JP2785153B2 - Capillary position detection device for ultrasonic bonding equipment - Google Patents

Capillary position detection device for ultrasonic bonding equipment

Info

Publication number
JP2785153B2
JP2785153B2 JP2198668A JP19866890A JP2785153B2 JP 2785153 B2 JP2785153 B2 JP 2785153B2 JP 2198668 A JP2198668 A JP 2198668A JP 19866890 A JP19866890 A JP 19866890A JP 2785153 B2 JP2785153 B2 JP 2785153B2
Authority
JP
Japan
Prior art keywords
capillary
bonding
support shaft
ultrasonic bonding
detection device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2198668A
Other languages
Japanese (ja)
Other versions
JPH04137545A (en
Inventor
聡蔵 鳥越
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Corp
Original Assignee
Kaijo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Corp filed Critical Kaijo Corp
Priority to JP2198668A priority Critical patent/JP2785153B2/en
Publication of JPH04137545A publication Critical patent/JPH04137545A/en
Application granted granted Critical
Publication of JP2785153B2 publication Critical patent/JP2785153B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301Capillary
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は超音波ボンデング装置のキャピラリ位置検出
装置に関するものである。
Description: TECHNICAL FIELD The present invention relates to a capillary position detecting device of an ultrasonic bonding device.

(従来技術) 例えば半導体素子の周辺部に設けた多数のバンブへの
リードの自動接続に使用される超音波ボンデング装置に
おいては、キャピラリの位置検出が必要である。そこで
従来においては次のような検出方法がとられている。即
ち第1図(a)(b)に示す平面図および側面図のよう
に、X−Y軸方向に移動しうるベッド(1)上に設けた
軸受(2)と支持軸(3)により支承されて、図示しな
い駆動源により図中矢印A−A′方向に往復回転運動す
るようにしたボンデングアーム(4)により、超音波ホ
ーン(5)の先端のキャピラリ(6)が図中B−B′方
向に往復回転運動しうるように形成されたボンデングヘ
ッドにおいて、支承軸(3)に、カップリング(7)に
よりロータリエンコーダ(8)を同軸的に取付けて、キ
ャピラリ(6)の位置を回転角度として検出することが
行われている。
(Prior Art) For example, in an ultrasonic bonding apparatus used for automatically connecting leads to a large number of bumps provided in a peripheral portion of a semiconductor element, it is necessary to detect a position of a capillary. Therefore, conventionally, the following detection method has been adopted. That is, as shown in the plan view and the side view shown in FIGS. Then, the capillary (6) at the tip of the ultrasonic horn (5) is moved by the bonding arm (4) made to reciprocate in the direction of arrow AA 'in the figure by a driving source (not shown). In a bonding head formed so as to be capable of reciprocating rotational movement in the direction '′, a rotary encoder (8) is coaxially attached to a bearing shaft (3) by a coupling (7) to adjust the position of the capillary (6). Detection as a rotation angle is performed.

(従来技術の問題点) しかし上記のようにロータリエンコーダによる検出に
は、次のような欠点がある。即ちキャピラリ(6)の往
復回転運動量は数mm程度であるため、その位置検出に当
たっては10μm以下の分解能が要求される。
(Problems of the prior art) However, as described above, the detection by the rotary encoder has the following disadvantages. That is, since the reciprocating rotational momentum of the capillary (6) is about several mm, a resolution of 10 μm or less is required for detecting the position.

従って例えば分解能を10μmに設定し、また支点即ち
支持軸(3)の中心からキャピラリ(6)の先端までの
距離を通常とられている100mmとした場合には、ロータ
リエンコーダ(8)に要求される支持軸(3)の1回転
当たりの出力パルス数は31400パルスと云う極めて多い
ものとなる。しかしこのような高分解能をもつエンコー
ダは現在のところ著しく高価であって、それだけボンデ
ング装置も高価となるため、製造コストの低減に大きな
障害になっているのが現状である。
Therefore, for example, if the resolution is set to 10 μm and the distance from the fulcrum, that is, the center of the support shaft (3) to the tip of the capillary (6) is 100 mm, which is usually taken, the rotary encoder (8) is required. The number of output pulses per rotation of the supporting shaft (3) is as large as 31400 pulses. However, encoders having such a high resolution are extremely expensive at the present time, and the bonding device is also expensive, which is a major obstacle to reducing the manufacturing cost.

(発明の目的) 本発明は上記のような問題点を解決した、超音波ボン
デング装置のキャピラリ位置検出装置の提供を目的とし
てなされたものである。
(Object of the Invention) The present invention has been made to provide a capillary position detecting device of an ultrasonic bonding device which solves the above-mentioned problems.

(問題点を解決するための本発明の手段) 本発明は支持軸の回転運動量を直線運動量に変換して
検出することにより、ロータリーエンコーダより低価額
の偏位センサ、例えば磁気近接センサや光変位センサを
用いて、ロータリエンコーダと変わることのない分解能
のもとに、キャピラリの回転運動量を検出できるように
したものである。次に実施例により本発明を詳細に説明
する。
(Means of the Invention for Solving the Problems) The present invention converts a rotational momentum of a support shaft into a linear momentum and detects the momentum. Using a sensor, the rotational momentum of the capillary can be detected under the same resolution as a rotary encoder. Next, the present invention will be described in detail with reference to examples.

(実施例) 第2図(a)(b)は本発明の一実施例を示す平面図
および側面図である。図において(1)はベッド、
(2)は軸受、(3)は支持軸、(4)はボンデングア
ーム、(5)は超音波ホーン、(6)はキャピラリであ
って、これらにより第1図と同様なボンデングヘッドを
形成し、キャピラリ(6)の先端がボンデング面(9)
に接したとき、支持軸(3)の中心がボンデング面
(9)に位置するように、ボンデング面(9)とボンデ
ングヘッドとは関係配置される。
(Example) FIGS. 2 (a) and 2 (b) are a plan view and a side view showing one embodiment of the present invention. In the figure, (1) is a bed,
(2) is a bearing, (3) is a support shaft, (4) is a bonding arm, (5) is an ultrasonic horn, and (6) is a capillary. These form a bonding head similar to FIG. And the tip of the capillary (6) is the bonding surface (9)
, The bonding surface (9) and the bonding head are arranged so that the center of the support shaft (3) is located on the bonding surface (9).

(10)は本発明の要部であるキャピラリ位置検出装置
であって、次の各部からなる。(11)は検出用円板であ
って、支持軸(3)の中心軸と直角な線(12)に対して
角度θだけ傾斜し、かつ傾斜方向がベッド(1)面と平
行になるように支持軸(3)の一端に同軸的に固定され
る。(13)は磁気近接センサであって、検出用円板(1
1)の中心を通る水平線上、即ちボンデング面(9)上
に中心軸が位置するように、支持軸(3)の中心と偏心
させて設けられる。
(10) is a capillary position detecting device as a main part of the present invention, and comprises the following components. (11) is a detection disk which is inclined by an angle θ with respect to a line (12) perpendicular to the center axis of the support shaft (3), and whose inclination direction is parallel to the bed (1) surface. Is coaxially fixed to one end of the support shaft (3). (13) is a magnetic proximity sensor, and a detection disk (1
It is provided eccentrically with the center of the support shaft (3) so that the center axis is located on a horizontal line passing through the center of 1), that is, on the bonding surface (9).

(作 用) ボンデングアーム(4)を、図示しない駆動源により
支持軸(3)を介して第2図(b)の矢印B−B′の範
囲において往復回転運動させ、これによりボンデング面
(9)を基準として、キャピラリ(6)に往復回転運動
を行わせてボンデングを行う。すると検出用円板(11)
も第2図(b)中の矢印A−A′の範囲内において往復
回転運動を行う。このため検出用円板(11)の磁気近接
センサ(13)との対設距離δは、支持軸(3)の回転角
度が大になるのに伴い大となり90度において最大にな
る。即ち今支持軸(3)の回転角度をπとしたとき、検
出用円板(11)の傾き角度θは回転角度πに対する変位
量δの係数であるので、回転角度が90度の範囲内におい
てはπは π=θδ ……(1) によって与えられ、支持軸(3)の回転運動量は直線運
動量し変換される。従って磁気近接センサ(13)は、支
持軸(3)の回転角度、従ってキャピラリ(6)の回転
角度πの変化に比例して変化する検出用円板(11)の変
位量を読み取る。従って磁気近接センサ(13)の電気的
信号を読み取ることにより、支持軸(3)の回転量を検
知することができ、キャピラリ(6)の位置の検出が可
能である。
(Operation) The bonding arm (4) is reciprocated in the range of the arrow BB ′ in FIG. 2 (b) through the support shaft (3) by the driving source (not shown), thereby the bonding surface (9). The bonding is performed by causing the capillary (6) to perform a reciprocating rotational movement on the basis of ()). Then the detection disk (11)
Also performs a reciprocating rotational movement within the range of arrows AA 'in FIG. 2 (b). Therefore, the distance δ between the detection disk (11) and the magnetic proximity sensor (13) increases as the rotation angle of the support shaft (3) increases and becomes maximum at 90 degrees. That is, assuming that the rotation angle of the support shaft (3) is π, the tilt angle θ of the detection disk (11) is a coefficient of the displacement δ with respect to the rotation angle π. Is given by π = θδ (1), and the rotational momentum of the support shaft (3) is converted into a linear momentum. Accordingly, the magnetic proximity sensor (13) reads the amount of displacement of the detection disk (11), which changes in proportion to the change in the rotation angle of the support shaft (3), that is, the change in the rotation angle π of the capillary (6). Therefore, by reading the electric signal of the magnetic proximity sensor (13), the rotation amount of the support shaft (3) can be detected, and the position of the capillary (6) can be detected.

これに加えて本発明においては、検出用円板(11)の
傾斜角度θと変位δとは前(1)式の関係を有すること
から、磁気近接センサ(13)の特性に応じてθを変化さ
せることにより、単位角度当たりの変位を調節設定する
ことができ、適当な分解能を得ることが可能である。従
って本発明によれば従来装置に用いられているロータリ
エンコーダに比べて遥に低価額であことが周知である磁
気近接センサを用いて、高い分解能のものにキャピラリ
の位置検出を行うことができる。このため装置の低価額
化による製造コストの低下が図られると同時に、高品質
化にも充分対応できる。なお以上説明した磁気近接セン
サに代えて、光変位センサその他の変位センサを用いる
ことができる。
In addition, in the present invention, since the inclination angle θ and the displacement δ of the detection disk (11) have the relationship of the above equation (1), θ is set according to the characteristics of the magnetic proximity sensor (13). By changing the displacement, the displacement per unit angle can be adjusted and set, and an appropriate resolution can be obtained. Therefore, according to the present invention, it is possible to detect the position of a capillary at a high resolution using a magnetic proximity sensor that is known to be much lower in price than a rotary encoder used in a conventional apparatus. . For this reason, the manufacturing cost is reduced by reducing the price of the apparatus, and at the same time, it is possible to sufficiently cope with high quality. Note that an optical displacement sensor or another displacement sensor can be used instead of the magnetic proximity sensor described above.

(発明の効果) 本発明は以上のようにボンデングアームの回転運動量
を直線運動に置き換え、これをロータリエンコーダに比
べて安価な変位センサを用いて電気的に検出処理してキ
ャピラリの位置の検出を行うようにしているため、容易
に高い精度で検出でき、しかも装置の原価の低減に大き
く寄与することができる。
(Effect of the Invention) As described above, the present invention replaces the rotational momentum of the bonding arm with the linear motion, and electrically detects and processes the linear motion using a displacement sensor which is less expensive than the rotary encoder to detect the position of the capillary. Since the detection is performed, the detection can be easily performed with high accuracy, and the cost of the apparatus can be greatly reduced.

【図面の簡単な説明】[Brief description of the drawings]

第1図は従来装置の説明図、第2図は本発明の一実施例
の説明図である。 (1)……ベッド、(2)……軸受、3……支持軸、 (4)……ボンデング、(5)……超音波ホーン、 (6)……キャピラリ、(7)……カップリング、 (8)……ロータリエンコーダ、(9)……ボンデング
面、(10)……キャピラリ位置検出装置、(11)……検
出用円板、(12)……変位センサ(磁気近接センサ)。
FIG. 1 is an explanatory view of a conventional apparatus, and FIG. 2 is an explanatory view of an embodiment of the present invention. (1) Bed, (2) Bearing, 3 Support shaft, (4) Bonding, (5) Ultrasonic horn, (6) Capillary, (7) Coupling (8) Rotary encoder, (9) Bonding surface, (10) Capillary position detector, (11) Detection disk, (12) Displacement sensor (magnetic proximity sensor).

