JP2780622B2 - Hermetically sealed structure of optical semiconductor device module - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hermetic sealing of an optical semiconductor device module, and more particularly to a hermetic sealing structure of a hole for leading an optical fiber.

[0002]

2. Description of the Related Art In an optical semiconductor device module, when humid air entering from the outside of the module causes dew condensation inside the module due to a temperature difference between the inside and outside of the module,
Water droplets adhere to an optical surface such as a lens constituting an optical system or an end face of an optical fiber, which causes a problem that coupling loss between the optical semiconductor element and the optical fiber increases. In addition, when water droplets adhere between electrodes of an optical semiconductor element or the like, there is a problem that an electrical short circuit causes an operation failure. In order to solve these problems, in an optical semiconductor element module, it is usually necessary to hermetically seal the module package.

In particular, when the optical semiconductor element is a semiconductor laser and a cooling type module in which the temperature is controlled by an electronic cooling element, the semiconductor laser and optical components are cooled by the electronic cooling element, so that the module package is air-tight. If the module is not hermetically sealed, dew condensation tends to occur due to a temperature difference between the inside and outside of the module. In this case, water droplets adhere to the semiconductor laser and the optical system components, causing an increase in coupling loss and a decrease in optical output. In addition, water droplets electrically short-circuit the electrodes of the temperature control element, thereby controlling the temperature. Becomes impossible, and the characteristics of the semiconductor laser become unstable. Such a cooled semiconductor laser module particularly requires an airtight sealing structure.

FIG. 3 is a longitudinal sectional view showing an example of a conventional hermetically sealed structure of an optical semiconductor element module.

[0005] The optical semiconductor element package 6 containing the optical semiconductor element 7 is joined to a stem holder 10 containing a lens 8. The optical fiber 11 is fixed to the stem holder 10 via the optical fiber support 9 so that the optical semiconductor element 7 and the optical fiber 11 are optically optimally coupled to each other to form the optical semiconductor element-optical system integrated unit 5. I do. The optical semiconductor element-optical system integrated unit 5 is fixed to the package body 3 via the electronic cooling element 12.

Next, the optical fiber 11 is connected to the package body 3.
Then, the space between the optical fiber 11 on which the solder coating 15 has been applied in advance and the optical fiber leading hole is filled with the solder 14 through the hole 3b for leading the optical fiber on the side wall 3a. Finally, the package body 3 and the package lid 4 are seam-welded to hermetically seal the module package 2.

[0007]

In the conventional hermetic sealing technique, a compression or tensile stress is generated in the optical fiber due to deformation at the time of curing of the solder or thermal expansion / thermal shrinkage of the module package. As a result, the end face of the optical fiber deviates from the optically optimum position or breaks, thereby deteriorating the reliability of the module. In addition, since a metal film must be attached to the soldering part of the optical fiber or package in advance, the cost of parts is high, and the work of uniformly filling the space between the optical fiber lead-out hole and the optical fiber becomes complicated. There is a point.

[0008]

In order to solve the above-mentioned problems, the hermetically sealed structure of the optical semiconductor device module according to the present invention comprises an optical semiconductor device, an optical fiber, and both an optical semiconductor device and a fiber. An optical unit to be coupled
In the hermetically sealed structure of the optical semiconductor element module including the optical semiconductor element, the optical fiber, and the module package containing the optical unit, the optical semiconductor element module includes a rubber pipe having irregularities on an inner surface and an outer surface. The optical fiber is fixed by interposing the rubber pipe between the optical fiber leading hole of the package and the optical fiber.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail with reference to the drawings.

FIG. 1 illustrates the hermetically sealed structure of the optical semiconductor device module of one embodiment of the present invention shown in FIG.
It is a longitudinal sectional view of a fit. FIG. 2 shows an optical half of one embodiment of the present invention.
FIG. 3 is a cross-sectional view showing a hermetically sealed structure of a conductive element module.
You. In FIG. 1, the rubber pipe 13 has the irregularities shown in FIG.
However, to make the description easier to understand,
There is no unevenness provided on the rubber pipe which is one of the features of
The configuration will be described.

The optical semiconductor element package 6 containing the optical semiconductor element 7 is joined to a stem holder 10 containing a lens 8. An optical fiber support 9 is provided so that the optical semiconductor element 7 and the optical fiber 11 are optically optimally coupled.
The optical fiber 11 is adjusted and fixed with respect to the stem holder 10 via the optical fiber, thereby forming the optical semiconductor element-optical system integrated unit 5. This optical semiconductor element-optical system integrated unit 5
Are fixed to the package body 3 via the electronic cooling element 12.

Next, a rubber pipe 1 is inserted between the optical fiber 11 and the hole 3b for guiding the fiber on the side wall 3a of the package body 3.
Then, the package body 3 and the lid 4 are seam-welded to hermetically seal the module. Here, the outer diameter of the rubber pipe 13 is larger than the inner diameter of the hole 3b for leading out the fiber, and the inner diameter of the through hole of the rubber pipe 13 is smaller than the outer diameter of the optical fiber 11, so that the press-fitted rubber pipe 13 This prevents humid air outside the module from entering the optical module.

FIG. 2 shows an optical semiconductor device module according to the present invention.
1 is a longitudinal sectional view showing one embodiment of the hermetic sealing structure of FIG.

In the configuration shown in FIG . 1, press fitting is difficult.
In view of this, the rubber pipe 13 is provided with irregularities.
Airtightness of the optical semiconductor device module of the present invention shown in FIG.
In the sealing structure , the outer surface and the inner surface of the rubber pipe 13b are provided with irregularities, and the hole 3b for guiding the optical fiber and the optical fiber 1 are formed.
1 facilitates press-fitting. Thereby, the optical fiber 11 and the inner surface of the rubber pipe 13b, the hole 3b
The contact pressure between the rubber pipe 13b and the outer surface of the rubber pipe 13b can be increased, and the airtightness can be improved.

[0015]

As described above, the hermetically sealed structure of the optical semiconductor element module according to the present invention is constructed such that a rubber pipe is press-fitted between the optical fiber and the hole for leading out the optical fiber, thereby allowing the outside air to enter the module. And the dew condensation between the electrodes of the optical system unit and the optical semiconductor element can be prevented. Here, in the present invention, irregularities are provided on the rubber pipe.
The press-fitting of the rubber pipe is easy. The thermal stress of the optical fiber due to the thermal expansion and contraction of the package can be reduced by elastically deforming the rubber pipe. In addition, since the rubber pipe is simply press-fitted into the hole for guiding the optical fiber, there is no need to apply or cure an adhesive, and there is no need for a pretreatment such as adhesion of a metal coating to the optical fiber, making it easy to manufacture. And has the advantage of being inexpensive.

[Brief description of the drawings]

FIG. 1 is a view for explaining a hermetically sealed structure of an optical semiconductor element module of the present description, wherein a rubber pipe has irregularities.
FIG. 7 is a diagram showing a configuration that is not provided.

Figure 2 is a longitudinal sectional view showing an embodiment of a hermetically sealed structure of the optical semiconductor element module of the present description.

Figure 3 is a longitudinal sectional view showing one example of a hermetic sealing structure of a conventional optical semiconductor device module.

[Description of Signs] 1 Optical semiconductor element module 2 Module package 3 Package body 4 Package lid 5 Optical semiconductor element-optical system integrated unit 6 Optical semiconductor element package 7 Optical semiconductor element 8 Lens 9 Optical fiber support 10 Stem holder 11 Optical fiber 12 thermoelectric cooler 13 rubber pipe 14 solder 15 solder coating

Claims (1)

(57) [Claims] 1. An optical semiconductor device, an optical fiber, an optical unit for optically coupling the optical semiconductor device and the fiber, and the optical semiconductor device, the optical fiber, and the optical unit built therein, and Optical fiber through optical fiber
Including a module package having a hole for the Aiba derivation
In the hermetically sealed structure of the optical semiconductor element module, the optical semiconductor element
The outer diameter is larger than the inner diameter of
The inner diameter is small and the inner and outer surfaces have irregularities.
It comprises a rubber pipes that, the rubber between the hole and the optical fiber for the optical fiber derived
A hermetically sealed structure for an optical semiconductor element module, wherein the optical fiber is fixed with a medium pipe interposed therebetween .