WO2018135294A1 - Pressure sensor - Google Patents

Pressure sensor Download PDF

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Publication number
WO2018135294A1
WO2018135294A1 PCT/JP2017/047242 JP2017047242W WO2018135294A1 WO 2018135294 A1 WO2018135294 A1 WO 2018135294A1 JP 2017047242 W JP2017047242 W JP 2017047242W WO 2018135294 A1 WO2018135294 A1 WO 2018135294A1
Authority
WO
WIPO (PCT)
Prior art keywords
recess
sensor
sensor chip
chip
adhesive
Prior art date
Application number
PCT/JP2017/047242
Other languages
French (fr)
Japanese (ja)
Inventor
和哉 滝本
柴田　浩
Original Assignee
株式会社鷺宮製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社鷺宮製作所 filed Critical 株式会社鷺宮製作所
Priority to CN201780082216.9A priority Critical patent/CN110573852B/en
Publication of WO2018135294A1 publication Critical patent/WO2018135294A1/en

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/14—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means involving the displacement of magnets, e.g. electromagnets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features

Definitions

  • the present invention relates to a pressure sensor.
  • a sensor unit that constitutes a part of a liquid-sealed semiconductor pressure sensor is disposed in a liquid-sealed chamber (pressure-receiving space) formed between a base and a diaphragm, as shown in Patent Document 1, for example. Yes.
  • a sensor unit includes, for example, a diaphragm sandwiched between a base and a receiving member, a pressure receiving space that is formed above the diaphragm and that stores oil as a pressure transmission medium, and a pressure receiving space in the pressure receiving space.
  • a sensor chip (referred to as a semiconductor pressure detection element in Patent Document 1), a base that supports the sensor chip, and an output signal output from the sensor chip.
  • a plurality of lead pins for supplying power to the sensor chip are included as main elements.
  • such a sensor chip is bonded to a bottom wall portion forming a bottom portion of a recess formed in a package member via an adhesive layer made of a silicon-based adhesive.
  • the adhesive layer has a predetermined Young's modulus, and the thickness of the adhesive layer is set to a predetermined thickness of 110 ⁇ m or more.
  • the thickness of the adhesive layer is set in this way because the greater the thickness of the adhesive layer, the easier the force applied to the sensor element from the package member is relaxed by the adhesive layer, and also due to temperature changes. This is because fluctuations in sensor characteristics can be suppressed as much as possible.
  • Patent Document 3 in order to suppress a change in the characteristics of the sensor element based on deformation due to thermal stress in a resin case accompanying a demand for downsizing of the pressure sensor, a recess portion to which an adhesive is applied.
  • the recess has a depth of about 0.05 mm to 0.2 mm. This prevents the bottom surface of the corner portion of the sensor element from being close to contact with the resin case, and reduces the deformation of the resin case affecting the characteristics of the sensor element. As a result, the stress from the outside and the stress due to the deformation of the resin case are relieved, so that the characteristic change of the sensor element is reduced.
  • Patent Document 2 and Patent Document 3 In the manufacturing process of a pressure sensor as shown in Patent Document 2 and Patent Document 3, a small amount of adhesive is applied to a surface to be bonded of a package member or a resin case to which a sensor element is bonded, and adhesion with a predetermined film thickness is performed. When the layer is formed uniformly, it is necessary to measure the coating amount of the adhesive and manage the film thickness with high accuracy.
  • the present invention is a pressure sensor, which is a pressure sensor that can obtain an adhesive layer having a uniform thickness without requiring high-precision management of the amount of adhesive applied. It aims to provide a method.
  • a pressure sensor includes a sensor chip that detects pressure and sends a detection output signal, and a support member that supports the sensor chip via an adhesive layer.
  • a sensor unit and a sensor unit housing portion for housing the sensor unit, and the support member has a recess for measuring a predetermined coating amount of the adhesive so as to form an adhesive layer having a predetermined film thickness. It is characterized by having.
  • the recess may be a recess formed at one end of the chip mount member facing the surface of the sensor chip, and the support member is a chip mount member.
  • the recess may be a gap formed between one end of the chip mount member and the surface of the sensor chip.
  • the recess may be a depression formed at the end of the hermetic glass facing the surface of the sensor chip.
  • the recess is a sensor. It may be a depression formed on the end face of the base facing the surface of the chip.
  • the adhesive may be applied more than the inner volume of the recess so that the adhesive overflows from the recess.
  • the diameter of the inner peripheral surface forming the recess may be set smaller than the length of the diagonal of the sensor chip, or the diameter of the inner peripheral surface forming the recess is the length of the diagonal of the sensor chip. It may be set larger than
  • a pressure sensor includes a sensor chip that detects a pressure and sends a detection output signal, a sensor unit that includes a support member that supports the sensor chip via an adhesive layer, and a sensor unit.
  • a support unit, and the support member has a recess having a predetermined depth to which an adhesive is applied so as to form an adhesive layer having a predetermined film thickness. It is characterized by having, in part, a cavity to which no adhesive is applied around an adhesive applied at a substantially central portion more than the depth of the recess.
  • the support member has a recess for measuring a predetermined application amount of the adhesive so as to form an adhesive layer having a predetermined film thickness.
  • An adhesive layer having a uniform thickness can be obtained without requiring high-precision management.
  • FIG. 1 is a partial cross-sectional view showing a main part of a sensor unit in an example of a pressure sensor according to the present invention.
  • FIG. 2 is a cross-sectional view showing a configuration of an example of a pressure sensor according to the present invention.
  • FIG. 3A is a partial cross-sectional view showing a main part of a modified example of the sensor unit in the example of the pressure sensor according to the present invention.
  • FIG. 3B is a partial cross-sectional view showing a main part of a modified example of the sensor unit in the example of the pressure sensor according to the present invention.
  • FIG. 4A is a partial cross-sectional view showing a main part of a modification of the sensor unit in an example of the pressure sensor according to the present invention.
  • FIG. 4B is a partial cross-sectional view showing a main part of a modified example of the sensor unit in the example of the pressure sensor according to the present invention.
  • FIG. 4C is a partial cross-sectional view showing a main part of a modified example of the sensor unit in the example of the pressure sensor according to the present invention.
  • FIG. 5A is a partial cross-sectional view showing a main part of a sensor unit used in another example of the pressure sensor according to the present invention.
  • FIG. 5B is a partial cross-sectional view showing a main part of a sensor unit used in another example of the pressure sensor according to the present invention.
  • FIG. 6A is a partial cross-sectional view showing a main part of a modified example of the sensor unit used in another example of the pressure sensor according to the present invention.
  • FIG. 6B is a partial cross-sectional view showing a main part of a modified example of the sensor unit used in another example of the pressure sensor according to the present invention.
  • FIG. 2 schematically shows a configuration of an example of a pressure sensor according to the present invention.
  • the pressure sensor includes a joint member 30 connected to a pipe through which a fluid whose pressure is to be detected is guided, and a sensor unit connected to a base plate 28 of the joint member 30 to be described later, and a detection output from the sensor chip. And a sensor unit housing for supplying a signal to a predetermined pressure measuring device.
  • the metal joint member 30 has an internal thread portion 30fs that is screwed into the external thread portion of the connection portion of the pipe described above.
  • the female screw portion 30fs communicates with the port 30a of the joint member 30 that guides the fluid supplied from the direction indicated by the arrow P to the pressure chamber 28A described later.
  • One open end of the port 30a opens toward a pressure chamber 28A formed between the base plate 28 of the joint member 30 and the diaphragm 32 of the sensor unit.
  • the outer portion of the sensor unit housing portion is formed by a cylindrical waterproof case 20 as a cover member.
  • An opening 20 b is formed at the lower end of the resin waterproof case 20.
  • the peripheral edge of the base plate 28 of the joint member 30 is engaged with the step portion on the peripheral edge of the opening 20b that is the inner side.
  • air or liquid as a fluid is supplied through the port 30a of the joint member 30.
  • a lower end surface of the housing 12 of the sensor unit is placed on the base plate 28.
  • the sensor unit that detects the pressure in the pressure chamber 28A and sends out a detection output signal includes a cylindrical housing 12, a metal diaphragm 32 that isolates the pressure chamber 28A and the inner periphery of the housing 12, and a plurality of pressures.
  • a sensor chip 16 having a detection element, a metal chip mount member 18 that supports the sensor chip 16 at one end via an adhesive layer 50, and an input / output terminal group 40ai ( i 1 to 8) and the hermetic glass 14 for fixing the input / output terminal group 40ai and the oil filling pipe 44 between the outer peripheral surface of the chip mount member 18 and the inner peripheral surface of the housing 12 as main elements. It is configured to include.
  • the diaphragm 32 is supported on one lower end surface of the housing 12 facing the pressure chamber 28A.
  • the diaphragm protection cover 34 that protects the diaphragm 32 disposed in the pressure chamber 28A has a plurality of communication holes 34a.
  • the peripheral edge of the diaphragm protection cover 34 is joined to the lower end surface of the stainless steel housing 12 by welding together with the peripheral edge of the diaphragm 32.
  • a predetermined amount of silicone oil PM or a fluorine-based inert liquid is used as a pressure transmission medium. It is filled through an oil filling pipe 44. Note that one end of the oil filling pipe 44 is crushed and closed as indicated by a two-dot chain line after oil filling.
  • the silicone oil is, for example, a silicone oil having a dimethylpolysiloxane structure composed of a siloxane bond and an organic methyl group.
  • the fluorine-based inert liquid is, for example, a liquid having a perfluorocarbon structure, a liquid having a hydrofluoroether structure, or a low polymer of ethylene trifluoride chloride, and fluorine and chlorine are bonded to the main chain. , Both ends may have a fluorine or chlorine structure.
  • a metal potential adjusting member 17 is further supported on the lower end surface of the hermetic glass 14.
  • the potential adjusting member 17 is connected to a terminal having a communication hole and connected to the zero potential of the circuit of the sensor chip 16 as disclosed in, for example, Japanese Patent No. 3987386.
  • the two power supply terminals and the one output terminal are connected to the core wires 38 a of the lead wires 38 via the connection terminals 36.
  • Each lead wire 38 is connected to a predetermined pressure measuring device. In FIG. 2, only four of the eight terminals are shown.
  • the input / output terminal group 40ai and a sensor chip 16, which will be described later, are connected by a bonding wire Wi.
  • the sensor chip 16 includes a plurality of pressure detection elements, for example, a main body formed in a substantially rectangular shape with silicon, a circuit layer formed on the upper end surface of the main body to form a processing circuit, and a first An insulating film layer as a second layer laminated on the upper surface of the circuit layer as a layer, an aluminum shield layer formed on the insulating film layer, and a protective layer protecting the upper layer portion of the shield layer It consists of The length of the diagonal line of the rectangular sensor chip 16 is set to be slightly larger than the diameter of the chip mount member 18, for example.
  • the sensor chip 16 is bonded to one end of the chip mount member 18 via an adhesive layer 50.
  • the adhesive layer 50 is formed in a recess 18R formed at one end of a chip mount member 18 facing the adherend surface of the sensor chip 16 as shown in a partially enlarged view in FIG. It is formed at a portion between the end face of the hermetic glass 14 adjacent to one end of the mount member 18 and the outer peripheral edge of the sensor chip 16 facing the end face. A portion between the end surface of the hermetic glass 14 adjacent to one end portion of the chip mount member 18 and the outer peripheral edge of the sensor chip 16 facing the end surface is used as, for example, a measurement recess for measuring a predetermined adhesive application amount. It is formed by an excessive adhesive overflowing from the inside of the recess 18R.
  • the concave portion 18R serving as a measuring concave portion for measuring a predetermined adhesive application amount has a depth Dp such that the thickness of the adhesive layer is 5 ⁇ m or more, for example.
  • the material of the adhesive layer 50 is, for example, a silicone adhesive as described in the specification of a patent application (Application No .: Japanese Patent Application No. 2016-185678) previously filed by the applicant. It is said.
  • the material of the chip mount member 18 is, for example, an iron-nickel alloy or a metal such as stainless steel.
  • the adhesive application amount is set to be equal to or greater than the inner volume of the recess 18R overflowing from the recess 18R, so that the adhesive layer 50 having a uniform film thickness is formed. It is not necessary to manage the coating amount with high accuracy.
  • the terminal block 24 for aligning the input / output terminal group 40ai is formed of a resin material, for example, polybutylene terephthalate (PBT).
  • the terminal block 24 includes a plurality of holes into which the input / output terminal group 40ai is inserted and a hollow portion having a predetermined volume inside.
  • the lower end surface of the terminal block 24 is bonded to the upper end surface of the housing 12 with a silicone-based adhesive so as to cover the upper end surface of the hermetic glass 14.
  • an annular adhesive layer 10 a having a predetermined thickness is formed on the upper end surface of the housing 12.
  • a coating layer 10b made of a silicone-based adhesive is formed on the entire upper end surface of the hermetic glass 14 from which the input / output terminal group 40ai protrudes with a predetermined thickness.
  • An annular protrusion 24P that protrudes toward the hermetic glass 14 is formed on the inner peripheral surface that forms the hollow portion of the terminal block 24 and faces the upper end surface of the hermetic glass 14.
  • the protruding length of the annular protrusion 24P is set according to the viscosity of the coating layer 10b.
  • the covering layer 10b is formed on the upper end surface of the hermetic glass 14 with a predetermined thickness. As shown in the portion 10c, the covering layer 10b further covers a part of the plurality of lead pins 40ai protruding from the upper end surface of the hermetic glass 14. May be formed.
  • the silicone-based adhesive layer 10 including the coating layer 10a, the coating layer 10b, and the coating layer 10c is formed as an electrostatic protection layer on the upper end surface of the housing 12 and the entire upper end surface of the hermetic glass 14. Therefore, by forming the electrostatic protection layer with the silicone-based adhesive in this way, the electrostatic strength of the sensor unit is improved without being affected by the presence or absence of the ESD protection circuit.
  • the above-mentioned silicone adhesive is preferably, for example, a flexible additive type one-component system.
  • the silicone-based adhesive is, for example, an adhesive having a low molecular siloxane bond. Further, since the silicone adhesive and the silicone oil are compatible, there is no possibility that the adhesiveness of the silicone adhesive will deteriorate even if silicone oil or the like is mixed in the silicone adhesive.
  • the terminal block 24 and the end cap 22 are disposed in the waterproof case 20 so as to face the base plate 28 of the joint member 30 with the above-described sensor unit interposed therebetween.
  • the upper end surface of the end cap 22 protrudes upward from the opening end of the waterproof case 20. That is, the position of the upper end surface of the end cap 22 is higher than the position of the opening end surface of the waterproof case 20.
  • the adhesive layer 50 is formed in the recess 18 ⁇ / b> R formed at one end of the chip mount member 18, but is not limited to such an example.
  • the chip mount member 18 ′ having a length slightly shorter than the length along the central axis of the chip mount member 18 is used to face the adherend surface of the sensor chip 16.
  • a recess 18′R having a predetermined depth Dp may be formed in a gap between the end face of the chip mount member 18 ′ and the adherend surface of the sensor chip 16.
  • FIG. 3A, FIG. 3B, FIG. 4A, FIG. 4B, and FIG. 4C described later, the same components as those in the example shown in FIG. The duplicate explanation is omitted.
  • the adhesive layer 50 is formed in the recess 18'R and is formed at a portion where the end surface of the adjacent hermetic glass 14 and the outer peripheral edge of the sensor chip 16 facing the end surface intersect.
  • the portion where the end face of the hermetic glass 14 adjacent to the sensor chip 16 and the outer peripheral edge of the sensor chip 16 facing the end face intersect is formed by, for example, an excess adhesive overflowing from the inside of the recess 18′R.
  • the recess 18′R has, for example, a depth Dp such that the thickness of the adhesive layer is 5 ⁇ m or more.
  • the adhesive layer 50 having a uniform film thickness is formed by setting the application amount of the adhesive to be equal to or greater than the inner volume of the recess 18'R overflowing from the recess 18'R. Therefore, it is not necessary to manage the application amount of the adhesive with high accuracy.
  • the sensor chip 16 in the sensor unit is supported by one end of the chip mount member 18 held in the hermetic glass 14, but is not limited to such an example.
  • 16 may be configured to be directly fixed to the portion of the hermetic glass 14 ′ facing the adherend surface of the sensor chip 16 as shown in FIG. 3B without using the chip mount member 18.
  • a concave portion 14 ′ Ga for forming the adhesive layer 50 is formed in a portion of the hermetic glass 14 ′ facing the surface to be bonded of the sensor chip 16.
  • the recess 14′Ga is formed by a carbon jig when the hermetic glass 14 ′ is formed, for example.
  • the recess 14′Ga has a predetermined depth Dp such that the thickness of the adhesive layer 50 is 5 ⁇ m or more.
  • the adhesive layer 50 is formed in the recess 14 ′ Ga and is formed at a portion where the end surface of the hermetic glass 14 adjacent to the sensor chip 16 and the outer peripheral edge of the sensor chip 16 facing the end surface intersect.
  • a portion where the end face of the hermetic glass 14 adjacent to the sensor chip 16 and the outer peripheral edge of the sensor chip 16 facing the end face intersect is formed by, for example, an excessive adhesive overflowing from the inside of the recess 14′Ga.
  • the diameter of the chip mount member 48 is set larger than the length of the diagonal line of the sensor chip 16 (hereinafter also referred to as the length of the diagonal line) as partially enlarged in FIG. 4A. May be.
  • the sensor chip 16 is bonded to one end of the chip mount member 18 via the adhesive layer 50.
  • the adhesive layer 50 is formed in a recess 48R formed at one end portion of the chip mount member 48 facing the adherend surface of the sensor chip 16, and an extended surface of the end surface of one end portion of the chip mount member 48 and its surface It is formed at a portion where the outer peripheral edge of the sensor chip 16 facing the end surface intersects.
  • the portion where the extended surface of the end surface of one end of the chip mount member 48 intersects with the outer peripheral edge of the sensor chip 16 facing the end surface is formed by surface tension by, for example, excess adhesive overflowing from the inside of the recess 48R.
  • the recess 48R has a depth Dp such that the thickness of the adhesive layer is 5 ⁇ m or more.
  • the material of the chip mount member 48 is, for example, an iron-nickel alloy or a metal such as stainless steel, similar to the material of the chip mount member 18 described above.
  • the adhesive application amount is set to be equal to or larger than the inner volume of the concave portion 48R overflowing from the concave portion 48R, whereby the adhesive layer 50 having a uniform film thickness is formed. It is not necessary to manage the coating amount with high accuracy.
  • the sensor chip 16 is used by using a chip mount member 48 ′ having a length slightly shorter than the length along the central axis of the chip mount member 48.
  • a recess 48 ′ R having a predetermined depth Dp may be formed between the end surface of the chip mount member 48 ′ facing the surface to be bonded and the surface to be bonded of the sensor chip 16.
  • the adhesive layer 50 is formed in the recess 48'R and is formed at a portion where the extended surface of the end face of the hermetic glass 14 adjacent to the sensor chip 16 and the outer peripheral edge of the sensor chip 16 facing the end face intersect. ing.
  • a portion where the extended surface of the end face of the hermetic glass 14 adjacent to the sensor chip 16 and the outer peripheral edge of the sensor chip 16 facing the end face intersect is formed by, for example, an excessive adhesive overflowing from the inside of the recess 48′R.
  • the recess 48′R has a depth Dp such that the thickness of the adhesive layer is 5 ⁇ m or more.
  • the adhesive layer 50 having a uniform film thickness is formed by setting the application amount of the adhesive to be equal to or greater than the inner volume of the recess 48′R overflowing from the recess 48′R. Therefore, it is not necessary to manage the application amount of the adhesive with high accuracy.
  • the sensor chip 16 in the sensor unit is supported by one end portion of the chip mount member 48 held in the hermetic glass 14, but the present invention is not limited to such an example.
  • 16 may be configured to be directly fixed to the portion of the hermetic glass 14 ′ facing the adherend surface of the sensor chip 16 as shown in FIG. 4C without using the chip mount member 48.
  • a recess 14 ′ Gb for forming the adhesive layer 50 is formed in the portion of the hermetic glass 14 ′ facing the surface to be bonded of the sensor chip 16.
  • the diameter of the inner peripheral surface forming the recess 14′Gb may be set larger than the length of the diagonal line of the sensor chip 16 as shown in a partially enlarged manner in FIG. 4C.
  • the recess 14 ′ Gb is formed by a carbon jig.
  • the recess 14′Gb has a predetermined depth Dp such that the thickness of the adhesive layer 50 is 5 ⁇ m or more, for example.
  • the adhesive layer 50 is formed in the recess 14′Gb, and is formed at a portion where the end surface of the hermetic glass 14 ′ adjacent to the sensor chip 16 and the outer peripheral edge of the sensor chip 16 facing the end surface intersect.
  • a portion where the end face of the hermetic glass 14 ′ adjacent to the sensor chip 16 and the outer peripheral edge of the sensor chip 16 facing the end face intersect is formed by, for example, an excessive adhesive overflowing from the inside of the recess 14 ′ Gb.
  • FIG. 5A is a partially enlarged view showing a main part of a sensor unit in another example of the pressure sensor according to the present invention.
  • the sensor unit includes, for example, a diaphragm (not shown) sandwiched between a base 54 and a receiving member (not shown) as shown in Patent Document 1, and a pressure formed above the diaphragm.
  • a pressure receiving space (not shown) as a liquid sealing chamber that stores oil as a transmission medium, a sensor chip 16 that is disposed in the pressure receiving space and detects a pressure variation of the oil via a diaphragm, and a metal that supports the sensor chip 16
  • the main base 54 and a plurality of lead pins 40'ai for sending output signals from the sensor chip 16 and supplying power to the sensor chip 16 are included as main elements.
  • FIG. 5A In the example shown in FIG. 5A, FIG. 5B, FIG. 6A, and FIG. 6B described later, the same components as those in the example shown in FIG. Omitted.
  • the sensor chip 16 is directly fixed to the surface of the base 54 that faces the adherend surface of the sensor chip 16.
  • a recess 54Ga for forming the adhesive layer 50 is formed in the portion of the base 54 that faces the adherend surface of the sensor chip 16.
  • One end of the recess 54Ga opens toward the adherend surface of the sensor chip 16.
  • the recess 54Ga has, for example, a predetermined depth Dp such that the thickness of the adhesive layer 50 is 5 ⁇ m or more.
  • the diameter of the inner peripheral surface forming the recess 54Ga in the base 54 is set slightly smaller than the length of the diagonal line of the sensor chip 16.
  • the adhesive layer 50 is formed in the recess 54Ga, and is formed at a portion where the end surface of the base 54 adjacent to the sensor chip 16 and the outer peripheral edge of the sensor chip 16 facing the end surface intersect.
  • the portion where the end surface of the base 54 adjacent to the sensor chip 16 and the outer peripheral edge of the sensor chip 16 facing the end surface intersect is formed by, for example, an excessive adhesive overflowing from the inside of the recess 54Ga.
  • the adhesive application amount is set to be equal to or greater than the inner volume of the recess 54Ga overflowing from the recess 54Ga, so that the adhesive layer 50 having a uniform film thickness is formed. It is not necessary to manage the coating amount with high accuracy.
  • Each lead pin 40'ai is supported in each through hole of the base 54 via a hermetic glass 56.
  • Each lead pin 40'ai and the sensor chip 16 are connected by a bonding wire Wi.
  • the base 54 is formed of a metal material.
  • the present invention is not limited to such an example.
  • the base 54 ′ is formed of a resin material. Also good.
  • the sensor chip 16 is directly fixed to the surface of the base 54 ′ that faces the adherend surface of the sensor chip 16.
  • a concave portion 54 ′ Gb for forming the adhesive layer 50 is formed in the portion of the base 54 ′ that faces the surface to be bonded of the sensor chip 16.
  • One end of the recess 54 ′ Gb opens toward the surface to be bonded of the sensor chip 16.
  • the recess 54′Gb has, for example, a predetermined depth Dp such that the adhesive layer 50 has a thickness of 5 ⁇ m or more.
  • the diameter of the inner peripheral surface forming the concave portion 54 ′ Gb in the base 54 ′ is set slightly smaller than the length of the diagonal line of the sensor chip 16.
  • the adhesive layer 50 is formed in the recess 54′Gb, and is formed at a portion where the end surface of the base 54 ′ adjacent to the sensor chip 16 and the outer peripheral edge of the sensor chip 16 facing the end surface intersect.
  • the portion where the end surface of the base 54 ′ adjacent to the sensor chip 16 intersects with the outer peripheral edge of the sensor chip 16 facing the end surface is formed by, for example, excess adhesive overflowing from the inside of the recess 54 ′ Gb.
  • the adhesive amount 50 having a uniform film thickness is formed by setting the application amount of the adhesive to be equal to or greater than the inner volume of the recess 54′Gb overflowing from the recess 54′Gb. Therefore, it is not necessary to manage the application amount of the adhesive with high accuracy.
  • FIG. 6A is a partially enlarged view of a main part of a sensor unit in still another example of a pressure sensor according to the present invention.
  • the sensor unit is formed above a diaphragm (not shown) sandwiched between a base 64 and a receiving member (not shown), for example, as shown in Patent Document 1, for example.
  • a pressure receiving space (not shown) as a liquid sealing chamber for storing oil as a pressure transmission medium
  • a sensor chip 16 that is arranged in the pressure receiving space and detects oil pressure fluctuations via a diaphragm, and supports the sensor chip 16.
  • a metal base 64 and a plurality of lead pins 40 ′ ai that send output signals from the sensor chip 16 and supply power to the sensor chip 16 are included as main elements.
  • the sensor chip 16 is configured to be directly fixed to the surface of the base 64 facing the adherend surface of the sensor chip 16.
  • a concave portion 64Ga for forming the adhesive layer 50 is formed in the portion of the base 64 that faces the adherend surface of the sensor chip 16.
  • the diameter of the inner peripheral surface forming the recess 64Ga is set to be larger than the length of the diagonal line of the sensor chip 16.
  • the recess 64Ga has a predetermined depth Dp such that the thickness of the adhesive layer 50 is 5 ⁇ m or more.
  • the adhesive layer 50 is formed in the recess 64Ga, and is formed at a portion where the extended surface of the end surface of the base 64 adjacent to the sensor chip 16 and the outer peripheral edge of the sensor chip 16 facing the end surface intersect.
  • a portion where the extended surface of the end face of the base 64 adjacent to the sensor chip 16 and the outer peripheral edge of the sensor chip 16 facing the end face intersect is formed by, for example, an excessive adhesive overflowing from the inside of the recess 64Ga.
  • Each lead pin 40'ai is supported in each through hole of the base 64 via a hermetic glass 56.
  • Each lead pin 40'ai and the sensor chip 16 are connected by a bonding wire Wi.
  • the base 64 is formed of a metal material.
  • the present invention is not limited to such an example.
  • the base 64 ′ is formed of a resin material. Also good.
  • the sensor chip 16 is directly fixed to the surface of the base 64 ′ that faces the adherend surface of the sensor chip 16.
  • a concave portion 64′Gb for forming the adhesive layer 50 is formed in the portion of the base 64 ′ that faces the surface to be bonded of the sensor chip 16.
  • One end of the recess 64 ′ Gb opens toward the adherend surface of the sensor chip 16.
  • the recess 64′Gb has a predetermined depth Dp such that the thickness of the adhesive layer 50 is 5 ⁇ m or more.
  • the diameter of the inner peripheral surface forming the concave portion 64 ′ Gb in the base 64 ′ is set slightly larger than the length of the diagonal line of the sensor chip 16.
  • the adhesive layer 50 is formed in the recess 64′Gb, and is formed at a portion where the extended surface of the end surface of the base 64 ′ adjacent to the sensor chip 16 and the outer peripheral edge of the sensor chip 16 facing the end surface intersect. ing. A portion where the extended surface of the end surface of the base 54 ′ adjacent to the sensor chip 16 intersects with the outer peripheral edge of the sensor chip 16 facing the end surface is formed by, for example, an excessive adhesive overflowing from the inside of the recess 64 ′ Gb.
  • the adhesive layer 50 having a uniform film thickness is formed by setting the application amount of the adhesive to be equal to or greater than the inner volume of the recess 64′Gb overflowing from the recess 64′Gb. Therefore, it is not necessary to manage the application amount of the adhesive with high accuracy.
  • the application amount of the adhesive is set to be equal to or greater than the inner volume of the recess 18R overflowing from the recess 18R.
  • the adhesive is applied to a part of the substantially central portion in the cavity of the recess 18R so that the height from the bottom to the top of the recess in the applied adhesive is higher than the depth of the recess 18R.
  • the sensor chip 16 may be bonded. In such a case, a cavity is formed in the recess around the adhesive applied to the central portion to which the sensor chip is bonded.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

In this pressure sensor, an adhesive layer (50) is formed in a recessed portion (18R) formed in one end, opposing an adhered surface of a sensor chip (16), of a chip mount member (18), and is formed in a part between an end surface of hermetic glass (14) adjacent to one end portion of the chip mount member (18) and an outer peripheral edge of the sensor chip (16) facing said end surface.

Description

圧力センサPressure sensor
　本発明は、圧力センサに関する。 The present invention relates to a pressure sensor.
　液封型の半導体圧力センサの一部を構成するセンサユニットは、例えば、特許文献１に示されるように、ベースとダイアフラムとの間に形成される液封室（受圧空間）内に配されている。そのようなセンサユニットは、例えば、ベースと受け部材との間に挟み込まれたダイアフラムと、ダイアフラムの上方に形成され圧力伝達媒体としてのオイルを貯留する液封室としての受圧空間と、受圧空間内に配されダイアフラムを介しオイルの圧力変動を検出するセンサチップ（特許文献１においては、半導体圧力検出素子と呼称される）と、センサチップを支持するベースと、センサチップからの出力信号の送出およびセンサチップへの電力供給を行う複数のリードピンとを主な要素として含んで構成されている。 A sensor unit that constitutes a part of a liquid-sealed semiconductor pressure sensor is disposed in a liquid-sealed chamber (pressure-receiving space) formed between a base and a diaphragm, as shown in Patent Document 1, for example. Yes. Such a sensor unit includes, for example, a diaphragm sandwiched between a base and a receiving member, a pressure receiving space that is formed above the diaphragm and that stores oil as a pressure transmission medium, and a pressure receiving space in the pressure receiving space. A sensor chip (referred to as a semiconductor pressure detection element in Patent Document 1), a base that supports the sensor chip, and an output signal output from the sensor chip. A plurality of lead pins for supplying power to the sensor chip are included as main elements.
　そのようなセンサチップは、例えば、特許文献２に示されるように、パッケージ部材に形成された凹部の底部を形成する底壁部にシリコン系接着剤からなる接着剤層を介して接着されている。その接着剤層は、所定のヤング率を有し、接着剤層の厚さが、１１０μｍ以上の所定の厚さに設定されている。このように接着剤層の厚さが設定されるのは、接着剤層の厚さが大であるほど、パッケージ部材からセンサ素子に加わる力が接着剤層によって緩和されやすく、しかも、温度変化によるセンサ特性の変動を極力抑制できるからである。 For example, as shown in Patent Document 2, such a sensor chip is bonded to a bottom wall portion forming a bottom portion of a recess formed in a package member via an adhesive layer made of a silicon-based adhesive. . The adhesive layer has a predetermined Young's modulus, and the thickness of the adhesive layer is set to a predetermined thickness of 110 μm or more. The thickness of the adhesive layer is set in this way because the greater the thickness of the adhesive layer, the easier the force applied to the sensor element from the package member is relaxed by the adhesive layer, and also due to temperature changes. This is because fluctuations in sensor characteristics can be suppressed as much as possible.
　また、例えば、特許文献３に示されるように、圧力センサの小型化の要求に伴う樹脂ケースにおける熱応力による変形に基づくセンサ素子の特性の変化を抑制すべく、接着剤が塗布される凹み部が、センサ素子の台座が配される樹脂ケースの底面の逃げ部の底部に設けられるものが提案されている。その凹み部は、０．０５ｍｍ～０．２ｍｍ程度の深さを有する。これにより、センサ素子の角部の底面が樹脂ケースと接触に近い状態となることを防ぎ、樹脂ケースの変形がセンサ素子の特性に影響を及ぼすことが低減される。その結果、外部からの応力、および、樹脂ケースの変形による応力が、緩和されるのでセンサ素子の特性変化が低減される。 Further, for example, as shown in Patent Document 3, in order to suppress a change in the characteristics of the sensor element based on deformation due to thermal stress in a resin case accompanying a demand for downsizing of the pressure sensor, a recess portion to which an adhesive is applied However, what is provided in the bottom part of the relief part of the bottom face of the resin case where the base of a sensor element is arranged is proposed. The recess has a depth of about 0.05 mm to 0.2 mm. This prevents the bottom surface of the corner portion of the sensor element from being close to contact with the resin case, and reduces the deformation of the resin case affecting the characteristics of the sensor element. As a result, the stress from the outside and the stress due to the deformation of the resin case are relieved, so that the characteristic change of the sensor element is reduced.
特開２０１６－４５１７２号公報Japanese Unexamined Patent Publication No. 2016-45172 特開２００３－２４７９０３号公報JP 2003-247903 A 特開２００４－３６１３０８号公報JP 2004-361308 A
　特許文献２および特許文献３に示されるような、圧力センサの製造工程においては、接着剤をセンサ素子が接着されるパッケージ部材または樹脂ケースの被接着面に微量、塗布し所定の膜厚の接着層を一様に形成する場合、接着剤の塗布量を計量し、膜厚を高精度に管理することが必要とされる。 In the manufacturing process of a pressure sensor as shown in Patent Document 2 and Patent Document 3, a small amount of adhesive is applied to a surface to be bonded of a package member or a resin case to which a sensor element is bonded, and adhesion with a predetermined film thickness is performed. When the layer is formed uniformly, it is necessary to measure the coating amount of the adhesive and manage the film thickness with high accuracy.
　しかしながら、接着剤の塗布量を計量し、膜厚を高精度に管理することにも限界があり、膜厚がばらつく場合がある。 However, there is a limit to measuring the amount of adhesive applied and managing the film thickness with high accuracy, and the film thickness may vary.
　以上の問題点を考慮し、本発明は、圧力センサであって、接着剤の塗布量における高精度の管理を要することなく、一様な膜厚の接着層を得ることができる圧力センサの製造方法を提供することを目的とする。 In view of the above-described problems, the present invention is a pressure sensor, which is a pressure sensor that can obtain an adhesive layer having a uniform thickness without requiring high-precision management of the amount of adhesive applied. It aims to provide a method.
　上述の目的を達成するために、本発明に係る圧力センサは、圧力を検出し検出出力信号を送出するセンサチップと、センサチップを、接着剤層を介して支持する支持部材とを含んでなるセンサユニットと、センサユニットを収容するセンサユニット収容部と、を備え、支持部材は、所定の膜厚を有する接着剤層を形成するように接着剤の所定の塗布量を計量するための凹部を有することを特徴とする。 In order to achieve the above object, a pressure sensor according to the present invention includes a sensor chip that detects pressure and sends a detection output signal, and a support member that supports the sensor chip via an adhesive layer. A sensor unit and a sensor unit housing portion for housing the sensor unit, and the support member has a recess for measuring a predetermined coating amount of the adhesive so as to form an adhesive layer having a predetermined film thickness. It is characterized by having.
　また、支持部材が、チップマウント部材である場合、凹部は、センサチップの表面に向き合うチップマウント部材の一端部に形成される窪みであってもよく、さらに、支持部材が、チップマウント部材である場合、凹部は、チップマウント部材の一端部とセンサチップの表面との間に形成される隙間であってもよい。 When the support member is a chip mount member, the recess may be a recess formed at one end of the chip mount member facing the surface of the sensor chip, and the support member is a chip mount member. In this case, the recess may be a gap formed between one end of the chip mount member and the surface of the sensor chip.
　さらにまた、支持部材が、ハーメチックガラスの場合、凹部は、センサチップの表面に向き合うハーメチックガラスの端部に形成される窪みであってもよく、支持部材が、ベースである場合、凹部は、センサチップの表面に向き合うベースの端面に形成される窪みであってもよい。 Furthermore, when the support member is hermetic glass, the recess may be a depression formed at the end of the hermetic glass facing the surface of the sensor chip. When the support member is a base, the recess is a sensor. It may be a depression formed on the end face of the base facing the surface of the chip.
　接着剤は、接着剤が凹部から溢れ出るように、凹部の内容積以上に塗布されてもよい。 The adhesive may be applied more than the inner volume of the recess so that the adhesive overflows from the recess.
　凹部を形成する内周面の直径は、センサチップの対角線の長さに比して小に設定されてもよく、あるいは、凹部を形成する内周面の直径は、センサチップの対角線の長さに比して大に設定されてもよい。 The diameter of the inner peripheral surface forming the recess may be set smaller than the length of the diagonal of the sensor chip, or the diameter of the inner peripheral surface forming the recess is the length of the diagonal of the sensor chip. It may be set larger than
　さらに、本発明に係る圧力センサは、圧力を検出し検出出力信号を送出するセンサチップと、センサチップを、接着剤層を介して支持する支持部材とを含んでなるセンサユニットと、センサユニットを収容するセンサユニット収容部と、を備え、支持部材は、所定の膜厚を有する接着剤層を形成するように接着剤が塗布される所定の深さの凹部を有し、凹部は、凹部の略中央部に凹部の深さ以上に塗布された接着剤の周囲に、接着剤が塗布されていない空洞を一部に有することを特徴とする。 Furthermore, a pressure sensor according to the present invention includes a sensor chip that detects a pressure and sends a detection output signal, a sensor unit that includes a support member that supports the sensor chip via an adhesive layer, and a sensor unit. A support unit, and the support member has a recess having a predetermined depth to which an adhesive is applied so as to form an adhesive layer having a predetermined film thickness. It is characterized by having, in part, a cavity to which no adhesive is applied around an adhesive applied at a substantially central portion more than the depth of the recess.
　本発明に係る圧力センサによれば、支持部材は、所定の膜厚を有する接着剤層を形成するように接着剤の所定の塗布量を計量するための凹部を有するので接着剤の塗布量における高精度の管理を要することなく、一様な膜厚の接着層を得ることができる。 According to the pressure sensor of the present invention, the support member has a recess for measuring a predetermined application amount of the adhesive so as to form an adhesive layer having a predetermined film thickness. An adhesive layer having a uniform thickness can be obtained without requiring high-precision management.
図１は、本発明に係る圧力センサの一例におけるセンサユニットの要部を示す部分断面図である。FIG. 1 is a partial cross-sectional view showing a main part of a sensor unit in an example of a pressure sensor according to the present invention. 図２は、本発明に係る圧力センサの一例の構成を示す断面図である。FIG. 2 is a cross-sectional view showing a configuration of an example of a pressure sensor according to the present invention. 図３Ａは、本発明に係る圧力センサの一例におけるセンサユニットの変形例の要部を示す部分断面図である。FIG. 3A is a partial cross-sectional view showing a main part of a modified example of the sensor unit in the example of the pressure sensor according to the present invention. 図３Ｂは、本発明に係る圧力センサの一例におけるセンサユニットの変形例の要部を示す部分断面図である。FIG. 3B is a partial cross-sectional view showing a main part of a modified example of the sensor unit in the example of the pressure sensor according to the present invention. 図４Ａは、本発明に係る圧力センサの一例におけるセンサユニットの変形例の要部を示す部分断面図である。FIG. 4A is a partial cross-sectional view showing a main part of a modification of the sensor unit in an example of the pressure sensor according to the present invention. 図４Ｂは、本発明に係る圧力センサの一例におけるセンサユニットの変形例の要部を示す部分断面図である。FIG. 4B is a partial cross-sectional view showing a main part of a modified example of the sensor unit in the example of the pressure sensor according to the present invention. 図４Ｃは、本発明に係る圧力センサの一例におけるセンサユニットの変形例の要部を示す部分断面図である。FIG. 4C is a partial cross-sectional view showing a main part of a modified example of the sensor unit in the example of the pressure sensor according to the present invention. 図５Ａは、本発明に係る圧力センサの他の一例に用いられるセンサユニットの要部を示す部分断面図である。FIG. 5A is a partial cross-sectional view showing a main part of a sensor unit used in another example of the pressure sensor according to the present invention. 図５Ｂは、本発明に係る圧力センサの他の一例に用いられるセンサユニットの要部を示す部分断面図である。FIG. 5B is a partial cross-sectional view showing a main part of a sensor unit used in another example of the pressure sensor according to the present invention. 図６Ａは、本発明に係る圧力センサの他の一例に用いられるセンサユニットの変形例の要部を示す部分断面図である。FIG. 6A is a partial cross-sectional view showing a main part of a modified example of the sensor unit used in another example of the pressure sensor according to the present invention. 図６Ｂは、本発明に係る圧力センサの他の一例に用いられるセンサユニットの変形例の要部を示す部分断面図である。FIG. 6B is a partial cross-sectional view showing a main part of a modified example of the sensor unit used in another example of the pressure sensor according to the present invention.
　図２は、本発明に係る圧力センサの一例の構成を概略的に示す。 FIG. 2 schematically shows a configuration of an example of a pressure sensor according to the present invention.
　図２において、圧力センサは、圧力が検出されるべき流体が導かれる配管に接続される継手部材３０と、継手部材３０のベースプレート２８に連結され後述するセンサユニットを収容しセンサチップからの検出出力信号を所定の圧力測定装置に供給するセンサユニット収容部と、を含んで構成されている。 In FIG. 2, the pressure sensor includes a joint member 30 connected to a pipe through which a fluid whose pressure is to be detected is guided, and a sensor unit connected to a base plate 28 of the joint member 30 to be described later, and a detection output from the sensor chip. And a sensor unit housing for supplying a signal to a predetermined pressure measuring device.
　金属製の継手部材３０は、上述の配管の接続部の雄ねじ部にねじ込まれる雌ねじ部３０ｆｓを内側に有している。雌ねじ部３０ｆｓは、矢印Ｐの示す方向から供給される流体を後述する圧力室２８Ａに導く継手部材３０のポート３０ａに連通している。ポート３０ａの一方の開口端は、継手部材３０のベースプレート２８とセンサユニットのダイヤフラム３２との間に形成される圧力室２８Ａに向けて開口している。 The metal joint member 30 has an internal thread portion 30fs that is screwed into the external thread portion of the connection portion of the pipe described above. The female screw portion 30fs communicates with the port 30a of the joint member 30 that guides the fluid supplied from the direction indicated by the arrow P to the pressure chamber 28A described later. One open end of the port 30a opens toward a pressure chamber 28A formed between the base plate 28 of the joint member 30 and the diaphragm 32 of the sensor unit.
　センサユニット収容部の外郭部は、カバー部材としての円筒状の防水ケース２０により形成されている。樹脂製の防水ケース２０の下端部には、開口部２０ｂが形成されている。内側となる開口部２０ｂの周縁の段差部には、継手部材３０のベースプレート２８の周縁が係合されている。 The outer portion of the sensor unit housing portion is formed by a cylindrical waterproof case 20 as a cover member. An opening 20 b is formed at the lower end of the resin waterproof case 20. The peripheral edge of the base plate 28 of the joint member 30 is engaged with the step portion on the peripheral edge of the opening 20b that is the inner side.
　圧力室２８Ａ内には、継手部材３０のポート３０ａを通じて流体としての空気または液体が供給される。センサユニットのハウジング１２の下端面は、ベースプレート２８に載置されている。 In the pressure chamber 28A, air or liquid as a fluid is supplied through the port 30a of the joint member 30. A lower end surface of the housing 12 of the sensor unit is placed on the base plate 28.
　圧力室２８Ａ内の圧力を検出し検出出力信号を送出するセンサユニットは、円筒状のハウジング１２と、圧力室２８Ａとハウジング１２の内周部とを隔絶する金属製のダイヤフラム３２と、複数の圧力検出素子を有するセンサチップ１６と、接着剤層５０を介してセンサチップ１６を一端部で支持する金属製のチップマウント部材１８と、センサチップ１６に電気的に接続される入出力端子群４０ａｉ（ｉ＝１～８）と、入出力端子群４０ａｉおよびオイル充填用パイプ４４をチップマウント部材１８の外周面とハウジング１２の内周面との間に固定するハーメチックガラス１４と、を主な要素として含んで構成されている。 The sensor unit that detects the pressure in the pressure chamber 28A and sends out a detection output signal includes a cylindrical housing 12, a metal diaphragm 32 that isolates the pressure chamber 28A and the inner periphery of the housing 12, and a plurality of pressures. A sensor chip 16 having a detection element, a metal chip mount member 18 that supports the sensor chip 16 at one end via an adhesive layer 50, and an input / output terminal group 40ai ( i = 1 to 8) and the hermetic glass 14 for fixing the input / output terminal group 40ai and the oil filling pipe 44 between the outer peripheral surface of the chip mount member 18 and the inner peripheral surface of the housing 12 as main elements. It is configured to include.
　ダイヤフラム３２は、上述の圧力室２８Ａに向き合うハウジング１２の一方の下端面に支持されている。圧力室２８Ａに配されるダイヤフラム３２を保護するダイヤフラム保護カバー３４は、複数の連通孔３４ａを有している。ダイヤフラム保護カバー３４の周縁は、ダイヤフラム３２の周縁とともに溶接によりステンレス鋼製のハウジング１２の下端面に接合されている。 The diaphragm 32 is supported on one lower end surface of the housing 12 facing the pressure chamber 28A. The diaphragm protection cover 34 that protects the diaphragm 32 disposed in the pressure chamber 28A has a plurality of communication holes 34a. The peripheral edge of the diaphragm protection cover 34 is joined to the lower end surface of the stainless steel housing 12 by welding together with the peripheral edge of the diaphragm 32.
　金属製のダイヤフラム３２と向かい合うセンサチップ１６およびハーメチックガラス１４の端面との間に形成される液封室には、例えば、圧力伝達媒体として所定量のシリコーンオイルＰＭ、または、フッ素系不活性液体がオイル充填用パイプ４４を介して充填されている。なお、オイル充填用パイプ４４の一方の端部は、オイル充填後、二点鎖線で示されるように、押し潰され閉塞される。 In the liquid sealing chamber formed between the sensor chip 16 facing the metal diaphragm 32 and the end face of the hermetic glass 14, for example, a predetermined amount of silicone oil PM or a fluorine-based inert liquid is used as a pressure transmission medium. It is filled through an oil filling pipe 44. Note that one end of the oil filling pipe 44 is crushed and closed as indicated by a two-dot chain line after oil filling.
　シリコーンオイルは、例えば、シロキサン結合と有機質のメチル基とからなるジメチルポリシロキサン構造を持つシリコーンオイルとされる。フッ素系不活性液体は、例えば、パーフルオロカーボン構造をもつ液体、および、ハイドロフルオロエーテル構造をもつ液体、または、三フッ化塩化エチレンの低重合物であって、主鎖にフッ素および塩素が結合し、両端がフッ素、塩素の構造を有するものでもよい。 The silicone oil is, for example, a silicone oil having a dimethylpolysiloxane structure composed of a siloxane bond and an organic methyl group. The fluorine-based inert liquid is, for example, a liquid having a perfluorocarbon structure, a liquid having a hydrofluoroether structure, or a low polymer of ethylene trifluoride chloride, and fluorine and chlorine are bonded to the main chain. , Both ends may have a fluorine or chlorine structure.
　ハーメチックガラス１４の端部に形成される凹部に配されるセンサチップ１６とダイヤフラム３２との間には、さらに、金属製の電位調整部材１７がハーメチックガラス１４の下端面に支持されている。電位調整部材１７は、例えば、特許第３９８７３８６号公報にも示されるような、連通孔を有しセンサチップ１６の回路のゼロ電位に接続される端子に接続されている。 Between the sensor chip 16 and the diaphragm 32 disposed in the recess formed in the end portion of the hermetic glass 14, a metal potential adjusting member 17 is further supported on the lower end surface of the hermetic glass 14. The potential adjusting member 17 is connected to a terminal having a communication hole and connected to the zero potential of the circuit of the sensor chip 16 as disclosed in, for example, Japanese Patent No. 3987386.
　入出力端子群４０ａｉ（ｉ＝１～８）は、２本の電源用端子と、１本の出力用端子と、５本の調整用端子とから構成されている。各端子の両端部は、それぞれ、上述のハーメチックガラス１４の端部に形成される凹部と後述する端子台２４の孔とに向けて突出している。２本の電源用端子と、１本の出力用端子とは、接続端子３６を介して各リード線３８の芯線３８ａに接続されている。各リード線３８は、所定の圧力測定装置に接続される。なお、図２においては、８本の端子うちの４本の端子だけが示されている。入出力端子群４０ａｉと後述するセンサチップ１６との間は、ボンディングワイヤＷｉで接続されている。 The input / output terminal group 40ai (i = 1 to 8) includes two power supply terminals, one output terminal, and five adjustment terminals. Both end portions of each terminal protrude toward a recess formed at the end portion of the above-described hermetic glass 14 and a hole of a terminal block 24 described later. The two power supply terminals and the one output terminal are connected to the core wires 38 a of the lead wires 38 via the connection terminals 36. Each lead wire 38 is connected to a predetermined pressure measuring device. In FIG. 2, only four of the eight terminals are shown. The input / output terminal group 40ai and a sensor chip 16, which will be described later, are connected by a bonding wire Wi.
　センサチップ１６は、複数の圧力検出素子を有し、例えば、シリコンで略矩形状に形成されている本体部と、本体部の上端面に形成され処理回路を形成する回路層と、第１の層としての回路層の上面に積層される第２の層としての絶縁膜層と、その絶縁膜層に形成されるアルミニウム製のシールド層と、シールド層の上層部を保護する保護層とを含んで構成されている。矩形状のセンサチップ１６の対角線の長さは、例えば、チップマウント部材１８の直径よりも若干大となるように設定されている。 The sensor chip 16 includes a plurality of pressure detection elements, for example, a main body formed in a substantially rectangular shape with silicon, a circuit layer formed on the upper end surface of the main body to form a processing circuit, and a first An insulating film layer as a second layer laminated on the upper surface of the circuit layer as a layer, an aluminum shield layer formed on the insulating film layer, and a protective layer protecting the upper layer portion of the shield layer It consists of The length of the diagonal line of the rectangular sensor chip 16 is set to be slightly larger than the diameter of the chip mount member 18, for example.
　センサチップ１６は、チップマウント部材１８の一端部に接着剤層５０を介して接着されている。 The sensor chip 16 is bonded to one end of the chip mount member 18 via an adhesive layer 50.
　接着剤層５０は、図１に部分的に拡大されて示されるように、センサチップ１６の被接着面に向き合うチップマウント部材１８の一端部に形成される凹部１８Ｒ内に形成されるとともに、チップマウント部材１８の一端部に隣接するハーメチックガラス１４の端面とその端面に臨むセンサチップ１６の外周縁との間の部分に形成されている。チップマウント部材１８の一端部に隣接するハーメチックガラス１４の端面とその端面に臨むセンサチップ１６の外周縁との間の部分は、例えば、所定の接着剤の塗布量を計量する計量用凹部としての凹部１８Ｒ内から溢れ出た余分な接着剤により形成される。凹部１８Ｒの一端は、センサチップ１６の被接着面に向けて開口している。所定の接着剤の塗布量を計量する計量用凹部としての凹部１８Ｒは、例えば、その接着剤層の厚さが５μｍ以上となるような深さＤｐを有している。接着剤層５０の材質は、それぞれ、本出願人により、先に出願された特許出願（出願番号：特願２０１６－１８５６７８号）の明細書中に記載されるような、例えば、シリコーン系接着剤とされる。また、チップマウント部材１８の材質は、例えば、鉄ニッケル系合金、または、ステンレス鋼等の金属とされる。 The adhesive layer 50 is formed in a recess 18R formed at one end of a chip mount member 18 facing the adherend surface of the sensor chip 16 as shown in a partially enlarged view in FIG. It is formed at a portion between the end face of the hermetic glass 14 adjacent to one end of the mount member 18 and the outer peripheral edge of the sensor chip 16 facing the end face. A portion between the end surface of the hermetic glass 14 adjacent to one end portion of the chip mount member 18 and the outer peripheral edge of the sensor chip 16 facing the end surface is used as, for example, a measurement recess for measuring a predetermined adhesive application amount. It is formed by an excessive adhesive overflowing from the inside of the recess 18R. One end of the recess 18 </ b> R opens toward the adherend surface of the sensor chip 16. The concave portion 18R serving as a measuring concave portion for measuring a predetermined adhesive application amount has a depth Dp such that the thickness of the adhesive layer is 5 μm or more, for example. The material of the adhesive layer 50 is, for example, a silicone adhesive as described in the specification of a patent application (Application No .: Japanese Patent Application No. 2016-185678) previously filed by the applicant. It is said. The material of the chip mount member 18 is, for example, an iron-nickel alloy or a metal such as stainless steel.
　このように接着剤の塗布量が、凹部１８Ｒ内から溢れ出るような凹部１８Ｒの内容積以上に設定されることにより、一様な膜厚を有する接着剤層５０が形成されるので接着剤の塗布量を高精度で管理する必要がないこととなる。 In this way, the adhesive application amount is set to be equal to or greater than the inner volume of the recess 18R overflowing from the recess 18R, so that the adhesive layer 50 having a uniform film thickness is formed. It is not necessary to manage the coating amount with high accuracy.
　入出力端子群４０ａｉを整列させる端子台２４は、樹脂材料、例えば、ポリブチレンテレフタレート（ＰＢＴ）で成形されている。端子台２４は、入出力端子群４０ａｉが挿入される複数個の孔とともに、内側に所定の容積の空洞部を有している。端子台２４の下端面は、ハーメチックガラス１４の上端面を覆うようにハウジング１２の上端面に、シリコーン系接着剤により接着されている。これにより、所定の厚さを有する環状の接着層１０ａがハウジング１２の上端面に形成されることとなる。また、入出力端子群４０ａｉが突出するハーメチックガラス１４の上端面全体には、シリコーン系接着剤からなる被覆層１０ｂが所定の厚さで形成されている。 The terminal block 24 for aligning the input / output terminal group 40ai is formed of a resin material, for example, polybutylene terephthalate (PBT). The terminal block 24 includes a plurality of holes into which the input / output terminal group 40ai is inserted and a hollow portion having a predetermined volume inside. The lower end surface of the terminal block 24 is bonded to the upper end surface of the housing 12 with a silicone-based adhesive so as to cover the upper end surface of the hermetic glass 14. As a result, an annular adhesive layer 10 a having a predetermined thickness is formed on the upper end surface of the housing 12. Further, a coating layer 10b made of a silicone-based adhesive is formed on the entire upper end surface of the hermetic glass 14 from which the input / output terminal group 40ai protrudes with a predetermined thickness.
　端子台２４の空洞部を形成する内周面であって、ハーメチックガラス１４の上端面に向き合う内周面には、ハーメチックガラス１４に向けて突出する環状突起部２４Ｐが形成されている。環状突起部２４Ｐの突出長さは、被覆層１０ｂの粘性等に応じて設定される。このように環状突起部２４Ｐが形成されることにより、塗布された被覆層１０ｂの一部が、表面張力により環状突起部２４Ｐと、端子台２４の空洞部を形成する内周面のうちハーメチックガラス１４の上端面に略直交する部分との間の狭い空間内に引っ張られて保持されるので、被覆層１０ｂが端子台２４の空洞部内における一方側に偏ることなく塗布されることとなる。また、被覆層１０ｂは、ハーメチックガラス１４の上端面に所定の厚さで形成されるが、部分１０ｃに示すように、ハーメチックガラス１４の上端面から突出する複数のリードピン４０ａｉの一部分をさらに覆うように形成されてもよい。これにより、ハウジング１２の上端面およびハーメチックガラス１４の上端面全体には、被覆層１０ａ、被覆層１０ｂおよび被覆層１０ｃからなるシリコーン系接着層１０が静電気保護層として形成されることとなる。従って、このようにシリコーン系接着剤により静電気保護層が形成されることにより、ＥＳＤ保護回路の有無に影響されることなく、センサユニットの静電気耐力が、向上することとなる。 An annular protrusion 24P that protrudes toward the hermetic glass 14 is formed on the inner peripheral surface that forms the hollow portion of the terminal block 24 and faces the upper end surface of the hermetic glass 14. The protruding length of the annular protrusion 24P is set according to the viscosity of the coating layer 10b. By forming the annular protrusion 24P in this way, a part of the applied coating layer 10b is hermetic glass in the inner peripheral surface forming the annular protrusion 24P and the cavity of the terminal block 24 by surface tension. 14 is pulled and held in a narrow space between the upper end surface of the terminal 14 and the portion substantially perpendicular to the upper end surface, the coating layer 10b is applied without being biased to one side in the cavity of the terminal block 24. The covering layer 10b is formed on the upper end surface of the hermetic glass 14 with a predetermined thickness. As shown in the portion 10c, the covering layer 10b further covers a part of the plurality of lead pins 40ai protruding from the upper end surface of the hermetic glass 14. May be formed. As a result, the silicone-based adhesive layer 10 including the coating layer 10a, the coating layer 10b, and the coating layer 10c is formed as an electrostatic protection layer on the upper end surface of the housing 12 and the entire upper end surface of the hermetic glass 14. Therefore, by forming the electrostatic protection layer with the silicone-based adhesive in this way, the electrostatic strength of the sensor unit is improved without being affected by the presence or absence of the ESD protection circuit.
　上述のシリコーン系接着剤は、例えば、柔軟性のある付加型の一成分系であるものが好ましい。シリコーン系接着剤は、例えば、低分子シロキサン結合を有する接着剤とされる。また、シリコーン系接着剤とシリコーンオイルとが相性がよいのでシリコーン系接着剤にシリコーンオイル等が万一混じりあった場合であっても、シリコーン系接着剤の接着性が悪化する虞がない。 The above-mentioned silicone adhesive is preferably, for example, a flexible additive type one-component system. The silicone-based adhesive is, for example, an adhesive having a low molecular siloxane bond. Further, since the silicone adhesive and the silicone oil are compatible, there is no possibility that the adhesiveness of the silicone adhesive will deteriorate even if silicone oil or the like is mixed in the silicone adhesive.
　端子台２４の外周面、および、端子台２４に連結され上述の孔を覆うエンドキャップ２２の外周面と防水ケース２０の内周面との間、また、防水ケース２０の内周面とハウジング１２の外周面との間には、封止材２６が、所定量、充填されている。端子台２４およびエンドキャップ２２は、上述のセンサユニットを挟んで継手部材３０のベースプレート２８と向き合って防水ケース２０内に配置されている。 Between the outer peripheral surface of the terminal block 24, the outer peripheral surface of the end cap 22 connected to the terminal block 24 and covering the above-described hole, and the inner peripheral surface of the waterproof case 20, and the inner peripheral surface of the waterproof case 20 and the housing 12 A predetermined amount of the sealing material 26 is filled between the outer peripheral surface and the outer peripheral surface. The terminal block 24 and the end cap 22 are disposed in the waterproof case 20 so as to face the base plate 28 of the joint member 30 with the above-described sensor unit interposed therebetween.
　エンドキャップ２２の上端面は、防水ケース２０の開口端から上方に向けて突出している。即ち、エンドキャップ２２の上端面の位置は、防水ケース２０の開口端面の位置よりも高い位置となる。 The upper end surface of the end cap 22 protrudes upward from the opening end of the waterproof case 20. That is, the position of the upper end surface of the end cap 22 is higher than the position of the opening end surface of the waterproof case 20.
　図１に示される例においては、接着剤層５０は、チップマウント部材１８の一端部に形成される凹部１８Ｒ内に形成されているが、斯かる例に限られることなく、例えば、図３Ａに部分的に拡大されて示されるように、チップマウント部材１８における中心軸線に沿った長さよりも若干短い長さを有するチップマウント部材１８´が用いられることにより、センサチップ１６の被接着面に向き合うチップマウント部材１８´の端面とセンサチップ１６の被接着面との間の隙間に、所定の深さＤｐを有する凹部１８´Ｒが形成されてもよい。なお、図３Ａ、後述する図３Ｂ、図４Ａ、図４Ｂ、および、図４Ｃに示される例においては、図１に示される例における構成要素と同一の構成要素について同一の符合を付して示し、その重複説明を省略する。 In the example shown in FIG. 1, the adhesive layer 50 is formed in the recess 18 </ b> R formed at one end of the chip mount member 18, but is not limited to such an example. As shown in a partially enlarged manner, the chip mount member 18 ′ having a length slightly shorter than the length along the central axis of the chip mount member 18 is used to face the adherend surface of the sensor chip 16. A recess 18′R having a predetermined depth Dp may be formed in a gap between the end face of the chip mount member 18 ′ and the adherend surface of the sensor chip 16. In the example shown in FIG. 3A, FIG. 3B, FIG. 4A, FIG. 4B, and FIG. 4C described later, the same components as those in the example shown in FIG. The duplicate explanation is omitted.
　接着剤層５０は、凹部１８´Ｒ内に形成されるとともに、隣接するハーメチックガラス１４の端面とその端面に臨むセンサチップ１６の外周縁とが交わる部分に形成されている。 The adhesive layer 50 is formed in the recess 18'R and is formed at a portion where the end surface of the adjacent hermetic glass 14 and the outer peripheral edge of the sensor chip 16 facing the end surface intersect.
　センサチップ１６に隣接するハーメチックガラス１４の端面とその端面に臨むセンサチップ１６の外周縁とが交わる部分は、例えば、凹部１８´Ｒ内から溢れ出た余分な接着剤により形成される。凹部１８´Ｒは、例えば、その接着剤層の厚さが５μｍ以上となるような深さＤｐを有している。 The portion where the end face of the hermetic glass 14 adjacent to the sensor chip 16 and the outer peripheral edge of the sensor chip 16 facing the end face intersect is formed by, for example, an excess adhesive overflowing from the inside of the recess 18′R. The recess 18′R has, for example, a depth Dp such that the thickness of the adhesive layer is 5 μm or more.
　このように接着剤の塗布量が、凹部１８´Ｒ内から溢れ出るような凹部１８´Ｒの内容積以上に設定されることにより、一様な膜厚を有する接着剤層５０が形成されるので接着剤の塗布量を高精度で管理する必要がないこととなる。 Thus, the adhesive layer 50 having a uniform film thickness is formed by setting the application amount of the adhesive to be equal to or greater than the inner volume of the recess 18'R overflowing from the recess 18'R. Therefore, it is not necessary to manage the application amount of the adhesive with high accuracy.
　さらに、上述の例において、センサユニットにおけるセンサチップ１６は、ハーメチックガラス１４内に保持されるチップマウント部材１８の一端部で支持されているが、斯かる例に限られることなく、例えば、センサチップ１６が、チップマウント部材１８を用いることなく、図３Ｂに示されるように、センサチップ１６の被接着面に向き合うハーメチックガラス１４´の部分に直接的に固定されるように構成されてもよい。センサチップ１６の被接着面に向き合うハーメチックガラス１４´の部分には、接着剤層５０を形成する凹部１４´Ｇａが形成されている。凹部１４´Ｇａは、例えば、ハーメチックガラス１４´を成形する際、カーボン製の治具により、形成される。凹部１４´Ｇａは、例えば、その接着剤層５０の厚さが５μｍ以上となるような所定の深さＤｐを有している。接着剤層５０は、凹部１４´Ｇａ内に形成されるとともに、センサチップ１６に隣接するハーメチックガラス１４の端面とその端面に臨むセンサチップ１６の外周縁とが交わる部分に形成されている。センサチップ１６に隣接するハーメチックガラス１４の端面とその端面に臨むセンサチップ１６の外周縁とが交わる部分は、例えば、凹部１４´Ｇａ内から溢れ出た余分な接着剤により形成される。 Furthermore, in the above-described example, the sensor chip 16 in the sensor unit is supported by one end of the chip mount member 18 held in the hermetic glass 14, but is not limited to such an example. 16 may be configured to be directly fixed to the portion of the hermetic glass 14 ′ facing the adherend surface of the sensor chip 16 as shown in FIG. 3B without using the chip mount member 18. A concave portion 14 ′ Ga for forming the adhesive layer 50 is formed in a portion of the hermetic glass 14 ′ facing the surface to be bonded of the sensor chip 16. The recess 14′Ga is formed by a carbon jig when the hermetic glass 14 ′ is formed, for example. For example, the recess 14′Ga has a predetermined depth Dp such that the thickness of the adhesive layer 50 is 5 μm or more. The adhesive layer 50 is formed in the recess 14 ′ Ga and is formed at a portion where the end surface of the hermetic glass 14 adjacent to the sensor chip 16 and the outer peripheral edge of the sensor chip 16 facing the end surface intersect. A portion where the end face of the hermetic glass 14 adjacent to the sensor chip 16 and the outer peripheral edge of the sensor chip 16 facing the end face intersect is formed by, for example, an excessive adhesive overflowing from the inside of the recess 14′Ga.
　さらにまた、チップマウント部材４８の直径が、図４Ａに部分的に拡大されて示されるように、センサチップ１６における四角形の対角線の長さ（以下、対角線の長さともいう）よりも大に設定されてもよい。このような場合、センサチップ１６は、チップマウント部材１８の一端部に接着剤層５０を介して接着されている。 Furthermore, the diameter of the chip mount member 48 is set larger than the length of the diagonal line of the sensor chip 16 (hereinafter also referred to as the length of the diagonal line) as partially enlarged in FIG. 4A. May be. In such a case, the sensor chip 16 is bonded to one end of the chip mount member 18 via the adhesive layer 50.
　接着剤層５０は、センサチップ１６の被接着面に向き合うチップマウント部材４８の一端部に形成される凹部４８Ｒ内に形成されるとともに、チップマウント部材４８の一端部の端面の延長した面とその端面に臨むセンサチップ１６の外周縁とが交差する部分に形成されている。チップマウント部材４８の一端部の端面の延長した面とその端面に臨むセンサチップ１６の外周縁とが交差する部分は、例えば、凹部４８Ｒ内から溢れ出た余分な接着剤により表面張力により形成される。凹部４８Ｒは、例えば、その接着剤層の厚さが５μｍ以上となるような深さＤｐを有している。チップマウント部材４８の材質は、上述のチップマウント部材１８の材質と同様に、例えば、鉄ニッケル系合金、または、ステンレス鋼等の金属とされる。 The adhesive layer 50 is formed in a recess 48R formed at one end portion of the chip mount member 48 facing the adherend surface of the sensor chip 16, and an extended surface of the end surface of one end portion of the chip mount member 48 and its surface It is formed at a portion where the outer peripheral edge of the sensor chip 16 facing the end surface intersects. The portion where the extended surface of the end surface of one end of the chip mount member 48 intersects with the outer peripheral edge of the sensor chip 16 facing the end surface is formed by surface tension by, for example, excess adhesive overflowing from the inside of the recess 48R. The For example, the recess 48R has a depth Dp such that the thickness of the adhesive layer is 5 μm or more. The material of the chip mount member 48 is, for example, an iron-nickel alloy or a metal such as stainless steel, similar to the material of the chip mount member 18 described above.
　このように接着剤の塗布量が、凹部４８Ｒ内から溢れ出るような凹部４８Ｒの内容積以上に設定されることにより、一様な膜厚を有する接着剤層５０が形成されるので接着剤の塗布量を高精度で管理する必要がないこととなる。 As described above, the adhesive application amount is set to be equal to or larger than the inner volume of the concave portion 48R overflowing from the concave portion 48R, whereby the adhesive layer 50 having a uniform film thickness is formed. It is not necessary to manage the coating amount with high accuracy.
　さらにまた、図４Ｂに部分的に拡大されて示されるように、チップマウント部材４８における中心軸線に沿った長さよりも若干短い長さを有するチップマウント部材４８´が用いられることにより、センサチップ１６の被接着面に向き合うチップマウント部材４８´の端面とセンサチップ１６の被接着面との間に、所定の深さＤｐを有する凹部４８´Ｒが形成されてもよい。 Furthermore, as shown in a partially enlarged view in FIG. 4B, the sensor chip 16 is used by using a chip mount member 48 ′ having a length slightly shorter than the length along the central axis of the chip mount member 48. A recess 48 ′ R having a predetermined depth Dp may be formed between the end surface of the chip mount member 48 ′ facing the surface to be bonded and the surface to be bonded of the sensor chip 16.
　接着剤層５０は、凹部４８´Ｒ内に形成されるとともに、センサチップ１６に隣接するハーメチックガラス１４の端面の延長した面とその端面に臨むセンサチップ１６の外周縁とが交わる部分に形成されている。 The adhesive layer 50 is formed in the recess 48'R and is formed at a portion where the extended surface of the end face of the hermetic glass 14 adjacent to the sensor chip 16 and the outer peripheral edge of the sensor chip 16 facing the end face intersect. ing.
　センサチップ１６に隣接するハーメチックガラス１４の端面の延長した面とその端面に臨むセンサチップ１６の外周縁とが交わる部分は、例えば、凹部４８´Ｒ内から溢れ出た余分な接着剤により形成される。凹部４８´Ｒは、例えば、その接着剤層の厚さが５μｍ以上となるような深さＤｐを有している。 A portion where the extended surface of the end face of the hermetic glass 14 adjacent to the sensor chip 16 and the outer peripheral edge of the sensor chip 16 facing the end face intersect is formed by, for example, an excessive adhesive overflowing from the inside of the recess 48′R. The For example, the recess 48′R has a depth Dp such that the thickness of the adhesive layer is 5 μm or more.
　このように接着剤の塗布量が、凹部４８´Ｒ内から溢れ出るような凹部４８´Ｒの内容積以上に設定されることにより、一様な膜厚を有する接着剤層５０が形成されるので接着剤の塗布量を高精度で管理する必要がないこととなる。 In this way, the adhesive layer 50 having a uniform film thickness is formed by setting the application amount of the adhesive to be equal to or greater than the inner volume of the recess 48′R overflowing from the recess 48′R. Therefore, it is not necessary to manage the application amount of the adhesive with high accuracy.
　さらに、上述の例において、センサユニットにおけるセンサチップ１６は、ハーメチックガラス１４内に保持されるチップマウント部材４８の一端部で支持されているが、斯かる例に限られることなく、例えば、センサチップ１６が、チップマウント部材４８を用いることなく、図４Ｃに示されるように、センサチップ１６の被接着面に向き合うハーメチックガラス１４´の部分に直接的に固定されるように構成されてもよい。センサチップ１６の被接着面に向き合うハーメチックガラス１４´の部分には、接着剤層５０を形成する凹部１４´Ｇｂが形成されている。凹部１４´Ｇｂを形成する内周面の直径が、図４Ｃに部分的に拡大されて示されるように、センサチップ１６の対角線の長さよりも大に設定されてもよい。凹部１４´Ｇｂは、例えば、ハーメチックガラス１４´を成形する際、カーボン製の治具により、形成される。凹部１４´Ｇｂは、例えば、その接着剤層５０の厚さが５μｍ以上となるような所定の深さＤｐを有している。接着剤層５０は、凹部１４´Ｇｂ内に形成されるとともに、センサチップ１６に隣接するハーメチックガラス１４´の端面とその端面に臨むセンサチップ１６の外周縁とが交わる部分に形成されている。センサチップ１６に隣接するハーメチックガラス１４´の端面とその端面に臨むセンサチップ１６の外周縁とが交わる部分は、例えば、凹部１４´Ｇｂ内から溢れ出た余分な接着剤により形成される。 Furthermore, in the above-described example, the sensor chip 16 in the sensor unit is supported by one end portion of the chip mount member 48 held in the hermetic glass 14, but the present invention is not limited to such an example. 16 may be configured to be directly fixed to the portion of the hermetic glass 14 ′ facing the adherend surface of the sensor chip 16 as shown in FIG. 4C without using the chip mount member 48. In the portion of the hermetic glass 14 ′ facing the surface to be bonded of the sensor chip 16, a recess 14 ′ Gb for forming the adhesive layer 50 is formed. The diameter of the inner peripheral surface forming the recess 14′Gb may be set larger than the length of the diagonal line of the sensor chip 16 as shown in a partially enlarged manner in FIG. 4C. For example, when the hermetic glass 14 ′ is formed, the recess 14 ′ Gb is formed by a carbon jig. The recess 14′Gb has a predetermined depth Dp such that the thickness of the adhesive layer 50 is 5 μm or more, for example. The adhesive layer 50 is formed in the recess 14′Gb, and is formed at a portion where the end surface of the hermetic glass 14 ′ adjacent to the sensor chip 16 and the outer peripheral edge of the sensor chip 16 facing the end surface intersect. A portion where the end face of the hermetic glass 14 ′ adjacent to the sensor chip 16 and the outer peripheral edge of the sensor chip 16 facing the end face intersect is formed by, for example, an excessive adhesive overflowing from the inside of the recess 14 ′ Gb.
　図５Ａは、本発明に係る圧力センサの他の一例におけるセンサユニットの要部を部分的に拡大して示す。 FIG. 5A is a partially enlarged view showing a main part of a sensor unit in another example of the pressure sensor according to the present invention.
　図５Ａにおいて、センサユニットは、例えば、特許文献１にも示されるような、ベース５４と受け部材（不図示）との間に挟み込まれたダイアフラム（不図示）と、ダイアフラムの上方に形成され圧力伝達媒体としてのオイルを貯留する液封室としての受圧空間（不図示）と、受圧空間内に配されダイアフラムを介しオイルの圧力変動を検出するセンサチップ１６と、センサチップ１６を支持する金属製のベース５４と、センサチップ１６からの出力信号の送出およびセンサチップ１６への電力供給を行う複数のリードピン４０´ａｉとを主な要素として含んで構成されている。 In FIG. 5A, the sensor unit includes, for example, a diaphragm (not shown) sandwiched between a base 54 and a receiving member (not shown) as shown in Patent Document 1, and a pressure formed above the diaphragm. A pressure receiving space (not shown) as a liquid sealing chamber that stores oil as a transmission medium, a sensor chip 16 that is disposed in the pressure receiving space and detects a pressure variation of the oil via a diaphragm, and a metal that supports the sensor chip 16 The main base 54 and a plurality of lead pins 40'ai for sending output signals from the sensor chip 16 and supplying power to the sensor chip 16 are included as main elements.
　なお、図５Ａ、後述する図５Ｂ、図６Ａおよび図６Ｂに示される例においては、図１に示される例における構成要素と同一の構成要素について同一の符合を付して示し、その重複説明を省略する。 In the example shown in FIG. 5A, FIG. 5B, FIG. 6A, and FIG. 6B described later, the same components as those in the example shown in FIG. Omitted.
　センサチップ１６は、センサチップ１６の被接着面に向き合うベース５４の表面に直接的に固定されている。センサチップ１６の被接着面に向き合うベース５４の部分には、接着剤層５０を形成する凹部５４Ｇａが形成されている。凹部５４Ｇａの一端は、センサチップ１６の被接着面に向けて開口している。凹部５４Ｇａは、例えば、その接着剤層５０の厚さが５μｍ以上となるような所定の深さＤｐを有している。ベース５４における凹部５４Ｇａを形成する内周面の直径は、センサチップ１６の対角線の長さよりも若干小に設定されている。 The sensor chip 16 is directly fixed to the surface of the base 54 that faces the adherend surface of the sensor chip 16. A recess 54Ga for forming the adhesive layer 50 is formed in the portion of the base 54 that faces the adherend surface of the sensor chip 16. One end of the recess 54Ga opens toward the adherend surface of the sensor chip 16. The recess 54Ga has, for example, a predetermined depth Dp such that the thickness of the adhesive layer 50 is 5 μm or more. The diameter of the inner peripheral surface forming the recess 54Ga in the base 54 is set slightly smaller than the length of the diagonal line of the sensor chip 16.
　接着剤層５０は、凹部５４Ｇａ内に形成されるとともに、センサチップ１６に隣接するベース５４の端面とその端面に臨むセンサチップ１６の外周縁とが交わる部分に形成されている。センサチップ１６に隣接するベース５４の端面とその端面に臨むセンサチップ１６の外周縁とが交わる部分は、例えば、凹部５４Ｇａ内から溢れ出た余分な接着剤により形成される。このように接着剤の塗布量が、凹部５４Ｇａ内から溢れ出るような凹部５４Ｇａの内容積以上に設定されることにより、一様な膜厚を有する接着剤層５０が形成されるので接着剤の塗布量を高精度で管理する必要がないこととなる。 The adhesive layer 50 is formed in the recess 54Ga, and is formed at a portion where the end surface of the base 54 adjacent to the sensor chip 16 and the outer peripheral edge of the sensor chip 16 facing the end surface intersect. The portion where the end surface of the base 54 adjacent to the sensor chip 16 and the outer peripheral edge of the sensor chip 16 facing the end surface intersect is formed by, for example, an excessive adhesive overflowing from the inside of the recess 54Ga. In this way, the adhesive application amount is set to be equal to or greater than the inner volume of the recess 54Ga overflowing from the recess 54Ga, so that the adhesive layer 50 having a uniform film thickness is formed. It is not necessary to manage the coating amount with high accuracy.
　各リードピン４０´ａｉは、ベース５４の各貫通孔にハーメチックガラス５６を介して支持されている。各リードピン４０´ａｉとセンサチップ１６との間は、ボンディングワイヤＷｉで接続されている。 Each lead pin 40'ai is supported in each through hole of the base 54 via a hermetic glass 56. Each lead pin 40'ai and the sensor chip 16 are connected by a bonding wire Wi.
　図５Ａに示される例においては、ベース５４が金属材料で成形されているが、斯かる例に限られることなく、例えば、図５Ｂに示されるように、ベース５４´が樹脂材料により成形されてもよい。 In the example shown in FIG. 5A, the base 54 is formed of a metal material. However, the present invention is not limited to such an example. For example, as shown in FIG. 5B, the base 54 ′ is formed of a resin material. Also good.
　センサチップ１６は、センサチップ１６の被接着面に向き合うベース５４´の表面に直接的に固定されている。センサチップ１６の被接着面に向き合うベース５４´の部分には、接着剤層５０を形成する凹部５４´Ｇｂが形成されている。凹部５４´Ｇｂの一端は、センサチップ１６の被接着面に向けて開口している。凹部５４´Ｇｂは、例えば、その接着剤層５０の厚さが５μｍ以上となるような所定の深さＤｐを有している。ベース５４´における凹部５４´Ｇｂを形成する内周面の直径は、センサチップ１６の対角線の長さよりも若干小に設定されている。 The sensor chip 16 is directly fixed to the surface of the base 54 ′ that faces the adherend surface of the sensor chip 16. A concave portion 54 ′ Gb for forming the adhesive layer 50 is formed in the portion of the base 54 ′ that faces the surface to be bonded of the sensor chip 16. One end of the recess 54 ′ Gb opens toward the surface to be bonded of the sensor chip 16. The recess 54′Gb has, for example, a predetermined depth Dp such that the adhesive layer 50 has a thickness of 5 μm or more. The diameter of the inner peripheral surface forming the concave portion 54 ′ Gb in the base 54 ′ is set slightly smaller than the length of the diagonal line of the sensor chip 16.
　接着剤層５０は、凹部５４´Ｇｂ内に形成されるとともに、センサチップ１６に隣接するベース５４´の端面とその端面に臨むセンサチップ１６の外周縁とが交わる部分に形成されている。センサチップ１６に隣接するベース５４´の端面とその端面に臨むセンサチップ１６の外周縁とが交わる部分は、例えば、凹部５４´Ｇｂ内から溢れ出た余分な接着剤により形成される。このように接着剤の塗布量が、凹部５４´Ｇｂ内から溢れ出るような凹部５４´Ｇｂの内容積以上に設定されることにより、一様な膜厚を有する接着剤層５０が形成されるので接着剤の塗布量を高精度で管理する必要がないこととなる。 The adhesive layer 50 is formed in the recess 54′Gb, and is formed at a portion where the end surface of the base 54 ′ adjacent to the sensor chip 16 and the outer peripheral edge of the sensor chip 16 facing the end surface intersect. The portion where the end surface of the base 54 ′ adjacent to the sensor chip 16 intersects with the outer peripheral edge of the sensor chip 16 facing the end surface is formed by, for example, excess adhesive overflowing from the inside of the recess 54 ′ Gb. Thus, the adhesive amount 50 having a uniform film thickness is formed by setting the application amount of the adhesive to be equal to or greater than the inner volume of the recess 54′Gb overflowing from the recess 54′Gb. Therefore, it is not necessary to manage the application amount of the adhesive with high accuracy.
　図６Ａは、本発明に係る圧力センサのさらなる他の一例におけるセンサユニットの要部を部分的に拡大して示す。 FIG. 6A is a partially enlarged view of a main part of a sensor unit in still another example of a pressure sensor according to the present invention.
　図６Ａにおいて、センサユニットは、例えば、例えば、特許文献１にも示されるような、ベース６４と受け部材（不図示）との間に挟み込まれたダイアフラム（不図示）と、ダイアフラムの上方に形成され圧力伝達媒体としてのオイルを貯留する液封室としての受圧空間（不図示）と、受圧空間内に配されダイアフラムを介しオイルの圧力変動を検出するセンサチップ１６と、センサチップ１６を支持する金属製のベース６４と、センサチップ１６からの出力信号の送出およびセンサチップ１６への電力供給を行う複数のリードピン４０´ａｉとを主な要素として含んで構成されている。 In FIG. 6A, the sensor unit is formed above a diaphragm (not shown) sandwiched between a base 64 and a receiving member (not shown), for example, as shown in Patent Document 1, for example. A pressure receiving space (not shown) as a liquid sealing chamber for storing oil as a pressure transmission medium, a sensor chip 16 that is arranged in the pressure receiving space and detects oil pressure fluctuations via a diaphragm, and supports the sensor chip 16. A metal base 64 and a plurality of lead pins 40 ′ ai that send output signals from the sensor chip 16 and supply power to the sensor chip 16 are included as main elements.
　センサチップ１６は、センサチップ１６の被接着面に向き合うベース６４の表面に直接的に固定されるように構成される。センサチップ１６の被接着面に向き合うベース６４の部分には、接着剤層５０を形成する凹部６４Ｇａが形成されている。凹部６４Ｇａを形成する内周面の直径は、センサチップ１６の対角線の長さよりも大に設定される。凹部６４Ｇａは、例えば、その接着剤層５０の厚さが５μｍ以上となるような所定の深さＤｐを有している。 The sensor chip 16 is configured to be directly fixed to the surface of the base 64 facing the adherend surface of the sensor chip 16. A concave portion 64Ga for forming the adhesive layer 50 is formed in the portion of the base 64 that faces the adherend surface of the sensor chip 16. The diameter of the inner peripheral surface forming the recess 64Ga is set to be larger than the length of the diagonal line of the sensor chip 16. For example, the recess 64Ga has a predetermined depth Dp such that the thickness of the adhesive layer 50 is 5 μm or more.
　接着剤層５０は、凹部６４Ｇａ内に形成されるとともに、センサチップ１６に隣接するベース６４の端面の延長面とその端面に臨むセンサチップ１６の外周縁とが交わる部分に形成されている。センサチップ１６に隣接するベース６４の端面の延長した面とその端面に臨むセンサチップ１６の外周縁とが交わる部分は、例えば、凹部６４Ｇａ内から溢れ出た余分な接着剤により形成される。 The adhesive layer 50 is formed in the recess 64Ga, and is formed at a portion where the extended surface of the end surface of the base 64 adjacent to the sensor chip 16 and the outer peripheral edge of the sensor chip 16 facing the end surface intersect. A portion where the extended surface of the end face of the base 64 adjacent to the sensor chip 16 and the outer peripheral edge of the sensor chip 16 facing the end face intersect is formed by, for example, an excessive adhesive overflowing from the inside of the recess 64Ga.
　各リードピン４０´ａｉは、ベース６４の各貫通孔にハーメチックガラス５６を介して支持されている。各リードピン４０´ａｉとセンサチップ１６との間は、ボンディングワイヤＷｉで接続されている。 Each lead pin 40'ai is supported in each through hole of the base 64 via a hermetic glass 56. Each lead pin 40'ai and the sensor chip 16 are connected by a bonding wire Wi.
　図６Ａに示される例においては、ベース６４が金属材料で成形されているが、斯かる例に限られることなく、例えば、図６Ｂに示されるように、ベース６４´が樹脂材料により成形されてもよい。 In the example shown in FIG. 6A, the base 64 is formed of a metal material. However, the present invention is not limited to such an example. For example, as shown in FIG. 6B, the base 64 ′ is formed of a resin material. Also good.
　センサチップ１６は、センサチップ１６の被接着面に向き合うベース６４´の表面に直接的に固定されている。センサチップ１６の被接着面に向き合うベース６４´の部分には、接着剤層５０を形成する凹部６４´Ｇｂが形成されている。凹部６４´Ｇｂの一端は、センサチップ１６の被接着面に向けて開口している。凹部６４´Ｇｂは、例えば、その接着剤層５０の厚さが５μｍ以上となるような所定の深さＤｐを有している。ベース６４´における凹部６４´Ｇｂを形成する内周面の直径は、センサチップ１６の対角線の長さよりも若干大に設定されている。 The sensor chip 16 is directly fixed to the surface of the base 64 ′ that faces the adherend surface of the sensor chip 16. A concave portion 64′Gb for forming the adhesive layer 50 is formed in the portion of the base 64 ′ that faces the surface to be bonded of the sensor chip 16. One end of the recess 64 ′ Gb opens toward the adherend surface of the sensor chip 16. For example, the recess 64′Gb has a predetermined depth Dp such that the thickness of the adhesive layer 50 is 5 μm or more. The diameter of the inner peripheral surface forming the concave portion 64 ′ Gb in the base 64 ′ is set slightly larger than the length of the diagonal line of the sensor chip 16.
　接着剤層５０は、凹部６４´Ｇｂ内に形成されるとともに、センサチップ１６に隣接するベース６４´の端面の延長した面とその端面に臨むセンサチップ１６の外周縁とが交わる部分に形成されている。センサチップ１６に隣接するベース５４´の端面の延長した面とその端面に臨むセンサチップ１６の外周縁とが交わる部分は、例えば、凹部６４´Ｇｂ内から溢れ出た余分な接着剤により形成される。このように接着剤の塗布量が、凹部６４´Ｇｂ内から溢れ出るような凹部６４´Ｇｂの内容積以上に設定されることにより、一様な膜厚を有する接着剤層５０が形成されるので接着剤の塗布量を高精度で管理する必要がないこととなる。 The adhesive layer 50 is formed in the recess 64′Gb, and is formed at a portion where the extended surface of the end surface of the base 64 ′ adjacent to the sensor chip 16 and the outer peripheral edge of the sensor chip 16 facing the end surface intersect. ing. A portion where the extended surface of the end surface of the base 54 ′ adjacent to the sensor chip 16 intersects with the outer peripheral edge of the sensor chip 16 facing the end surface is formed by, for example, an excessive adhesive overflowing from the inside of the recess 64 ′ Gb. The Thus, the adhesive layer 50 having a uniform film thickness is formed by setting the application amount of the adhesive to be equal to or greater than the inner volume of the recess 64′Gb overflowing from the recess 64′Gb. Therefore, it is not necessary to manage the application amount of the adhesive with high accuracy.
　なお、上述の本発明に係る圧力センサの一例において、接着剤の塗布量が、凹部１８Ｒ内から溢れ出るような凹部１８Ｒの内容積以上に設定されているが、斯かる例に限られることなく、例えば、塗布された接着剤における凹部の底部から頂部までの高さが、凹部１８Ｒの深さ以上の高さとなるように、接着剤が凹部１８Ｒの空洞内の略中央部の一部に塗布され、センサチップ１６が接着されてもよい。このような場合、センサチップを接着する中央部に塗布された接着剤の周囲に、空洞が凹部内に形成されることとなる。 In the above-described example of the pressure sensor according to the present invention, the application amount of the adhesive is set to be equal to or greater than the inner volume of the recess 18R overflowing from the recess 18R. However, the present invention is not limited to this example. For example, the adhesive is applied to a part of the substantially central portion in the cavity of the recess 18R so that the height from the bottom to the top of the recess in the applied adhesive is higher than the depth of the recess 18R. The sensor chip 16 may be bonded. In such a case, a cavity is formed in the recess around the adhesive applied to the central portion to which the sensor chip is bonded.

Claims (9)

  1. 　圧力を検出し検出出力信号を送出するセンサチップと、該センサチップを、接着剤層を介して支持する支持部材とを含んでなるセンサユニットと、
    　前記センサユニットを収容するセンサユニット収容部と、を備え、
    　前記支持部材は、所定の膜厚を有する前記接着剤層を形成するように接着剤の所定の塗布量を計量するための凹部を有することを特徴とする圧力センサ。     A sensor unit including a sensor chip that detects pressure and sends a detection output signal; and a support member that supports the sensor chip via an adhesive layer;
    A sensor unit housing portion for housing the sensor unit,
    The pressure sensor according to claim 1, wherein the support member has a recess for measuring a predetermined application amount of the adhesive so as to form the adhesive layer having a predetermined film thickness.
  2. 　前記支持部材が、チップマウント部材である場合、前記凹部は、前記センサチップの表面に向き合うチップマウント部材の一端部に形成される窪みであることを特徴とする請求項１記載の圧力センサ。 2. The pressure sensor according to claim 1, wherein when the support member is a chip mount member, the recess is a recess formed at one end of the chip mount member facing the surface of the sensor chip.
  3. 　前記支持部材が、チップマウント部材である場合、前記凹部は、前記チップマウント部材の一端部と前記センサチップの表面との間に形成される隙間であることを特徴とする請求項１記載の圧力センサ。 2. The pressure according to claim 1, wherein when the support member is a chip mount member, the recess is a gap formed between one end of the chip mount member and the surface of the sensor chip. Sensor.
  4. 　前記支持部材が、ハーメチックガラスの場合、前記凹部は、前記センサチップの表面に向き合うハーメチックガラスの端部に形成される窪みであることを特徴とする請求項１記載の圧力センサ。 2. The pressure sensor according to claim 1, wherein when the support member is hermetic glass, the recess is a recess formed at an end of the hermetic glass facing the surface of the sensor chip.
  5. 　前記支持部材が、ベースである場合、前記凹部は、前記センサチップの表面に向き合うベースの端面に形成される窪みであることを特徴とする請求項１記載の圧力センサ。 2. The pressure sensor according to claim 1, wherein when the support member is a base, the recess is a recess formed in an end surface of the base facing the surface of the sensor chip.
  6. 　前記接着剤は、該接着剤が該凹部から溢れ出るように、前記凹部の内容積以上に塗布されることを特徴とする請求項１乃至請求項５のうちのいずれかに記載の圧力センサ。 The pressure sensor according to any one of claims 1 to 5, wherein the adhesive is applied to an inner volume or more of the recess so that the adhesive overflows from the recess.
  7. 　前記凹部を形成する内周面の直径が、前記センサチップの対角線の長さに比して小に設定されることを特徴とする請求項１乃至請求項５のうちのいずれかに記載の圧力センサ。 The pressure according to any one of claims 1 to 5, wherein a diameter of an inner peripheral surface forming the concave portion is set to be smaller than a length of a diagonal line of the sensor chip. Sensor.
  8. 　前記凹部を形成する内周面の直径が、前記センサチップの対角線の長さに比して大に設定されることを特徴とする請求項１乃至請求項５のうちのいずれかに記載の圧力センサ。 6. The pressure according to claim 1, wherein a diameter of an inner peripheral surface forming the recess is set larger than a diagonal length of the sensor chip. Sensor.
  9. 　圧力を検出し検出出力信号を送出するセンサチップと、該センサチップを、接着剤層を介して支持する支持部材とを含んでなるセンサユニットと、
    　前記センサユニットを収容するセンサユニット収容部と、を備え、
    　前記支持部材は、所定の膜厚を有する前記接着剤層を形成するように接着剤が塗布される所定の深さの凹部を有し、
    　前記凹部は、該凹部の略中央部に該凹部の深さ以上に塗布された前記接着剤の周囲に、該接着剤が塗布されていない空洞を一部に有することを特徴とする圧力センサ。     A sensor unit including a sensor chip that detects pressure and sends a detection output signal; and a support member that supports the sensor chip via an adhesive layer;
    A sensor unit housing portion for housing the sensor unit,
    The support member has a recess having a predetermined depth to which an adhesive is applied so as to form the adhesive layer having a predetermined thickness.
    The pressure sensor according to claim 1, wherein the concave part has a cavity in which the adhesive is not applied around a part of the adhesive applied to a substantially central part of the concave part at a depth greater than the depth of the concave part.
PCT/JP2017/047242 2017-01-18 2017-12-28 Pressure sensor WO2018135294A1 (en)

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