JP2813526B2 - Circuit inspection device and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to testing (measuring) characteristics of a device under test by inputting / outputting a test signal to / from an electrode (pad) of the device under test such as an integrated circuit (IC) on a semiconductor wafer. Inspection device (probe card) and method of manufacturing the same, particularly, a contact (bump) in contact with an electrode (pad) of a device to be inspected is disposed on an electrically insulating flexible film. The present invention relates to a circuit inspection device (probe card) and a method for manufacturing the same.

[0002]

2. Description of the Related Art As a probe card in which contacts (bumps) are disposed on an electrically insulating flexible film, for example, a probe card described in Japanese Patent Application Laid-Open No. 62-182672 is widely known. . This probe card is manufactured by the following method.

First, a lead wire is formed on one main surface of an electrically insulating thin film made of a polyimide film by a photolithography method, and a laser beam is irradiated from the main surface on the opposite side to the surface on which the lead wire is formed, thereby forming a plurality of layers. Are formed at predetermined intervals in the electrically insulating thin film. Next, a contact (bump) is formed by depositing a conductive metal in each through hole by an electroplating method. At this time, one end of the bump is made to protrude from the surface of the electrically insulating thin film. Thereafter, the electrical insulating thin film with the bumps and the lead wires obtained as described above is stretched over the opening of the printed circuit board as the support frame, and the peripheral edge is fixed with a clamp to obtain a probe card. At this time, the lead wire on the electrically insulating thin film,
A conductor (transmission line) on the printed circuit board corresponding to the lead wire is connected by embedding a conductive material in a hole formed in the electrically insulating thin film.

The degree of integration of integrated circuits is steadily increasing, as represented by LSIs and VLSIs. As the degree of integration increases, pad electrodes not only line up at the peripheral edge of a chip but also at the inner periphery thereof. Began to be formed. Also, it is desired to form bumps corresponding to the pad electrodes having such an arrangement also in the probe card. However, it is necessary to provide a lead wire individually for each bump, so that one electrical There is a limit to the number of leads that can be formed on an insulating thin film.

Therefore, for example, the above-mentioned publication proposes laminating several layers of an electrically insulating thin film provided with a lead wire. In this case, a bump is formed by providing a through hole reaching a predetermined lead wire from the bump forming surface (the lower surface of the lowermost electrically insulating thin film), and depositing a conductor in the through hole by plating or the like. It has been proposed to do this by letting them do it. At this time, the conductor is deposited until one end protrudes from the lower surface of the lowermost electrically insulating thin film by a predetermined length.

[0006]

However, when a bump is formed by simply filling a through-hole extending over a plurality of electrically insulating thin films with a conductor, the bump is likely to break when the probe card is used. The above proposals are still insufficient for obtaining a highly reliable probe card.

[0007] For example, as shown in FIG.
The electric insulating thin film 102 provided with the lead and the electric insulating thin film 104 provided with the lead wire 103 are laminated, and the lead wires 101, 10 are formed from the bump forming surface (the lower surface of the electric insulating thin film 102).
In the case where bumps 105 and 106 are formed by filling these through holes with a conductor by a technique such as plating, the through holes extending between the two electrically insulating thin films 102 and 104 are simply formed by a conductor. Bump 10 formed by filling with
6 has a long length, so that when the probe card is used, it is likely to be broken around the boundary between the bump forming surface and the protruding portion or around the interface between the electrically insulating thin films 102 and 104, and the tip portion may be dropped. strong.

This is because, when the probe card is used, in order to ensure stable contact between the bumps of the probe card and the pads of the device under test, the device is generally placed in a vertical direction with respect to the device under test placed horizontally. Not only is a force applied to the probe card to press it, but also a horizontal force is applied to the probe card to cause the probe card to move slightly horizontally and slide on the pad of the device under test. At this time, since the bump is bent in the electrically insulating thin film by the force applied to the tip portion of the bump, the longer the length of the bump, the higher the possibility that the bump is broken.

An object of the present invention is to provide a more reliable circuit inspection device (probe card) and a method for manufacturing the same.

[0010]

A circuit inspection device according to the present invention, which achieves the above object, comprises a plurality of electrically insulating thin films provided with a plurality of lead wires, wherein the plurality of electrically insulating thin films are laminated. A plurality of bumps are provided on a lower surface of the lowermost electrically insulating thin film, and a plurality of contacts penetrating one or more of the plurality of electrically conductive thin films and conducting to one of the lead wires on the predetermined electrically insulating thin film are provided. A plurality of transmission lines provided on the circuit board, the lead wires and the contacts of the flexible film section with bumps, the film section having at least a circuit board supporting the flexible film section with bumps; A contact that conducts input / output of a test signal through a contact and conducts through one of the plurality of the electrically insulating thin films to one of the lead wires on the predetermined electrically insulating thin film is a contact to be conducted. Electrically insulating thin film with lead wire A plurality of conductive members attached to an electrically insulating thin film located below the conductive insulating film, and the conductive member has a through hole formed in the electrically insulating thin film to form the contact. Characterized in that it has a size to cover at least the opening.

[0011] In addition, a method of manufacturing a circuit inspection device according to the present invention, which achieves the above-mentioned object, is characterized in that a plurality of electrically insulating thin films provided with a plurality of lead wires are laminated, and one of the electrically insulating thin films is provided. Or a flexible film section with bumps provided with a plurality of contacts penetrating through a plurality of sheets and conducting to one of the lead wires on the predetermined electrically insulating thin film so as to protrude from the lower surface of the lowermost electrically insulating thin film. Forming a circuit board having a flexible film portion with bumps and a plurality of transmission lines by electrically connecting the lead wires of the flexible film portion with bumps and the transmission lines of the circuit board to each other. And forming a circuit inspection device by integrating the plurality of electrically insulating thin films on the predetermined electrically insulating thin film in forming the bumped flexible film portion. Conduct with one of the leads The contact is provided with a conductive member attached at a predetermined position on an electric insulating thin film located below the electric insulating thin film provided with the lead wire to be conducted, and the conductive member is bounded by the conductive member. Is formed in an electrically insulating thin film located above and below the through hole, and a conductive metal is deposited in the through hole by an electroplating method using the conductive member as an electrode. It is characterized by the following.

[0012]

In the circuit inspection device of the present invention, a contact penetrating a plurality of electrically insulating thin films and conducting to one of the lead wires on the predetermined electrically insulating thin film is provided with the lead wire to be conducted. Is divided into a plurality by a conductive member attached on the electrically insulating thin film located below the electrically insulating thin film, and the conductive member is electrically insulated to form the contact. It has a size to cover at least the opening of the through hole provided in the conductive thin film.

Here, the conductive member is attached to the electrically insulating thin film located below the electrically insulating thin film provided with the lead wire to which the contact is conducted as described above. . Therefore, the conductive member is attached to the tip of the contact when the circuit inspection device is used (when the circuit inspection device is moved in the horizontal direction with the tip of the contact pressed against the pad of the device under test). It is less susceptible to such forces. Therefore, the bending of the contact caused when the circuit inspection device is used is the lowest classification for the contact penetrating a plurality of the electrically insulating thin films and conducting to one of the leads on the predetermined electrically insulating thin film. (A section including the protruding portion of the contact).

However, the length of this section is equal to the length of a contact that is conductive to one of the leads on the electrically insulating thin film to which the conductive member for forming the section is attached, Since the length is short, the deflection is slightly generated. For this reason, in the circuit inspection device of the present invention, the possibility that the contact breaks during use is low, and as a result, the reliability is higher than that of the same type conventionally proposed.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to the drawings, an embodiment of a circuit inspection device (hereinafter referred to as a probe card) of the present invention and a method of manufacturing the same will be described. FIG. 1 is a cross-sectional view (cross-sectional view taken along line XX 'of FIG. 3) of a flexible film portion with bumps constituting a probe card of the present embodiment, and FIG. FIG. 3 is a plan view of the flexible film portion as viewed from above, and FIG. 3 is a plan view of the flexible film portion with bumps as viewed from the back surface (surface opposite to the contact forming surface); FIGS. 6 is a process diagram for explaining a method of manufacturing a flexible film portion with bumps, and FIG. 7 is a cross-sectional view of the probe card of the present embodiment.

First, the structure of the flexible film portion 20 with bumps, which is a characteristic portion of the probe card according to the present embodiment, will be described with reference to FIGS. As shown in FIG.
In the flexible film portion 20 with bumps, a polyimide film 12a having a predetermined number of lead wires 10a extending from the central portion to the outer peripheral portion and a conductive member 11 provided at the central portion, and a predetermined number extending from the central portion to the outer peripheral portion. A polyimide film 12b having a number of lead wires 10b and a connecting conductive portion 13 provided on the outer peripheral portion is laminated. A predetermined number of bumps 14 are arranged in two rows along a square outline at the center of the laminate (hereinafter, the outer bumps are referred to as the outer bumps 1).
4a, the inner bumps are referred to as inner bumps 14b).

The outer bump 14a is made of a polyimide film 12a.
Through the lead wire 10a provided on the polyimide film 12a. Also, the inner bump 14
b denotes the conductive member 11 provided on the polyimide film 12a.
The lead wire 1 provided on the polyimide film 12b penetrates two of the polyimide films 12a and 12b while being divided into two portions (14b-1 and 14b-2).
0b.

Here, the polyimide film 12a on the lower surface side is
It is obtained by molding a polyimide film having a thickness of 25 μm into a circular shape having a diameter of 68 mm. The lead wire 10a provided on the polyimide film 12a has a thickness of 1 made of copper (Cu).
8 μm thin film with a line width of 50 μm and a total number of about 4
00. As shown in FIG. 2 (the numbers of the lead wires 10a and the conductive members 11 shown in FIG. 2 are not 100% but are simplified), the lead wires 10a are arranged radially, and the inner tip portion has a diameter. It has a circular shape of 100 μm, and the outer end has a line width of 200 μm. The conductive member 11 provided at the center of the polyimide film 12a is made of a copper thin film having a thickness of 18 μm and has a circular shape with a diameter of 100 μm.

On the other hand, the thickness of the polyimide film 12b on the upper surface side from the lead wire 10a is 10 μm, and this polyimide film 12b also has a circular shape with a diameter of 68 mm. The lead wire 10b provided on the polyimide film 12b is a thin film made of copper (Cu) with a thickness of 2 μm, the line width is 50 μm, and the total number is about 250. As shown in FIG. 3 (the numbers of the lead wires 10b and the connecting conductive portions 13 shown in FIG.
0b are also arranged radially, and the inner tip has a diameter of 10
It has a circular shape of 0 μm, and the outer tip has a line width of 200 μm.
spread to μm. The connecting conductive portion 13 provided on the outer peripheral portion of the polyimide film 12b has a thickness of 2 μm.
And a size of 200 μm × 2 mm.

Lead wire 1 penetrating through polyimide film 12a
0a is formed of nickel (N
i) A substantially cylindrical shape made of an alloy (diameter 30 μm, height 25 μ)
A hemisphere having a height of 35 μm is placed on the lower end of the m-shaped cylinder), and the end protrudes 35 μm from the surface of the polyimide film 12a. The total number of outer bumps 14a is about 400, which are 100 points along the square contour.
It is planted at a pitch of μm.

Further, the inner bumps 14b penetrating through the polyimide films 12a and 12b and conducting with the lead wires 10b.
The two parts (14b-1, 14b-) are formed by the conductive member 11 provided on the polyimide film 12a as described above.
It is classified into 2). The lower portion 14b-1 has a substantially cylindrical shape made of a nickel (Ni) alloy (a hemisphere having a height of 35 μm is placed on a lower end portion of a cylinder having a diameter of 30 μm and a height of 25 μm). It protrudes from the surface of the polyimide film 12a by 35 μm. Also, the upper part 14b
-2 is a 30 [mu] m diameter made of a nickel (Ni) alloy;
It has a column shape with a height of 12 μm. Inner bump 14b
Are approximately 250 and are planted at a pitch of 100 μm along the square contour.

