JP2780324B2 - X-ray thickness gauge - Google Patents

X-ray thickness gauge

Info

Publication number
JP2780324B2
JP2780324B2 JP9455489A JP9455489A JP2780324B2 JP 2780324 B2 JP2780324 B2 JP 2780324B2 JP 9455489 A JP9455489 A JP 9455489A JP 9455489 A JP9455489 A JP 9455489A JP 2780324 B2 JP2780324 B2 JP 2780324B2
Authority
JP
Japan
Prior art keywords
ray
thin film
substrate
thickness
rays
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP9455489A
Other languages
Japanese (ja)
Other versions
JPH02271212A (en
Inventor
順一郎 中島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP9455489A priority Critical patent/JP2780324B2/en
Publication of JPH02271212A publication Critical patent/JPH02271212A/en
Application granted granted Critical
Publication of JP2780324B2 publication Critical patent/JP2780324B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は薄膜の厚さを測定するX線膜厚計に関する。Description: TECHNICAL FIELD The present invention relates to an X-ray film thickness meter for measuring the thickness of a thin film.

〔従来の技術〕[Conventional technology]

従来、この種のX線膜厚計はX線の吸収効果を利用し
て金属膜の厚さを測定するもあのであり、近年、半導体
基板における薄膜の膜厚を測定するのに、よく用いられ
てきた。
Conventionally, this type of X-ray film thickness meter measures the thickness of a metal film using the absorption effect of X-rays. In recent years, this type of X-ray film thickness meter is often used to measure the thickness of a thin film on a semiconductor substrate. I have been.

このX線膜厚計は、図面には示さないが、被測定試料
である薄膜が形成された基板表面に対して所定の入射角
でX線を投射するX線発生器と、このX線発生器と対称
に斜に配置された検出器とを有している。
Although not shown in the drawings, this X-ray film thickness meter includes an X-ray generator that projects X-rays at a predetermined incident angle onto a substrate surface on which a thin film to be measured is formed, and an X-ray generator. And a detector symmetrically arranged obliquely with the detector.

この基板の薄膜の厚さを測定する場合は、まず、X線
を基板の薄膜の表面に照射し、薄膜及び基板に含まれる
元素より反射するX線を検出器でそれぞれ測定し、その
強度差を膜厚に換算して膜厚としていた。
When measuring the thickness of the thin film of the substrate, first, X-rays are irradiated on the surface of the thin film of the substrate, and the X-rays reflected from the elements contained in the thin film and the substrate are measured by a detector, and the intensity difference is measured. Was converted to a film thickness to obtain a film thickness.

〔発明が解決しようとする課題〕[Problems to be solved by the invention]

上述した従来のX線膜厚計で、例えば、1μm以下の
厚さの薄膜では、基板中の反射するX線の強度をモニタ
する場合、薄膜中の元素の密度が大きく、X線質量係数
が大きいと、薄膜中の吸収が大きくなり、1μm以下の
薄膜でも測定可能な場合がある。ところが、逆に、基板
の元素で反射するX線の強度が強く、薄膜の元素の密度
が小さく、かつ薄膜のX線質量吸収係数が小さいとき
は、薄膜によるX線の吸収が小さく、膜厚測定が出来な
いという問題がある。
In the conventional X-ray film thickness meter described above, for example, in the case of a thin film having a thickness of 1 μm or less, when monitoring the intensity of reflected X-rays in the substrate, the density of the elements in the thin film is large and the X-ray mass coefficient is large. If it is large, the absorption in the thin film becomes large, so that the measurement may be possible even with a thin film of 1 μm or less. However, conversely, when the intensity of X-rays reflected by the elements of the substrate is high, the density of the elements in the thin film is small, and the X-ray mass absorption coefficient of the thin film is small, the absorption of X-rays by the thin film is small, and the film thickness is small. There is a problem that measurement cannot be performed.

本発明の目的は、基板に形成された薄膜の膜厚が1μ
m以下でも膜厚の測定が出来るX線膜厚計を提供するこ
とである。
It is an object of the present invention that a thin film formed on a substrate has a thickness of 1 μm.
It is an object of the present invention to provide an X-ray film thickness meter capable of measuring the film thickness even when the thickness is less than m.

