JP2808958B2 - Wiring board and manufacturing method thereof - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board on which semiconductor elements and electronic components are mounted, and a method of manufacturing the same.

[0002]

2. Description of the Related Art FIG. 10 shows, for example, "Microselect".
ronics Packaging Handb
book "(VAN NOSTRAND REINHOL
D New York, 1989) is a cross-sectional view showing a conventional wiring board, in which 10 is a signal on which electronic components (not shown) such as a semiconductor element, a semiconductor device, and a resistor are mounted on the surface. The wiring layer includes a signal wiring 101 and a dielectric 102. The signal wiring 101
Are electrically connected by via holes 103 formed in the dielectric 102, and some signal wirings are connected to electrode pads 104 provided on the surface of the signal wiring layer 10.
Further, the signal wiring layer portion 10 is provided with via holes 107 and 108 connected to the potential supply electrode pads 105 and 106 formed on the surface, respectively. Reference numeral 20 denotes a power supply layer formed integrally with the signal wiring layer 10, and a power supply layer 201 for supplying a potential to the semiconductor element and the electric component.
a, 201b and a ground layer 202a, 2 for supplying 0 potential
02b and a dielectric layer 203 made of alumina or the like for electrically insulating the respective layers. The power supply layer and the earth layer are formed by sintering particles of tungsten, molybdenum / manganese mixture, or the like. The power supply layer 20 is provided with via holes 204 and 205 for electrically connecting predetermined layers, and the upper end thereof is connected to a ground pad 206 and a power supply pad 207 formed on the surface of the power supply layer. It is electrically connected to via holes 107 and 108.

A conventional wiring board is configured as described above,
One via hole 20 from power supply layers 201a and 201b
5. The current supplied to the semiconductor element or the electronic component via the power supply pad 207, the via hole 108 and the electrode pad 106 is applied to the other electrode pad 105, the via hole 10
7, flows to the earth layers 202a and 202b via the earth pad 206 and the via hole 204. Thus, the current is supplied to the semiconductor elements and electronic components (not shown) mounted on the wiring board. Note that the current flowing when the potential supplied to the power supply layers 201a and 201b is negative flows in the opposite direction. In addition, when the operating speed of the mounted semiconductor element or electronic component increases, the current becomes a pulse-shaped current having a steep rise, and there is a concern that an induced current due to this current is induced in the power supply layer to prevent normal operation. However, the power supply layers 201a, 201b and the earth layers 202a,
Since the capacitor is formed with the dielectric layer 203 interposed between the capacitor and the capacitor 202b, the effect of the induced current can be reduced.

[0004]

In the wiring board configured as described above, the power supply layer and the ground layer of the power supply layer and the via hole are made by sintering a mixture of powdered tungsten and molybdenum / manganese, and Its thickness is as thin as about 20 μm, and when the current supplied to the semiconductor element or the electronic component increases, the electric resistance of the power supply layer and the earth layer becomes a problem. For this reason, each layer is composed of a plurality of layers (22 layers in this conventional example).
It is required to form. As a result, the manufacturing process becomes complicated and expensive. Further, since the dielectric layer is made of a sintered body of a powder such as alumina, the dielectric layer is easily broken and has a problem in mechanical strength. Therefore, when the mechanical strength is taken into consideration, there is a disadvantage that the thickness of the substrate becomes large and heavy because the thickness cannot be reduced.

The present invention has been made in order to solve such a problem, and has as its object to obtain a thin and light wiring board which can supply a large current, is easy to manufacture, is inexpensive, and has a further advantage. It is an object of the present invention to provide a manufacturing method suitable for a wiring board.

[0006]

A wiring board according to the present invention is provided via first and second via holes provided in a signal wiring layer on which electronic components such as semiconductor elements, semiconductor devices, and resistors are mounted. A power supply layer for supplying a current to the element or the component includes a first conductive plate connected to the first via hole, and a protrusion penetrating the conductive plate and connected to the second via hole. And a second conductive plate having a portion, and an insulating member for electrically insulating the conductive plates from each other.

Also, signal wiring layers on which electronic components such as a semiconductor element, a semiconductor device, and a resistor are mounted on both surfaces, and first, second, third, and third signal wiring layers provided on each signal wiring layer. A first and a second conductive plate connected to the second and third via holes, respectively; a power supply layer for supplying a current to the element or component via the fourth via hole; Respectively, and penetrate the other conductive plate with each other.
And vias that are respectively connected to the via holes, and an insulating member that electrically insulates the conductive plates.

An insulating member made of an adhesive material is used. Also, an insulating member composed of an adhesive layer and a dielectric layer formed between the adhesive layers is used. In addition, a conductive plate in which the joint surface with the insulating member is formed in an uneven shape is used.

Further, the method of manufacturing a wiring board according to the present invention includes the step of forming a hole formed in one conductive plate, a projection formed in the other conductive plate, and a hole formed in the insulating sheet. In an aligned state, the power supply layer is formed by laminating the conductive plates with an insulating sheet interposed therebetween, and heating and pressurizing them to form a power supply layer, and then forming a signal wiring layer on the power supply layer. It is.

[0010]

As described above, since the power supply layer is formed using the conductive plate, a large current capacity can be obtained, and a thin wiring board having an excellent heat radiation effect can be obtained. Further, it is only necessary to heat and press the conductive plate and the insulating sheet, and an inexpensive wiring board can be easily manufactured.

[0011]

FIG. 1 is a sectional view showing a wiring board according to a first embodiment of the present invention. In the figure, reference numeral 10 denotes a signal wiring layer having the same configuration as that of the conventional example, and the description thereof will be omitted. Reference numeral 30 denotes a power supply layer integrally formed on the lower surface of the signal wiring layer 10, and a power supply layer 3 made of a conductive plate such as a copper plate, an iron nickel plate, and an aluminum plate.
1 and an earth layer 302, and an insulating member 303 provided between the layers and made of an adhesive material such as an epoxy resin or a polyimide resin. Reference numeral 301a denotes a through hole opened in the power supply layer 301, which is formed so as to diverge from the front surface to the rear surface. Reference numeral 302a denotes a protrusion formed on the surface of the earth layer 302, which is inserted into the through hole 301a via an insulating member 303. Reference numeral 302b denotes a flat surface formed at the tip of the protrusion 302a, which is located on the same plane as the surface of the power supply layer 301. In the power supply layer 30 thus configured, the upper surface of the power supply layer 301 is directly electrically connected to one via hole 108 provided in the signal wiring layer 10, and the flat surface 302 b of the ground layer 302 is connected to the other via hole 107. Is directly electrically connected to In the above embodiment, one via hole 107 and one via hole 108 provided in the signal wiring layer 10 are provided for each of the ground layer 302 and the power supply layer 301, but a plurality of via holes may be provided.

FIG. 2 is a sectional view showing a manufacturing process of a wiring board according to an embodiment of the present invention. In the figure, 31 is a conductive plate for a power supply layer, which has a divergent shape (dimension b) as shown in the figure.
1> a1) is provided with a through hole 31a. Reference numeral 32 denotes a ground layer conductive plate having a projection 32a (dimension b2> a2) having a flat surface 32b at the tip. Reference numeral 33 denotes an insulating adhesive sheet disposed between the power supply layer conductive plate 31 and the ground layer conductive plate 32 and has a hole 33a. Here, the height h of the protrusion 32 a is slightly smaller than the sum of the thickness of the power supply layer conductive plate 31 and the thickness of the adhesive sheet 33.

Next, the manufacturing method will be described. First, as shown in FIG. 2A, a through hole 31a formed in the power supply layer conductive plate 31, a projection 32a formed in the ground layer conductive plate 32, and a hole 33a formed in the adhesive sheet 33. And the conductive plate 31,
The layers 32 are laminated with an adhesive sheet 33 interposed therebetween. Next,
These are heated and pressed by heating and pressing means (not shown) to bring the adhesive sheet 33 into a molten state, whereby the two conductive plates 31 and 32 are bonded as shown in FIG. 2B.
Here, the adhesive is applied to the power supply layer conductive plate 31 and the projection 32a.
The portion protruding from the surface may be flattened by grinding or the like. In addition, the surface of the conductive plate for the power supply layer, the protrusions, and the adhesive portion may have some irregularities as long as it does not hinder the subsequent steps. Thus, the power supply layer 3 as shown in FIG.
0 is produced. Next, the surface of the power supply layer 30 is shown in FIG.
After being covered with the dielectric layer insulating plate 11 as shown in (1), through holes 11a and 11b are formed in the dielectric layer insulating plate to partially cover the surfaces of the power supply layer conductive plate 31 and the projections 32a. Expose each. Thereafter, FIG.
The signal wiring layer 10 as shown in FIG.

According to the above embodiment, for example, the power supply layer 301
By forming the power supply layer 30 using a 100 μm copper plate for the ground layer 302, compared with a conventional power supply layer using a power supply layer having a thickness of 1 mm and a ground layer using five layers each, as compared with a conventional power supply layer. The power supply capability is five times or more, and the thickness can be reduced to 300 μm or less. In this way, a thin and light wiring board that can supply a large current and can be obtained.

