JP2812291B2 - High frequency transistor matching circuit - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency circuit matching circuit, and more particularly to a high-frequency transistor matching circuit suitable for easily realizing input / output matching.

[0002]

2. Description of the Related Art Conventionally, in an input / output matching circuit using a microstrip circuit, a pattern 14 for adjusting impedance is provided on a substrate 11 as shown in FIG. In addition, the impedance is adjusted as a capacitance component and the impedance is matched.

A technique disclosed in Japanese Patent Application Laid-Open No. Sho 58-166815, which is a first conventional example of the above technique, is to dispose a microstrip substrate provided with a microstrip line and an FET element on a ground conductor. In the high-frequency amplifier, a space is provided between the substrate and the FET element, the line and the FET element are coupled by a lead terminal of the FET element, and the lead terminal is used as an input matching circuit. High-frequency amplifier.

[0004] Japanese Patent Laid-Open Publication No. Hei.
The technique disclosed in Japanese Patent No. 170602 discloses a microwave integrated circuit in which a plurality of circuit elements are integrated, in which a series circuit of an inductive element and a variable capacitance element is connected between the source of a field-effect transistor of a first-stage circuit and ground. The microwave integrated circuit is characterized in that the capacitance value of the variable capacitor is controlled by an input signal from an external terminal. According to the second prior art, the input impedance of the first stage circuit is It is appropriately changed by the input signal from the terminal, and therefore, it is possible to set the system to an input matching characteristic having a noise matching characteristic and a gain matching characteristic that meet the system specifications.

[0005]

However, the above-mentioned prior art has the following disadvantages.

The first problem is that in the prior art, it is difficult to make adjustments to achieve impedance matching, and a great deal of time and skill are required.

The reason is that, since the impedance is constituted by a distributed constant circuit, the adjustment depends on fine adjustment of the length and width of the pattern.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional circumstances, and accordingly, an object of the present invention is to solve the above-mentioned problems inherent in the prior art and to facilitate impedance adjustment of a high-frequency circuit. And a new high-frequency transistor matching circuit.

[0009]

In order to achieve the above object, a high-frequency transistor matching circuit according to the present invention is provided on both input and output microstrip patterns.
Rail-shaped grooves are provided in advance, and electrode leads of the transistor are connected to these groove portions, so that a spherical conductor can easily move on the rail-shaped grooves.

The above-mentioned groove is formed parallel to the electrode lead of the transistor (first groove) or the first groove.
And a second groove formed substantially at right angles to the first groove and connected to the first groove, or formed on the opposite side to the second groove and connected to the first groove. A third groove is formed, and the structure includes the first, second, and third grooves.

According to the present invention, it is possible to form a structure in which grooves are formed in the electrode leads themselves protruding on the input and output sides of the transistor, and a spherical conductor can be moved in these grooves.

[0012]

The conductor sphere can be easily moved on the rail-shaped groove. By changing the position of the conductor,
An effect as an open stub is provided, and an optimum impedance is easily realized.

After the adjustment is completed so as to obtain the optimum impedance, the conductive ball is fixed at that position with a non-conductive adhesive.

[0014]

Next, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view showing a first embodiment according to the present invention.

The first embodiment according to the present invention shown in FIG. 1 is a circuit in which a microstrip line is connected to the input and output electrode leads of a transistor to achieve impedance matching. A rail-shaped groove is carved on this strip pattern, and a spherical conductor is moved in the rail-shaped groove.

Referring to FIG. 1, reference numeral 1 denotes a ground conductor, on which two microstrip substrates 2 and 2 are mounted and fixed. A transistor 3 is disposed between the two microstrip substrates 2 and 2, and one of the three electrode terminal leads is connected to the ground conductor 1 and grounded. The electrode lead to be grounded is, for example, an emitter and a base in the case of a bipolar transistor, and is a gate and a source in the case of an FET.

The microstrip line 4 is formed on the microstrip substrate 2 by, for example, depositing gold. Silver can be used instead of gold, and copper can also be used. In the case of copper, a copper plate is bonded on the microstrip substrate 2 instead of vapor deposition.

A rail-shaped groove 5 is formed on the microstrip line 4 in the longitudinal direction of the line, and a spherical conductor (spherical conductor or conductive sphere) 6 is movably provided along the groove 5 in the groove 5. Is engaged. Light bulb leads 3a and 3b of the transistor 3 are joined to an end face of the microstrip line 4 including the groove 5.

FIG. 2 is a perspective view showing a second embodiment according to the present invention.

Referring to FIG. 2, in the second embodiment, in addition to the configuration of the first embodiment, a microstrip line 7 is formed on the microstrip substrate 2 in a direction substantially perpendicular to the microstrip line 4. Is formed, and a rail-shaped groove 5a is carved in the longitudinal direction. Groove 5a
Similarly, a spherical conductor 6 is movably engaged. The microstrip lines 4 and 7 are connected in a T-shape as shown.

