JPH07209115A - Semiconductor pressure detector and its producing method - Google Patents

Abstract

PURPOSE:To provide a semiconductor pressure detector of a good air-sealed tightness by providing a liquid-seal structure only in one chamber without providing two chambers of airtight part. CONSTITUTION:Provided are a circuit board 10 constituting a processing circuit cooperating with a pressure sensing element 5 outputting electric signals according to the pressure, a bonding wire 12, pins 2a and 2b for giving an receiving signals between the pressure sensing element 5 and the exterior, a connector housing 1 having a press for holding each end of the pin 2a and 2b and provided with a sealing hole 1b for a sealing liquid 13, and a main body housing 3 which has a pressure guide hole 3b to guide external pressure and a slidable seal diaphragm 7 to prevent leak of the seal liquid 13 and transmit the pressure received through the pressure guide hole 3b. And, each of the connection surfaces of the connector housing 1 and the main body housing 3, groove upper surface of the recess provided with each open end of pins 2a and 2b, and the seal hole 1b after sealing the seal liquid 13 are air-sealed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a so-called seal diaphragm type semiconductor pressure detector in which a liquid such as insulating oil is enclosed in a pressure detection chamber sealed with a seal diaphragm.

[0002]

2. Description of the Related Art Conventionally, a seal diaphragm type semiconductor pressure detector receives pressure in a direction in which a pressure sensitive element is pressed against a pedestal from a gauge surface, and therefore has a high withstand pressure and is resistant to corrosion-resistant metal such as stainless steel. Since it has a part, it can be used even in a bad environment. Therefore, there is a high demand especially for automobiles.

Regarding this type of semiconductor pressure detector, the present applicant has already applied for the one shown in FIG. 11 in Japanese Patent Application No. 5-183838. In FIG. 11, the pressure detection chamber 31 in which the semiconductor pressure sensor element 30 is housed includes an element mounting board 32, a fixed base 33 mounted on the element mounting board 32, and a seal diaphragm 34 mounted on the fixed base 33. The sensor unit 35 having such a liquid sealing structure is housed in the main body housing 37 in which the pressure introducing hole 36 is formed. And
The connector housing 39 provided with the terminal 38 is caulked to the main body housing 37, and the O-ring 40
Airtightly sealed with a and 40b. Further, the lead 42 is inserted into the through hole 41 of the element mounting base 32, and hermetically sealed with a component such as glass 43,
The lead 4 is provided in a place different from the pressure detection chamber 31, that is, a so-called circuit chamber.
2 and the terminal 38 are electrically connected by a flexible conductor 44. Then, the lead 42 and the element mounting board 32
A condenser 45 is provided on the side of the connector housing 39 between and.

Reference numeral 46 is a sealing hole for sealing the sealing liquid 47, and after the sealing is completed, a metallic sealing ball 48 is press-fitted or welded to seal.

[0005]

DISCLOSURE OF THE INVENTION As a result of further diligent studies, the inventors of the present invention have conducted further studies on the semiconductor pressure detector having the above-mentioned structure, and have found that the following points need further improvement. That is, an airtight portion is required between the periphery of the hermetically sealed portion and the sensor unit and the housing, and an airtight member such as an adhesive, a full circumference weld, an O-ring, etc. is used for hermetically sealing these. As a result, the number of parts is increased by the airtight member and the cost is increased accordingly, the airtight process in the manufacturing process is complicated, and the pressure resistance reliability is lowered due to the increase in the number of airtight parts.

Further, when used in a harsh environment such as for automobiles, it is necessary to hermetically isolate the bonding wires and leads for exchanging electric signals from the outside world to maintain the reliability of the detector. Since it has two chambers, the pressure detection chamber and the circuit chamber, the structure thereof is complicated, so that it is difficult to hermetically seal the respective chambers, which is a factor of reducing reliability.

As described above, since the liquid sealing structure is complicated, the conventional semiconductor pressure detector is greatly limited in its use.
Therefore, the present invention has been made in view of the above problems, and provides a semiconductor pressure detector having a liquid-sealed structure of only one chamber without providing an airtight portion of two chambers of a pressure detection chamber and a circuit chamber. Is the first purpose.

A second object of the present invention is to perform good airtight sealing in the case of one chamber.

[0009]

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has a housing having a pressure detection chamber for hermetically sealing a pressure transmission medium, and a pressure sensitive device for outputting a signal according to the pressure. An element, a processing circuit electrically connected to and cooperating with the pressure-sensitive element, and a signal transmission means for exchanging a signal between the pressure-sensitive element and the outside via the processing circuit. A pressure element and the processing circuit are provided in the pressure detection chamber,
The pressure-sensitive element and the signal transmission means electrically connected to the processing circuit are held inside the housing to provide a technical means for exchanging signals between the pressure-sensitive element and the outside. is there.

Further, the signal transmission means includes an adjustment signal transmission means for externally supplying an adjustment signal to the pressure sensitive element via the processing circuit so that the pressure sensitive element outputs a desired characteristic. Power transmission means for operating the pressure element,
The output signal transmission means supplies the output signal from the pressure sensitive element to the outside through the processing circuit. Then, the adjustment signal transmission means, the power transmission means, and the output are formed so that each end of the adjustment signal transmission means, the power transmission means, and the output signal transmission means is opened in the pressure detection chamber of the housing. A signal transmitting means is held inside the housing, and an airtight member is put in a predetermined portion of the pressure detection chamber opened at each end to hermetically seal.

A seal diaphragm is provided at the end of the pressure introducing hole of the second housing, and a bonding wire is used to adjust the electrical connection between the pressure sensitive element and the outside through the processing circuit. The taper groove of the concave portion of the first housing in which the transmission terminal, the power transmission terminal, and the output signal transmission terminal are taken, and the adjustment signal transmission terminal, the power transmission terminal, and the respective ends of the output signal transmission terminal are opened. An airtight member having an insertion member is inserted into the first housing, and the adjustment signal transmission terminal, the power transmission terminal, and the output signal transmission terminal are provided with bending points inside the first housing. From 0.5 mm to 3 mm, and further, the surface of the second housing having the seal diaphragm and the surface of the first housing having the recess are aligned with each other. As well as sealing, the pressure transmission medium sealed from the sealed holes provided in said first housing, to hermetically seal the encapsulating in hole by a sealing means by inserting the elastic member to the encapsulant in hole.

Further, the other ends of the adjustment signal transmission terminal, the power transmission terminal and the output signal transmission terminal are opened in a concave portion on the fitting side of the first housing which is fitted with an external connector. Then, the technical means relating to the manufacturing method of each portion having the above configuration is adopted. Further, the pressure sensitive element may be a processing circuit-body type pressure sensitive element in which the processing circuit is integrated in the pressure sensitive element.

[0013]

According to the present invention, the pressure from the outside is transmitted to the pressure sensitive element provided in the pressure detecting chamber via the pressure transmitting medium. Then, the pressure sensitive element outputs an electric signal corresponding to the transmitted pressure. This output signal is processed by the processing circuit and output to the outside through the signal transmission means.

Further, an adjusting signal from the outside is supplied to the pressure sensitive element via the processing circuit via the signal transmitting means, and the pressure sensitive element is electrically adjusted so as to output a desired characteristic.

[0015]

The present invention will be described below with reference to the drawings-embodiments. FIG. 1 is a sectional view showing an overall outline of a semiconductor pressure detector of the present invention. A thin metallic seal diaphragm 7 slidable on the metallic main body housing 3 (second housing) is airtightly joined to the end of a pressure introducing hole 3b described later together with a metallic pressing member 14 by laser welding or the like. There is. However, the pressing member 14 used in the present embodiment is not always necessary, and even without such a pressing member 14, airtight bonding at this portion is sufficiently possible. (First Step) The connector housing 1 (first housing) made of resin is provided with the pins 2a and 2b which are insert-molded and body-molded so as to be held internally. At this time, in the recess of the connector housing 1, the pins 2a, 2b
Is formed so that each end thereof protrudes, and a groove for inserting an airtight member 11, which will be described later, is simultaneously formed around the opening.
The groove has a taper 20 described later. (Second Step) Although only one pin 2a is shown in the figure, there are a plurality of pins 2a, which are a power transmission terminal and an output signal transmission terminal used for exchanging signals when the semiconductor pressure detector is used. , For power supply, for grounding, for output, for adjustment, etc. The direction pin 2b is an adjustment signal transmission terminal used exclusively for the adjustment terminal so that the semiconductor pressure detector has a desired output characteristic by electrical writing or the like. In the semiconductor pressure detector of the present embodiment actually prototyped by the present inventors, the pin 2a has 3 pins, which are the 5V voltage supply terminal, the sensor output terminal, and the ground terminal, and the pin 2b is 1 pin and the adjustment terminal. It was dedicated, and a total of four pins 2a and 2b were used for the actual adjustment.

Usually, such an adjusting terminal is located outside the connector housing 1 and is hermetically sealed with an adhesive or the like in order to prevent malfunction and characteristic changes of the semiconductor pressure detector.
On the other hand, in the present embodiment, as shown in the figure, the pin 2b which is the adjusting terminal is provided in the connector housing 1, and each end is opened in a pressure detection chamber in the connector housing 1 which will be described later and will be described later. Is electrically connected to the pressure-sensitive element 5 by the bonding wire 12 via the processing circuit.
On the other hand, each of the other ends is opened so as to project into a recess on the fitting side to be fitted with an external connector (not shown), and is electrically connected to an external circuit (not shown).

Although only one pin 2b is shown in this embodiment, it may be plural in the processing circuit. Further, in the present embodiment, different pins 2a and 2b are used for exchanging signals between the pressure sensitive element 5 and the outside. However, in addition to these pins, although not shown, one type of terminal or the like is used for pressure sensing. Element 5
It is possible to use a signal transmission means for electrically transmitting and receiving a signal by electrically connecting between an external circuit and an external circuit (not shown).

Interfaces between the pins 2a, 2b and the connector housing 1 in the recesses of the connector housing 1 which will be described later, in which the semiconductor pressure sensitive element 5 is provided, and these pins 2a,
Each end of 2b is hermetically sealed with a groove of a concave portion in a peripheral portion opened in the pressure detection chamber by an airtight member 11 such as a sealant (adhesive) such as silicone. Here, in order to improve the airtight reliability against temperature change, a filler (not shown) having a thermal expansion coefficient lower than that of the airtight member 11 is mixed in the airtight member 11, or a filler having a thermal expansion coefficient lower than that of the airtight member 11 is mixed. By inserting a low insertion member 19, for example, a ring-shaped metal, to suppress the coefficient of thermal expansion as a whole, the pin 2
The difference in the coefficient of thermal expansion between a and 2b is reduced. In this embodiment, a metal ring is inserted as the insertion member 19 at a predetermined position of the pins 2a and 2b to reduce the difference in thermal expansion coefficient. Furthermore, in order to prevent peeling and cracking at the interface between the pin-adhesive and the resin-adhesive due to the difference in thermal expansion coefficient, the airtight member 1
The taper 20 (described later) of the groove of the connector housing 1 that fills up the connector 1 makes it possible to reduce the thermal stress at the interface. (Third Step) Further, in order to enhance the pull-out strength of the pins 2a, 2b, the pins 2a, 2b are bent inside the connector housing 1 to improve the pressure resistance, and the resin of the connector housing 1 and the pins 2a, 2b are further improved. In order to minimize the stress on the bonding interface due to the difference in the coefficient of thermal expansion of the metal, the bending point is provided on the adhesive side, that is, on the groove bottom surface of the recess of the connector housing 1. As a result of intensive studies made by the present inventors in this respect, in the semiconductor pressure detector of this embodiment, the bending point--
It was effective to set the distance between the bonded portions to 3 mm or less. Further, the lower limit is preferably 0.5 mm as a level which causes no problem in resin molding, although it varies depending on molding conditions. As described above, in this example, the effective range between the bending point and the adhesive portion was set to 0.5 mm to 3 mm.

A circuit board 10 is electrically and mechanically connected to each end of the pins 2a and 2b in the recess of the connector housing 1 by a conductive joining member 15, for example, a conductive adhesive such as solder or silver paste. There is. (Fourth Step) The circuit board 10 is provided with a processing circuit which is electrically connected to and cooperates with the pressure sensitive element 5 to process or adjust a signal from the pressure sensitive element 5. In the case where the pressure element 5 is an integrated sensor element having a processing circuit, it protects the pressure sensitive element 5, or is a disk-shaped capacitor or the like for removing noise, and is used for soldering or conductive bonding member 1.
The pressure-sensitive element 5 and the bonding wire 12 are electrically connected to each other via the chip terminal 6 fixed by 5 or the like.

The pedestal 4 is made of glass or the like and is hermetically fixed to the connector housing 1 by a joining member 18 such as an adhesive (sealant) such as silicone, and the pressure sensitive element 5 is hermetically joined to the pedestal 4 by anodic bonding or the like. There is. in this way,
Pressure-sensitive element 5 provided in the recess of the connector housing 1.
Are electrically connected to the circuit board 10 by the bonding wires 12. (Fifth step) Although not used this time, in order to enhance airtightness reliability against temperature changes, the filler 2 and the insertion member 19 are also inserted in the joining member 18 as in the case of the airtight member 11, and the pin 2
It is effective to reduce the difference in coefficient of thermal expansion between a and 2b.

A pressure reference chamber 9 is formed between the pressure-sensitive element 5 and the pedestal 4, and the absolute pressure can be detected by applying a vacuum. On the other hand, in the central portions of the pedestal 4 and the housing connector 1, the ventilation holes 4a shown by the dotted lines in the figure,
By providing 1a and bringing the reference pressure of the measured pressure into the connector, the relative pressure can be easily detected.

An O-ring 8 provided so as to hermetically seal between the connector housing 1 and the pressing member 14 is sandwiched from above and below in the drawing, and the connector housing 1 is fixed by caulking the entire circumference at the upper end portion 3a of the main body housing 3. is doing. (Sixth Step) The pressure-sensitive element 5 and the circuit board 10 are arranged in the concave portion of the connector housing 1, and after the main body housing 3 is attached, fluorosilicone oil or the like sealed by vacuum sealing or the like from the sealing hole 1b. Liquid 1 acting as a pressure transmission medium for
3 is filled to form a pressure detection chamber. The filling hole 1b after filling the filling liquid 13 is hermetically sealed, and as a sealing means thereof, an elastic material such as a spherical rubber (for example, a rubber ball) or a packing having a protrusion on the circumference of a cylindrical rubber is used. Member 16
Is used, and the elastic member 16 is inserted into the sealing hole 1b. The elastic member 16 is fixed by deforming the projecting portion 1c by heat staking through a plate-shaped small member 17 such as a spacer, and the sealing hole 1b is hermetically sealed. If the small member 17 is fixed by ultrasonic welding or the like, the sealing hole 1b can be hermetically sealed without being caulked by heat. Also, 1
In the case of a low pressure up to about 0 atm, it is possible to hold the elastic member 16 only by heat staking without using the small member 17 to hermetically seal the sealing hole 1b. (Seventh Step) Here, when the elastic member 16 is inserted into the sealing hole 1b, the volume of the sealing liquid 13 pushes up the seal diaphragm 7, so that the internal pressure of the sealing liquid 13 rises. In order to make this increase in internal pressure as small as possible, the amount of increase in internal pressure when the elastic member 16 is inserted in the manufacturing process stage is predicted, and pressure is applied in advance from the pressure introduction hole 3b of the main body housing 3 to seal the seal diaphragm 7 as an element. I am trying to shift to the side.
(Eighth Step) When manufacturing the semiconductor pressure detector of the present invention, the eighth step is not always necessary, and the necessity of the eighth step is determined according to the usage environment of the semiconductor pressure detector. To be done. That is, it is necessary when the operating environment is 15 atm or less, unnecessary when the operating environment is 30 atm or more, and appropriately depending on the output accuracy of the pressure sensitive element 5 when the operating environment is over 15 atm and less than 30 atm (15-30 atm). decide. Here, in the case of 15 to 30 atm, for example, it is necessary when high-precision output is required, and is not necessary when high-precision output is not required. No decision is made.

In the semiconductor pressure detector having the above structure, the taper 20 is provided in the groove of the connector housing 1 in order to prevent cracking of the airtight member 11 and peeling of the adhesive interface due to temperature change. Figure 20 shows the shape of 20
And with reference to FIG. 3, it demonstrates below. In order to prevent cracks and peeling due to temperature changes, it is important to consider the following three points. First of all, the airtight member 11
The amount of is reduced to minimize the volume change due to thermal expansion. Secondly, the area of the open portion 21, which is the free end, is increased to minimize the stress applied to the adhesive interface by the volume change. Thirdly, the adhesive area is increased as much as possible to improve the adhesive force. The shape shown in FIG. 2 in consideration of these three points is the basic shape of the groove of the connector housing 1 of this embodiment.

Further, as shown in FIG. 3, the airtight member 11 is further provided.
In order to reduce the amount of the taper, the tapered surface 20 should be a curved surface with a radius R, or in order to increase the area of the adhesive interface, gathers (not shown) having wavy unevenness when viewed from above in the drawing should be provided. It is also possible to further increase the adhesive area and increase the adhesive force. In this way, the taper 20
The airtight member 11 is inserted in the basic shape of the groove of the connector housing 1 having the above-mentioned structure, and further, the insertion member 19 having a lower thermal expansion coefficient than the airtight member 11 is put in the airtight member 11 to improve airtight reliability As a result, cracking of the airtight member 11 and peeling at the adhesive interface are suppressed, and the reliability of the temperature resistance change is greatly improved.

Next, the electrical connection between the pressure sensitive element 5 and the circuit board 10 by the bonding wire 12 will be described below with reference to FIGS. 4 to 7. FIG. 4 is an enlarged view of an essential part showing a connection state of the present embodiment. The part of the conductor 22 provided on the circuit board 10 and the pin 2a (2b) are connected by the conductive joint member 15, and the conductor 22 is formed. The chip terminal 6 is provided to the other part of the
A protective film 23 is formed on at least the remaining portion of the conductor 22. The negative end of the bonding wire 12 is connected to the chip terminal 6, and the other end is connected to the pressure sensitive element 5.

Further, as shown in FIG. 5, the bonding wire 12 can be directly connected to the conductor 22 without using the chip terminal 6. In this way, the circuit board 10 that constitutes the processing circuit so that the pressure sensitive element 5 outputs a desired characteristic.
Adjustment signal transmission means for supplying an adjustment signal to the pressure sensitive element 5 from the outside via the power transmission means for operating the pressure sensitive element 5, and an output signal from the pressure sensitive element 5 to the outside via the circuit board 10. The supplied output signal transmission means is configured, and electrical continuity is established between the pressure sensitive element 5 and the circuit board 10, and it becomes possible to obtain output characteristics with respect to pressure changes.

Here, the electrically connected state between the pressure sensitive element 5 and the circuit board 10 may be configured as shown in FIG. 6 in addition to the configurations shown in FIGS. 4 to 5. That is, the end is the pressure sensitive element 5.
The other end of the bonding wire 12 connected to
a and 2b are directly bonded, and then the conductive bonding member 15 covers the entire head portion 24 of the pins 2a and 2b including the connection portion of the bonding wire 12.
Bonding wire 12, pins 2a and 2b, and circuit board 1
This is a configuration for electrically connecting to the conductor 22 on the 0. With this configuration, the pins 2a, 2b, the conductor 22 on the circuit board 10, and the bonding wire 12 are connected at a single point, so that the chip terminal 6 is not necessary and therefore the area required for the connection is reduced. Becomes smaller. Therefore, the circuit area can be reduced, and the size can be reduced. In addition, since the connecting portions directly wire-bonded to the pins 2a and 2b are covered with the conductive joining member 15, the reliability is high and it is extremely effective under severe usage conditions such as an automobile.

The circuit board 10 can be applied to any resin, ceramic, plate-shaped capacitor or the like on which a conductor can be printed. Also, the surface treatment of the pins 2a, 2b,
When wire bonding is difficult due to flatness, flatness, etc.,
As means for improving the reliability of fixing the circuit board 10, FIG.
It is advisable to employ a cap-shaped auxiliary member 25 as described above.
According to FIG. 7, a conductive joining member 27 of solder, silver paste or the like is provided on the end faces of the pins 2a and 2b, and further an auxiliary member 25 is arranged and heated by a light beam for fusion joining. Then, the bonding wire 5 is formed on the auxiliary member 25.
Is bonded, and the conductive joining member 15 is provided so as to cover the connection portion and reach the conductor 22. Further, the open end surface of the auxiliary member 25 is provided with a so-called collar 26 that is folded back toward the outside. The collar 26 supports the circuit board 10 and reduces the load on the conductive joint member 15 in terms of strength. And the conductive joint member 15
Is prevented from hanging downward in the figure, and the reliability is further improved.

Next, as a sealing means after the elastic member 16 is inserted into the sealing hole 1b, instead of the sealing means shown in FIG. 1, the structure shown in FIG. 8 or 9 described below is adopted. May be. 8 and 9 are explanatory views showing a hermetically sealed state of the sealing hole 1b. According to FIG. 8, as sealing means after the elastic member 16 is inserted into the sealing hole 1b after filling the sealing liquid, A ring-shaped holding member 27 from the direction shown by the arrow in the figure.
The holding member 27a is fixed by crimping the lower crimping portion 28 using a means for fitting a. -Figure 9,
According to this, the holding member 27b is fixed by adopting a means for fitting the holding member 27b such as a C-shaped spring from the direction shown by the arrow as a sealing means. It should be noted that the holding members 27a, 2 when adopting the configuration of FIGS.
The corresponding portion of the connector housing 1 in which 7b is provided needs to have a shape suitable for each as shown in each drawing, and can be easily formed by ordinary resin molding.

As described above, since the elastic member 16 is used to deform the protruding portion 1c of the connector housing 1 and the holding members 27a and 27b are used as the airtight sealing means for the sealing hole 1b, it is usually carried out. High airtightness can be obtained by simple processing of the housing and sealing work, as compared with means such as sealing the holes of the existing metal housing with metal balls (none of which are shown).

Further, the pin 2 is provided inside the connector housing 1.
a, 2b are bent, and the pins 2a, 2b are opened so as to project in the pressure detection chamber, that is, positions extremely close to the adhesive portions of the pins 2a, 2b on the groove upper surface of the recess of the connector housing 1 (0. 5 mm to 3 mm), the reliability is greatly improved in this respect.

Further, as shown in FIG. 1, one end of the pin 2b, which is an adjustment terminal, is opened in a recess on the pressure receiving side of the connector housing 1, and the other end is a fitting side to be fitted with an external connector (not shown). The recess is provided so as to project together with the pin 2a. As a result, it is possible to completely prevent characteristic defects and the like due to contact with the conductive member in the external environment. Further, since the adhesive used for attaching the adjustment terminal which is usually used is unnecessary, the reliability in this respect is improved. Further, the reliability is further improved by using the waterproof connector housing.

Further, in the case where the processing circuits shown in this embodiment are all pressure-sensitive elements integrated in the pressure-sensitive element 5, that is, a so-called processing circuit-body type pressure-sensitive element, the structure shown in FIG. 10 is used. Can be taken. That is, FIG. 10 is a cross-sectional view of an essential part of the whole schematic diagram when a processing circuit body type pressure-sensitive element is used, and in the semiconductor pressure detector of FIG.
0 is removed, a processing circuit-body type pressure sensitive element 29 is installed on the pedestal 4 instead of the pressure sensitive element 5, and electrical connection with the pins 2a and 2b is performed by the bonding wire 12. . Since the configuration of the other parts other than this is exactly the same as that of the present embodiment, the description thereof will be omitted.

In the semiconductor pressure detector having the above-described structure, parts such as hermetic seals that have been conventionally used are not used at all, and the connector housing 1 is provided with a recess having a liquid sealing structure. Is used as the pressure detection chamber, and the circuit portion such as the circuit board 10 is entirely enclosed in the filled liquid 13 in the pressure detection chamber to seal each part. Therefore, the pressure detection chamber and the circuit chamber are hermetically sealed. A liquid-sealed structure with only one chamber without a section is extremely simplified, and is inexpensive and has high mass productivity. And the connector housing 1
And the joint surface of the main body housing 3 and the pins 2a and 2b
The upper surface of the groove of the recess where each end of the
Since each part such as the sealing hole 1b after sealing the is sealed airtightly, it becomes possible to perform the airtight sealing in the case of one chamber. Therefore, the use is not limited, and the range of use is greatly expanded.

Although the O-ring 8 is used to hermetically seal the space between the connector housing 1 and the pressing member 14,
It is also possible to hermetically bond the connector housing 1 and the main body housing 3 with an adhesive (sealant) such as silicone. When fluorosilicone is used as the airtight member 11, silicone oil can be used as the filling liquid 13.

Further, in the present embodiment, the other ends of the pins 2a and 2b, each of which has the other end opened in the pressure detection chamber, are formed in the concave portion on the fitting side of the connector housing 1 which fits with the external connector. However, if it is not necessary to fit an external connector, wire harness etc. (not shown) directly to each of the other ends.
Are connected, and the connected portion is hermetically sealed with a filler or the like to exchange signals with the outside.

Further, in the semiconductor pressure detector of the present invention, various devises are made in each part, but it goes without saying that various modifications can be made without departing from the spirit of the invention.

[0038]

As described above, according to the present invention, a pressure sensing element and a processing circuit are provided in the pressure detection chamber in the housing, and signals from the outside are transmitted via the signal transmission means internally connected to the housing. Since the communication is performed, there is an excellent effect that the liquid sealing structure of only one chamber can be realized without providing the airtight portions of the pressure detecting chamber and the circuit chamber.

Further, the joint surface between the first housing and the second housing, the groove upper surface in which the respective ends of the adjustment signal transmission terminal, the power transmission terminal and the output signal transmission terminal are opened, and the pressure transmission medium. Since each part of the enclosed hole after enclosing is sealed airtight without using parts such as a hermetic seal, it is possible to favorably perform airtight sealing in the case of one chamber.

[Brief description of drawings]

FIG. 1 is a sectional view showing an overall outline of a semiconductor pressure detector of the present invention.

FIG. 2 shows an enlarged view of a main part of a tapered portion of the present invention.

FIG. 3 is an enlarged view of a main part of another tapered portion according to the present invention.

FIG. 4 is an enlarged view of a main part of the connection between the pressure sensitive element of the present invention and a circuit board.

FIG. 5 is an enlarged view of another main part of the connection between the pressure-sensitive element of the present invention and the circuit board.

FIG. 6 is an enlarged view of still another main part of the connection between the pressure-sensitive element of the present invention and the circuit board.

FIG. 7 is an enlarged view of still another main part of the connection between the pressure-sensitive element of the present invention and the circuit board.

FIG. 8 is an explanatory view showing another hermetically sealed state of the sealing hole of the present invention.

FIG. 9 is an explanatory view showing still another hermetically sealed state of the sealing hole of the present invention.

FIG. 10 is a sectional view of an essential part using a processing circuit-body type pressure-sensitive element of the present invention.

FIG. 11 shows a cross-sectional view of a conventional semiconductor pressure detector.

[Explanation of symbols]

 1 Connector Housing (First Housing) 1b Encapsulation Hole 2a Pin (Power Transmission Terminal, Output Signal Transmission Terminal) 2b Pin (Adjustment Signal Transmission Terminal) 3 Body Housing (Second Housing) 5 Pressure Sensitive Element 7 Seal Diaphragm 8 O Ring 10 Circuit board 11 Airtight member 13 Filled liquid (pressure transmission medium) 14 Holding member 15 Conductive joining member 16 Elastic member 18 Joining member 19 Inserting member 20 Taper 21 Free end 22 Conductor 24 Head 25 Auxiliary member 27a, 27b Holding member 29 Processing circuit-body type pressure sensitive element

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Takashi Nagasaka 1-1-1, Showa-cho, Kariya city, Aichi prefecture Nihon Denso Co., Ltd.

Claims (18)

[Claims] 1. A housing having a pressure detection chamber for hermetically sealing a pressure transmission medium, a pressure sensitive element for outputting a signal according to pressure, and a processing circuit electrically connected to the pressure sensitive element to cooperate with each other. A signal transmission means for exchanging signals between the pressure sensitive element and the outside through the processing circuit, the pressure sensitive element and the processing circuit being provided in the pressure detection chamber, A semiconductor pressure detector characterized in that the signal transmission means electrically connected to the processing circuit is held inside the housing to exchange signals between the pressure sensitive element and the outside. 2. A housing having a pressure detection chamber for hermetically sealing a pressure transmission medium, a pressure sensitive element for outputting a signal according to pressure, and a processing circuit electrically connected to and cooperating with the pressure sensitive element. An adjustment signal transmission means for supplying an adjustment signal from the outside to the pressure sensitive element via the processing circuit so that the pressure sensitive element outputs a desired characteristic; and a power transmission means for operating the pressure sensitive element, An output signal transmitting means for supplying an output signal from the pressure-sensitive element to the outside through the processing circuit, the pressure-sensitive element and the processing circuit being provided in the pressure detection chamber, the pressure-sensitive element and the processing being provided. A semiconductor pressure detector characterized in that the adjustment signal transmission means and the output signal transmission means electrically connected to a circuit are held inside the housing to exchange signals between the pressure sensitive element and the outside. . 3. Each end of the adjustment signal transmission means and the output signal transmission means held inside the housing is opened in the pressure detection chamber, and each predetermined end of the pressure detection chamber is opened. The semiconductor pressure detector according to claim 2, further comprising an airtight member. 4. A pressure-sensitive element that outputs an electric signal according to pressure, a processing circuit that is electrically connected to the pressure-sensitive element and cooperates with each other, and an electrical connection between the pressure-sensitive element and the processing circuit. A bonding wire to be taken, an adjustment signal transmission terminal for supplying an adjustment signal to the pressure sensitive element via the processing circuit so that the pressure sensitive element outputs a desired characteristic, and a power transmission terminal for operating the pressure sensitive element. An output signal transmission terminal for supplying an output signal from the pressure-sensitive element to the outside through the processing circuit, and a recess, and the adjustment signal transmission terminal, the power transmission terminal, and the output signal transmission in the recess. Firstly provided is an enclosing hole for internally holding each terminal of the terminal so as to open and enclosing a pressure transmitting medium for indirectly transmitting a pressure from the outside to the pressure sensitive element.
And a second housing having a pressure introduction hole for introducing a pressure from the outside, and sealed in the recess between the first housing and the second housing that are hermetically sealed via a seal diaphragm. There is the pressure sensitive element, the processing circuit, and the wire bonding in the pressure transmitting medium filled, and when the pressure from the outside is introduced from the pressure introducing hole, the seal diaphragm receives the pressure and through the pressure transmitting medium. A semiconductor pressure detector, wherein the pressure is transmitted to the pressure sensitive element. 5. The semiconductor pressure detector according to claim 4, wherein the seal diaphragm is provided at an end of the pressure introducing hole of the second housing. 6. A taper is provided in a groove in which the adjustment signal transmission terminal, the power transmission terminal, and the output signal transmission terminal of the recess are opened, and an airtight member is provided inside the taper. The semiconductor pressure detector according to claim 4 or 5. 7. The semiconductor pressure detector according to claim 6, wherein an insert member having a thermal expansion coefficient lower than that of the airtight member is provided inside the airtight member. 8. The adjustment signal transmission terminal, the transmission terminal, and the output signal transmission terminal, which are internally held in the first housing, are bent inside the first housing. The semiconductor pressure detector according to any one of 1 to 7. 9. The bending point at which the adjustment signal transmission terminal, the power transmission terminal, and the output signal transmission terminal bend inside the first housing is the adjustment signal transmission terminal, the power transmission terminal, and the output signal. 9. The semiconductor pressure detector according to claim 8, wherein the transmission terminal is 0.5 mm to 3 mm from the bottom surface of the groove in which the respective ends are opened. 10. The semiconductor pressure detector according to claim 4, wherein an elastic member is inserted into the sealing hole, and the sealing hole is hermetically sealed by a sealing means. 11. The semiconductor pressure detector according to claim 10, wherein the sealing means is a means for caulking the periphery of the sealing hole of the first housing via a small member. 12. The sealing means includes a holding member for the first member.
11. The semiconductor pressure detector according to claim 10, which is a means to be fitted into the housing of. 13. The pressure-sensitive element has an end of the bonded bonding wire, and each of the adjustment signal transmission terminal, the power transmission terminal, and the output signal transmission terminal opened in the pressure detection chamber. The head of the end has the other end of the bonding wire directly bonded, and the conductive bonding member is simultaneously attached to at least the connecting portion of the bonding wire of the head and the part of the peripheral circuit. 13. The semiconductor pressure according to claim 4, wherein electrical connection is established among the piezoelectric element, the peripheral circuit, the adjustment signal transmission terminal, the power transmission terminal, and the output signal transmission terminal. Detector. 14. A conductive joint member is provided on the head at each of the ends of the adjustment signal transmission terminal, the power transmission terminal, and the output signal transmission terminal, which are provided in the pressure detection chamber,
14. The semiconductor pressure detector according to claim 13, further comprising an auxiliary member, and the other end of the bonding wire is bonded to the auxiliary member. 15. The other end of each of the adjustment signal transmission terminal, the power transmission terminal, and the output signal transmission terminal, each end of which is opened in the pressure detection chamber, has the other end of the first housing fitted with an external connector. The semiconductor pressure detector according to any one of claims 4 to 14, wherein the semiconductor pressure detector is provided in a recess on the fitting side. 16. The semiconductor according to claim 1, wherein the pressure sensitive element is a processing circuit-body type pressure sensitive element in which the processing circuit is integrated in the pressure sensitive element. Pressure detector. 17. A first step of air-tightly joining a seal diaphragm to the negative end of the pressure introducing hole of the second housing, and adjusting signal transmission terminals and power so that each negative end is opened in the recess of the first housing. A second step of internally holding the transmission terminal and the output signal transmission terminal in the first housing, and providing a tapered groove in the first housing around the opening, and inserting after the second step. A third step of providing an airtight member having a member in the groove, and a processing circuit at each end of the adjustment signal transmission terminal, the power transmission terminal, and the output signal transmission terminal opened in the recess of the first housing. A fourth step of electrically connecting a circuit board constituting the above, and a step of electrically connecting the pressure sensitive element to a pedestal fixed to the recess of the first housing and electrically connecting to the circuit board via a bonding wire. 5 And an air-tightly joined surface of the second housing and a surface of the first housing having the recessed portion with an O-ring sandwiched therebetween to form a pressure detection chamber, and the first housing and the second housing. A sixth step of hermetically sealing the space between the housing and the housing, and after the first to sixth steps, the pressure transmission medium is sealed and filled through the sealing hole, and then the elastic member is inserted into the sealing hole. And a seventh step of hermetically sealing the sealing hole, the method for manufacturing a semiconductor pressure detector. 18. The seal diaphragm, wherein the elastic member is inserted into the sealing hole to increase the internal pressure generated in the pressure detection chamber by the pressure introducing hole before the seventh step. 18. The method for manufacturing a semiconductor pressure detector according to claim 17, further comprising an eighth step of shifting the pressure sensor to the pressure sensitive element side.