〔課題を解決するための手段〕[Means for solving the problem]

本発明のX線膜厚計は、X線の全反射臨界角度θ
もつ基板の上に全反射臨界角度θをもつとともにこの
θが前記θより小さい薄膜が形成されたその膜厚を
測定するX線膜厚計において、X線の入射角度θ及び
前記基板より反射するX線を検知する取出し角度θ
θ<θ=θ<θに設定する手段を備え構成され
る。
The X-ray film thickness meter according to the present invention comprises a film having a critical angle of total reflection θ 1 on a substrate having a critical angle of total reflection of X-rays θ 0 and a thin film in which θ 1 is smaller than the above-mentioned θ 0. in X Senmaku thickness meter for measuring the thickness, a means for setting a take-off angle theta 2 which detects the X-rays reflected from the incident angle theta X and the substrate of X-rays to θ 1 <θ X = θ 2 <θ 0 Provided and configured.

〔実施例〕〔Example〕

次に、本発明について図面を参照して説明する。 Next, the present invention will be described with reference to the drawings.

第1図は本発明の一実施例を説明するための入射、反
射X線と薄膜が形成された基板及び検出器との相対位置
を示す模式断面図である。なお、この図面では説明の都
合上屈折角については示していない。いま、第1図で示
すように、基板3の全反射臨界角度をθ、薄膜1の全
反射臨界角度をθ、X線の入射角度をθとし、この
入射X線2の入射角度θが、θ<θ<θの条件
で薄膜1に照射されると、入射X線2は薄膜1を透過
し、基板3の表面に到達する。
FIG. 1 is a schematic sectional view showing the relative positions of an incident and reflected X-ray, a substrate on which a thin film is formed, and a detector for explaining an embodiment of the present invention. In this drawing, the angle of refraction is not shown for convenience of explanation. As shown in FIG. 1, the critical angle of total reflection of the substrate 3 is θ 0 , the critical angle of total reflection of the thin film 1 is θ 1 , the incident angle of X-rays is θ X, and the incident angle of the incident X-rays 2 is theta X is, when irradiated to the thin film 1 under the condition of θ 1 <θ X <θ 0 , the incident X-ray 2 is transmitted through the film 1, to reach the surface of the substrate 3.

この基板3で全反射された出所X線5は、検出器4の
取り出し角度θがθ<θ<θのとき、最も強く
検出することが出来るという知見を得た。なお、このと
きの検出器4の取り出し角度θは前述のX線の入射角
度をθと等しい角度に設定しておいた。
It has been found that the source X-ray 5 totally reflected by the substrate 3 can be detected most strongly when the take-out angle θ 2 of the detector 4 is θ 120 . Incidentally, take-off angle theta 2 of the detectors 4 in this case has been set the incident angle of the aforementioned X-ray at an angle equal to theta X.

ここで、例えば、薄膜1の膜さをdとすると、入射及
び出所X線2透過距離1/2は、 1=2d/sinθ となる。例えば、θ=2mrad、d=100Åとすると、1
=10μmとなる。もし、仮りに、薄膜3がSiO2であると
すると、この密度が2.3g/cm3、X線質量吸収係数がほぼ
100cm2/gであるので、入射X線の強度I0と検出される出
所X線強度Iの比は、 I/I0=e×p(−100×2.3×10/10000)=0.79 程度となる。また、従来、行なわれていた場合では、検
出器4の取り出し角度θが45゜程度とすると、この強
化比I/I0が0.996となり、強度変化が誤差程度になり、
膜厚を評価することは難しい。これに比べ前述の全反射
を用いた本実施例では、薄膜の膜厚を評価するのに十分
な強度減衰が得られる。
Here, for example, when a film of the thin film 1 is d, the incident and source X-ray 2 transmission distance 1/2 becomes 1 = 2d / sin [theta X. For example, if θ X = 2 mrad and d = 100 °, 1
= 10 μm. If the thin film 3 is SiO 2 , the density is 2.3 g / cm 3 and the X-ray mass absorption coefficient is almost
Since it is 100 cm 2 / g, the ratio of the intensity X 0 of the incident X-ray to the intensity X of the source X-ray detected is I / I 0 = e × p (−100 × 2.3 × 10/10000) = 0.79. Become. Conventionally, when the take-out angle θ 2 of the detector 4 is set to about 45 °, the enhancement ratio I / I 0 becomes 0.996, and the intensity change becomes about an error.
It is difficult to evaluate the film thickness. On the other hand, in the present embodiment using the above-described total reflection, sufficient intensity attenuation for evaluating the thickness of the thin film can be obtained.