In the second embodiment shown in FIG.
Although the T-shaped microstrip line is formed only on the left (input side) microstrip substrate 2,
Needless to say, it can be similarly formed on the microstrip line 2 on the right side (output side).

FIG. 3 is a perspective view showing a third embodiment according to the present invention.

Referring to FIG. 3, in the third embodiment, in addition to the configuration shown in the second embodiment, a microstrip is provided on the microstrip substrate 2 opposite to the microstrip line 7. A microstrip line 8 similar to the line 7 is formed, and a rail-shaped groove 5b is carved on the microstrip line 8.
Similarly, a spherical conductor 6 is movably engaged with the groove 5b. The microstrip lines 4, 7, 8 are connected and formed in a + -shape as shown.

FIG. 4 is a perspective view showing a fourth embodiment according to the present invention.

Referring to FIG. 4, in the fourth embodiment, rail-shaped grooves 31a are engraved directly in the electrode lead 31 of the transistor 3 in the longitudinal direction. The conductor 6 is movably engaged.

In each of the first to fourth embodiments described above, the impedance can be changed by moving the spherical conductor 6 along the groove, and thereby the input / output impedance can be matched. At this time, the inductance (L) is adjusted mainly by the displacement caused by the moving operation of the spherical conductor 6 along the grooves 5 and 31a provided in the direction of the electrode leads 3a and 3b of the transistor 3 and the grooves 5a and 5b. The capacitance (C) is adjusted mainly by the displacement caused by the moving operation of the spherical conductor 6 along.

As described above, the conductor ball 6 moves in the grooves 5, 5a, 5b, 31a provided on the microstrip lines 4, 7, 8 or the electrode lead 31, or the spherical conductor (conductor ball) By changing the number of 6), input / output impedance matching of the transistor can be achieved.

After the impedance matching adjustment is completed by operating the spherical conductor 6, the spherical conductor 6 is fixed to its stationary position with a non-conductive adhesive.

[0030]

The first effect is that the matching of the input / output impedance of the transistor circuit constituted by the microstrip circuit can be easily realized.

The reason is that the configuration of the rail-shaped groove and the conductive sphere provided on the pattern allows a high degree of freedom to change the impedance at a high degree of freedom.

The second effect is that the input / output impedance matching adjustment according to the present invention is accurately realized in a short time, and the time for the adjustment can be greatly reduced.

This is because the spherical conductor is simply moved along the groove.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a first embodiment according to the present invention.

FIG. 2 is a perspective view showing a second embodiment according to the present invention.

FIG. 3 is a perspective view showing a third embodiment according to the present invention.

FIG. 4 is a perspective view showing a fourth embodiment according to the present invention.

FIG. 5 is a perspective view showing a conventional transistor matching circuit.

[Explanation of symbols]

 1, 11 ground conductor 2, 12 microstrip substrate 3, 13 transistor 3a, 15, 31 transistor lead terminal 4, 7, 8, 14 microstrip line 5, 5a, 5b, 31a groove 6 spherical Conductor (conductor ball)

Continuation of the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01P 3/08 H01P 5/02 H01P 5/08 H01L 23/48 H03F 3/60

Claims (6)

(57) [Claims] 1. A first microstrip line formed on a microstrip substrate in a direction in which an electrode lead terminal of a transistor protrudes, and a first groove formed in a longitudinal direction on the first microstrip line. A first spherical conductor movably engaged with the first groove, and connecting a lead terminal of a transistor to the first groove portion of the first microstrip line; A high-frequency transistor matching circuit, wherein the input / output impedance of the transistor is matched by arbitrarily moving a conductor. 2. A second microstrip line is formed on the microstrip substrate in a direction substantially perpendicular to the first microstrip line by connecting one end to the first microstrip line. 2. The high-frequency transistor matching device according to claim 1, further comprising a second groove formed on the microstrip line in a longitudinal direction thereof, and a second spherical conductor movably engaged with the second groove. circuit. 3. A third microstrip line is formed in a region on the microstrip substrate opposite to a region where the second microstrip line is formed, in a direction perpendicular to the first microstrip line. ,
The third microstrip line has a third
3. The high frequency transistor matching circuit according to claim 2, further comprising: engraving a groove, and engaging a third spherical conductor with the third groove. 4. The method according to claim 1, further comprising, after adjusting the impedance by displacing the spherical conductor, fixing the spherical conductor at the position of the groove with a non-conductive adhesive. The high-frequency transistor matching circuit according to claim 1. 5. A rail-shaped groove is formed in the longitudinal direction of the surface of the input / output electrode lead terminal of the transistor, a spherical conductor is movably engaged with the groove, and the spherical conductor is displaced and adjusted to adjust the input of the transistor. A high-frequency transistor matching circuit for matching output impedance. 6. The high-frequency transistor matching according to claim 5, further comprising, after displacing the spherical conductor and adjusting the impedance, fixing the spherical conductor at the position of the groove with a non-conductive adhesive. circuit.