JPH04137545A - Capillary position detection equipment of ultrasonic wave bonding equipment - Google Patents
Capillary position detection equipment of ultrasonic wave bonding equipmentInfo
- Publication number
- JPH04137545A JPH04137545A JP2198668A JP19866890A JPH04137545A JP H04137545 A JPH04137545 A JP H04137545A JP 2198668 A JP2198668 A JP 2198668A JP 19866890 A JP19866890 A JP 19866890A JP H04137545 A JPH04137545 A JP H04137545A
- Authority
- JP
- Japan
- Prior art keywords
- detection
- capillary
- bonding
- retaining shaft
- support shaft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001514 detection method Methods 0.000 title claims abstract description 26
- 238000006073 displacement reaction Methods 0.000 claims abstract description 12
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は超音波ホンデング装置のキャピラリ位置検出装
置に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a capillary position detection device for an ultrasonic Hondengu device.
（従来技術）
例えば半導体素子の周辺部に設けた多数のバンブへのリ
ードの自動接続に使用される超音波ボンデング装置にお
いては、キャピラリの位置検出か必要である。そこて従
来においては次のような検出方法かとられている。即ち
第１図（ａ）（ｂｌに示す平面図および側面図のように
、Ｘ−Ｙ軸方向に移動しうるベツド（１）上に設けた軸
受（２）と支持軸（３）により支承されて、図示しない
駆動源により図中矢印Ａ−Ａ’ 方向に往復回転運動す
るようにしたボンデングアーム（４）により、超音波ホ
ーン（５）の先端のキャピラリ（６）か図中Ｂ−Ｂ’
方向に往復回転運動しうるように形成されたボンデング
ヘッドにおいて、支承軸（３）に、カップリング（７）
によりロータリエンコーダ（８）を同軸的に取付けて、
キャビ５１月６）の位置を回転角度として検出すること
か行われている。(Prior Art) For example, in an ultrasonic bonding apparatus used for automatically connecting leads to a large number of bumps provided around a semiconductor element, it is necessary to detect the position of a capillary. Therefore, conventionally, the following detection method has been used. That is, as shown in the plan view and side view shown in FIG. The capillary (6) at the tip of the ultrasonic horn (5) or the capillary (6) at the tip of the ultrasonic horn (5) is connected to the capillary (6) at the tip of the ultrasonic horn (5) by the bonding arm (4), which is reciprocated in the direction of arrow A-A' in the figure by a drive source (not shown).
In the bonding head formed to be capable of reciprocating rotational movement in the direction, a coupling (7) is attached to the support shaft (3).
Install the rotary encoder (8) coaxially,
The position of the cab 51/6) is detected as a rotation angle.
（従来技術の問題点）
しかし上記のようにロータリエンコーダによる検出には
、次のような欠点かある。即ちキャピラリ（６）の往復
回転運動量は数順程度であるため、その位置検出に当た
っては１０Ｐ以下の分解能か要求される。(Problems with Prior Art) However, as described above, detection using a rotary encoder has the following drawbacks. That is, since the reciprocating rotational momentum of the capillary (6) is on the order of a number, a resolution of 10P or less is required to detect its position.
従って例えば分解能を１０ｐに設定し、また支点即ち支
持軸（３）の中心からキャビ５１月６）の先端までの距
離を通常とられている１００ｍｍとした場合には、ロー
タリエンコーダ（８）に要求される支持軸（３）の１回
転当たりの出力パルス数は３１４００パルスと云う極め
て多いものとなる。しかしこのような高分解能をもつエ
ンコーダは現在のところ著しく高価であって、それたけ
ボンデング装置も高価となるため、製造コストの低減に
大きな障害になっているのか現状である。Therefore, for example, if the resolution is set to 10p and the distance from the fulcrum, that is, the center of the support shaft (3) to the tip of the cab 51/6) is set to the usual 100 mm, the requirements for the rotary encoder (8) are The number of output pulses per rotation of the support shaft (3) is extremely large, 31,400 pulses. However, encoders with such high resolution are currently extremely expensive, and the bonding equipment is correspondingly expensive, which is currently a major hindrance to reducing manufacturing costs.
（発明の目的）
本発明は上記のような問題点を解決した、超音波ボンデ
ング装置のキャピラリ位置検出装置の提供を目的として
なされたものである。(Object of the Invention) The present invention has been made to provide a capillary position detection device for an ultrasonic bonding apparatus that solves the above-mentioned problems.
（問題点を解決するための本発明の手段）本発明は支持
軸の回転運動量を直線運動量に変換して検出することに
より、ロータリーエンコーダより低価額の偏位センサ、
例えは磁気近接センサや光変位センサを用いて、ロータ
リエンコーダと変わることのない分解能のもとに、キャ
ピラリの回転運動量を検出てきるようにしたものである
。(Means of the present invention for solving the problems) The present invention converts the rotational momentum of the support shaft into linear momentum and detects it.
For example, a magnetic proximity sensor or an optical displacement sensor is used to detect the rotational momentum of a capillary with the same resolution as a rotary encoder.
次に実施例により本発明の詳細な説明する。Next, the present invention will be explained in detail with reference to Examples.
（実施例）
第２図（ａ）（ｂ）は本発明の一実施例を示す平面図お
よび側面図である。図において（１）はヘッド、（２）
は軸受、（３）は支持軸、（４）はボンデングアーム、
（５）は超音波ホーン、（６）はキャピラリであって、
これらにより第１図と同様なボンデングヘッドを形成し
、キャビ５１月６）の先端かボンデング面（９）に接し
たとき、支持軸（３）の中心かボンデング面（９）に位
置するように、ボンデング面（９）とボンデングヘッド
とは関係配置される。(Embodiment) FIGS. 2(a) and 2(b) are a plan view and a side view showing an embodiment of the present invention. In the figure, (1) is the head, (2)
is the bearing, (3) is the support shaft, (4) is the bonding arm,
(5) is an ultrasonic horn, (6) is a capillary,
These form a bonding head similar to that shown in Figure 1, so that when the tip of the cavity 51 (6) touches the bonding surface (9), it is located at the center of the support shaft (3) or at the bonding surface (9). The bonding surface (9) and the bonding head are arranged in relation to each other.
（１０）は本発明の要部であるキャピラリ位置検出装置
であって、次の各部からなる。（１１）は検出用円板で
あって、支持軸（３）の中心軸と直角な線（１２）に対
して角度θたけ傾斜し、かつ傾斜方向かベツド（１）面
と平行になるように支持軸（３）の一端に同軸的に固定
される。（１３）は磁気近接センサてあって、検出用円
板（１１）の中心を通る水平線上、即ちボンデング面（
９）上に中心軸か位置するように、支持軸（３）の中心
と偏心させて設けられる。(10) is a capillary position detection device which is a main part of the present invention, and is composed of the following parts. (11) is a detection disk, which is inclined by an angle θ with respect to a line (12) perpendicular to the central axis of the support shaft (3), and whose inclination direction is parallel to the bed (1) surface. is coaxially fixed to one end of the support shaft (3). (13) is a magnetic proximity sensor located on the horizontal line passing through the center of the detection disk (11), that is, on the bonding surface (
9) It is provided eccentrically from the center of the support shaft (3) so that the central axis is located above.
（作 用）
ボンデングアーム（４）を、図示しない駆動源により支
持軸（３）を介して第２図（ｂ）の矢印Ｂ−Ｂ’ の範
囲において往復回転運動させ、これによりボンデング面
（９）を基準として、キャビ５１月６）に往復回転運動
を行わせてボンデングを行う。すると検出用円板（１１
）も第２図ｆｂｌ中の矢印Ａ−Ａ’ の範囲内において
往復回転運動を行う。このため検出用円板（１１）の磁
気近接センサ（１３）との対設距離δは、支持軸（３）
の回転角度が大になるのに伴い大となり９０度において
最大になる。即ち今支持軸（３）の回転角度をπとした
とき、検出用円板（１１）の傾き角度θは回転角度πに
対する変位量δの係数であるのて、回転角度か９０度の
範囲内においてはπはπ＝θδ −（１）
によって与えられ、支持軸（３）の回転運動量は直線運
動量に変換される。従って磁気近接センサ（１３）は、
支持軸（３）の回転角度、従ってキャピラリ（６）の回
転角度πの変化に比例して変化する検出用円板（１１）
の変位量を読み取る。従って磁気近接センサ（１３）の
電気的信号を読み取ることにより、支持軸（３）の回転
量を検知することかでき、キャビ５１月６）の位置の検
出か可能である。(Function) The bonding arm (4) is reciprocated and rotated in the range of arrow B-B' in FIG. ), bonding is performed by making the cab 51-6) perform a reciprocating rotational motion. Then, the detection disc (11
) also performs reciprocating rotational movement within the range of arrow AA' in FIG. 2 fbl. Therefore, the distance δ between the detection disc (11) and the magnetic proximity sensor (13) is
It increases as the rotation angle increases and reaches a maximum at 90 degrees. That is, when the rotation angle of the support shaft (3) is π, the inclination angle θ of the detection disc (11) is a coefficient of the displacement amount δ with respect to the rotation angle π, so it is within the range of 90 degrees from the rotation angle. , π is given by π=θδ −(1), and the rotational momentum of the support shaft (3) is converted into linear momentum. Therefore, the magnetic proximity sensor (13) is
A detection disk (11) that changes in proportion to changes in the rotation angle of the support shaft (3) and therefore the rotation angle π of the capillary (6).
Read the displacement amount. Therefore, by reading the electrical signal of the magnetic proximity sensor (13), it is possible to detect the rotation amount of the support shaft (3), and the position of the cavity 51/6) can be detected.