The outer end of the lead wire 10a and the conductive portion 13 for connection are connected by a connecting member 15,
This connecting member 15 is made of a nickel (Ni) alloy having a cylindrical shape with a diameter of 30 μm. Further, the outer end portion of the lead wire 10b and the connecting conductive portion 13 are connected to a circuit board 31 described later.
Are connected to the transmission lines 37b and 37a, respectively.

Next, a method of manufacturing the flexible film section 20 with bumps having the above-described configuration will be described with reference to the process charts of FIGS. First, a 18 μm-thick polyimide film 12 a (25 μm in thickness, 68 mm in diameter) is formed on one main surface of the circular polyimide film 12 a.
(FIG. 4A). The formation of the copper thin film 21 was performed in the following procedure. First, a copper thin film having a thickness of about 5000 angstroms is formed on one main surface of the polyimide film 12a by a sputtering method. Thereafter, this was immersed in a solution containing copper sulfate as a main component, and copper was deposited on the copper thin film by electroplating until the thickness of the copper thin film became 18 μm, thereby forming a copper thin film 21.

Next, a positive photoresist (AZ1350 manufactured by Seaplay) is applied to a thickness of 2 μm on the copper thin film 21 to form a resist film 22 (FIG. 4B).
The resist film 22 was sequentially subjected to baking, selective exposure and development to form a resist pattern 23 (FIG. 4C). The above-described selective exposure performed on the resist film 22 corresponds to the lead wire 10a and the conductive member 11 shown in FIGS.

Next, using the resist pattern 23 obtained in the previous step as a mask, the copper thin film 21 was etched using an aqueous solution of sodium peroxodisulfate as an etching solution (FIG. 4D). Thereafter, the remaining resist pattern 23 is removed with an organic solvent such as acetone, and the lead wire 1 is removed.
0a and the conductive member 11 were obtained (FIG. 4E).

Next, a through hole 24a for providing the outer bump 14a is provided below the inner end of the lead wire 10a, and a through hole 24b for providing the inner bump 14b is provided below the conductive member 11, respectively. Number formed (Fig. 5
(F)). These are formed by placing a XeCl excimer laser beam (wavelength 308 nm, beam diameter about 30 μm, power density 1) at a predetermined position on the lower surface of polyimide film 12a (the surface opposite to the surface on which lead wire 10a and conductive member 11 are provided).
J / cm ² ) to pierce the polyimide film 12a. At this time, the lead wire 10a and the conductive member 11 were used as alignment marks.

Next, the through holes 24a,
A nickel alloy is deposited in the through hole 24a by an electroplating method, and the outer bump 14a is
The lower portion 24b-1 of the inner bump 24b was formed on the portion b (FIG. 5 (g)). At this time, the electroplating treatment was performed by immersing the polyimide film 12a having undergone the previous step in a mixed solution containing nickel sulfate as a main component, and supplying electricity to the lead wire 10a and the conductive member 11 as electrodes. By supplying electricity in this manner, the through holes 24a, 24b
The nickel alloy is deposited (precipitated) in the inside, and the tip of the deposited nickel alloy is approximately 35 mm from the surface of the polyimide film 12a.
When projecting by μm, the current supply was stopped. Thereby, the height of the outer bump 14a and the lower portion 14 of the inner bump 14b are reduced.
The height of b-1 became substantially the same.

Next, on the polyimide film 12a on the side where the lead wire 10a is provided, the thickness from the lead wire 10a is about 10 mm.
A liquid polyimide resin was applied so as to have a thickness of μm, and was baked at 130 ° C. for 30 to 40 minutes to be solidified, thereby obtaining a polyimide film 12b (FIG. 5 (h)).

