JP2800744B2 - Semiconductor device package - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package for a semiconductor device, and more particularly to a package having a heat sink attached to a package body.

[0002]

2. Description of the Related Art In order to effectively radiate heat generated in a semiconductor device, a radiator is mounted on a package of the semiconductor device. A semiconductor device having such a configuration is disclosed in Japanese Utility Model Laid-Open Publication No. 64-44643,
There is one proposed in Japanese Patent No. 2953. The former is
As shown in FIG. 5, a radiator plate 22 is mounted on a package of a DIP type semiconductor device 21, and spring pieces 23 are integrally provided at both ends of the radiator plate, respectively. The heat sink 22 is fixedly supported by the semiconductor device 21 by sandwiching both ends of the package body 21.

In the latter, as shown in FIG. 6, a heat radiator 32 having an inverted tapered side surface is integrally provided on an upper surface of a package body of a pin grid array type semiconductor device 31. The heat radiating plate 33 having the heat radiating fins 34 integrally is engaged with and fixedly supported. In each of these semiconductor devices, the heat sink 22,
33 is formed separately from the semiconductor devices 21 and 31,
Since the heat sink can be attached after the package of the semiconductor device is formed, it is advantageous in simplifying the manufacturing process.

[0004]

However, in the technique shown in FIG. 5, the heat radiating plate 22 is fixed to the side surface of the flat package body of the semiconductor device 21 by using a spring force. When a lateral force is applied, the heat sink 22 may be easily moved with respect to the semiconductor device 21 and may be detached from the package body. Also, if this structure is applied to a flat type package in which the leads protrude from the four peripheral side surfaces of the package body, the spring pieces 23 interfere with the leads when the heat sink is moved,
Problems such as bending of the leads or short-circuiting of adjacent leads are likely to occur.

[0005] The technique shown in FIG.
Since the heat radiator 32 is integrally formed with the one package body, it cannot be denied that the number of manufacturing steps of the package body becomes more complicated than that of the semiconductor device described in the former publication. In addition, since the radiator 32 protrudes from the surface of the package body, in order to move the semiconductor device by the transport rail of the assembling / manufacturing apparatus, a design change or a new design is required so that the radiator plate 32 does not interfere with the rail or the like. It is necessary to introduce equipment, which is not preferable in order to generalize the manufacturing apparatus and reduce the price. Further, since it is necessary to attach and detach the heat radiating plate 33 to and from the package main body, if there is no space in the horizontal direction of the mounted semiconductor device, the heat radiating plate 3
Maintenance work when exchanging 3 becomes difficult.

SUMMARY OF THE INVENTION An object of the present invention is to solve the conventional problems as described above, to assemble the apparatus without changing the equipment, to make it easy to mount the radiator to the package body, and to connect the radiator to the package body. An object of the present invention is to provide a semiconductor device package that can be stably fixed and supported.

[0007]

The package of the present invention comprises:
The package body containing the semiconductor element is provided with a concave groove or a through groove at positions closer to the center than the side surfaces in the plane direction, and provided in the package body .
A part of the radiator attached closely to the flat upper surface
The provided engaging piece is located outside the side of the package body.
It is configured to be engaged with the concave groove or the through groove without being projected to the side . This engaging portion is formed as a concave groove formed by recessing the opposite side surface of the package body having a rectangular planar shape toward the center , or through a portion close to the side surface in a vertical direction.
It is configured as a groove . Further, the radiator has a flat plate portion having substantially the same shape as the flat shape of the package body of the semiconductor device,
Each of the opposing sides of the flat plate portion is formed in the shape of a tongue, and this part is bent downward to form an engagement piece.

[0008]

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a partially exploded perspective view of an embodiment in which the present invention is applied to a flat-type package semiconductor device,
FIG. 2 is a plan view and a front view in which a part of the assembled state is cut away. The semiconductor device 1 has a flat resin package body 2 having a substantially square planar shape. Inside the package body 2, a semiconductor element chip (not shown) is mounted. The lead 3 made of a large number of metallic materials electrically connected to the chip is
And the tip of each lead 3 is formed to be bent along the same plane as the bottom surface of the package body 2. In this embodiment, the lead 3 is not provided in the central region of each of the pair of side surfaces of the package body 2 facing each other. It is recessed in the direction, and a concave groove 4 is formed.

On the other hand, the radiator 11 is formed of a metal material having high thermal conductivity and spring properties, and has a flat plate portion 12 having a shape substantially similar to the flat shape of the package body 2.
And a number of radiating studs 13 or radiating fins erected on the upper surface of the flat plate portion 12. A cut groove 14 is formed on a pair of opposing sides of the flat plate portion 12 so as to form a tongue shape at a substantially central portion thereof, and the tongue-like portion is turned downward by 90 degrees. Are bent at a large angle to form the engagement pieces 15. In addition, the width dimension of these engagement pieces 15 and each engagement piece 15
The interval between them is set to a length substantially equal to the width dimension and the interval of the pair of concave grooves 4 provided in the package body 2.

Therefore, when attaching the radiator 11 to the semiconductor device 1 configured as described above, the radiator 1
The lower surface of the flat plate portion 12 is brought into contact with the upper surface of the package body 2. Then, the flat plate portion 12 is brought into close contact with the package main body 2 by making the pair of engagement pieces 15 of the radiator 11 enter into the pair of concave grooves 4 of the package main body 2 and pressing strongly, and at the same time, The engagement piece 15 is elastically contacted with the bottom surface of the concave groove 4 while deforming the spring. Thereby, the engagement piece 1
5 is engaged with the package body 2 between the concave grooves 4 by its own spring force, and as a result, the radiator 11 is integrated with the package body 2.

In the assembled state as shown in FIG. 2, the engaging piece 13 is engaged with the package body 2 by its own spring force in the thickness direction, and the concave groove 4 is formed in the width direction. By being in contact with both side surfaces, the position of the radiator 11 in the planar direction with respect to the package body 2 is restricted. Therefore, even when an external force is applied to the radiator 11, the radiator 11 is moved with respect to the package
The lead 5 is prevented from interfering with the lead 3, and the lead 3 is not bent or short-circuited. In addition, since the engaging force of the engaging piece 15 is also generated in the thickness direction of the flat plate portion 12, the flat plate portion 12 comes into close contact with the upper surface of the package body 2, and the heat is radiated from the package body 2. The efficiency of conducting heat to the vessel 11 is enhanced, and the heat dissipation of the semiconductor device 1 is enhanced.

Further, in this configuration, since there is no need to form any protrusions on the upper surface or side surface of the package body 2, even when the semiconductor device 1 is transported using the transport rail of the assembly and manufacturing apparatus. There is no problem, and the existing equipment can be used as it is, and no design change or new equipment is required. Further, when manufacturing the package body 2, it is possible to easily cope with the situation by partially changing the existing lead pattern and partially changing the resin molding die of the package body. In this case, the mold can be easily changed by simply providing a nest having a shape corresponding to the concave groove in the mold. Further, the lead pattern can be dealt with by distributing the lead existing in the concave groove to another side.

Here, when there is room for the number of leads arranged on the side surface of the package body, as shown in FIG.
Are formed, and each of the grooves 4 is also formed in the flat plate portion 12 of the radiator 11.
May be formed on each of the four sides. With this configuration, the engagement force is increased by the amount of the increased number of engagement portions between the radiator and the package body, and more stable fixing and support of the radiator can be achieved.

Alternatively, as shown in FIG. 4, near the opposing sides of the package body 2, a narrow through groove 5 which penetrates the package body up and down is formed. 15 may be fitted into the through-groove 5, and the inner surface of the through-groove 5 may be engaged with the engaging piece 15 by elastic contact. Further, in this case, the through groove 5 does not necessarily have to penetrate to the lower surface of the package body 2 and may be formed as a blind groove having a predetermined depth. What is necessary is just to design suitably according to it.

Also in the embodiments shown in FIGS. 3 and 4, the radiator 11 is firmly and securely attached to the package body 2 of the semiconductor device 1 by the engaging force between the engaging piece 15 and the concave groove 4 or the through groove 5. It can be stably supported, and a suitable heat radiation effect can be obtained. In addition, since the concave groove 4 and the through groove 5 do not protrude from the side surface of the package body 2, the design change of the assembly / manufacturing apparatus is unnecessary, and the semiconductor device itself can be easily manufactured. The same effect as that of the embodiment can be obtained.

The above embodiment shows an example in which the present invention is applied to a semiconductor device having a flat package structure. However, the present invention is applied to semiconductor devices having various package structures such as a DIP package and a grid array package. It is possible. Further, the process of forming the engaging portion such as a concave groove or a through groove on the side surface of the package body is slightly complicated as compared with the above embodiment, but the present invention is also applied to a package body formed of ceramic, alumina, or the like. It is possible to do.

[0017]

As described above, according to the present invention, a concave groove or a through groove is provided on the side of the package body in which the semiconductor element is mounted, at a position closer to the center than the side.
An engaging piece provided on a part of the radiator closely attached to the upper surface of the package body is located on the side of the package body.
The radiator is mounted on the package body by being engaged with the concave groove or the through groove in a state where the radiator is not protruded to the outside. It is engaged with the main body and has a groove in its width direction.
Alternatively , the radiator is constrained in the planar direction with respect to the package body by being in contact with both side surfaces of the through groove . Therefore, even when an external force is applied to the radiator, the radiator is moved with respect to the package main body, and the engagement piece is prevented from interfering with the lead, so that the lead is not bent or short-circuited. Further, it is rather name that any of the projections on the upper surface and side surfaces of the package body is present, in particular the package body
By Ino Do that engagement piece is projected from the side surface, the assembly using the transport rails of the manufacturing devices never trouble occurs also, unnecessary design changes and new facilities available existing ones as Becomes

[Brief description of the drawings]

FIG. 1 is a partially exploded perspective view of an embodiment of the present invention.

FIGS. 2A and 2B are a plan view and a front view, respectively, in which a part of an assembled state of the semiconductor device of FIG.

FIG. 3 is a plan view of another embodiment of the present invention.

FIG. 4 is a plan view and a partially cutaway front view of still another embodiment of the present invention.

FIG. 5 is a side view showing an example of a conventional package.

FIG. 6 is a side view showing another example of a conventional package.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 semiconductor device 2 package body 3 lead 4 concave groove 5 through groove 11 radiator 12 flat plate portion 15 engagement piece

Claims (5)

(57) [Claims] [Claim 1] and interior of the semiconductor element, the semiconductor device comprising a package body protruding leads from the sides or bottom, said package body being disposed opposite to each other in the planar direction, and the position of the center side than the side surface grooves or through grooves are respectively provided, also arranged in a flat close state flat plate portion of the radiator on the upper surface of the package body
Is, and the engagement piece provided on a part of the radiator is the
Projected outside the side surface of the package body
Packages that wherein a Rukoto engaged with the groove or the through grooves in the absence. Wherein said concave groove, the package of the semiconductor device according to claim 1 in which the planar shape is Hekomase toward the opposite sides of the <br/> package body in which the rectangles each center side. 3. The through-groove has a rectangular shape when viewed from above.
Located at the center of the package body
Through the package body in the vertical direction
The package of the semiconductor device according to claim 1, wherein the package is formed. Wherein said radiator has a flat plate portion of substantially the same shape as the planar shape of the package body of the semiconductor device, each part of the opposing sides of the flat plate portion is formed in a tongue shape, and package of the semiconductor device according to any one of claims 1 to 3 this part of the engagement piece is formed bent downward. 5. The semiconductor device package according to claim 4 , wherein the flat plate portion of the radiator is formed of a material having high thermal conductivity having a spring property.