これに加えて本発明においては、検出用円板（１１）の
傾斜角度θと変位δとは前（１）式の関係を有すること
から、磁気近接センサ（１３）の特性に応じてθを変化
させることにより、単位角度当たりの変位を調節設定す
ることかでき、適当な分解能を得ることか可能である。In addition, in the present invention, since the inclination angle θ and the displacement δ of the detection disc (11) have the relationship expressed by the above equation (1), θ is adjusted according to the characteristics of the magnetic proximity sensor (13). By changing the angle, the displacement per unit angle can be adjusted and set, and an appropriate resolution can be obtained.
従って本発明によれば従来装置に用いられているロータ
リエンコーダに比べて遥に低価額てあことか周知である
磁気近接センサを用いて、高い分解能のものにキャピラ
リの位置検出を行うことかできる。このため装置の低価
額化による製造コストの低下か図られると同時に、高品
質化にも充分対応てきる。なお以上説明した磁気近接セ
ンサに代えて、光変位センサその他の変位センサを用い
ることかできる。Therefore, according to the present invention, the capillary position can be detected with high resolution using a well-known magnetic proximity sensor that is far less expensive than the rotary encoder used in conventional devices. . Therefore, it is possible to reduce the manufacturing cost by lowering the price of the device, and at the same time, it is possible to sufficiently respond to higher quality. Note that in place of the magnetic proximity sensor described above, an optical displacement sensor or other displacement sensor may be used.
（発明の効果）
本発明は以上のようにボンデングアームの回転運動量を
直線運動に置き換え、これをロータリエンコーダに比へ
て安価な変位センサを用いて電気的に検圧処理してキャ
ピラリの位置の検出を行うようにしているため、容易に
高い精度て検出てき、しかも装置の原価の低減に大きく
寄与することかできる。(Effects of the Invention) As described above, the present invention replaces the rotational momentum of the bonding arm with linear motion, and electrically detects pressure using a displacement sensor that is cheaper than a rotary encoder to determine the capillary position. Since the detection is carried out, the detection can be easily performed with high accuracy, and it can also greatly contribute to reducing the cost of the device.
第１図は従来装置の説明図、
一実施例の説明図である。
（１）・・・ベツド、 （２）・・・軸受、 ３・・
・支持軸、（４）・・・ボンデング、 （５）・・・超
音波ホーン、（６）・・・キャピラリ、 （７）・・・
カップリング、第２図は本発明の
（８）・・・ロータリエンコーダ、 （９）・・・ボン
デング面、（１０）・・・キャピラリ位置検出装置、
（１１）・・・検出用円板、 （１２）・・・変位セン
サ（磁気近接センサ）。
代
理
人FIG. 1 is an explanatory diagram of a conventional device and an explanatory diagram of one embodiment. (1)...Bed, (2)...Bearing, 3...
・Support shaft, (4)...Bonding, (5)...Ultrasonic horn, (6)...Capillary, (7)...
Coupling, Fig. 2 shows (8)... rotary encoder of the present invention, (9)... bonding surface, (10)... capillary position detection device,
(11)...Disk for detection, (12)...Displacement sensor (magnetic proximity sensor). agent
Claims (1)
ンデングアームを支持軸により揺動自在に支持して、駆
動源により前記ボンデングアームを介して前記キャピラ
リに往復回転運動を与えてボンデングを行う超音波ボン
デング装置において、前記ボンデングアームの支持軸の
一端に傾斜させて同軸的に検出用円板を固定し、またこ
の検出用円板と偏心させて変位センサを対設して、その
出力により位置検出を行うようにしたことを特徴とする
超音波ボンデング装置のキャピラリ位置検出装置。An ultrasonic bonding device in which a bonding arm supporting an ultrasonic horn having a capillary at its tip is swingably supported by a support shaft, and a drive source applies reciprocating rotational motion to the capillary via the bonding arm to perform bonding. A detection disk is tilted and coaxially fixed to one end of the support shaft of the bonding arm, and a displacement sensor is installed eccentrically and opposite to the detection disk, and the position is detected by the output thereof. A capillary position detection device for an ultrasonic bonding device, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2198668A JP2785153B2 (en) | 1990-07-26 | 1990-07-26 | Capillary position detection device for ultrasonic bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2198668A JP2785153B2 (en) | 1990-07-26 | 1990-07-26 | Capillary position detection device for ultrasonic bonding equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04137545A true JPH04137545A (en) | 1992-05-12 |
| JP2785153B2 JP2785153B2 (en) | 1998-08-13 |
Family
ID=16395062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2198668A Expired - Fee Related JP2785153B2 (en) | 1990-07-26 | 1990-07-26 | Capillary position detection device for ultrasonic bonding equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2785153B2 (en) |
-
1990
- 1990-07-26 JP JP2198668A patent/JP2785153B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2785153B2 (en) | 1998-08-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |