JP2780474B2 - Manufacturing method of cream solder - Google Patents
Manufacturing method of cream solderInfo
- Publication number
- JP2780474B2 JP2780474B2 JP2271109A JP27110990A JP2780474B2 JP 2780474 B2 JP2780474 B2 JP 2780474B2 JP 2271109 A JP2271109 A JP 2271109A JP 27110990 A JP27110990 A JP 27110990A JP 2780474 B2 JP2780474 B2 JP 2780474B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- synthetic resin
- casing
- solder particles
- cream solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明はクリーム半田の製造方法に係り、半田粒子の
表面に、酸化防止のための合成樹脂コーティングを施す
ようにしたものである。DETAILED DESCRIPTION OF THE INVENTION (Industrial application field) The present invention relates to a method for producing cream solder, wherein a surface of a solder particle is coated with a synthetic resin for preventing oxidation.
（従来の技術） 電子部品を基板に接着するクリーム半田は、溶融半田
を霧状に射出するなどして微小な半田粒子を形成した
後、ふるいにより分粒して生成される。この半田粒子
は、スズ、鉛などの金属若しくはこれらの合金であり、
空気中の酸素に触れると、その表面に酸化膜が生じ、ヌ
レ性が低下することから、ヌレ性の改善等のために、上
記分粒の後、フラックスが添加される。(Prior Art) A cream solder for bonding an electronic component to a substrate is generated by forming fine solder particles by, for example, injecting molten solder in a mist state, and then sieving by a sieve. This solder particle is a metal such as tin or lead or an alloy thereof,
When exposed to oxygen in the air, an oxide film is formed on the surface and the wetting property is reduced. Therefore, a flux is added after the above-mentioned sizing to improve the wetting property.
（発明が解決しようとする課題） ところが、フラックスの添加前、殊に分粒工程におい
て、半田粒子は空気に触れることから、その表面に酸化
膜を生じ、この酸化膜の為に、ヌレ性が低下しやすい問
題があった。(Problems to be Solved by the Invention) However, before the addition of the flux, especially in the sizing step, the solder particles come into contact with air, so that an oxide film is formed on the surface thereof. There was a problem that was easily reduced.
そこで本発明は、半田粒子表面に酸化膜が生じるのを
防止できる手段を提供することを目的とする。Therefore, an object of the present invention is to provide means for preventing an oxide film from being formed on the surface of solder particles.
（課題を解決するための手段） 本発明は、還元ガス雰囲気のケーシング内へ溶融半田
を射出することにより半田粒子を形成し、次いでこのケ
ーシング内において半田粒子の表面に合成樹脂コーティ
ングを施した後、この半田粒子を分粒し、次いでフラッ
クスを添加してクリーム半田を製造するものである。(Means for Solving the Problems) The present invention forms a solder particle by injecting molten solder into a casing in a reducing gas atmosphere, and then forms a synthetic resin coating on the surface of the solder particle in the casing. Then, the solder particles are sized, and then a flux is added to produce cream solder.
また好ましくは、前記ケーシングに設けられた合成樹
脂槽に前記半田粒子を落下させて浸漬し、前記合成樹脂
コーティングを施すようにした。Also preferably, the solder particles are dropped and immersed in a synthetic resin tank provided in the casing, and the synthetic resin coating is applied.
また好ましくは、前記ケーシングに合成樹脂を霧状に
射出し、ケーシング内を落下中の前記半田粒子に吹き付
けて前記合成樹脂コーティングを施すようにした。Preferably, the synthetic resin is injected into the casing in a mist state, and the synthetic resin coating is applied by spraying the solder particles falling in the casing.
（作用） 上記構成によれば、分粒の前に、ケーシング内の還元
ガス雰囲気において半田粒子には合成樹脂コーティング
が施されるので、半田粒子表面に酸化膜が生じるのは防
止され、ヌレ性の良いクリーム半田を得ることができ
る。(Operation) According to the above configuration, before the sizing, the solder particles are coated with the synthetic resin in the reducing gas atmosphere in the casing, so that the formation of an oxide film on the surface of the solder particles is prevented, and the sliminess is reduced. A good cream solder can be obtained.
