JPS60261689A - Cream solder - Google Patents

Cream solder

Info

Publication number
JPS60261689A
JPS60261689A JP59116978A JP11697884A JPS60261689A JP S60261689 A JPS60261689 A JP S60261689A JP 59116978 A JP59116978 A JP 59116978A JP 11697884 A JP11697884 A JP 11697884A JP S60261689 A JPS60261689 A JP S60261689A
Authority
JP
Japan
Prior art keywords
particles
solder
flux
solder particles
cream solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59116978A
Other languages
Japanese (ja)
Other versions
JPH0526598B2 (en
Inventor
Shuichi Murakami
修一 村上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP59116978A priority Critical patent/JPS60261689A/en
Publication of JPS60261689A publication Critical patent/JPS60261689A/en
Publication of JPH0526598B2 publication Critical patent/JPH0526598B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To maintain uniformly solder particles and flux particles in a manner as to prevent the sepn. thereof and to improve the quality of soldering by coating glycerol on the surface of the solder particles. CONSTITUTION:The glycerol 3 is coated on the surface of the solder particles 1 in cream solder consisting of the particles 1 and the flux 2. The glycerol 3 on the surface of the particles 1 prevents the particles 1 from approaching to each other and therefore the particles 1 are uniformly dispersed in the flux 2. The settling of the particles 1 and the sepn. of the flux 2 and the particles 1 are thus obviated.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は微小回路などの半田付けにおいて用いられるク
リーム半田に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to cream solder used in soldering microcircuits and the like.

従来例の構成とその問題点 従来のクリーム半田は、拡大すると第１図に示す様に、
半田粒子１とフラックス成分２とから成っている。この
様なりリーム半田では、半田粒子１は、混錬直後では第
１図に示す様に均一に分散しているが、時間の経過と共
に第２図に示す様に比重の大きい半田粒子１が沈澱して
フラックス成分２と半田粒子１の分離が発生する。この
様なりリーム半田を使用する場合、半田粒子とフラック
ス成分の混合割合が不均一となり、クリーム半田塗布量
のバラツキや半田付は品質の低下の原因となっていた。The structure of the conventional example and its problems When the conventional cream solder is enlarged, as shown in Fig. 1,
It consists of solder particles 1 and flux components 2. In this ream solder, solder particles 1 are uniformly dispersed as shown in Figure 1 immediately after kneading, but as time passes, solder particles 1 with higher specific gravity settle as shown in Figure 2. As a result, flux component 2 and solder particles 1 are separated. When ream solder is used in this way, the mixing ratio of solder particles and flux components becomes uneven, causing variations in the amount of cream solder applied and deterioration of soldering quality.

また、従来より、フラックスに水添ひまし前糸やアマイ
ド系の助剤を添加して、分離を防ぐ方法もとられていた
が、助剤が半田付は性を低下させていた。In addition, conventional methods have been used to prevent separation by adding hydrogenated castor yarn or amide-based auxiliary agents to flux, but the auxiliary agents reduce soldering properties.

発明の目的 本発明は、上記従来の技術的欠点をなくし、半田粒子と
７ラツクス成分が分離することのないよう均一に保ち、
半田付は品質を向上させると共に、被半田付は物に供給
する場合の均一供給をも可能にしたクリーム半田を提供
するものである。Purpose of the Invention The present invention eliminates the above-mentioned conventional technical drawbacks, maintains the solder particles and the 7 lux component uniformly so that they do not separate, and
The purpose is to provide cream solder that improves the quality of soldering and also enables uniform supply when supplying to objects to be soldered.

発明の構成 本発明は、グリセリンを被覆した半田粒子とフラックス
とから構成されており、半田粒子表面のグリセリンが半
田粒子同士の接近を防止し、半田粒子を均一に７ラツク
ス中に分散させるという効果を有する。Structure of the Invention The present invention is composed of solder particles coated with glycerin and flux, and has the effect that the glycerin on the surface of the solder particles prevents the solder particles from coming close to each other and uniformly disperses the solder particles in the flux. has.

実施例の説明 第３図は本発明を説明するだめの構成図である。Description of examples FIG. 3 is a structural diagram for explaining the present invention.

３７＋ ここで、１は半田粒子、２はフラックス、３は半田粒子
１０表面を覆っているグリセリンである。37+ Here, 1 is a solder particle, 2 is a flux, and 3 is glycerin covering the surface of the solder particle 10.

本実施例によれば、半田粒子１の表面のグリセリン３が
半田粒子１同士が近接するのを防ぐため、半田粒子１は
フラックス２中に均一に分散し、その結果、半田粒子１
は沈澱せず、フラックスと半田粒子の分離が発生しない
。According to this embodiment, since the glycerin 3 on the surface of the solder particles 1 prevents the solder particles 1 from coming close to each other, the solder particles 1 are uniformly dispersed in the flux 2, and as a result, the solder particles 1
does not precipitate, and no separation of flux and solder particles occurs.

〔実施例１〕　クリーム半田組成比（重量係）フラック
ス　１２チ 但し、トールロジン　４９％ ロジン変性マレイン酸樹脂　２ｏ％ ジエチレングリコールモツプチルエ ーテル　３０％ 塩酸アニリン　１％ グリセリン　２％ Ｓｎ　６３チ、　Ｐｂ　３７％、３００メツシユ以下の
半田粒子８６チ ；）〔実施例２〕　クリーム半田組成比（重量係）フラ
ックス　１２％ 但し、トールロジン　４９チ 重合ロジン　１８％ ジエチレングリコールモノブチルエ ーテル　３２％ 塩酸アニリン　１％ グリセリン　２係 ９ｎ　６３％、Ｐｂ　３７％、３００メツシユ以下の半
田粒子８６係 発明の効果 以上、本発明によると、クリーム半田は、室温で２００
０〜４ｏ○０ボイズの粘度となり、２ｏ日経過後も半田
粒子の沈澱がみられなかった。[Example 1] Cream solder composition ratio (by weight) Flux 12% However, tall rosin 49% Rosin modified maleic acid resin 20% Diethylene glycol mottyl ether 30% Aniline hydrochloride 1% Glycerin 2% Sn 63% Pb 37%, 300 Solder particles smaller than a mesh: 86 cm;) [Example 2] Cream solder composition ratio (weight ratio): flux: 12%, however, tall rosin: 49%: polymerized rosin: 18%, diethylene glycol monobutyl ether: 32%, aniline hydrochloride: 1%, glycerin: 2%: 9n: 63%, According to the present invention, the cream solder has 37% Pb and 300 mesh or less solder particles.
The viscosity was 0 to 400 voids, and no precipitation of solder particles was observed even after 20 days.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来技術によるクリーム半田の混錬直後の状態
を示す説明図、第２図は従来技術によるクリーム半田の
混錬後の状態を示す説明図、第３図は本発明の一実施仲
１におけるクリーム半田の状態を示す説明図である。 １・・・・・・半田粒子、２・・・・・・フラックス、
３・・・・・・グリセリン。 代理人の氏名　弁理士　中　尾　敏　男　ほか１名第１
図 第２図 第３図FIG. 1 is an explanatory diagram showing the state of cream solder immediately after kneading according to the prior art, FIG. 2 is an explanatory diagram showing the state of cream solder after kneading according to the prior art, and FIG. FIG. 1 is an explanatory diagram showing the state of cream solder in No. 1; 1...Solder particles, 2...Flux,
3...Glycerin. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2 Figure 3

Claims (1)

【特許請求の範囲】[Claims] 半田粒子と７ラツクスから成るクリーム半田に於て、半
田粒子の表面にグリセリンを被覆させたことを特徴とす
るクリーム半田。A cream solder consisting of solder particles and 7 lux, characterized in that the surface of the solder particles is coated with glycerin.
JP59116978A 1984-06-07 1984-06-07 Cream solder Granted JPS60261689A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59116978A JPS60261689A (en) 1984-06-07 1984-06-07 Cream solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59116978A JPS60261689A (en) 1984-06-07 1984-06-07 Cream solder

Publications (2)

Publication Number Publication Date
JPS60261689A true JPS60261689A (en) 1985-12-24
JPH0526598B2 JPH0526598B2 (en) 1993-04-16

Family

ID=14700461

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59116978A Granted JPS60261689A (en) 1984-06-07 1984-06-07 Cream solder

Country Status (1)

Country Link
JP (1) JPS60261689A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04147787A (en) * 1990-10-09 1992-05-21 Matsushita Electric Ind Co Ltd Production of cream solder
EP0557363A1 (en) * 1990-10-31 1993-09-01 Motorola Inc. Solder paste having solder alloy/formate complexes as oxide scavengers, and method for preparing same
JP2007258420A (en) * 2006-03-23 2007-10-04 Rohm Co Ltd Led light-emitting device and its manufacturing method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020046627A1 (en) 1998-06-10 2002-04-25 Hitoshi Amita Solder powder, flux, solder paste, soldering method, soldered circuit board, and soldered joint product

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04147787A (en) * 1990-10-09 1992-05-21 Matsushita Electric Ind Co Ltd Production of cream solder
EP0557363A1 (en) * 1990-10-31 1993-09-01 Motorola Inc. Solder paste having solder alloy/formate complexes as oxide scavengers, and method for preparing same
EP0557363A4 (en) * 1990-10-31 1994-01-19 Motorola, Inc.
JP2007258420A (en) * 2006-03-23 2007-10-04 Rohm Co Ltd Led light-emitting device and its manufacturing method

Also Published As

Publication number Publication date
JPH0526598B2 (en) 1993-04-16

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term