Further, since the semiconductor elements and electronic components mounted on the wiring board are directly connected to the power supply layer 301 and the ground layer 302 via the via holes 107 and 108, the heat generated by the semiconductor elements and electronic components is reduced by the power supply. Since it is transmitted directly to the layer and the ground layer and diffused, a wiring board having an excellent heat radiation effect can be obtained.

Further, a thin and light wiring board can be easily and inexpensively manufactured by a very simple method of heating and pressing using a conductive plate such as a copper plate, an iron nickel plate, and an aluminum plate.

Embodiment 2 FIG. 3 is a sectional view showing a wiring board according to a second embodiment of the present invention. In the figure, parts corresponding to the respective parts in FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted. Reference numeral 40 denotes a power supply layer formed on the lower surface of the signal wiring layer 10, and 402 denotes a power supply layer 30.
1 is an earth layer adhered to the power supply layer 4 by the power supply layer 301 and the insulating member 303.
0. Numeral 402a denotes a projection formed by pressing the earth layer 402 with a mold or the like.
1 is inserted through the insulating member 303 into the through hole 301a formed in the first through hole. Reference numeral 402 denotes a depression formed in the earth layer 402 during press molding.

FIG. 4 is a sectional view showing a manufacturing process of a wiring board according to Embodiment 2 of the present invention. In the figure, parts corresponding to the respective parts in FIG. 3 are denoted by the same reference numerals, and description thereof will be omitted. Reference numeral 42 denotes a ground-layer conductive plate made of a metal material that can be plastically deformed by press working, and does not have a protrusion as in the first embodiment. 100 is a metal upper mold provided on the power supply layer conductive plate 31 side, 110 is a metal lower mold provided on the ground layer conductive plate 42 side, and has a triangular projection 110a on the surface. It is protruding.

Next, the manufacturing method will be described. First, as shown in FIG. 4A, with the through-holes 31 a formed in the power supply layer conductive plate 31 and the holes 33 a formed in the adhesive sheet 33 being aligned, the power supply layer conductive plate 31 is formed. And the ground layer conductive plate 42 with an adhesive sheet 33 interposed therebetween. Next, when these are pressed from above and below using the upper mold 100 and the lower mold 110, the ground layer conductive plate 42 is plastically deformed by the projection 110 a protruding from the lower mold 110, as shown in FIG. Adhesive sheet 33
The projection 42a is formed in a state of being inserted into the power supply layer conductive plate 31 through the through hole 33a. At this time, a flat surface 42b is formed at the tip of the protrusion 42a by the upper die 100. A depression 42c is formed on the lower surface of the ground layer conductive plate 42 by the lower die 110. Next, heating means (not shown) is used in the state of being pressed in this manner.
And the adhesive sheet 33 is melted to bond the two conductive plates 31 and 42. Thus, the power supply layer 40 as shown in FIG. 3 is manufactured. Since then
The signal wiring layer 10 as shown in FIG. 1 is manufactured by the same steps as in the second embodiment.

According to the above embodiment, a flat metal plate, that is, a conductive plate for an earth layer is pressed with a mold or the like to form a projection, and is bonded to the conductive plate for a power supply layer by melting an adhesive sheet. Embodiment 1
As described above, the fabrication is easier than forming the protrusions on the metal plate in advance.

Embodiment 3 FIG. 5 is a sectional view showing a wiring board according to a third embodiment of the present invention. In the figure, parts corresponding to the respective parts in FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted. Reference numeral 50 denotes a power supply layer integrally formed between the pair of signal wiring layers 10. The power supply layer 501 and the ground layer 502 are formed of a conductive plate such as a copper plate, an iron nickel plate, or an aluminum plate. And an insulating member 503 made of an adhesive material such as resin or polyimide resin. 501a is a power supply layer 501
Are formed in a divergent shape from the front surface to the rear surface. Reference numeral 502a denotes a through hole opened in the ground layer 502, which is formed so as to diverge from the back surface to the front surface. Reference numeral 501b denotes a protrusion formed on the back surface of the power supply layer 501, and a through hole 5b of the ground layer 502.
02a are inserted at regular intervals in the area 02a. 502
b is a protrusion formed on the surface of the earth layer 502,
The power supply layer 501 is inserted into the through hole 501a at a constant interval. Reference numeral 501c denotes a flat surface formed at the tip of the protrusion 501b, which is located on the same plane as the surface of the ground layer 502. 502c is the protrusion 50
The flat surface formed at the tip of 2b is located on the same plane as the surface of the power supply layer 501. The power supply layer 50 having such a configuration is configured such that the surface of the power supply layer 501 has the upper surface of the signal wiring layer 1.
0, is directly electrically connected to one via hole 108, and the flat surface 502 c of the ground layer 502 is directly electrically connected to the other via hole 107. Also, the back surface of the ground layer 502 is directly electrically connected to one via hole 109 provided in the lower signal wiring layer 10, and the flat surface 501 c of the power supply layer 501 is directly electrically connected to the other via hole 110. Have been. In the above embodiment, the via holes 107 and 108 provided in the upper signal wiring layer 10 and the via holes 109 and 110 provided in the lower signal wiring layer 10 correspond to the ground layer 502.
One power supply layer and one power supply layer 501 are provided, but a plurality of power supply layers may be provided.

