductor remaining material portion is adhered is achieved by separating the carrier tape from the laminate at a gentle angle, and the subsequent second conductor In the process of removing the remaining material,
A method is employed in which a peeling bar is pressed against the outer surface of the carrier tape to bend the carrier tape at a steep angle, thereby removing the second conductor remaining material portion in the adhesive state from the carrier tape.

By adopting such a method, the second conductor remaining material portion is removed in a step different from the step of peeling the carrier tape, so that the second conductor remaining material portion can be more reliably removed. obtain. That is, even if any trouble occurs in the removal of the second conductor remaining material portion, since the removal of the second conductor remaining material portion is performed in a step different from the step of peeling the carrier tape or the like, the processing of the trouble is performed. Can be performed without affecting the execution of the present step before the step of removing the second conductor remaining material portion. Further, as the above trouble, a situation may sometimes occur in which the adhesive force of the carrier tape is too strong and the second conductor remaining material portion is not peeled off from the carrier tape. Since the carrier tape is performed in a separate step as described above, the carrier tape is separately heated, for example, to reduce the adhesive force thereof, and thereafter, it is possible to remove the second conductor remaining material portion. Thus, it is possible to reliably remove the second conductor remaining material portion without causing the risk of occurrence. In other words, when the peeling of the carrier tape and the removal of the second conductor residual material portion are performed simultaneously, in order to adopt the method of weakening the adhesive force of the carrier tape by the above-described heating, the heating is performed in the state of the laminate. There is no other choice but the heating may cause the adhesive layer of the insulating tape to melt. However, as described above, the removal of the second conductor remaining material is performed in a separate step, and the removal is performed by peeling off the carrier tape. , The heating can be easily performed only on the adhesive layer of the carrier tape.

[0075]

As described above, according to the method of manufacturing a flat wiring body according to the first aspect of the present invention, the conductor foil is formed by the punching step into a relatively small area surrounding the wiring pattern portion and the entire wiring pattern portion. A first conductor remaining material portion of
Since it is separated and divided into a relatively large second conductor remaining material portion other than these and the first conductor remaining material portion is removed before the transfer process to the insulating tape, the wiring pattern portion in the transfer process is removed. At the stage of the bonding step, the conductor foil in the wiring pattern portion is securely removed, and the adhesive layer of the entire area corresponding to the wiring pattern portion is heated and pressed in the bonding step of the wiring pattern portion. Thus, only the wiring pattern portion can be securely bonded to the insulating tape without bonding the second conductor remaining material portion. Since the second conductor remaining material portion can be reliably maintained in the non-adhered state in the wiring pattern portion bonding process, the removal of the second conductor remaining material portion performed later is easy and easy. In addition to the reliable operation, it is possible to reliably prevent the occurrence of a disturbance such as a displacement of the wiring pattern portion.

On the other hand, in the above-mentioned punching step, the conductor remaining material portion
Since the first and second conductor remaining material portions are punched separately, the area of the first conductor remaining material portion to be peeled and removed in the first conductor remaining material portion removing step is a conventional method of peeling the entire conductor remaining material portion. Therefore, the first conductor remaining material portion receives a significantly smaller adhesive resistance from the adhesive layer of the carrier tape due to the peeling, and thus has a significantly smaller tensile force than the conventional case. It can be easily peeled off by force. In addition, even when the adhesive layer is heated in accordance with the peeled area, the heating temperature can be lowered, and the possibility of adverse effects such as co-peeling of the wiring pattern portion can be eliminated.

According to the second aspect of the present invention, in addition to the effect of the first aspect of the present invention, the first conductor remaining portion to be punched in the punching step is formed so as to surround the whole of the wiring pattern portion more than the surrounding region. Since it has a substantially contoured shape surrounding a slightly enlarged area, it satisfies the requirement in the bonding step of the wiring pattern part, that is, the requirement to eliminate the extra conductor residue in the area surrounding the entire wiring pattern part. While the first
Since the area of the first conductor remaining material portion to be peeled and removed in the conductor remaining material portion removing step can be minimized, the adhesive resistance due to the peeling can be minimized, and the removal of the first conductor remaining material portion can be further improved. It can be done easily and reliably.

According to the third aspect of the present invention, in addition to the effect of the first aspect of the invention, in the bonding step of the wiring pattern portion in the transfer step, the shape corresponding to the region surrounding the entire wiring pattern portion is formed. Since a heating plate is used and the heating plate is pressed against the back surface position of the insulating tape or the carrier tape corresponding to the wiring pattern portion position, the wiring pattern portion interposed between the carrier tape and the insulating tape and the It is possible to easily realize that only the wiring pattern portion is to be bonded by heating and pressurizing from the two conductor remaining material portions, and the second conductor remaining material portion is reliably non-bonded.

According to the fourth aspect of the present invention, in addition to the effect of the first aspect of the present invention, in the bonding step of the wiring pattern portion in the transfer step, the laminate is placed in a chamber in a predetermined reduced pressure state. Since the laminate is placed and heated and pressed in this state, it is possible to reliably prevent air bubbles from entering the boundary between the wiring pattern portion to be transferred and the adhesive layer of the insulating tape. Thus, the wiring pattern portion and the insulating tape can be securely brought into close contact with each other over the entire surface of the wiring pattern portion.

According to the fifth aspect of the present invention, in addition to the effect of the first aspect of the present invention, the carrier tape is separated at a steep angle while pressing the peeling bar. Can be peeled off.

According to the sixth aspect of the present invention, in addition to the effect of the fifth aspect of the present invention, a carrier tape and a second conductor remaining material portion are formed from the laminate after the wiring pattern portion is bonded to the insulating tape side. Are sequentially removed, and an insulating tape in which only the wiring pattern portion is adhered can be obtained, and the transfer of the wiring pattern portion can be completed. In addition, all the conductive foil is removed from the carrier tape, so that the carrier tape can be reused.

According to the seventh aspect of the present invention, in addition to the effect of the fifth aspect of the present invention, a separating step is performed from the laminate after the wiring pattern portion is bonded to the insulating tape side in the wiring pattern portion bonding step. By one process, the carrier tape and the second conductor remaining material portion can be removed at the same time, and an insulating tape with only the wiring pattern portion adhered can be obtained. Thereby, the transfer step of the wiring pattern portion can be completed. Further, all the conductor foils are removed from the carrier tape, so that the carrier tape can be reused.

According to the eighth aspect of the present invention, in addition to the effects of the seventh aspect of the invention, a punching step, a first conductor remaining material removing step, and a wiring pattern part bonding step are performed by the carrier. This can be performed with the tape or the laminate temporarily stopped, and each step can be performed reliably.
Moreover, in the separation step, peeling of the carrier tape,
The removal of the second conductor remaining material portion and the removal of the insulating tape to which the wiring pattern portion is adhered can be respectively performed continuously, whereby the efficiency of the separation process and the simplification of the device can be achieved. .

According to the ninth aspect of the present invention, in addition to the effect of the first aspect of the invention, the step of removing the remaining second conductor is performed in a step different from the step of peeling the carrier tape. With this configuration, even if any trouble occurs in the step of removing the second conductor residual material portion, the processing can be performed without affecting each step in the previous main line. In addition, since the peeled carrier tape is kept in a state where the second conductor remaining material remains adhered, it is possible to weaken the adhesive force of the peeled carrier tape by, for example, heating. This makes it possible to reliably perform the step of removing the second conductor remaining material portion.

[Brief description of the drawings]

FIG. 1 is a schematic view of a manufacturing apparatus for carrying out a first embodiment.

FIG. 2 is an enlarged sectional view of a carrier tape on which an adhesive layer is formed by lamination.

FIG. 3 is an enlarged sectional view of a carrier tape on which conductive foils are laminated.

FIG. 4 is a plan view showing a state where a cut is made in a punching step.

FIG. 5 is a partially cut-away simplified front view of an apparatus used in a first conductor remaining material removing step.

FIG. 6 is a perspective view showing a state where a first conductor remaining material portion is peeled off.

FIG. 7 is a view corresponding to FIG. 4 in a state where a first conductor remaining material portion has been removed;

FIG. 8 is a simplified front view of an apparatus in which respective steps such as lamination of a first insulating tape, bonding of a wiring pattern portion, peeling of a carrier tape, and removal of a second conductor residual material portion are performed.

FIG. 9 is an enlarged cross-sectional view of a state of a first insulating tape laminating step.

FIG. 10 is a partially cut-away enlarged perspective view of a lower heating plate.

FIG. 11 is a simplified enlarged sectional view of a lower heating plate.

FIG. 12 is a schematic diagram of a manufacturing apparatus for carrying out a second embodiment.

FIG. 13 is an enlarged cross-sectional explanatory view of a state of a first insulating tape laminating step and a wiring pattern part bonding step.

FIG. 14 is a partially enlarged sectional view of the wiring pattern portion bonding means of FIG.

FIG. 15 is an enlarged cross-sectional explanatory view of a state of a laminated tape separating step.

16 is a partially enlarged cross-sectional view of the heater roller and the peeling bar of FIG.

FIG. 17 is a plan view showing a state where a cut is made by a conventional punching step.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Carrier tape 1a Adhesive layer 2 Conductive foil 3 First insulating tape (insulating tape) 3a Hot melt layer (adhesive layer) 4 Laminating tape (laminate) 21 Wiring pattern part 22 First conductor remaining part 23 Second conductor remaining Material part 57,167a Heat transfer plate (heating plate) 166 Chamber 171 Accumulator (continuous feeding mechanism) P1, P11 Conductive foil lamination process P2, P12 Punching process P3, P13 First conductor remaining material portion removing process P4, P15 First insulation Tape laminating step P5, P16 Wiring pattern part bonding step (wiring pattern part bonding step) P6 Carrier tape peeling step P7 Second conductor remaining material part removing step P17 Separation step

 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-6-68722 (JP, A) JP-A-6-76656 (JP, A) JP-A-6-76657 (JP, A) JP-A-6-76657 76661 (JP, A) JP-A-7-6639 (JP, A) JP-A-5-20938 (JP, A) JP-A-7-6640 (JP, A)

Claims (9)

(57) [Claims] 1. A step of laminating a conductor foil on one side of a carrier tape via an adhesive layer, and forming the laminated conductor foil into a wiring pattern portion and a region larger than a region surrounding the entire wiring pattern portion. The carrier tape is not divided along a boundary between each other so as to be separated and partitioned into one conductor remaining material portion and a second conductor remaining material portion excluding both the first conductor remaining material portion and the wiring pattern portion. A punching step of punching a cut only in the conductive foil, and a first conductive residual material removing step of peeling only the first conductive residual material from the carrier tape in the conductive foil after the punching step. Forming a laminate by laminating an insulating tape with an adhesive layer on the carrier tape from which the first conductor residue has been removed so that the adhesive layer and the conductive foil are in contact with each other; Small amount of laminate Kutomo heating and pressing the corresponding area to the wiring pattern portion, the manufacturing method of the flat wiring body according to characterized in that it comprises a transfer step including the step of adhering only the wiring pattern part to the insulating tape. 2. The method according to claim 1, wherein the first conductor remaining material portion punched in the punching step has a shape surrounding a region slightly larger than a region surrounding the entire wiring pattern portion. Manufacturing method of flat wiring body. 3. The method according to claim 1, wherein the step of bonding the wiring pattern portion in the transfer step uses a heating plate having a shape corresponding to a region surrounding the entire wiring pattern portion, and the heating plate corresponds to the position of the wiring pattern portion. A method for manufacturing a flat wiring body, which is performed by pressing the flat wiring body against a back surface of an insulating tape or a carrier tape. 4. The method according to claim 1, wherein, in the bonding step of the wiring pattern portion in the transfer step, after the entire laminate including the wiring pattern portion is positioned in the chamber, the inside of the chamber is reduced in pressure. A method for producing a flat wiring body, wherein the method is carried out by heating and pressurizing underneath. 5. The carrier according to claim 1, wherein in the transfer step, after the wiring pattern portion bonding step of bonding only the wiring pattern portion to the insulating tape, the release bar is pressed against the outer surface of the laminate on the carrier tape side. A method for manufacturing a flat wiring body, comprising a step of separating the tape by separating the tape from the laminate at an acute angle. 6. The method according to claim 5, wherein a carrier tape peeling step of peeling the carrier tape in the laminate from the insulating tape and a second conductor remaining material removing step of removing the second conductor remaining material are sequentially performed. A method for manufacturing a flat wiring body. 7. The flat panel according to claim 5, wherein a separation step of simultaneously removing the carrier tape and removing the second conductor remaining material portion from the laminated body to which the wiring pattern portion is adhered is performed. Manufacturing method of wiring body. 8. The method according to claim 7, wherein the carrier tape or the laminate is sent forward by a predetermined unit size in the moving direction, and a punching step, a first conductor remaining material removing step, and a wiring pattern part bonding step are performed. The carrier tape or the laminate is temporarily stopped, and the separating step is performed while continuously feeding the laminate forward in the moving direction via the continuous feeding mechanism after the wiring pattern part bonding step. A method of manufacturing a flat wiring body. 9. The transfer step according to claim 1, wherein the transfer step includes bonding the second conductor remaining material portion to the carrier tape after the wiring pattern portion bonding step of bonding only the wiring pattern portion to the insulating tape. Peeling off the carrier tape, and thereafter removing the second conductor remaining material portion from the carrier tape by pressing the peeling bar against the outer surface of the carrier tape and bending the carrier tape at an acute angle. Manufacturing method of a flat wiring body.