JP2012127781A - Dynamic quantity sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve temperature characteristics of a sensor chip as compared with a conventional case using beads as a spacer.SOLUTION: In a method for manufacturing a dynamic quantity sensor in which a sensor chip 3 is stuck to an adherend 4 through high molecular adhesive 2 for easing thermal stress by elastic deformation, the same material as the adhesive 2 is cured on a part of an adhesion scheduled area of the adherend 4 to the sensor chip 3 to form a spacer 12 for holding an interval between the sensor chip 3 and the adherend 4. In the formation of the spacer 12, application and curing of the same material as the adhesive 2 in a droplet state are repeated several times. While holding the sensor chip 3 by the spacer 12, the adhesive 2 between the sensor chip 3 and the adherend 4 is cured. Since the spacer 12 reaches the same Young's modulus as that of the adhesive 2 after curing the adhesive 2, and when the adhesive 2 is contracted by a temperature change, stress received from the spacer 12 to the sensor chip 3 can be reduced and the temperature characteristics of the sensor chip 3 can be improved.

Description

  The present invention relates to a mechanical quantity sensor.

  In a mechanical quantity sensor, a sensor chip is bonded to an adherend such as a case via an adhesive. However, due to a difference in linear expansion coefficient between the adherend and the sensor chip, thermal stress is applied to the sensor chip due to a temperature change. It will take. For this reason, conventionally, an elastic adhesive that relieves thermal stress by elastic deformation, in particular, a low-elasticity adhesive (soft adhesive) is used.

  However, since the low-elasticity adhesive is in a liquid state before being cured, the sensor chip is self-weighted after the adhesive is applied to the adherend and the sensor chip is placed and before the adhesive is cured. The thickness of the adhesive may not be sufficient to relieve the thermal stress, or the sensor chip may be tilted and the thickness of the adhesive may become uneven.

  Therefore, conventionally, by mixing the beads with a low-elasticity adhesive, the beads function as a spacer for keeping the distance between the sensor chip and the adherend, and the adhesive necessary for alleviating the thermal stress is used. The thickness is secured. As the low-elasticity adhesive, for example, a silicone-based adhesive is used, and as the beads, for example, PS (polystyrene), alumina, or glass is used (for example, Patent Document 1, 2).

JP-A-8-110351 (see paragraph 0014) JP-A-5-333056 (see paragraph 0014)

  By the way, in the above-mentioned prior art, after applying an adhesive to an adherend and placing the sensor chip, the sensor chip is maintained while maintaining the distance between the sensor chip and the adherend until the adhesive is cured. In order to maintain the hardness, beads made of high elasticity such as PS, that is, relatively hard beads were used, and the Young's modulus of the beads was higher than that of the adhesive after curing. Specifically, the Young's modulus of PS beads was three orders of magnitude higher than that of silicone adhesives. In addition, the linear expansion coefficient of PS beads was about 1/5 smaller than that of the silicone adhesive.

  Further, as described in paragraph 0014 of Patent Document 1, it is preferable to use beads having a uniform particle diameter, but in practice, it is difficult to use beads having a uniform particle diameter, There will be variations in diameter.

  For this reason, the problem as shown in FIG. 11 will arise. Here, FIG. 11 shows a state in which the sensor chip 3 and the adherend are bonded by the low-elasticity adhesive 2 in which the beads 30 are mixed, and the same components as in FIG. The code | symbol is attached | subjected.

  That is, as shown in FIG. 11, when the environmental temperature is lower than the curing temperature of the adhesive 2, the adhesive 2 contracts more than the beads 30, and the relatively large beads 30 push the sensor chip 3 and distort. It will be generated. Furthermore, since the arrangement of the beads 30 in the adhesive 2 cannot be controlled, there is a variation in the position of the relatively large beads 30, which causes variations in the magnitude and distribution of strain generated in the sensor chip 3. This becomes a factor of deterioration of the temperature characteristics of the sensor chip 3.

  The deterioration of the temperature characteristic means that in the temperature characteristic diagram showing the relationship between the output of the sensor and the temperature, the line indicating the relationship between the two is bent, and the inclination of the line is not constant. If the inclination is constant, the temperature correction of the output characteristics in the circuit is possible. However, if the inclination is not constant, the scale of the circuit chip becomes large in order to correct the temperature with high accuracy.

  In view of the above points, the present invention aims to improve the temperature characteristics of a sensor chip as compared with the case where conventional beads are used as spacers.

In order to achieve the above object, in the first aspect of the present invention, the sensor chip (3) is attached to the adherend (4) via the first polymer adhesive (2) that relieves thermal stress by elastic deformation. In the manufacturing method of the mechanical quantity sensor bonded to
A second polymer adhesive having a Young's modulus after curing substantially the same as that of the first polymer adhesive (2) in a part of a region to be bonded to the sensor chip (2) of the adherend (4) Forming a spacer (12, 13) for keeping the distance between the sensor chip (3) and the adherend (4) by curing
After forming the spacer (12), applying a first polymer adhesive (2) to the entire area to be bonded;
The sensor chip (3) and the adherend (4) are placed while the sensor chip (3) is placed on the planned bonding area where the adhesive (2) is applied and the sensor chip (3) is held by the spacers (12, 13). And a step of curing the first polymer adhesive (2) between the two.

  “The Young's modulus after curing is substantially the same as that of the first polymer adhesive (2)” means that the Young's modulus after curing is 0.1 times to that of the first polymer adhesive (2). It means that it is in the range of 10 times.

  According to this, since the spacer is formed using the first polymer adhesive that relaxes the thermal stress and the material having a similar Young's modulus after curing, the temperature change compared to the case where the conventional beads are used as the spacer. It is possible to reduce the stress that the sensor chip receives from the spacer when the adhesive contracts due to the above, and to improve the temperature characteristics of the sensor chip.

  In the second aspect of the invention, in the step of forming the spacer (12), the second polymer adhesive is applied and cured in the form of droplets, whereby the spacer having a desired thickness (T1). (12) is formed.

  Here, the first polymer adhesive that relieves thermal stress and the polymer adhesive having a similar Young's modulus after curing, as described above, are in a liquid state before curing. It spreads wet on the surface. For this reason, the frequency | count of application | coating until formation of the spacer of desired thickness increases, and the problem that it takes time arises.

  On the other hand, in the present invention, since it is applied in the form of droplets, the applied material does not wet and spread on the surface of the adherend due to surface tension, and remains in the state of droplets. Thereby, compared with the case where the applied material spreads wet, it is possible to reduce the number of times of application and time until a spacer having a desired thickness is formed.

  In the second aspect of the present invention, as described in the third aspect, in the step of forming the spacer (12), application and curing in a droplet state are performed a plurality of times, so that a desired thickness is obtained. A spacer may be formed.

  Moreover, in invention of Claims 1-3, as described in Claim 4, for example, the same material as the first polymer adhesive (2) is used as the second polymer adhesive. Is preferred. Thereby, since the Young's modulus and the linear expansion coefficient of the first polymer adhesive after curing and the spacer can be made the same, the stress that the sensor chip receives from the spacer when the adhesive shrinks due to temperature change can be further reduced. The temperature characteristics of the chip can be further improved.

In the invention according to claim 5, in the step of forming the spacer (13), the tip surface (21) of the adhesive application nozzle (10) and the adherend (4) having a predetermined interval (T 2). The second polymer adhesive (2) applied from the adhesive application nozzle (10) is cured, and the second polymer adhesive is the same as the first polymer adhesive (2). Using materials,
In the step of applying the first polymer adhesive (2), the first polymer adhesive (2) is additionally applied from the adhesive application nozzle (10) used in the step of forming the spacer. It is said.

  According to this, since the spacer is formed using the same material as the first polymer adhesive, as in the invention described in claim 4, the Young's modulus between the first polymer adhesive after curing and the spacer In addition, the linear expansion coefficient can be made the same, and the temperature characteristics of the sensor chip can be further improved.

  In the fifth aspect of the invention, as in the sixth, seventh, and eighth aspects, the second polymer adhesion applied from the adhesive application nozzle (20) in the step of forming the spacer (13). The agent can be partially cured.

  In the inventions according to claims 5 to 8, in the step of forming the spacer (13), the adhesive application nozzle (20) protrudes to the adherend (4) side from the tip surface (21). In addition, it is preferable to use one provided with projecting portions (23, 24) whose projecting height (T3) with respect to the tip surface (21) is the same as the predetermined interval (T2). According to this, the distance between the tip surface of the adhesive application nozzle and the adherend can be automatically set to a predetermined interval by applying the protruding portion of the adhesive application nozzle to the adherend. It is.

  In addition, the code | symbol in the bracket | parenthesis of each means described in this column and the claim is an example which shows a corresponding relationship with the specific means as described in embodiment mentioned later.

It is sectional drawing which shows the structure of the pressure sensor in 1st Embodiment. It is sectional drawing which shows the manufacturing process of the pressure sensor in 1st Embodiment. It is sectional drawing which shows the manufacturing process of the pressure sensor in 2nd Embodiment. It is sectional drawing which shows a part of manufacturing process of the pressure sensor in 3rd Embodiment. It is sectional drawing of the adhesive application nozzle used in the manufacturing process of the pressure sensor in 4th Embodiment. It is sectional drawing which shows a part of manufacturing process of the pressure sensor in 5th Embodiment. (A), (b) is respectively sectional drawing of the adhesive application nozzle in FIG. 6, and the top view seen from the nozzle front end side. It is a top view of the adhesive agent hardened | cured for spacers when using the adhesive agent application nozzle shown by FIG. (A), (b) is sectional drawing of the adhesive application nozzle used at the manufacturing process of the pressure sensor in 6th Embodiment, respectively, and the top view seen from the nozzle front end side. FIG. 10 is a plan view of an adhesive cured for a spacer when the adhesive application nozzle of FIG. 9 is used. It is sectional drawing of the mechanical quantity sensor for demonstrating the subject which this invention tends to solve.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, parts that are the same or equivalent to each other are given the same reference numerals in the drawings in order to simplify the description.

(First embodiment)
In the present embodiment, the present invention is applied to a pressure sensor mounted on a vehicle. FIG. 1 shows a cross-sectional configuration of the pressure sensor in the present embodiment.

  In the pressure sensor 1 of this embodiment, a sensor chip 3 is bonded to a ceramic stem 4 via an adhesive (first polymer adhesive) 2, and the ceramic stem 4 is bonded to a resin case (not shown). It is a thing. In the present embodiment, the ceramic stem 4 is an adherend that is bonded to the sensor chip 3.

  Since the pressure sensor 1 of the present embodiment is mounted on a vehicle, the pressure sensor 1 is exposed to a change in outside air temperature and a temperature change due to the operation and stop of the engine. Therefore, a low-elastic polymer adhesive is used as the adhesive 2 in order to relieve thermal stress caused by the difference in linear expansion coefficient between the sensor chip 3 and the ceramic stem 4 by elastic deformation. This low elasticity means the range whose Young's modulus is 0.3-10 MPa.

  As the adhesive 2, a general silicone adhesive, fluorosilicone adhesive, or the like can be used. In the case of using a fluorosilicone adhesive, for example, the product name “X-32-1619” manufactured by Shin-Etsu Chemical Co., Ltd. can be used, and the Young's modulus after curing in this case is about 1 MPa.

  The sensor chip 3 has a configuration in which a Si semiconductor substrate 5 and a glass pedestal 6 are laminated. The Si semiconductor substrate 5 has a diaphragm 5a formed on the front surface side by a recess 5b provided on the back surface side thereof. A space 5c between the diaphragm 5a and the glass pedestal 6 is sealed and serves as a vacuum chamber as a reference pressure chamber.

  Although not shown, the diaphragm 5a is formed with a gauge diffusion resistor (strain gauge) that generates an electrical signal based on the strain of the diaphragm 5a so as to form a bridge circuit. In the pressure sensor 1, when pressure is applied from the surface side of the diaphragm 5a, the diaphragm 5a is distorted, the resistance value of the gauge diffusion resistance is changed based on the distortion of the diaphragm 5a, and the voltage value in the bridge circuit is changed. To do. The changed voltage value is detected as an electric signal by the circuit unit, so that the applied pressure is detected. In the pressure sensor of this embodiment, the pressure difference between the pressure applied to the surface of the diaphragm 5a and the inside of the vacuum chamber 5c, that is, the absolute pressure is detected.

  Next, a method for manufacturing the pressure sensor 1 having the structure shown in FIG. 1 will be described. FIG. 2 shows a manufacturing process of the pressure sensor 1.

  As shown in FIG. 2A, a step of forming a plurality of spacers 12 in a part of a region to be bonded to the sensor chip 3 on the surface of the ceramic stem 4 is performed.

  Specifically, the same material (second polymer adhesive) as the low-elasticity adhesive (first polymer adhesive) 2 is applied by the piezo injector 10 and cured with hot air. By repeating this coating and curing a plurality of times, a layer 11 made of the same material (second polymer adhesive) as the low-elasticity adhesive 2 is stacked and printed, thereby forming a spacer 12 having a desired thickness T1. To do.

  The piezo injector applies a liquid adhesive before curing in the form of fine droplets, and has the same mechanism as a commercially available inkjet printer.

  The desired thickness T1 of the spacer 12 is the same thickness as the desired thickness of the adhesive 2 sufficient to relieve thermal stress in the post-manufactured pressure sensor 1 shown in FIG. The formation position of the spacer 12 is a position where the sensor chip 3 can be held in parallel to the surface of the ceramic stem 4.

  Here, since the low-elasticity adhesive 2 is in a liquid state before being cured, the adhesive 2 spreads wet when there is a certain volume. For this reason, the frequency | count of application | coating until formation of the spacer of desired thickness increases, and the problem that it takes time arises.

  However, when a micro droplet is applied with a piezo injector, the surface of the ceramic stem 4 does not spread due to surface tension and remains in a droplet state. Thereby, compared with the case where the apply | coated adhesive spreads wet, the frequency | count of application | coating and time until it forms the spacer 12 of desired thickness T1 can be reduced.

  Subsequently, as shown in FIG. 2 (b), a step of applying the adhesive 2 to the entire region to be bonded to the sensor chip 3 on the surface of the ceramic stem 4 is performed. The adhesive application nozzle used at this time may be a general one, and a different one from that used when forming the spacer 12 is used. The adhesive 2 is applied in an amount necessary to make the adhesive 2 have a desired thickness. Further, the adhesive 12 after application includes a spacer 12.

  Thereafter, as shown in FIG. 2 (c), the sensor chip 3 is placed on the surface of the ceramic stem 4 where the adhesive 2 is applied, and the adhesive 2 between the sensor chip 3 and the ceramic stem 4 is placed. A step of curing is performed. This step may be performed under the same conditions as in the prior art. For example, the adhesive is cured by blowing hot air.

  In this step, since the adhesive 2 is cured while the sensor chip 3 is held by the spacer 12, the sensor chip 3 can be prevented from sinking or tilting by its own weight until the adhesive 2 is cured. . As a result, the thickness of the adhesive 2 after curing can be made uniform and can be set to a thickness sufficient to alleviate thermal stress.

  In this way, the pressure sensor 1 having the structure shown in FIG. 1 is manufactured.

  As described above, in this embodiment, since the spacer 12 is formed using the same material as the low-elasticity adhesive 2 that relieves thermal stress, the Young's modulus of the spacer 12 and the spacer 12 are cured after the adhesive 2 is cured. The linear expansion coefficient is the same as that of the low elasticity adhesive 2.

  Therefore, according to this embodiment, compared with the case where the conventional beads 30 are used as the spacer, the stress that the sensor chip 3 receives from the spacer when the adhesive 2 contracts due to a temperature change can be reduced, and the temperature of the sensor chip 3 can be reduced. The characteristics can be improved.

  In this embodiment, coating and curing are repeated a plurality of times. However, if a relatively large droplet can be formed and a desired thickness can be obtained by one coating and curing, the number of times of coating and curing. May be once.

  In this embodiment, the adhesive is cured with hot air in the step of forming the spacer 12 shown in FIG. 2A and the step of curing the adhesive 2 shown in FIG. The adhesive may be cured by other heating methods such as, and the adhesive may be cured by other curing methods such as UV irradiation depending on the type of adhesive.

  In this embodiment, the piezo injector 10 is used in order not to heat the thermosetting adhesive. However, other application means can be used as long as the adhesive can be applied in a droplet state so that the adhesive is not cured or denatured. May be used.

  In the present embodiment, the same material as the low-elasticity adhesive 2 in FIG. 1 is used as the material (second polymer adhesive) for forming the spacer 12, but the low-elasticity adhesion in FIG. A material different from the agent 2 may be used. However, a polymer adhesive having a Young's modulus after curing substantially the same as the low-elasticity adhesive 2 in FIG. 1, that is, 0.1 to 10 times that of the low-elasticity adhesive 2 is used. Such a material can be arbitrarily selected from general polymer adhesives. Incidentally, the polymer adhesive can control the Young's modulus (hardness) by changing the degree of crosslinking of the polymer or changing the amount of polymer oil added.

  Here, as described above, the conventional PS beads have a Young's modulus three or more orders of magnitude higher than the Young's modulus of the silicone-based adhesive and a linear expansion coefficient of about 1/5, which is due to temperature changes. This was the cause of the sensor chip receiving stress from the spacer when the adhesive contracted.

  Therefore, as a material for forming the spacer 12, a polymer adhesive material whose Young's modulus after curing is closer to the low-elasticity adhesive 2 in FIG. 1 than conventional PS beads is used as a spacer. Compared with the case where the beads are used, the stress that the sensor chip receives from the spacer when the adhesive shrinks can be reduced.

  When a polymer adhesive different from the low-elasticity adhesive 2 is used, if the Young's modulus is close, the stress that the sensor chip receives from the spacer can be reduced. It is preferable to have a linear expansion coefficient that is substantially the same as that of the adhesive 2. For example, when the low-elasticity adhesive 2 in FIG. 1 is a silicone-based adhesive, the materials are different, but if the same silicone-based adhesive is used, the linear expansion coefficients are substantially the same.

  Further, when a polymer adhesive different from the low-elasticity adhesive 2 is used, it is preferable to satisfy at least one of excellent applicability with a piezo injector and excellent curing time and curing method. If an adhesive having a shorter curing time than the low-elasticity adhesive 2 is used, the manufacturing time can be shortened.

(Second Embodiment)
The present embodiment is different from the first embodiment in the method of forming the spacer, and the method for manufacturing the pressure sensor in the present embodiment will be described below.

  FIG. 3 shows a manufacturing process of the pressure sensor in this embodiment. As shown in FIG. 3A, a step of forming a spacer 13 in a part of a region to be bonded to the sensor chip 3 on the surface of the ceramic stem 4 is performed.

  Specifically, using the adhesive application nozzle 20 having a flat tip surface 21, the distance between the tip surface 21 of the adhesive application nozzle 20 and the ceramic stem 4 is set to a predetermined interval T2. A small amount of the adhesive 2 is discharged from the discharge port 20a. The predetermined interval T2 is the same thickness as the desired thickness of the adhesive 2 sufficient to relieve the thermal stress in the manufactured pressure sensor 1 shown in FIG. In this embodiment, the position of the adhesive application nozzle 20 in the vertical direction in the figure is defined by computer control or the like, whereby the distance between the tip surface 21 of the adhesive application nozzle 20 and the ceramic stem 4 is set to a predetermined interval T2. And

  And the spacer 13 is formed by UV-irradiating only the outer part of the adhesive 2 after coating by UV irradiation means as a curing means from the outside of the nozzle 20 for applying the adhesive and partially curing it. At this time, by setting the curing conditions such as the UV irradiation time to a condition in which the adhesive 2 after application is semi-cured, the adhesive 2 after application is not completely cured, but is in a semi-life state. Harden. The semi-curing is such that the adhesive 2 can be cured by reacting with the adhesive 2 additionally applied with the semi-lifetime adhesive 2 as described later, while being hard enough to hold the sensor chip 3. Means to harden.

  Although not shown, the adhesive application nozzle 20 has a substantially cylindrical shape, and the planar shape of the formed spacer 13 is annular.

  Thereafter, as shown in FIG. 3B, the adhesive application nozzle 20 is formed in the bonding area on the surface of the ceramic stem 4 while separating the adhesive application nozzle 20 used when forming the spacer 13 from the ceramic stem 4. The adhesive 2 is additionally applied.

  Subsequently, as shown in FIG. 3 (c), the sensor chip 3 is placed on the area of the ceramic stem 4 where the adhesive 2 is applied, and the sensor chip 3 is placed as shown in FIG. 3 (d). And a step of fully curing the adhesive 2 between the ceramic stem 4 and the ceramic stem 4. At this time, for example, the hot air is blown to cure the adhesive 2, and the curing conditions such as the hot air temperature and the hot air spraying time are set to conditions for the adhesive 2 to be completely cured. Thereby, the spacer 13 in a semi-lived state reacts and cures with the additionally applied adhesive 2 and is integrated with the additionally applied adhesive 2.

  As described above, in the present embodiment, the material forming the spacer (second polymer adhesive) is the same material as the low-elasticity adhesive (first polymer adhesive) 2 that relieves thermal stress. The spacers 12 are formed using, and the spacers 13 are integrated with the adhesive 2 after the additionally applied adhesive 2 is cured.

  As a result, in the pressure sensor 1 after manufacture, the adhesive 2 is entirely composed of a material having the same physical properties, and there are no members having different Young's modulus and linear expansion coefficient inside the adhesive 2. Compared with the case where the beads 30 are used, the stress that the sensor chip 3 receives from the spacer when the adhesive 2 contracts due to a temperature change can be reduced, and the temperature characteristics of the sensor chip 3 can be improved.

  In the present embodiment, the spacer 13 and the additionally applied adhesive 2 are integrated by main curing by setting the spacer 13 in a semi-lived state. However, the spacer 13 and the additionally applied adhesive 2 are combined. It does not have to be integrated. Even in this case, since the spacer 13 has the same Young's modulus as the adhesive 2 after the adhesive 2 is cured, the stress received by the sensor chip 3 from the spacer is larger than when the beads 30 are used as the spacer. Can be reduced.

  Further, in the present embodiment, the outer portion of the adhesive 2 after application is cured by ultraviolet irradiation in the step shown in FIG. 3A, but the nozzle 20 for applying the adhesive using hot air spraying means. The outer part of the adhesive 2 after application may be cured by spraying hot air from the outside.

(Third embodiment)
FIG. 4 is a cross-sectional view showing a part of the manufacturing process of the pressure sensor in the present embodiment.

  In this embodiment, in the step of forming the spacer shown in FIG. 3A described in the second embodiment, as shown in FIG. 4, an adhesive application nozzle 20 provided with a heating portion 22 on the tip side is used. . Thus, the spacer 13 is formed by locally heating the adhesive 2 applied from the adhesive application nozzle 20 by the heating unit 22 of the adhesive application nozzle 20 and partially curing the adhesive.

  Specifically, the heating unit 22 is composed of an electric heater such as a nichrome wire, and the heating unit 22 is heated by electric power, or the heating unit 22 is composed of a heat generating material that generates heat by absorbing electromagnetic waves, and the heating unit is irradiated by electromagnetic wave irradiation. It is possible to heat 22.

  In the second embodiment, the outer portion of the adhesive 2 after application is cured by the adhesive curing means from the outside of the adhesive application nozzle 20, but in this embodiment, the adhesive 2 after application is changed. The inner portion may be cured instead of the outer portion. However, from the viewpoint of holding the sensor chip 3 parallel to the surface of the ceramic stem 4 in order to make the thickness of the cured adhesive 2 uniform, the outer portion of the applied adhesive 2 is cured. It is preferable to make it.

(Fourth embodiment)
FIG. 5 shows a cross-sectional view of the adhesive application nozzle used in the manufacturing process of the pressure sensor in the present embodiment.

  In the present embodiment, in the step of forming the spacer shown in FIG. 3A described in the second embodiment, as shown in FIG. A projection provided with a protruding portion 23 is used. The protrusion 23 is provided on the outer peripheral side of the front end surface 21, and the protrusion height T3 with respect to the front end surface 21 is the same as the predetermined interval T2.

  According to this, by pressing the protruding portion 23 of the adhesive application nozzle 20 against the ceramic stem 4, the distance between the tip surface 21 of the adhesive application nozzle 20 and the ceramic stem 4 is automatically set to the predetermined interval T2. It can be.

(Fifth embodiment)
FIG. 6 shows a part of the manufacturing process of the pressure sensor in the present embodiment. FIGS. 7A and 7B show a sectional view of the adhesive application nozzle in FIG. 6 and a plan view seen from the nozzle tip side, and FIG. 8 shows a spacer for the spacer in the step shown in FIG. Fig. 2 shows a plan view of the cured adhesive.

  In the present embodiment, in the step of forming the spacer shown in FIG. 3A described in the second embodiment, as shown in FIG. 7A and FIG. The protrusion 24 that protrudes more toward the ceramic stem 4 than 21 is provided in an annular shape at the peripheral edge of the discharge port 20a. The protrusion height T3 with reference to the tip surface 21 of the protrusion 24 is the same as the predetermined interval T2.

  Then, as shown in FIG. 6A, the adhesive application nozzle 20 is brought close to the ceramic stem 4 and a small amount of the adhesive 2 is discharged.

  Subsequently, as shown in FIG. 6B, the protruding portion 24 of the adhesive application nozzle 20 is pressed against the ceramic stem 4. As a result, the adhesive 2 protrudes outside the protruding portion 24, and the adhesive 2 is positioned between the tip surface 21 of the adhesive application nozzle 20 and the ceramic stem 4.

  Thereafter, similarly to the second embodiment, the spacers 13 are formed by curing the adhesive 2 located outside the protrusions 24. At this time, as shown in FIG. 8, the planar shape of the formed spacer 13 becomes an annular shape along the outer shape of the protruding portion 24.

  Also in the present embodiment, as in the fourth embodiment, the front end surface 21 of the adhesive application nozzle 20 and the ceramic are automatically pressed by pressing the protruding portion 23 of the adhesive application nozzle 20 against the ceramic stem 4. The distance from the stem 4 can be set to a predetermined interval T2.

(Sixth embodiment)
9A and 9B show a sectional view of the adhesive application nozzle of the present embodiment and a plan view seen from the nozzle tip side, and FIG. 10 shows a plan view of the adhesive cured for the spacer. .

  In the present embodiment, in the step of forming the spacer shown in FIG. 3A described in the second embodiment, the adhesive application nozzle 20 shown in FIG. As shown in FIG. 9, a projection having a groove 25 in a part of the projection 24 is used.

  The groove 25 is for guiding the adhesive 2 from the discharge port 20a to the outside of the protrusion 24, and is formed to extend radially from the discharge port 20a. The groove part 25 is provided in multiple places with respect to the protrusion part 24, and as shown in FIG.9 (b), four places are provided in this embodiment. The bottom surface of the groove 25 is flush with the tip surface 21.

  Thereby, in this embodiment, the adhesive surface 21 located outside the protrusion 24 is discharged by discharging a small amount of the adhesive 2 in a state where the protrusion 24 of the adhesive application nozzle 20 is pressed against the ceramic stem 4. An adhesive 24 can be disposed between the ceramic stem 4 and the ceramic stem 4.

  And the spacer 13 is formed by hardening the adhesive agent located in the outer side of the protrusion part 24 similarly to 2nd Embodiment. At this time, as shown in FIG. 10, four spacers 13 are formed outside the discharge port 20a.

  Also in the present embodiment, as in the fifth embodiment, the front end surface 21 of the adhesive application nozzle 20 and the ceramic are automatically pressed by pressing the protruding portion 23 of the adhesive application nozzle 20 against the ceramic stem 4. The distance from the stem 4 can be set to a predetermined interval T2.

(Other embodiments)
(1) In each of the embodiments described above, the sensor chip 3 is bonded to the ceramic stem 4 and the ceramic stem 4 is bonded to the resin case. However, the sensor chip 3 is bonded to the resin case. There may be. In this case, the resin case is an adherend bonded to the sensor chip 3.

  (2) In each of the embodiments described above, the sensor chip 3 has a configuration in which the Si semiconductor substrate 5 and the glass pedestal 6 are stacked. However, the sensor chip 3 may be configured only by the Si semiconductor substrate 5.

  (3) In each of the embodiments described above, the present invention is applied to a method for manufacturing a pressure sensor that detects pressure as a mechanical quantity, but the sensor chip is covered with an adhesive that relieves thermal stress by elastic deformation. As long as it has a structure bonded to the adherend, it can also be applied to other methods for manufacturing a mechanical quantity sensor. Examples of other mechanical quantity sensors include an acceleration sensor that detects acceleration as a mechanical quantity.

1 Pressure sensor (mechanical quantity sensor)
2 Adhesive (first polymer adhesive)
3 Sensor chip 4 Ceramic stem (Substrate)
11 Layer made of the same material as the adhesive 2 (layer made of the second polymer adhesive)
12 Spacer (Spacer made of second polymer adhesive)
13 Spacer (Spacer made of second polymer adhesive)
20 Adhesive Application Nozzle 21 Adhesive Application Nozzle Tip Surface 22 Adhesive Application Nozzle Heating Unit 23 Adhesive Application Nozzle Protrusion 24 Adhesive Application Nozzle Protrusion

Claims (9)

In the manufacturing method of the mechanical quantity sensor in which the sensor chip (3) is bonded to the adherend (4) via the first polymer adhesive (2) that relaxes the thermal stress by elastic deformation,
In a part of a region where the adherend (4) is to be bonded to the sensor chip (2), a second high modulus whose Young's modulus after curing is substantially the same as that of the first polymer adhesive (2). Forming a spacer (12, 13) for maintaining a distance between the sensor chip (3) and the adherend (4) by curing a molecular adhesive;
After forming the spacer (12), applying the first polymer adhesive (2) to the entire area to be bonded;
The sensor chip (3) is placed on the planned bonding area where the adhesive (2) is applied, and the sensor chip (3) is held by the spacers (12, 13), and the sensor chip (3) And a step of curing the first polymer adhesive (2) between the adherend (4) and the method of manufacturing a mechanical quantity sensor.   In the step of forming the spacer (12), the spacer (12) having a desired thickness (T1) is formed by applying and curing the second polymer adhesive in a droplet state. The method of manufacturing a mechanical quantity sensor according to claim 1.   The manufacturing of the mechanical quantity sensor according to claim 2, wherein in the step of forming the spacer (12), application and curing of the second polymer adhesive in a droplet state are performed a plurality of times. Method.   4. The method of manufacturing a mechanical quantity sensor according to claim 1, wherein the same material as the first polymer adhesive (2) is used as the second polymer adhesive. 5. . In the step of forming the spacer (13), the adhesive is applied between the tip surface (21) of the adhesive application nozzle (10) and the adherend (4) at a predetermined interval (T2). The second polymer adhesive applied from the nozzle (10) is cured, and the same material as the first polymer adhesive (2) is used as the second polymer adhesive,
In the step of applying the first polymer adhesive (2), the first polymer adhesive (2) is additionally applied from the adhesive application nozzle (10) used in the step of forming the spacer. The method of manufacturing a mechanical quantity sensor according to claim 1.   6. The step of forming the spacer (13) comprises partially curing the second polymer adhesive (2) applied from the adhesive application nozzle (20). Manufacturing method of mechanical quantity sensor.   In the step of forming the spacer (13), the outside of the second polymer adhesive (2) is partially cured by an adhesive curing means from the outside of the adhesive application nozzle (20). The method of manufacturing a mechanical quantity sensor according to claim 6.   In the step of forming the spacer (13), the adhesive application nozzle (20) provided with a heating part (22) on the tip side is used, and the adhesive application nozzle (20) is formed by the heating part (22). The method for producing a mechanical quantity sensor according to claim 6, wherein the second polymer adhesive (2) applied from (2) is partially thermally cured. In the step of forming the spacer (13), the adhesive application nozzle (20) protrudes toward the adherend (4) with respect to the tip surface (21), and the tip surface (21) is formed. 9. The apparatus according to claim 5, wherein a protrusion provided with a reference protrusion height (T 3) having the same distance as the predetermined interval (T 2) is used. Manufacturing method of mechanical quantity sensor.

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