According to the above embodiment, since the signal wiring layers are formed on both sides of the power supply layer, it is possible to obtain a wiring board having a larger wiring capacity than the first and second embodiments.

Embodiment 4 FIG. 6 is a sectional view showing a wiring board according to a fourth embodiment of the present invention. In the figure, parts corresponding to the respective parts in FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted. Reference numeral 313 denotes an insulating member provided between the power supply layer 301 and the earth layer 302. The adhesive layers 313a and 313b made of an adhesive material such as an epoxy resin or a polyimide resin and a high dielectric constant provided between the adhesive layers. It is integrally formed with a dielectric layer 313c made of a high dielectric material or a ferroelectric material. Here, the number of the adhesive layer and the number of the dielectric layers provided between the layers are not limited.

According to the above embodiment, since the insulating member 313 having the dielectric layer 313b is provided between the power supply layer 301 and the ground layer 302, the power supply layer 301 and the ground layer 3 are provided.
02, and has the same function as connecting a large-capacity capacitor between the power supply and the ground, so that the power supply and the ground when a semiconductor element or the like driven at high speed is mounted are connected. Noise generated therebetween can be reduced.

Embodiment 5 FIG. 7 is a sectional view showing a wiring board according to a fifth embodiment of the present invention. In the figure, parts corresponding to the respective parts in FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted. Reference numeral 301a denotes an uneven portion formed on the inner surface of the power supply layer 301 made of a conductive plate such as a copper plate, an iron nickel plate, or an aluminum plate, that is, a bonding surface with the insulating member 303; Concave and convex portions formed on the inner surface of the earth layer 302 made of a conductive plate, that is, the bonding surface with the insulating member 303, the concave portion corresponding to the convex portion on the power supply layer side, and the convex portion corresponding to the concave portion on the power supply layer side. ing. Here, the concavo-convex portions formed on the power supply layer and the ground layer are not limited to wavy shapes, and may be, for example, concavo-convex portions having corner portions.

According to the above-described embodiment, the power supply layer 301 and the earth layer 302 are provided on the joint surface with the insulating member 303 by the uneven portions 3.
01a and 302a, the opposing area between the power supply layer and the ground layer increases, so that the floating capacitance between the layers increases, so that noise generated between the power supply and the ground can be reduced, and the junction can be reduced. By increasing the area, the adhesive strength between the layers can be increased.

Sixth Embodiment In the first embodiment, one power supply layer 301 is laminated on one earth layer 302. However, as a sixth embodiment, as shown in FIG. And two power supply layers 30 via insulating members 303-1 and 303-2.
The power supply layer 60 may be formed by laminating 1-1 and 301-2.

Embodiment 7 As a seventh embodiment, as shown in FIG. 9, a part of the power supply layer 60 shown in FIG. 8 is modified to form a power supply layer 70, and signal wiring layers are formed on both sides of the power supply layer 70. By forming the wiring 10, it is possible to obtain a wiring board having a larger wiring capacity than that of the sixth embodiment. Needless to say, the number of power supply layers and earth layers constituting the power supply layer in each of the above embodiments is not limited at all.

[0029]

As described above, according to the present invention, it is possible to obtain a wiring board which can supply a large current and has an excellent heat radiation effect. By forming signal wiring layers on both sides of the power supply layer, a wiring board having a large wiring capacity can be obtained. In addition, by providing an insulating member having a dielectric layer between the power supply layer and the ground layer, the stray capacitance between the power supply layer and the ground layer is increased, and a semiconductor element or the like driven at a high speed is mounted. Noise generated between the power supply and the ground at the time can be reduced. In addition, the power supply layer and the earth layer have irregularities on the joint surface with the insulating member,
Since the facing area between the power supply layer and the ground layer increases, the stray capacitance between the layers increases, so that noise generated between the power supply and the ground can be reduced. Can be enhanced. Further, according to the present invention, a thin and light wiring board can be easily and inexpensively manufactured by a very simple method of heating and pressing using a conductive plate and an insulating member.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a wiring board according to Embodiment 1 of the present invention.

FIG. 2 is a cross-sectional view illustrating a manufacturing process of the wiring board according to the first embodiment of the present invention.

FIG. 3 is a sectional view showing a wiring board according to a second embodiment of the present invention.

FIG. 4 is a cross-sectional view showing a step of manufacturing a wiring board according to Embodiment 2 of the present invention.

FIG. 5 is a sectional view showing a wiring board according to Embodiment 3 of the present invention.

FIG. 6 is a sectional view showing a wiring board according to Embodiment 4 of the present invention.

FIG. 7 is a sectional view showing a wiring board according to a fifth embodiment of the present invention.

FIG. 8 is a sectional view showing a wiring board according to Embodiment 6 of the present invention.

FIG. 9 is a sectional view showing a wiring board according to Embodiment 7 of the present invention.

FIG. 10 is a cross-sectional view showing a conventional wiring board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Signal wiring layer 30 Power supply layer 107 Via hole 108 Via hole 301 Power supply layer 302 Ground layer 301a Through hole 302a Projection 303 Insulating member 31 Power supply layer conductive plate 33 Adhesive sheet 32 Ground layer conductive plate 42 Ground layer Conductive plate 100 Upper die 110 Lower die 110a Projection 40 Power supply layer 50 Power supply layer 60 Power supply layer 70 Power supply layer

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H05K 3/46 H01L 23/12 H05K 1/02

Claims (7)

(57) [Claims] 1. A semiconductor device, a semiconductor device, a signal wiring layer on which electronic components such as a resistor are mounted, and first and second via holes provided in the signal wiring layer, the device and the component being connected to each other. In a wiring board having a power supply layer for supplying a current, the power supply layer includes a first conductive plate connected to the first via hole, and a second via hole penetrating the conductive plate. A wiring board, comprising: a second conductive plate having a protrusion connected to the second conductive plate; and an insulating member for electrically insulating the conductive plate from each other. 2. A signal wiring layer on which electronic components such as a semiconductor element, a semiconductor device, and a resistor are mounted on both surfaces, and first, second, and third signal wiring layers provided on each signal wiring layer.
In a wiring board having a power supply layer for supplying a current to the element or component via a fourth via hole, the power supply layer is connected to the first and second via holes respectively connected to the second and third via holes. A conductive plate, a protrusion formed on the conductive plate, and penetrating through the other conductive plate and connected to the fourth and first via holes, respectively; And an insulating member that electrically insulates the wiring board. 3. The wiring board according to claim 1, wherein the insulating member is made of an adhesive material. 4. The wiring board according to claim 1, wherein the insulating member comprises an adhesive layer and a dielectric layer formed between the adhesive layers. 5. The wiring board according to claim 1, wherein the first and second conductive plates are formed so that their joint surfaces with the insulating member are uneven. 6. A wiring board having a signal wiring layer on which electronic components such as a semiconductor element, a semiconductor device, and a resistor are mounted, and a power supply layer for supplying current to the elements and components, wherein one of the conductive plates is The holes formed, the protrusions formed on the other conductive plate, and the holes formed on the insulating sheet are aligned with each other, and the conductive plates are laminated via an insulating sheet between the conductive plates. Forming a power supply layer by heating and pressing to form a power supply layer, and then forming a signal wiring layer on the power supply layer. 7. A wiring board having a signal wiring layer on which electronic components such as a semiconductor element, a semiconductor device, and a resistor are mounted, and a power supply layer for supplying a current to the element or the component, includes a pair of conductive plates. An insulating sheet is disposed on the conductive sheet, and the holes formed in one conductive plate and the holes formed in the insulating sheet are aligned with each other using an upper die and a lower die provided with projections in a state where they are aligned. Pressing and forming a projection penetrating the hole of the insulating sheet by plastic deformation on a part of the other conductive plate by the lower mold projection, and forming a flat part at the tip of the projection by the upper mold. A method for manufacturing a wiring board, comprising: forming a power supply layer by heating, forming a power supply layer, and then forming a signal wiring layer on the power supply layer.