JP2781557B2 - Passive circuit device for microwave integrated circuit - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a passive circuit device for a microwave integrated circuit.
You. [Prior art] Monolithic microwave integrated circuit (hereinafter referred to as MMIC)
U). Is generally semi-insulating of silicon, gallium arsenide, etc.
Active transistors, diodes, etc.
From elements, inductance, capacitance, resistance, etc.
Are integrated at the same time. This MMIC
Is based on a dielectric circuit based on a conventional passive circuit
After mounting on the board, the active element and the passive element are mounted.
Significantly smaller than Bridged microwave integrated circuits
can do. Therefore, conventionally, amplifiers, mixers,
Applying MMIC technology to unit function circuits such as phase shifters to achieve miniaturization
I have been. In these MMICs, distributed constant lines are often used.
The length of the distributed circuit is a function of wavelength,
The lower the frequency of the transmitted signal, the more
The shape becomes larger. FIG. 6 is used to solve the above problems.
FIG. 5 is a perspective view of a conventional passive circuit for a microwave integrated circuit.
You. In FIG. 6, a predetermined width is placed on a semiconductor substrate 1 having a substrate thickness h.
The conductor films 2 and 3 are formed through the gap 50 of Ws.
The body films 2 and 3 form a slot line. Up
A dielectric film 4 is formed on a substantially central portion of the conductor film 3 and the dielectric film 4 is formed.
Square-shaped spiral thin-film strip conductor on electric conductor film 4
5 are formed. The strip conductor 5 and the conductor film 2
Are electrically connected by the connection conductor 6. With the above configuration, the conductive film 3 and the conductive film
A thin film strip formed on the body film 3 via the dielectric film 4
The conductor 5 constitutes a thin-film microstrip line.
And the distributed constant of the thin-film microstrip line
The circuit is parallel to the slot line composed of the conductor films 2 and 3.
Connected to a column. Therefore, the distributed constant circuit is
By forming a strip line,
Significantly smaller compared to distributed constant circuits
You. [Problems to be Solved by the Invention] However, in the conventional example of FIG.
The above functional circuit is formed around the thin film microstrip line.
Transmission on the above thin film microstrip line.
To avoid interference with the signal
Form a functional circuit at a predetermined distance from the trip line
Needed. In addition, the passive circuit having the configuration shown in FIG.
In this case, the area occupied by the distributed constant circuit
I can't do it. Therefore, the MMIC as a whole is
The problem is that it is difficult to significantly reduce the size compared to
was there. The object of the present invention is to solve the above-mentioned problems, and
Compared to conventional passive circuits for microwave integrated circuits such as several circuits,
Passive for microwave integrated circuits that can be further miniaturized
It is to provide a circuit device. [Means for Solving the Problems] The passive circuit for a microwave integrated circuit according to the first invention of the present application
The road device is shaped to extend longitudinally on the substrate (1).
A conductive film formed so as to extend in the longitudinal direction on the substrate.
And a strip electrically connected to the conductor film (2)
A conductor (5), the strip conductor (5), and the substrate in the vicinity thereof
(1) a dielectric film (4) formed on the dielectric film (4) and the substrate (1);
Extending in the longitudinal direction in a coplanar relationship with the conductor film (2);
A predetermined gap (50) is formed between the conductor film (2) and the conductor film (2).
And a ground conductor film (3) which extends in the longitudinal direction in a coplanar relationship with each other on the substrate (1).
The conductor film present and formed through the gap (50)
(2) and the ground conductor film (3), a slot line
Are formed on the substrate (1) via the dielectric film (4).
Said strip formed to extend in the longitudinal direction
The conductor (5) and the ground conductor film (3) form a microstructure.
A strip line is formed, and the microstrip line is connected to the slot line.
It is characterized by being continued. Further, for a microwave integrated circuit according to the second invention of the present application.
The passive circuit device extends longitudinally on the substrate (1).
A central conductor film (11) formed so as to extend in the longitudinal direction on the substrate (1).
And electrically connected to the central conductor film (11).
Strip conductor (14), the strip conductor (14) and the substrate near the strip conductor (14)
(1) a dielectric film (4) formed on the dielectric film (4) and the substrate (1);
Extending in the longitudinal direction in a coplanar relationship with the central conductor film (11);
A predetermined gap (52a, 52) is provided on both sides of the center conductor film (11).
b) the center conductor film (11) is sandwiched
And a ground conductor film (13) formed on the substrate (1). The substrate (1) is coplanar with the center conductor film (11).
Extending in the longitudinal direction in relation to both of the central conductor film (11).
The center conductor film through predetermined gaps (52a, 52b) on the side
The ground conductor film (1) formed so as to sandwich (11)
3) and a coplanar wire formed by the center conductor film (11).
And forming a path on the substrate (1) via the dielectric film (4).
The strip conductor (14) and the ground conductor formed by
A microstrip line is formed by the film (13), and the microstrip line is formed on the coplanar line.
It is characterized by being connected. Further, the microwave integrated circuit according to the third invention of the present application
Passive circuit device extends longitudinally on the substrate (1)
And a conductive film (2) formed in such a manner as to extend in the longitudinal direction on the substrate (1).
And a first strike electrically connected to the conductor film (2).
A lip conductor (21), the first strip conductor (21) and the base near the first strip conductor (21).
A first dielectric film (4) formed on a plate (1), on the first dielectric film (4) and on the substrate (1)
And extends in the longitudinal direction in a coplanar relationship with the conductor film (2).
And a predetermined gap (50a) between the conductive film (2) and the conductive film (2).
And a second dielectric film formed on the ground conductor film (3)
(30), extending in the longitudinal direction on the second dielectric film (30).
Formed on the first strip conductor (21).
A second strip conductor (22) that is electrically connected to each other, and extends in the longitudinal direction in a coplanar relationship with each other on the substrate (1).
The conductor present and formed through the gap (50a)
The slot line is formed by the film (2) and the ground conductor film (3).
Forming a path, and forming the first dielectric film (4) on the substrate (1) with each other.
The first is formed to extend in the longitudinal direction through
Of the strip conductor (21) and the ground conductor film (3)
Forming a first microstrip line on the first dielectric film (4) and the substrate (1).
Mutually extending in the longitudinal direction via the second dielectric film (30).
The second strip conductor (2
2) and the ground conductor film (3) to form a second micro
Forming a strip line, and forming the first microstrip line on the slot line.
Path and the second microstrip line are connected
It is characterized by the following. [Operation] By configuring as in the first aspect of the present invention,
Slots formed by the body film (2) and the ground conductor film (3)
A line is formed, and the strip conductor (5) and the ground conductor are formed.
A microstrip line is formed with the body film (3)
Then, the microstrip line is inserted into the slot line.
It is connected. Here, for example, the ground conductor film
(3) function via a dielectric substrate layer or a semiconductor substrate layer
Even if a circuit is formed, the microstrip
The electromagnetic field generated in the loop line is shielded by the ground conductor film (3).
And does not interfere with the functional circuit. Therefore,
Electrical separation between the cross trip line and the above functional circuit
realizable. Further, by configuring as in the second invention,
The ground conductor film (13) and the center conductor film (11)
To form a coplanar line, and on the substrate (1),
The strip formed via the dielectric film (4)
The microstructure is formed by the conductor (14) and the ground conductor film (13).
Form a strip line, and attach the
A cross-trip line is connected. Here, for example
For example, a dielectric substrate layer or a semiconductor may be provided on the ground conductor film (13).
Even if a functional circuit is formed via the substrate layer,
The electromagnetic field generated in the microstrip line is
It is shielded by the conductive film (13) and does not interfere with the above functional circuits.
No. Therefore, the microstrip line and the functional circuit
Electrical isolation from the road can be realized. Further, by configuring as in the third invention,
The conductor film (2) and the ground conductor film (3).
To form a slot line, and the first strip conductor
(21) and the ground conductor film (3), the first microphone
A second strip conductor, forming a second strip conductor.
(22) and the ground conductor film (3) to form a second microphone
Loss strip line, and the slot line
1 microstrip line and the second microstrip line.