フロントページの続き (58)調査した分野(Int.Cl.6,DB名) H01L 21/60 301 H01L 21/607Continuation of the front page (58) Field surveyed (Int.Cl. 6 , DB name) H01L 21/60 301 H01L 21/607

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】先端にキャピラリを有する超音波ホーンを
支持したボンデングアームを支持軸により揺動自在に支
持して、駆動源により前記ボンデングアームを介して前
記キャピラリに往復回転運動を与えてボンデングを行う
超音波ボンデング装置において、 前記ボンデングアームの支持軸の一端に傾斜させて同軸
的に検出用円板を固定し、またこの検出用円板と偏心さ
せて変位センサを対設して、その出力により位置検出を
行うようにしたことを特徴とする超音波ボンデング装置
のキャピラリ位置検出装置。
1. A bonding arm which supports an ultrasonic horn having a capillary at a tip thereof is swingably supported by a support shaft, and a reciprocating rotary motion is given to the capillary via the bonding arm by a driving source to bond. In the ultrasonic bonding apparatus to be performed, a detection disk is fixed coaxially by inclining at one end of a support shaft of the bonding arm, and a displacement sensor is provided eccentrically with the detection disk, and an output thereof is provided. A capillary position detecting device for an ultrasonic bonding device, wherein the position is detected by using the following.
JP2198668A 1990-07-26 1990-07-26 Capillary position detection device for ultrasonic bonding equipment Expired - Fee Related JP2785153B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2198668A JP2785153B2 (en) 1990-07-26 1990-07-26 Capillary position detection device for ultrasonic bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2198668A JP2785153B2 (en) 1990-07-26 1990-07-26 Capillary position detection device for ultrasonic bonding equipment

Publications (2)

Publication Number Publication Date
JPH04137545A JPH04137545A (en) 1992-05-12
JP2785153B2 true JP2785153B2 (en) 1998-08-13

Family

ID=16395062

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2198668A Expired - Fee Related JP2785153B2 (en) 1990-07-26 1990-07-26 Capillary position detection device for ultrasonic bonding equipment

Country Status (1)

Country Link
JP (1) JP2785153B2 (en)

Also Published As

Publication number Publication date
JPH04137545A (en) 1992-05-12

Similar Documents

Publication Publication Date Title
JP2785153B2 (en) Capillary position detection device for ultrasonic bonding equipment
US5180094A (en) Wire bonder with bonding arm angle sensor
JPS60218853A (en) Wafer front aligning device
JP2687952B2 (en) Capillary position detector for bonding equipment
US4870272A (en) Transducer adjustment apparatus for shaft encoder
JP3666592B2 (en) Bonding equipment
US4702605A (en) Rocker arm sensor
US20060076390A1 (en) Wire bonder
JP3462372B2 (en) Wire bonding method and wire bonding apparatus for semiconductor circuit components
JPH05130705A (en) Current collector for rolling stock
JP2937017B2 (en) Image input device
CN1205428A (en) Displacement sensor and method for producing target feature thereof
JPH0716238Y2 (en) Pointer reading device
JPS6410093B2 (en)
JPH0379047A (en) Wire-bonding device
JPS62287107A (en) Center position measuring instrument
JPH045097Y2 (en)
JPH0980059A (en) Scanner system
JP2543393B2 (en) Inclination sensor
JP2547683Y2 (en) Apparatus for detecting reference position of head carriage in magnetic recording apparatus
JPH03105771A (en) Head position detection mechanism
JP2541164B2 (en) Encoder eccentricity adjustment method and apparatus
JP2699412B2 (en) Optical head tilt device
JPH0637153A (en) Wire bonding method
JPH01311210A (en) Measuring instrument for waving shape of disk surface

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees