JP2798274B2 - Manufacturing method of chip-shaped parts - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Summary] The present invention relates to a method for manufacturing a chip-shaped component, and aims at producing a substrate to be processed on which a process required for manufacturing a chip-shaped component is performed without requiring slicing. By bonding the long side surfaces or short side surfaces of a plurality of strip-shaped ceramic substrates having the overall shape when a plurality of chip-shaped component substrates to be manufactured are aligned in one direction in an adjacent state, The plurality of strip-shaped ceramic substrates are connected to form a single substrate to be processed, necessary processing is performed in the state of the substrate to be processed, and then dicing and a bonding portion of the substrate to be processed are performed. And peeling off to form individual chip-shaped components.

[Industrial application field] The present invention relates to a method for manufacturing a chip-shaped component.

Generally, when manufacturing chip-shaped parts such as ceramic parts such as sliders of a magnetic head, first, a ceramic material formed by sintering a plate material or a prism material of a size that can be obtained in large numbers is sliced and processed. A substrate is cut out, and processing (for example, various processings such as grinding, lapping, and polishing) is performed in this state, and a large number of parts are processed at a time. Then, the substrate to be processed is diced and individually processed. It is a chip-shaped part.

The present invention particularly provides a plurality of chip-shaped component substrates, and a plurality of strip-shaped ceramic substrates having an overall shape when aligned in one direction in a state of being adjacent to each other. By bonding the side surfaces or the short side surfaces to each other, the plurality of strip-shaped substrates are connected to form one substrate to be processed, and a means for performing necessary processing on the substrate to be processed is provided. .

[Prior Art] A conventional method of manufacturing a magnetic head component, which is an example of a chip-shaped component, is as shown in FIG.

In other words, ′
Create 11.

′ Slicing the material 11 to make the substrate 12,
The substrate is subjected to processing including polishing, polishing, and various processing.

′ Individual magnetic head parts 13 are prepared by dicing.

'Attach other components to the individual magnetic heads 13 to produce the final product 14.

It consists of each process.

[Problems to be Solved by the Invention] In the method of manufacturing a magnetic head component shown in FIG. 3, the substrate is formed by slicing the material 11 in the step (1). For this reason, cracks are generated on the substrate, and slicing processing distortion remains. Then, due to the processing distortion, the rate at which defective products are generated by the subsequent processing increases. In addition, before the individual magnetic head parts are formed, it is necessary to perform a total of three times of slicing processing in the step of ′ and dicing processing in two directions in the step of ′. Is also expensive.

Therefore, the present invention provides a means for producing a strip-shaped substrate to be processed without the need for slicing, and for dicing only one direction in order to make individual chip-shaped components. It is intended to solve the above problems.

[Means for Solving the Problems] The present invention focuses on the fact that a ceramic substrate can be easily formed without the need for slicing if it is a rectangular substrate, and processing is performed based on this rectangular substrate. In addition, since the processing unit becomes smaller in the strip-shaped substrate, a plurality of the strip-shaped substrates are further bonded side by side to create a large wafer-shaped processing substrate, and the conventional processing is performed using the processing substrate. This makes it possible to perform processing with greatly improved efficiency as compared with the processing of magnetic head parts described above.

FIG. 1 is an explanatory view of an embodiment in which the method of the present invention is applied to the case of manufacturing a magnetic head slider as a magnetic head component.

 Hereinafter, the principle of the present invention will be described with reference to FIG.

In FIG. 1, reference numeral 1 denotes a strip-shaped substrate made of ceramic or the like, which has the same shape as a plurality of substrates of the magnetic head slider 5 to be manufactured, which are aligned in one direction in an adjacent state. They are almost the same strip shape.

Reference numeral 2 denotes a substrate to be processed formed by bonding and connecting the long side surfaces 6 of different strip-shaped substrates 1 to each other.

Reference numeral 3 denotes a processing table on which the substrate to be processed 2 is placed and supported.

Reference numeral 4 denotes a positioning unit for positioning the substrate to be processed 2 on the table 3.

Reference numeral 5 denotes a magnetic head slider.

6 is a long side surface of the strip-shaped substrate 1.

Here, the manufacturing process of the magnetic head slider 5 is as follows.

That is, each surface (all six surfaces) of a ceramic strip-shaped material prepared by a known ceramic molding method is precision-processed, and a strip-shaped substrate 1 (a size of a plurality of chip-shaped components to be manufactured is arranged). For example, a plurality of pieces having a thickness of 0.5 mm, a width of 2.5 mm, and a length of 100 mm) are prepared.

By bonding the long side surfaces 6 of the strip-shaped substrates 1 to each other, a substrate 2 to be processed in which a plurality of strip-shaped substrates are connected is created.

The substrate to be processed 2 is placed on the table for processing 3 and pressed against the positioning portion 4 to set the substrate for processing 2 at a predetermined position on the table for processing 3. Then, processing such as polishing, lapping, and polishing is performed on the surface portion (upper surface) of the processing target substrate 2 supported by the processing table 3.

The bonded portion of the processed substrate 2 is peeled off to return to the original plural strip-shaped substrates 1.

Each of the strip-shaped substrates 1 is diced into individual magnetic head sliders 5.

In this process, a magnetic head slider is manufactured.

[Operation] As described above, the steps of the present invention are particularly different from the steps of manufacturing the conventional magnetic head slider. That is, a plurality of substrates of chip-like components for manufacturing purposes, a plurality of rectangular substrates having the overall shape when aligned in one direction in an adjacent state are prepared, and the long sides of different rectangular substrates are bonded to each other. Thus, the plurality of strip-shaped substrates are connected to form one substrate to be processed.

Therefore, phenomena such as generation of cracks due to slicing and residual slicing distortion do not occur, and generation of defective products can be suppressed as much as possible.

Embodiment As described above, FIG. 1 shows an embodiment in the case of a magnetic head slider. Here, the order is reversed from the above-mentioned step, and as shown in FIG. 2, after processing, the substrate 2 to be processed is diced in a direction crossing the long side surface 6 to form a single magnetic head slider. It is also possible to manufacture individual magnetic head sliders by making the side surfaces adhere to each other and then peeling off the adhered portions. Further, in producing the substrate to be processed 2 in which a plurality of strip-shaped substrates 1 are connected, instead of bonding the long side surfaces 6 to each other, the short side surfaces 7 of the strip-shaped substrate 1 may be bonded to each other. Good.

[Effects of the Invention] Since the present invention is configured as described above,
It has the following effects.

(A) The occurrence of cracks due to slicing and the occurrence of residual slicing distortion do not occur, and the occurrence of defective chip-shaped components can be suppressed as much as possible. In addition, only one dicing process in one direction in the above-described process is required before each individual IC chip is formed, and the incidence of cracks due to the cutting process is reduced.

(B) Since the shape of the substrate to be processed is configured by using the same strip-shaped one as a unit in which the substrates of the chip-shaped components are arranged in-line, there is no wasted portion of the substrate material.
Cost reduction as a whole can be achieved.

(C) At the time of the processing in the above-mentioned step, the adhesive bonding the strip-shaped substrates acts as a chemical sealing, so that generation of unnecessary chemical action can be prevented.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing an embodiment of the present invention, FIG. 2 is an explanatory view showing another embodiment of the present invention, and FIG. 3 is an explanatory view showing a conventional example. In Fig. 1 and Fig. 2, 1 ... strip-shaped substrate 2 ... substrate to be processed (wafer-shaped) 3 ... processing table 4 ... positioning part 5 ... chip-shaped component (magnetic head slider) 6 ... … Long side of strip-shaped substrate 7 …… Shorten side of strip-shaped substrate

Continuation of the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) B28D 1/22 B28B 11/14 G11B 5/127

Claims (2)

(57) [Claims] 1. A method for manufacturing a plurality of chip-shaped component substrates, comprising:
By bonding the long side surfaces or the short side surfaces of a plurality of strip-shaped ceramic substrates having an overall shape when aligned in one direction in an adjacent state, the plurality of strip-shaped ceramic substrates are connected to each other to form a one-piece. A plurality of substrates to be processed are prepared, necessary processing is performed in the state of the substrate to be processed, and then, an adhesive portion of the substrate to be processed is peeled off, and the state of the original plurality of strip-shaped substrates is removed. Next, a dicing process is performed on each of the strip-shaped substrates to cut out individual chip-shaped components. 2. The method according to claim 1, wherein a plurality of chip-shaped component substrates to be manufactured are provided.
By bonding the long side surfaces or the short side surfaces of a plurality of strip-shaped ceramic substrates having an overall shape when aligned in one direction in an adjacent state, the plurality of strip-shaped ceramic substrates are connected to each other to form a one-piece. A plurality of substrates to be processed are prepared, necessary processing is performed in the state of the substrate to be processed, and then the plate to be processed is diced in a direction crossing the bonding surface to obtain a single chip. A method of manufacturing a chip-shaped component, wherein the side surfaces of the substrate of the chip-shaped component are adhered to each other, and then the bonded portions of the side surfaces are peeled off to form individual chip-shaped components.