JP2817275B2 - Semiconductor manufacturing equipment - Google Patents

Description

Description: FIELD OF THE INVENTION The present invention relates to a semiconductor manufacturing apparatus, and more particularly to a semiconductor device attached to a pressure-sensitive adhesive sheet and extending the distance between individually divided semiconductor elements (hereinafter referred to as pellets) in the pressure-sensitive adhesive sheet. (Hereinafter referred to as an expansion ring).

[Conventional technology]

Conventionally, a pressure-sensitive adhesive sheet expanding apparatus in a semiconductor manufacturing apparatus of this kind has an expansion ring 4 mounted on a stage 5 as shown in FIG. 4A in a sectional view of FIG. The dicing frame 6 is fixed with a clamp jig 3, and the stage 5 is lifted up as shown in FIG. Of the cap 7 as shown in FIG.
, The adhesive sheet 2 is sandwiched and fixed between the expansion ring 4 and the cap 7, then the adhesive tape 2 is cut, and the expansion ring 4 is detached from the dicing frame 6.

[Problems to be solved by the invention]

The contact portion of the above-described conventional expansion ring with the adhesive tape has a uniform slippery surface state and shape. However, as shown in the plan view of FIG. 3, when the pressure-sensitive adhesive sheet is stretched, the portion of the pressure-sensitive adhesive sheet that is in contact with the pellet remains as it is, and the portion between the pellet and the pellet is stretched and expanded. When the pressure-sensitive adhesive sheet is stretched using a conventional expansion ring, if there is a difference in the pellet size between the X direction and the Y direction, the difference in the interval between the pellets 1 in the X direction and the Y direction is large, and the Y direction is to be expanded. Then, there is a disadvantage that the reverse X direction is too wide and the crack 8 is formed, and the adhesive sheet 2 is torn.

If the above-mentioned drawbacks make it impossible to obtain the interval between the pellets, the recognition rate and recognition accuracy at the mounter are reduced, and the rate of occurrence of scratches and chips generated when adjacent pellets come into contact with each other is reduced. There is also a disadvantage that the height is increased.

[Means for solving the problem]

The present invention relates to a semiconductor manufacturing apparatus having an expansion ring for holding a semiconductor element by widening the interval between semiconductor elements which are attached to the adhesive sheet and individually divided by extending the adhesive sheet. A semiconductor manufacturing apparatus having an expansion ring in which at least a part of a portion in contact with the pressure-sensitive adhesive sheet has a roughened surface for suppressing slippage of the pressure-sensitive adhesive sheet.

〔Example〕

FIG. 1 is a plan view of a first embodiment of the present invention. The adhesive sheet is easy to slip at a smooth portion 9b at the contact portion of the expansion ring 4 with the adhesive sheet, and the adhesive sheet is hard to slip at the rough portion 9a at the adhesive portion with the adhesive sheet. Therefore, in this case X
Since the adhesive sheet is hard to spread in the Y direction, even if the adhesive sheet is stretched in the Y direction, X
Since the direction is difficult to spread, the Y direction does not spread so much that a crack is formed.

FIG. 2 is a plan view (a) of a second embodiment of the present invention and FIG.
FIG. 4B is a sectional view (A) of FIG. As shown in FIG. 1A, in the X direction of the contact portion 7 of the expansion ring 4 with the pressure-sensitive adhesive sheet, irregularities 10 having a sawtooth cross section are provided in parallel with the Y direction. Due to this unevenness,
When the adhesive sheet is stretched, the adhesive sheet is hard to be protruded, and the adhesive sheet is less likely to slip, so that the adhesive sheet is less likely to spread in the X direction than in the Y direction.

〔The invention's effect〕

As described above, in the present invention, in the contact portion of the expansion ring with the pressure-sensitive adhesive sheet, the pressure-sensitive adhesive sheet has a portion that is less slippery than the contact portion with another pressure-sensitive adhesive sheet, so that the interval between the pellets is less likely to spread. The direction can be provided, and there is an effect of preventing a crack from being generated in the pressure-sensitive adhesive sheet due to an excessively wide interval between the pellets.

[Brief description of the drawings]

FIG. 1 is a plan view of a first embodiment of the present invention, FIGS. 2 (a) and 2 (b) are plan views of the second embodiment of the present invention and sectional views taken along line AA, and FIG. 4 (a), (b), a plan view when the adhesive sheet is stretched by a conventional expansion ring.
(C) is a sectional view of the pressure-sensitive adhesive sheet expanding device. 1 ... Pellets, 2 ... Adhesive sheet, 3 ... Clamp jig, 4 ... Expansion ring, 5 ... Stage, 6 ... Dicing frame, 7 ... Cap, 8 ... Crack, 7 ... Adhesive sheet 9a ... rough part in the contact part with the adhesive sheet, 9b ... ... smooth part in the contact part with the adhesive sheet,
10 ... A part with irregularities at the contact part with the adhesive sheet.

Claims (1)

(57) [Claims] 1. A semiconductor manufacturing apparatus having an expansion ring for holding a semiconductor element by widening an interval between semiconductor elements which are attached to the adhesive sheet and individually divided by extending the adhesive sheet, wherein the adhesive sheet is elongated. A semiconductor manufacturing apparatus, comprising: an expansion ring having a rough surface that suppresses slippage of the adhesive sheet in at least a part of a portion that comes into contact with the adhesive sheet.