Next, a copper thin film 25 having a thickness of 2 μm was formed on the polyimide film 12b by sputtering (FIG. 5 (i)). In order to prevent the copper thin film 25 from peeling off due to the film stress, and to prevent the entire electrically insulating thin film (polyimide films 12a and 12b) from losing flexibility, the copper thin film 25 provided on the polyimide film 12a is used. Also has a reduced thickness.

Next, a positive photoresist (AZ1350 manufactured by Seaplay) is applied to a thickness of 3 μm on the copper thin film 25 to form a resist film 26 (FIG. 5 (j)).
The resist film 26 was sequentially subjected to baking, selective exposure, and development to form a resist pattern 27 (FIG. 6 (k)). Note that the above-described selective exposure performed on the resist film 26 corresponds to the lead wire 10b and the connection conductive portion 13 shown in FIGS.

Next, using the resist pattern 27 obtained in the previous step as a mask, the copper thin film 25 was etched using an aqueous solution of sodium peroxodisulfate as an etching solution. By this etching, the resist pattern 2
7, a lead wire 10b formed of a part of the copper thin film 25
And the conductive portion 13 for connection were formed (FIG. 6 (l)). Next, a through hole 28a for providing the upper portion 14b-2 of the inner bump 14b is formed on the conductive member 11, and a connecting member for connecting the outer end of the lead wire 10a and the connecting conductive portion 13 is formed. A predetermined number of through holes 28b for providing the holes 15 were respectively formed on the outer ends of the lead wires 10a (FIG. 6 (m)). These are formed by placing a XeCl excimer laser beam (wavelength 308 nm, beam diameter about 30 μm, power density 1) at a predetermined position on the upper surface of the resist pattern 27.
J / cm ² ) to pierce the resist portion, the copper thin film 25 and the polyimide film 10b. At this time, the lead wire 10b and the connection conductive portion 13 were used as alignment marks.

Next, after cleaning and drying, a nickel alloy is deposited by electroplating in the through holes 28a and 28b formed in the previous step, and the upper portion 14b-2 of the inner bump 14b is placed in the through hole 28a. The conductive member 15 was formed in the through hole 28b (FIG. 6 (n)). The electroplating treatment at this time was performed by immersing the washed and dried laminate in a mixed solution containing nickel sulfate as a main component, and applying current to the lead wire 10a and the conductive member 11 as electrodes. By energizing in this manner, a nickel alloy is deposited (precipitated) in the through holes 28a and 28b.
The tip of the deposited nickel alloy is a polyimide film 12
When the height became almost the same as the surface of b, the energization was stopped. Thereafter, the remaining resist pattern 27 was removed with an organic solvent such as acetone to obtain the intended flexible film section 20 with bumps (FIG. 6 (o)).

As described above, according to this embodiment, the conductive member 11 for dividing the bump can be easily formed simultaneously with the lead wire 10a. Further, since the sputtering method is used as the forming method, the bump can be sufficiently adhered to the polyimide film 12a. Therefore, even if the bump is moved in the horizontal direction while pressing the bump against the pad of the device under test when using the probe card, A hard-to-break product was obtained. In addition, since bumps were formed using the conductive member 11 and the lead wires 10a as electrodes, all bumps could be formed under the same conditions, and bumps with uniform height could be obtained. Next, the flexible film section 20 with bumps
The probe card provided with is described with reference to FIG. The probe card 30 shown in FIG. 7 includes a flexible film section 20 with bumps, a circuit board 31, a first main body 32, a second main body 33, and elastic force applying means.

The circuit board 31 is made of glass epoxy resin, and has a disk 36 having an opening at the center,
And transmission lines 37a and 37b attached to the inside. A connection portion (not shown) for connecting the transmission line 37a to the connection conductive portion 13 of the flexible film portion 20 with a bump, and a transmission line 37b and a bump on one main surface of the disc 36 are provided. A connection portion (not shown) for connecting the flexible film portion 20 to the outer end portion of the lead wire 10b is provided. The transmission line 37a is connected to a relay terminal 39a erected on the peripheral edge of the disk 36, and the transmission line 37b is connected to a relay terminal 39b erected on the peripheral edge of the disk 36. These relay terminals 39a and 39b are connected to external terminals (for example, external terminals of a semiconductor tester) for inputting and outputting test signals to and from the probe card 30.