The lip line is connected. Here, for example,
A dielectric substrate layer or a semiconductor substrate layer is formed on the ground conductor film (3).
Even if a functional circuit is formed via
The electromagnetic field generated in the microstrip line is
Be shielded by the body membrane (3) and do not interfere with the above functional circuits.
No. Therefore, the first microstrip line and the
Electrical isolation from the functional circuit can be realized. In addition, the first
And a microstree including a second microstrip line
To reduce the occupied area of the
Therefore, the size of the device can be significantly reduced. Embodiment 1 First Embodiment FIG. 1 (A) shows a first embodiment of the present invention.
Of the slot line to which the branch circuit of the strip line is connected
FIG. 1 (B) is a partially cutaway perspective view of the MMIC.
It is a longitudinal cross-sectional view about the AA 'line of (A). Fig. 1
In (A), 70 indicates a break line. 1 (A) and 1 (B), a semiconductor having a substrate thickness h is shown.
A substantially rectangular conductive film 2 is formed on a substrate 1, and the conductive film 2
A predetermined width and a predetermined length on the semiconductor substrate 1 on which the
L-shaped thin film strip conductor 5 having
You. One end of the strip conductor 5 is electrically connected to the conductor film 2.
Continued. Semiconductor on the strip conductor 5 and its vicinity
A dielectric film 4 is formed on a substrate 1 by a strip conductor 5 and a conductor film.
Strip conductor except for the point of connection with 2 and its vicinity
5 is formed. On the dielectric film 4 and its
A substantially rectangular conductor film 3 is formed on the semiconductor substrate 1 including the vicinity.
Are formed with a gap 50 having a predetermined width Ws from the conductor film 2. With the above configuration, the conductor films 2 and 3
Therefore, a slot line is formed, and the strip conductor 5
The conductor film 3 is grounded by the conductor film 3 and one end is open.
Is constituted. Therefore,
1 The circuits shown in FIGS. 1A and 1B
MMIC to which a branch circuit that is a
You. The dielectric film 4 of the MMIC is formed by using various known film forming techniques.
It can be formed very thin with a film thickness of several μm or less.
And the width of the strip conductor 5 is about several μm.
Because it can be formed very thin,
The occupied area of the trip line can be reduced. In addition, in the conventional MMIC shown in FIG.
Although the medium on the conductor film 4 is air and the relative dielectric constant is 1,
On the other hand, the MMIC of the first embodiment shown in FIGS.
In the GaAs semiconductor substrate 1 as described above.
When a trip line is formed, the relative dielectric constant of the GaAs semiconductor substrate
The rate is about 13. Therefore, the above microstrip line
The electromagnetic field around the road is concentrated near the strip conductor 5,
This allows the distribution to be determined using a microstrip line.
When forming several circuits, it is necessary to obtain a predetermined electrical length.
The length of the strip conductor 5 to be shorter than that of the conventional example.
Can be further reduced compared to the conventional example.
There are advantages. Furthermore, the electromagnetic field of the microstrip line is
Since it exists only between the body film 3 and the strip conductor 5,
The electromagnetic field is shielded by the conductor film 3 which is a ground conductor.
As a result, it does not leak onto the upper surface of the conductive film 3. Therefore,
For example, a GaAs semiconductor substrate layer or a dielectric film layer is formed on the conductive film 3.
When peripheral circuits such as the above functional circuits are formed via
Electromagnetic field of microstrip line leaks to above peripheral circuit
Between the microstrip line and peripheral circuits.
Electrical separation can be realized, and any field on the upper surface of the conductive film 3
Interferes with the signal transmitted to the microstrip line
That the above functional circuit can be formed without
There are advantages. Second Embodiment FIG. 2 (A) shows two cores according to a second embodiment of the present invention.
MMIC with planar line connected by microstrip line
FIG. 2 (B) is a partially cutaway perspective view of FIG.
FIG. 2C is a vertical sectional view taken along line B1-B1 'of FIG.
It is a longitudinal cross-sectional view about the line B2-B2 'of FIG. Second
In FIGS. (A), (B) and (C), the same
The same reference numerals are given to the ones. Also, 71
Indicates a break line. 2A, 2B and 2C, the substrate thickness h
Having a predetermined width and a predetermined length on a substantially central portion of the semiconductor substrate 1
The zigzag thin film strip conductor 14 is formed. The
One end 14a of the strip conductor 14 is connected to the tapered conductor 10a for connection.
To be electrically connected to the rectangular conductor 10 through
Tapered conductor 10a and conductor 10 are formed on semiconductor substrate 1.
It is. The other end 14b of the strip conductor 14 is connected to
Electrically connected to the rectangular conductor 11 through the upper conductor 11a.
As shown, the tapered conductor 11a and the conductor 11 are semiconductor
It is formed on a substrate 1. Here, conductors 10 and 11 are
The center of the semiconductor substrate 1 on which the lip conductor 14 is formed
It is formed on both sides facing each other. Width of conductors 10 and 11
Are formed by the conductors 10 and 11 and ground conductor films 12 and 13 described later.
The coplanar lines to be formed have a predetermined impedance
Wider than the width of the strip conductor 14 so that
It is formed. On the strip conductor 14 and the tapered conductors 10a, 11a
On the semiconductor substrate 1 in the vicinity of the conductors 14, 10a and 11a
In addition, a substantially rectangular dielectric film 4 forms the conductors 14, 10a, 11a.
It is formed to cover. Further, the dielectric film 4 is arranged
In addition, the vicinity of the dielectric film 4 and the conductors 10 and 11 are formed.
Ground conductor films 12 and 13 on the semiconductor substrate 1
Through the gap with the conductor 10 and a predetermined width Wc and with the conductor 11
The conductor films 12 and 13 are connected continuously through the gap of the constant width Wc.
It is formed by air connection. With the above configuration, the conductor 10 and the ground conductor
The first coplanar line is composed of 12,13
The conductor 11 and the ground conductors 12 and 13 form a second coplanar
Configure the track. Also, the strip conductor 14 and the ground conductor 1
A microstrip line is constituted by 2,13. Follow
Thus, the circuit of the second embodiment has two first and second couplers.
A circuit that connects a Renner line with a microstrip line
Constitute. The microstrip in the second embodiment
By using the loop line, the impedance in the MMIC can be improved.
Matching circuit, impedance conversion circuit, phase shift circuit, etc.
A phase shifter rotating unit and a delay line unit can be configured. The MMIC of the second embodiment is the same as that of the first embodiment.
It has the same effect, so the phase shifter rotating section and delay line section
Can be greatly reduced in size as compared with the conventional example. Ma
Further, for example, a GaAs semiconductor substrate layer or
Peripheral circuits such as the above functional circuits are formed via a dielectric film layer.
The electromagnetic field of the microstrip line
The microstrip line and the surroundings can be
Electrical isolation from the edge circuit can be achieved,
Place the microstrip anywhere on the upper surface of membranes 12,13.
Function loop without interfering with the signal transmitted to the
There is an advantage that a path can be formed. Third Embodiment FIG. 3 (A) shows two switches according to a third embodiment of the present invention.
Lot lines are formed in a two-layer structure and connected in cascade.
FIG. 2 is a perspective view of an MMIC connected by a microstrip line.
FIG. 3 (B) is a sectional view taken along the line CC ′ of FIG. 3 (A).
FIG. In FIGS. 3 (A) and (B),
The same components as those in the above-mentioned drawings are denoted by the same reference numerals.
I have. 3 (A) and 3 (B), a semiconductor having a substrate thickness h is shown.
A substantially rectangular conductive film 2 is formed on a substrate 1, and the conductive film 2
A predetermined width and a predetermined length on the semiconductor substrate 1 on which the
Zigzag thin film strip conductor 21 having
It is. One end of the strip conductor 21 is applied to the corner 2a of the conductor film 2.
It is connected pneumatically. Half on and near the strip conductor 21
On the conductor substrate 1, a dielectric film 4
The above strip except for the connection point with the body membrane 2 and its vicinity
It is formed so as to cover conductor 21. Here, the contact with the conductor film 2 is made.
