JP2790582B2 - Semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a method for cooling a semiconductor device having a water-cooled radiator.

[0002]

2. Description of the Related Art The structure of a conventional water-cooled semiconductor device will be described with reference to FIGS. 4 and 5
1 is a diagram showing a cross section of a conventional semiconductor device disclosed in, for example, Japanese Utility Model Laid-Open No. 55-154556, and a perspective view showing a water-cooled radiator of the conventional semiconductor device.

In FIGS. 4 and 5, reference numeral 1 denotes a semiconductor element;
Reference numeral 10 denotes a water-cooled radiator (water-cooled block), 4 denotes a water channel, and 5 denotes a hose joint for mounting a hose attached to the entrance of the water channel 4.

As shown in FIG. 4, a semiconductor element 1 is used by applying a pressing force in the direction of the arrow shown in the figure. In FIG. 4, the holding mechanism of the pressing force is omitted. FIG.
FIG. 2B is a cross-sectional view taken along a line AA in FIG.

Generally, when the semiconductor element 1 is operated, a power loss occurs due to the voltage drop. This power loss raises the internal temperature of the semiconductor element 1, and if the temperature rise is large, the performance of the semiconductor element 1 is significantly reduced, and the semiconductor element 1 cannot be used. For this reason, in a semiconductor device, an appropriate radiator is used to release heat generated by the semiconductor element 1 to the outside, thereby suppressing a temperature rise to a specified value.

In the conventional water-cooled semiconductor device shown in FIG. 4, the power loss of the semiconductor element 1 is transmitted from both sides to a water-cooled radiator (water-cooled block) 10,
The water is absorbed by the water and released to the outside.

The heat radiation effect is related to the length and shape of the water channel 4,
In order to dissipate a power loss ranging from 1 kilowatt (KW) to several kilowatts, for example, it is necessary to form a U-shaped water channel 4 as shown in FIG.

[0008]

In the conventional semiconductor device as described above, the formation of the water passage 4 in the water-cooled radiator (water-cooled block) 10 is generally performed by machining, as shown in FIG. If the shape becomes complicated, the processing time becomes extremely long and the cost increases, and the weight of the water-cooling block also increases. In addition, it is difficult to form the water channel 4 smoothly by the above-mentioned machining method, so that the water pressure required for flowing the same amount of water is high,
That is, there is a problem that a loss of head becomes large.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has as its object to provide a semiconductor device capable of reducing the weight, reducing the head loss, and reducing the cost.

[0010]

According to a first aspect of the present invention, there is provided a semiconductor device having a water-cooled radiator for cooling the semiconductor element by pressing against the semiconductor element.
The water-cooled radiator is configured by joining a pair of thin metal plates,
Forming a water channel in a part of the junction , and
The size of at least the water between the
A metal plate extending to the road is interposed .

[0011]

[0012]

In the semiconductor device according to the first aspect of the present invention, since the water-cooled radiator is formed by using two thin metal plates, the weight can be reduced, and a smooth water channel can be easily formed in the manufacturing process. The formation can also greatly reduce the head loss. Further, there is an advantage that the cost can be extremely reduced as compared with the conventional processing method since complicated machining is not required. Also, half
With a metal plate interposed between the conductor element and the water-cooled radiator
Heat dissipation can be further improved.

[0013]

[0014]

Embodiment 1 Hereinafter, the configuration of the first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a diagram showing a cross section of Embodiment 1 of the present invention. FIG. 2 is a diagram showing a water-cooled radiator according to Embodiment 1 of the present invention. In addition,
FIG. 2B is a cross-sectional view taken along the line AA in FIG.

1 and 2, reference numeral 1 denotes a semiconductor element;
Reference numerals 2 and 3 denote metal thin plates, 4 denotes a water channel, 5 denotes a hose joint attached to the entrance of the water channel 4, and 10A denotes a water-cooled radiator.
In the drawings, the same reference numerals indicate the same or corresponding parts.

The metal sheets 2 and 3 are made of, for example, copper,
The thickness of the thin metal plate 2 is about 2.0 to 3.0 mm, and the thickness of the thin metal plate 3 is about 1.0 to 1.5 mm.

As a method of forming the water channel 4, a portion corresponding to the water channel 4 is formed in advance by pressing one of the metal sheets 3, and the metal sheet 3 is pressed or bonded to the other metal sheet 2. In addition to this method, there is a method in which air is press-fitted into a portion where the water channel 4 is formed after two metal sheets are pressed.

The semiconductor element 1 is used with a pressing force applied in the direction of the arrow shown in FIG. In FIG. 1, the pressing force holding mechanism is omitted because it does not directly relate to the description of the first embodiment of the present invention.

In the semiconductor device constructed as shown in FIG. 1, the power loss generated in the semiconductor element 1 is dissipated as heat from both sides and flows in the direction of the arrow (heat flow) shown in FIG. Is done.

The first embodiment of the present invention, as described above,
In a semiconductor device having a water-cooled radiator 10A pressed against one or both surfaces of the semiconductor element 1, the water-cooled radiator 10A
Is formed by joining two metal thin plates 2 and 3 by pressure bonding or bonding, and forms a water passage 4 in a part of the joint.

That is, the water-cooled semiconductor device according to the first embodiment of the present invention has two relatively thin metal sheets 2 and 3 as shown in FIG.
And a water-cooled radiator 10A in which a water passage 4 is formed in a part of the joint portion, and a semiconductor device having the configuration shown in FIG. 1 is provided. Therefore, the weight is reduced, the smooth water channel 4 is formed, and the head loss is reduced. Also, there is an effect that a low-cost product can be obtained.

Embodiment 2 FIG. In the case of the first embodiment described above, considering the heat path, the metal thin plate 2 is a thin plate, so that the conduction thermal resistance is relatively large, and there is a limit to the heat radiation of large power. In order to further improve this, in the second embodiment, another metal plate 6 is inserted between the semiconductor element 1 and the thin metal plate 2 as shown in FIG. The metal plate 6 is made of, for example, copper, and has a thickness of about 3.0 to 5.0 mm.

The role of the metal plate 6 is important, and serves to conduct heat sufficiently to the upper part of the water channel 4. The thickness of the metal plate 6 can be arbitrarily set, but this may be determined in relation to the calorific value. Even if the thin metal plate 2 is thin, the semiconductor device according to the second embodiment can perform extremely high-performance cooling due to the presence of the metal plate 6.

In the second embodiment, the effect of improving the thermal resistance characteristic is improved by interposing a metal plate 6 having such a size that its end face extends at least above the water channel 4 between the semiconductor element 1 and the thin metal plate 2. Play. That is, there is an effect that heat dissipation is further improved.

The second embodiment is not limited to the semiconductor device having the water-cooled radiator 10A on both sides of the semiconductor element 1, but may have the water-cooled radiator 10A on only one side of the semiconductor element 1.

[0026]

As described above, the semiconductor device according to the first aspect of the present invention includes a water-cooled radiator that presses against a semiconductor element and cools the semiconductor element. The vessel is formed by joining a pair of metal sheets, forming a water channel in a part of the joint , and
When the size is small between the semiconductor element and the water-cooled radiator
Also , since the metal plate extending to the water channel is interposed , the weight can be reduced, and a smooth water channel can be formed, so that the head loss can be reduced. Further, there is an effect that the cost can be reduced. More heat dissipation
The effect that the property can be improved is produced.

[0027]

[Brief description of the drawings]

FIG. 1 is a diagram showing a cross section of a first embodiment of the present invention.

FIG. 2 is a perspective view showing Embodiment 1 of the present invention.

FIG. 3 is a diagram showing a cross section of a second embodiment of the present invention.

FIG. 4 is a diagram showing a cross section of a conventional semiconductor device.

FIG. 5 is a perspective view showing a water-cooled radiator of a conventional semiconductor device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor element 2 Metal thin plate 3 Metal thin plate 4 Waterway 5 Hose joint 6 Metal plate 10A Water-cooled radiator

Claims (1)

(57) [Claims] 1. A semiconductor device having a water-cooled radiator that cools the semiconductor element by pressing against the semiconductor element, wherein the water-cooled radiator is formed by joining a pair of metal thin plates, Forming a water channel in the portion and the semiconductor element
And at least the waterway between the water-cooled radiator and
A semiconductor device comprising a metal plate extending up to the center .