（実施例１） 次に、図面を参照しながら本発明の実施例を説明す
る。Embodiment 1 Next, an embodiment of the present invention will be described with reference to the drawings.
第１図は、クリーム半田の製造工程を示すものであ
る。１はケーシングであり、このケーシング１の内部
は、チッソガスと水素ガスの混合ガスのような還元ガス
雰囲気になっている。射出部２から溶融半田を霧状に射
出すると、霧状の溶融半田は下降しながら硬化して、微
小な半田粒子３が形成され、この半田粒子３は、ケーシ
ングの下部に設けられた合成樹脂槽４に落下して浸漬さ
れる。FIG. 1 shows a manufacturing process of cream solder. Reference numeral 1 denotes a casing, and the inside of the casing 1 has a reducing gas atmosphere such as a mixed gas of nitrogen gas and hydrogen gas. When the molten solder is ejected from the injection unit 2 in a mist state, the mist-like molten solder is hardened while descending, and minute solder particles 3 are formed. It falls into the tank 4 and is immersed.
次いで半田粒子３を合成樹脂槽４から取り出し、ふる
いなどにより分粒して、粒径を揃える。次いでフラック
スを添加すれば、クリーム半田は出来上がる。Next, the solder particles 3 are taken out of the synthetic resin tank 4 and sized by a sieve or the like to make the particle diameter uniform. Then, if the flux is added, the cream solder is completed.
第２図は、このようにして製造されたクリーム半田を
示している。５はフラックスである。半田粒子３の表面
は、合成樹脂槽４に浸漬したことにより、合成樹脂コー
ティング７が形成されており、したがって上記分粒工程
において空気中の酸素に触れても、酸化膜が生じること
はなく、ヌレ性の良いクリーム半田が得られる。合成樹
脂としては、例えばポリ塩化ビニリデン、ポリ４フッ化
エチレンなどが使用される。FIG. 2 shows the cream solder thus produced. 5 is a flux. Since the surface of the solder particles 3 is immersed in the synthetic resin tank 4, the synthetic resin coating 7 is formed. Therefore, even if the surface of the solder particles 3 is exposed to oxygen in the air in the sizing step, an oxide film is not formed. A cream solder with good wettability can be obtained. As the synthetic resin, for example, polyvinylidene chloride, polytetrafluoroethylene, or the like is used.
特に本手段は、ケーシング１内で半田粒子３を生成
し、このケーシング１内に設けられた合成樹脂槽４で、
直ちに半田粒子３に合成樹脂コーティング７を施すよう
にしているので、半田粒子３が空気に触れて酸化膜が生
じるの確実に防止できる。In particular, this means generates the solder particles 3 in the casing 1, and in the synthetic resin tank 4 provided in the casing 1,
Since the synthetic resin coating 7 is immediately applied to the solder particles 3, it is possible to reliably prevent the solder particles 3 from contacting with air to form an oxide film.
（実施例２） 第３図は他の実施例を示すものである。ケーシング１
には、溶融した合成樹脂を霧状を射出する射出部６が設
けられており、下降中の半田粒子３に吹き付けられて、
上記合成樹脂コーティング７が生成される。この場合
も、半田粒子３が空気に触れないように、溶融半田の射
出による半田粒子３の生成と、合成樹脂コーティング７
の生成は、還元ガス雰囲気中の同一ケーシング１で行わ
れる。(Embodiment 2) FIG. 3 shows another embodiment. Casing 1
Is provided with an injection section 6 for injecting the molten synthetic resin in a mist state, and is sprayed on the descending solder particles 3,
The synthetic resin coating 7 is produced. Also in this case, generation of the solder particles 3 by injection of the molten solder and the synthetic resin coating 7 are performed so that the solder particles 3 do not come into contact with air.
Is produced in the same casing 1 in a reducing gas atmosphere.
（発明の効果） 以上説明したように本発明は、ケーシング内の還元ガ
ス雰囲気において半田粒子に合成樹脂コーティングを施
した後、この半田粒子を分粒し、次いでフラックスを添
加してクリーム半田を製造するようにしているので、半
田粒子に酸化膜が生じることはなく、ヌレ性のよいクリ
ーム半田を得ることができる。またコーティング材とし
ては合成樹脂を使用するので、コストも安価となる利点
がある。(Effects of the Invention) As described above, the present invention provides a cream solder by applying a synthetic resin coating to solder particles in a reducing gas atmosphere in a casing, sizing the solder particles, and then adding a flux. As a result, no oxide film is formed on the solder particles, and a cream solder having good wettability can be obtained. Further, since a synthetic resin is used as the coating material, there is an advantage that the cost is reduced.
図は本発明の実施例を示すものであって、第１図はクリ
ーム半田の製造工程図、第２図はクリーム半田図、第３
図は他の実施例の側面図である。 ３……半田粒子 ５……フラックス ７……合成樹脂コーティングFIG. 1 shows an embodiment of the present invention. FIG. 1 is a view showing a manufacturing process of cream solder, FIG.
The figure is a side view of another embodiment. 3 solder particles 5 flux 7 synthetic resin coating
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) B23K 35/22 B23K 35/40 B23K 35/363──────────────────────────────────────────────────続 き Continued on the front page (58) Fields surveyed (Int.Cl. 6 , DB name) B23K 35/22 B23K 35/40 B23K 35/363
Claims (3)
を射出することにより半田粒子を形成し、次いでこのケ
ーシング内において半田粒子の表面に合成樹脂コーティ
ングを施した後、この半田粒子を分粒し、次いでフラッ
クスを添加することを特徴とするクリーム半田の製造方
法。A solder particle is formed by injecting a molten solder into a casing in a reducing gas atmosphere, and then the surface of the solder particle is coated with a synthetic resin in the casing. And then adding a flux.
前記半田粒子を落下させて浸漬し、前記合成樹脂コーテ
ィングを施すことを特徴とする請求項１記載のクリーム
半田の製造方法。2. The method according to claim 1, wherein said solder particles are dropped and immersed in a synthetic resin bath provided in said casing to apply said synthetic resin coating.
し、ケーシング内を落下中の前記半田粒子に吹き付けて
前記合成樹脂コーティングを施すことを特徴とする請求
項１記載のクリーム半田の製造方法。3. A method for producing a cream solder according to claim 1, wherein the synthetic resin is sprayed onto the casing in a mist state, and the synthetic resin coating is applied by spraying the solder particles falling in the casing. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2271109A JP2780474B2 (en) | 1990-10-09 | 1990-10-09 | Manufacturing method of cream solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2271109A JP2780474B2 (en) | 1990-10-09 | 1990-10-09 | Manufacturing method of cream solder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04147787A JPH04147787A (en) | 1992-05-21 |
| JP2780474B2 true JP2780474B2 (en) | 1998-07-30 |
Family
ID=17495464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2271109A Expired - Lifetime JP2780474B2 (en) | 1990-10-09 | 1990-10-09 | Manufacturing method of cream solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2780474B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000001506A1 (en) * | 1998-07-02 | 2000-01-13 | Matsushita Electric Industrial Co., Ltd. | Solder powder and method for preparing the same and solder paste |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4298407A (en) * | 1980-08-04 | 1981-11-03 | E. I. Du Pont De Nemours And Company | Flux treated solder powder composition |
| JPS60261689A (en) * | 1984-06-07 | 1985-12-24 | Matsushita Electric Ind Co Ltd | Cream solder |
| JP2564152B2 (en) * | 1987-10-27 | 1996-12-18 | タムラ化研株式会社 | Solder paste |
| JPH02147194A (en) * | 1988-11-30 | 1990-06-06 | Fujitsu Ltd | Solder paste |
-
1990
- 1990-10-09 JP JP2271109A patent/JP2780474B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000001506A1 (en) * | 1998-07-02 | 2000-01-13 | Matsushita Electric Industrial Co., Ltd. | Solder powder and method for preparing the same and solder paste |
| US6416590B1 (en) | 1998-07-02 | 2002-07-09 | Matsushita Electric Industrial Co., Ltd. | Solder powder and method for preparing the same and solder paste |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04147787A (en) | 1992-05-21 |
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