The tip portion 21a of the strip conductor 21 which is different from one end to be connected
A through hole 60 is formed in the upper dielectric film 4. Also, a long film is formed on the semiconductor substrate 1 on the upper and lower sides of the dielectric film 4 in the figure.
The rectangular conductor film 20 is spaced apart from the dielectric film 4 by a predetermined distance.
It is formed. On the semiconductor substrate 1 including the dielectric film 4 and its vicinity
A substantially rectangular conductor film 3 is formed between the conductor film 2 and the predetermined width Ws.
Through the gap 50a and through the gap 50b having a predetermined width Ws with the conductive film 20.
And excluding the through hole 60 and its vicinity
Is done. Further, the vicinity of the through hole 60 and the conductor film 20
On the conductive film 3 including the vicinity of the corner 20a, and the corner 20a
A dielectric film 30 is formed on the semiconductor substrate 1 near the through hole.
Except 60 is formed. From the vicinity of the through hole 60
On the dielectric film 30 up to the vicinity of the corner 20a of the conductor film 20,
A zigzag thin film strip having a predetermined width and a predetermined length
A conductor 22 is formed. One end 22a of the strip conductor 22 is in the through hole 60
Strip through the through-hole conductor 23
It is electrically connected to one end 21a of the body 21. In addition,
The other end 22b of the conductor 22 is near the corner 20a of the conductor film 20.
Conductive film via connection conductor 24 formed on dielectric film 30
It is electrically connected to the corner 20a of the 20. With the above configuration, the conductive films 2 and 3
To form the first slot line, and the conductor films 20 and 3 form the first slot line.
To form a second slot line. Also the strip guide
Body 21 and the conductor film 3 as a ground conductor,
Construct a stripline, strip conductor 22 and ground conductor
The second microstrip line by the conductor film 3
Is configured. In the third embodiment, the first and second masks are used.
The cross-trip line is electrically connected in cascade,
A second slot line is connected to the cascade-connected microstrip.
It is electrically connected via a lip line. As described above, the first and second microstrip lines
Is formed in a two-layer structure, thereby achieving the first and second implementations.
In the case of forming with one layer of microstrip line as in the example
Longer length for a given board area
Can be formed. Follow
Therefore, when realizing a strip conductor having a predetermined length,
Compare the area occupied by the microstrip line with the conventional example
The microstrip line
The MMIC including the road can be significantly reduced in size compared to the conventional example.
Can be. Also in the third embodiment, the first and the second
Has the same effect as that of the embodiment. In the third embodiment shown in FIG.
The lip conductors 21 and 22 are conductors in any longitudinal section of the substrate 1.
Do not overlap each other directly above 21 or directly below conductor 22
However, the present invention is not limited to this.
No. Fourth Embodiment FIG. 4 is a longitudinal sectional view of an MMIC according to a fourth embodiment of the present invention.
And a longitudinal section corresponding to FIG. 1 (B) of the first embodiment.
FIG. In FIG. 4, the same as the above drawing
The same reference numerals are given to the same. The MMIC of the fourth embodiment is a modification of the MMIC of the first embodiment.
It is an example, and the following points are different. That is, FIG. 1 (A)
And the semiconductor substrate 1 at the position where the conductor film 3 of FIG.
After the conductor film 3 is formed on the entire surface of the strip conductor 5,
A dielectric film is formed on the conductive film 3 at the position where the
4a is formed. A strip conductor 5 is formed on the dielectric film 4a.
It is formed. Here, one end of the strip conductor 5 is a conductor film.
2 is electrically connected. Next, a dielectric film on and near the strip conductor 5
After the dielectric film 4b is formed on the dielectric film 4b,
The conductor film 3a is formed on the conductor film 3 in the vicinity thereof. this
As a result, the conductor film 3 serving as a ground conductor is electrically connected to the conductor film 3a.
Connected. Therefore, the strip conductor 5 is formed by the conductor films 3 and 3a.
The strip conductor 5 and the conductor film 3
And 3a to transmit signals in a mode close to the conventional coaxial mode.
A substantially coaxial-mode microwave line to be transmitted is configured. this
In the microwave line, as in the first embodiment, the
The trip conductor 5 is formed by the conductor films 3 and 3a which are ground conductors.
The MMIC of this fourth embodiment is the first
It has the same effect as the embodiment. Fifth Embodiment FIG. 5 is a longitudinal sectional view of an MMIC according to a fifth embodiment of the present invention.
And a longitudinal section corresponding to FIG. 3B of the third embodiment.
FIG. In FIG. 5, the same as the above drawing
The same reference numerals are given to the same. The MMIC of the fourth embodiment is a modification of the MMIC of the first embodiment.
It is an example, and the following points are different. That is, the third embodiment
3 (A) and 3 (B)
Film 3, dielectric film 30, strip conductor 22, and conductors 23, 24
After further forming a dielectric film 40 thereon, a ground conductor film 41 is formed.
A dielectric film or a semiconductor substrate layer is formed on the ground conductor film 41.
Form 42. Further, on the dielectric film or the semiconductor substrate layer 42
The strip conductors 43 and 44 or functional circuits are formed
You. In the MMIC configured as described above, a dielectric film or
Are strip conductors 43, 44 formed on the semiconductor substrate layer 42.
Alternatively, a functional circuit, and a circuit formed in the third embodiment
Transmitted in each of the microstrip line sections
Signal is shielded by the ground conductor film 41 as described above.
As a result, the strip conductors 43, 44 or
The functional circuit and the microstrip line are electrically connected to each other.
Separated by air. Therefore, for a given substrate area,
Compared to the conventional example, more functional circuits and lines
It can be accommodated. In addition to the MMIC of the fifth embodiment, the functional circuits of each layer
Method of Fifth Embodiment for Shielding Lines and Lines with Ground Conductive Film
Therefore, even if a plurality of functional circuits and lines are accommodated,
Good. Other Embodiments In the above embodiments, the semiconductor substrate 1 is used.
However, the present invention is not limited to this, and a dielectric substrate may be used. [Effect of the Invention] As described in detail above, the microwave integration according to the first invention
According to the passive circuit device for a circuit, the longitudinal direction is formed on the substrate (1).
A conductive film (2) formed so as to extend in a longitudinal direction;
And a strip electrically connected to the conductor film (2)
A conductor (5), the strip conductor (5), and the substrate in the vicinity thereof
(1) a dielectric film (4) formed on the dielectric film (4) and the substrate (1);
Extending in the longitudinal direction in a coplanar relationship with the conductor film (2);
A predetermined gap (50) is formed between the conductor film (2) and the conductor film (2).
And a ground conductor film (3) which extends in the longitudinal direction in a coplanar relationship with each other on the substrate (1).
The conductor film present and formed through the gap (50)
(2) and the ground conductor film (3), a slot line
Are formed on the substrate (1) via the dielectric film (4).
Said strip formed to extend in the longitudinal direction
The conductor (5) and the ground conductor film (3) form a microstructure.
A strip line is formed, and the microstrip line is connected to the slot line.
Continued. Here, for example, a dielectric substrate is formed on the ground conductor film (3).
When a functional circuit is formed via a board layer or semiconductor substrate layer
However, the electromagnetic field generated in the microstrip line
The field is shielded by the ground conductor film (3), and the functional circuit
Does not interfere with Therefore, the above microstrip line
Circuit and the above functional circuit can be electrically separated,
The circuit can be formed on the microstrip line.
The size of the device can be greatly reduced compared to the conventional example.
can do. Further, the passive circuit for a microwave integrated circuit according to the second invention is provided.
According to the road device, it extends longitudinally on the substrate (1).
A central conductor film (11) formed so as to extend in the longitudinal direction on the substrate (1).
And electrically connected to the central conductor film (11).
Strip conductor (14), the strip conductor (14) and the substrate near the strip conductor (14)
(1) a dielectric film (4) formed on the dielectric film (4) and the substrate (1);
Extending in the longitudinal direction in a coplanar relationship with the central conductor film (11);
A predetermined gap (52a, 52) is provided on both sides of the center conductor film (11).
b) the center conductor film (11) is sandwiched
And a ground conductor film (13) formed on the substrate (1). The substrate (1) is coplanar with the center conductor film (11).
Extending in the longitudinal direction in relation to both of the central conductor film (11).
The center conductor film on the side with predetermined intervals (52a, 52b)
Ground conductor film (13) formed so as to sandwich (11)
And the central conductor film (11) to form a coplanar line.
Formed on the substrate (1) via the dielectric film (4).
The strip conductor (14) and the ground conductor formed by
A microstrip line is formed by the film (13), and the microstrip line is formed on the coplanar line.
Connected. Here, for example, a dielectric substrate is formed on the ground conductor film (13).
When a functional circuit is formed via a board layer or semiconductor substrate layer
However, the electromagnetic field generated in the microstrip line
The field is shielded by the ground conductor film (13) and the functional circuit
Does not interfere with Therefore, the above microstrip line
Circuit and the above functional circuit can be electrically separated,
The circuit can be formed on the microstrip line.
The size of the device can be greatly reduced compared to the conventional example.
can do. Further, the passive device for a microwave integrated circuit according to the third invention.
According to the circuit device, it extends on the substrate (1) in the longitudinal direction.
And a conductive film (2) formed in such a manner as to extend in the longitudinal direction on the substrate (1).
And a first strike electrically connected to the conductor film (2).
A lip conductor (21), the first strip conductor (21) and the base near the first strip conductor (21).
A first dielectric film (4) formed on a plate (1), on the first dielectric film (4) and on the substrate (1)
And extends in the longitudinal direction in a coplanar relationship with the conductor film (2).
And a predetermined gap (50a) between the conductive film (2) and the conductive film (2).
And a second dielectric film formed on the ground conductor film (3)
(30), extending in the longitudinal direction on the second dielectric film (30).
Formed on the first strip conductor (21).
A second strip conductor (22) that is electrically connected to each other, and extends in the longitudinal direction in a coplanar relationship with each other on the substrate (1).
The conductor present and formed through the gap (50a)
The slot line is formed by the film (2) and the ground conductor film (3).
Forming a path, and forming the first dielectric film (4) on the substrate (1) with each other.
The first is formed to extend in the longitudinal direction through
Of the strip conductor (21) and the ground conductor film (3)
Forming a first microstrip line on the first dielectric film (4) and the substrate (1).
Mutually extending in the longitudinal direction via the second dielectric film (30).
The second strip conductor (2
2) and the ground conductor film (3) to form a second micro
Forming a strip line, and forming the first microstrip line on the slot line.
And the second microstrip line is connected
You. Here, for example, a dielectric substrate is formed on the ground conductor film (3).
When a functional circuit is formed via a board layer or semiconductor substrate layer
Is generated in the first microstrip line.
Electromagnetic field is shielded by the ground conductor film (3),
Does not interfere with active circuits. Therefore, the first micro
The electrical separation between the stripline and the above functional circuit is realized.
Wear. Also, the first and second microstrip lines
Occupied area of microstrip line section including
The device can be made relatively small, making the device significantly smaller
Can be

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A shows a slot line MM to which a microstrip line branch circuit according to a first embodiment of the present invention is connected.
FIG. 1 (B) is a partially broken longitudinal sectional view taken along the line AA ′ of FIG. 1 (A). FIG. 2 (A) is a second embodiment of the present invention. FIG. 2 (B) is a longitudinal sectional view taken along line B1-B1 ′ of FIG. 2 (A), and FIG. 2 (C) is a partial cutaway perspective view of an MMIC in which two coplanar lines are connected by microstrip lines. FIG. 3A is a longitudinal sectional view taken along the line B2-B2 'of FIG. 2A. FIG. 3A is a third embodiment of the present invention in which two slot lines are cascaded and formed in a two-layer structure. FIG. 3 (B) is a longitudinal sectional view taken along the line CC ′ of FIG. 3 (A), and FIGS. 4 and 5 are respectively a perspective view of the MMIC connected by the two microstrip lines. FIG. 6 is a longitudinal sectional view of the MMIC according to the fourth and fifth embodiments, and FIG. 6 is a perspective view of a conventional MMIC. 1 ... semiconductor substrate, 2,3,3a ... conductor film, 4 ... dielectric film, 5 ... strip conductor.

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01P 5/08 H01P 3/08

Claims (1)

(57) [Claims] A conductive film (2) formed on the substrate (1) so as to extend in the longitudinal direction; and a conductive film (2) formed on the substrate (1) so as to extend in the longitudinal direction. Strip conductor (5) to be electrically connected, the strip conductor (5) and the substrate (1) near the strip conductor (5)
A dielectric film (4) formed thereon; and a conductor extending on the dielectric film (4) and the substrate (1) in the longitudinal direction in a coplanar relationship with the conductor film (2). A ground conductor film (3) formed with a predetermined gap (50) between the film and the film (2), and extending in the longitudinal direction in a coplanar relationship with each other on the substrate (1); A slot line is formed by the conductor film (2) and the ground conductor film (3) formed through the gap (50), and the slot line is formed on the substrate (1) via the dielectric film (4). A microstrip line is formed by the strip conductor (5) formed so as to extend in the longitudinal direction and the ground conductor film (3), and the microstrip line is connected to the slot line. Circuit device for microwave integrated circuits. 2. A central conductor film (11) formed on the substrate (1) so as to extend in the longitudinal direction; and a central conductor film (11) formed on the substrate (1) so as to extend in the longitudinal direction. Strip conductor (14) electrically connected to the substrate, the strip conductor (14) and the substrate (1) in the vicinity thereof
A dielectric film (4) formed thereon, and extending on the dielectric film (4) and the substrate (1) in the longitudinal direction in a coplanar relationship with the central conductor film (11); Predetermined gaps (52a, 52b) on both sides of the center conductor film (11)
And a ground conductor film (13) formed so as to sandwich the center conductor film (11) therebetween. The ground conductor film (13) is formed on the substrate (1) in a coplanar relationship with the center conductor film (11). The center conductor film (1) extends through the center conductor film (11) on both sides of the center conductor film (11) via predetermined gaps (52a, 52b).
The ground conductor film (13) formed so as to sandwich 1)
And the center conductor film (11) to form a coplanar line. The strip conductor (14) and the ground conductor film () formed on the substrate (1) with the dielectric film (4) therebetween. 13.) A passive circuit device for a microwave integrated circuit, wherein a microstrip line is formed by the steps (a) and (b), and the microstrip line is connected to the coplanar line. 3. A conductive film (2) formed on the substrate (1) so as to extend in the longitudinal direction; and a conductive film (2) formed on the substrate (1) so as to extend in the longitudinal direction. A first strip conductor (21) electrically connected, a first dielectric film (4) formed on the first strip conductor (21) and the substrate (1) in the vicinity thereof, On the first dielectric film (4) and the substrate (1),
A ground conductor film (3) extending in the longitudinal direction in a coplanar relationship with the conductor film (2) and formed with a predetermined gap (50a) between the conductor film (2) and the ground conductor; A second dielectric film (30) formed on the conductor film (3); and a first strip conductor formed on the second dielectric film (30) so as to extend in the longitudinal direction. A second strip conductor (22) electrically connected to (21), extending in the longitudinal direction on the substrate (1) in a coplanar relationship with each other and formed through the gap (50a). The conductor film (2) and the ground conductor film (3) thus formed form a slot line, and extend in the longitudinal direction on the substrate (1) via the first dielectric film (4). The first microstrip is formed by the first strip conductor (21) and the ground conductor film (3). A line is formed, and formed on the first dielectric film (4) and the substrate (1) so as to extend in the longitudinal direction with the second dielectric film (30) therebetween. Second strip conductor (22)
And a second microstrip line formed by the ground conductor film (3) and the first microstrip line and the second microstrip line connected to the slot line. Passive circuit device for wave integrated circuits.