Both the first main body 32 and the second main body 33 are thick disks having openings corresponding to the openings of the disk 36 forming the circuit board 31, and both are screw members (not shown).
And are integrally fixed. Also, the elasticity applying means 3
Reference numeral 4 denotes an inner cylinder 41 formed of a cylindrical body having a flange portion 41b at an upper end, and a flange portion 41 of the inner cylinder 41 having one end fixed to a peripheral edge of the upper surface of the first main body 32 and the other end being a free end.
and a spring member 42 for pressing the outer peripheral portion of b from above.
The inner cylinder 41 has an opening of the disk 36 constituting the circuit board 31 and a corresponding first main body 32 and second main body 33.
And the hollow portion 43 of the inner cylinder 41
For example, a pressing member provided in a semiconductor tester or the like is inserted into the device.

The probe card 30 composed of these members
In the above, the flexible film section 20 with bumps makes the connection conductive section 13 provided on the upper surface thereof contact the connection section (not shown) of the transmission line 37a, and connects the outer end of the lead wire 10b to the transmission line. The first body 32 and the second body 33 are sandwiched together with the circuit board 31 in a state of being in contact with a connection portion (not shown) of 37b. The flexible film portion 20 with bumps is sandwiched between the first main body 32 and the second main body 33 without being relaxed, and the back surface (the surface opposite to the bump formation surface) is the lower end of the inner cylinder 41. (The end opposite to the end pressed by the spring member 42). As a result, the flexible film section 20 with bumps is in a state of projecting downward in the figure. Therefore,
The flexible film section 20 with bumps is separated from the circuit board 31 by
It can flex in both approaching directions.

An example of the use of the probe card 30 having the above configuration will be described with reference to a case where the device to be inspected is an IC. Note that a semiconductor tester (not shown) used in this example inputs and outputs a test signal,
Means for measuring the characteristics of Further, a pressing means for pressing the inner tube 41 while being inserted into the hollow portion 43 of the inner tube 41 constituting the probe card 30 is also provided.

First, the probe card 30 is attached to the semiconductor tester by connecting the relay terminals 39a and 39b to external terminals of the semiconductor tester. next,
The protruding tips of the bumps 14a and 14b constituting the probe card 30 are brought into contact with the electrodes (pads) of the IC. Further, by driving the pressing means of the semiconductor tester, the contact between the bump and the pad is made firm.

Then, an inspection signal is supplied from the semiconductor tester to the IC via the probe card 30, and the supplied inspection signal is returned to the semiconductor tester again via the probe card 30. By making a determination based on the returned test signal, a characteristic test of the IC can be performed.

According to the present embodiment, the bumps are not broken when the probe card is used, and the bumps have the same height, so that a reliable and favorable inspection can be performed. Note that the present invention is not limited to the above-described embodiment, but includes various modifications. Hereinafter, modified examples of the flexible film portion with bumps and the method of manufacturing the same, which are characteristic portions of the present invention, will be described.

First, in the above embodiment, the bumps are formed in two rows, but three or more rows may be formed as necessary. FIG.
Shows an example of a flexible film portion with bumps in which bumps are formed in three rows. In the flexible film section 60 with bumps shown in FIG.
An electrically insulating thin film 63a having a lead wire 61a and conductive members 62a and 62b, an electrically insulating thin film 63b having a lead wire 61b, a conductive member 62c and a conductive portion 64a for connection, a lead wire 61c and a conductive portion for connection 64
b and 64c are laminated. A bump 65a is connected to an inner end of the lead wire 61a, and a bump 65b divided into two parts by a conductive member 62a is connected to an inner end of the lead wire 61b. A bump 65c divided into three parts by conductive members 62b, 62c is connected to the inner front end of 61c. Further, the outer end of the lead wire 61a is connected to the connecting conductive part 64b by a connecting member 66a divided into two parts by the connecting conductive part 64a, and the outer end of the lead wire 61b is connected to the connecting member 64a. The connection portion 66c is connected to the connection conductive portion 64c. As described above, the flexible film portion with bumps, which is a feature of the present invention, may have a multilayer structure of three or more layers as necessary.

The effect of the present invention can be obtained if the bumps penetrating the three or more layers of the electrically insulating thin film are separated by a conductive member attached to at least one layer, preferably the lowermost electrically insulating thin film. Is obtained.

The shape of the portion of the circuit board serving as the support frame to be connected to the transmission line (the uppermost lead wire and the uppermost connection conductive portion in the flexible film portion with bumps) is determined by the shape of the transmission line of the circuit board. It can be changed appropriately according to the shape of the connection part.

The shape of the conductive member for partitioning a plurality of bumps that penetrate through a plurality of the electrically insulating thin films and conduct with one of the lead wires on the predetermined electrically insulating thin film is not limited to a circle. The shape may be a quadrangle or the like, and the shape is not particularly limited as long as it can cover at least the through hole for forming a bump. The present invention is not limited to one that can cover one through hole, and may be one that can cover two or more adjacent through holes.

As the material of the electrically insulating thin film, besides polyimide, organic materials such as acrylic resin, novolak resin, polystyrene, vinyl chloride resin, epoxy resin, polyurethane, rubber resin, and silicon oxide An inorganic material such as a material or an organic-inorganic composite material may be used.

The formation of a through hole for forming a bump is as follows.
In addition to drilling with laser light such as excimer laser light,
It may be performed by a photolithography method, a chemical drill method, or the like. As a material of a conductive member or a lead wire for dividing a bump into a plurality of parts, in addition to Cu, Cr, Ni,
Au, Pt, Al, W, or an alloy containing these metals may be used. Further, different materials may be used for the lead wire and the conductive member. In forming the bumps, Au, Ag, Pt, Cr,
Cu, Co, or an alloy containing these metals may be deposited by electroplating.

Further, in order to prevent noise, a conductive thin film having a thickness of about 3 μm made of a metal such as Cu may be formed at a desired location on the lower surface of the flexible film portion with bumps. The grounding using the grounding conductive thin film is performed, for example, by forming a through hole in an electrically insulating thin film to form a conductive member therein, and connecting the grounding conductive thin film to a lead wire or the like through the conductive member. It can be done by connecting to.

On the other hand, in the manufacturing process of the flexible film portion with bumps, the lead wires 10a and the conductive members 11 are formed on the polyimide film 12a as in the above embodiment, and then the bumps 1 are formed.
The order in which the formation of 4a and 14b-1 is performed is not limited.
Immediately after forming the lead wire 10a and the conductive member 11 on the polyimide film 12a, the polyimide film 12b may be formed, and then the bumps 14a and 14b-1 may be formed. In short, first, lead wire 1 is placed on polyimide film 12a.
The step of forming the conductive member 11 and the conductive member 11 may be performed.

Finally, a modified example of the probe card will be described. The transmission line of the circuit board not only connects the relay terminal and the lead wire or connection conductive part of the flexible film part with the bump electrically but also the impedance matching device,
A bypass capacitor or the like may be connected. Further, the opening of the circuit board may not be a through-hole, but may be one in which the opposite end face on which the flexible film section with bumps is stretched is closed.

As means for elastically pressing the flexible film portion with bumps, in addition to mechanical means such as the elasticity imparting means of the embodiment, for example, the flexible film portion with bumps may be used to close the closed space. May be formed, and a relatively high-pressure colorless gas may be filled in the closed space to elastically press the bumped flexible film portion.

[0051]

As described above, in the circuit inspection device of the present invention, since the bumps have the same height, uniform contact between each bump and the pad of the device under test can be obtained. In addition, since the bump is unlikely to be broken during use, it is possible to prevent the tip of the bump from dropping. Therefore, according to the present invention, a highly reliable circuit inspection device can be provided.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a flexible film portion with a bump constituting a probe card according to an embodiment.

FIG. 2 is a plan view of the flexible film portion with bumps in the manufacturing process shown in FIG.

FIG. 3 is a plan view of the flexible film portion with bumps of the example as viewed from the back surface (the surface opposite to the contact forming surface).

FIG. 4 is a process chart for explaining one manufacturing method of the flexible film portion with a bump.

FIG. 5 is another process diagram for explaining one manufacturing method of the flexible film portion with bumps, and is a process diagram for explaining a process following the process shown in FIG. 4 (e).

FIG. 6 is another process diagram for explaining one manufacturing method of the flexible film portion with bumps, and is a process diagram for explaining a process subsequent to the process shown in FIG. 5 (j).

FIG. 7 is a sectional view of the probe card of the embodiment.

FIG. 8 is a cross-sectional view of another example of a flexible film portion with bumps.

FIG. 9 is a cross-sectional view for explaining a problem of a conventional proposal.

[Explanation of symbols]

10a, 10b, 61a, 61b, 61c ... lead wire,
11, 62a, 62b ... conductive member, 12a, 12
b: polyimide film, 14a: outer bump, 14b: inner bump, 14b-1: lower part of the inner bump, 14
b-2: Upper part of the inner bump, 20, 60: Flexible film part with bump, 30: Probe card, 31: Circuit board, 37a, 37b: Transmission line, 63a, 63
b, 63c: electrical insulating thin film, 65a, 65b, 65
c ... bump.

Continued on the front page (58) Fields surveyed (Int.Cl. ⁶ , DB name) G01R 1/073 H01L 21/66 G01R 31/28

Claims (2)

(57) [Claims] A plurality of electrically insulating thin films provided with a plurality of lead wires are laminated, and a lead on a predetermined electrically insulating thin film penetrates one or more of the electrically insulating thin films. A flexible film portion with a bump provided with a plurality of contacts protruding from a lower surface of the lowermost electrically insulating thin film, and a circuit board supporting the flexible film portion with the bump; A circuit inspection device having at least a plurality of transmission lines provided on the circuit board and inputting / outputting an inspection signal via the lead wires and the contacts of the flexible film portion with bumps, The contact that penetrates a plurality of the electrically insulating thin films and conducts to one of the leads on the predetermined electrically insulating thin film is located below the electrically insulating thin film on which the lead to be conducted is provided. Adhering to the electrically insulating thin film It is divided into a plurality by a conductive member, and the conductive member has a size that at least covers an opening of a through hole provided in the electrically insulating thin film to form the contact. Characteristic device for circuit inspection. 2. A plurality of electrical insulating thin films provided with a plurality of lead wires are laminated, and a lead on a predetermined electrical insulating thin film penetrates one or more of the electrical insulating thin films. Forming a plurality of flexible film portions with bumps provided with a plurality of contacts protruding from the lower surface of the lowermost electrically insulating thin film, the plurality of contacts being electrically connected to one of the wires; A circuit board having the transmission line of the above, at least a step of integrating the lead wire of the flexible film portion with the bump and the transmission line of the circuit board while conducting each other to form a device for circuit inspection, In the method of manufacturing a device for circuit inspection including: forming the flexible film portion with a bump, the conductive film portion penetrates a plurality of electrically insulating thin films and is electrically connected to one of lead wires on a predetermined electrically insulating thin film. The contact is the object of conduction A conductive member attached to a predetermined position on the electric insulating thin film located below the electric insulating thin film provided with the lead wire is provided, and a through hole bordering the conductive member is formed in the through hole. Forming on the electrically insulating thin film positioned above and below, and depositing a conductive metal in the through hole by an electroplating method using the conductive member as an electrode, for circuit inspection. Device manufacturing method.