また、これらX線発生器及び検出器の取付けは、公知
の取付け手段を用い、X線防護用チャンバ外からリモー
トコントロールで各々の角度を調節出来るようにすれば
容易に実現出来る。
Further, the mounting of these X-ray generators and detectors can be easily realized by using known mounting means and allowing the respective angles to be adjusted by remote control from outside the X-ray protection chamber.

〔発明の効果〕〔The invention's effect〕

以上説明したように本発明は、薄く、その密度が小さ
く、かつ質量吸収係数の小さな薄膜の膜厚を測定する際
に、基板と薄膜のX線全反射臨界角度との中間の角度
で、基板の照射点に対して対称的にX線発生器と検出器
を配置することによって、入射X線と出所X線の強度差
が大きく得られるので、膜厚の測定を正確に測定出来る
X線膜厚計が得られるという効果がある。
As described above, the present invention provides a method for measuring the thickness of a thin film having a small thickness, a small density, and a small mass absorption coefficient, at an angle intermediate between the substrate and the X-ray total reflection critical angle of the thin film. By arranging the X-ray generator and detector symmetrically with respect to the irradiation point, a large difference in the intensity between the incident X-ray and the source X-ray can be obtained, so that the X-ray film can accurately measure the film thickness. There is an effect that a thickness gauge can be obtained.

【図面の簡単な説明】[Brief description of the drawings]

第1図は本発明の一実施例を説明するための入射、反射
X線と薄膜が形成された基板及び検出器との相対位置を
示す模式断面図である。 1……薄膜、2……入射X線、3……基板、4……検出
器、5……出所X線。
FIG. 1 is a schematic sectional view showing the relative positions of an incident and reflected X-ray, a substrate on which a thin film is formed, and a detector for explaining an embodiment of the present invention. 1 ... thin film, 2 ... incident X-ray, 3 ... substrate, 4 ... detector, 5 ... source X-ray.

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6,DB名) G01B 15/00 - 15/06 G01N 23/00 - 23/227──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. 6 , DB name) G01B 15/00-15/06 G01N 23/00-23/227

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】X線の全反射臨界角度θをもつ基板の上
に全反射臨界角度θをもつとともにこのθが前記θ
より小さい薄膜が形成されたその膜厚を測定するX線
膜厚計において、X線の入射角度θ及び前記基板より
反射するX線を検知する取出し角度θをθ<θ
θ<θに設定する手段を備えることを特徴とするX
線膜厚計
1. A The theta 1 with with a total reflection critical angle theta 1 on a substrate having a total reflection critical angle theta 0 of X-ray is the theta
In an X-ray thickness meter for measuring the thickness of a thin film smaller than 0 , the incident angle θ X of X-rays and the extraction angle θ 2 for detecting X-rays reflected from the substrate are defined as θ 1X =
X provided with means for setting θ 20
Wire thickness gauge
JP9455489A 1989-04-13 1989-04-13 X-ray thickness gauge Expired - Fee Related JP2780324B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9455489A JP2780324B2 (en) 1989-04-13 1989-04-13 X-ray thickness gauge

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9455489A JP2780324B2 (en) 1989-04-13 1989-04-13 X-ray thickness gauge

Publications (2)

Publication Number Publication Date
JPH02271212A JPH02271212A (en) 1990-11-06
JP2780324B2 true JP2780324B2 (en) 1998-07-30

Family

ID=14113536

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9455489A Expired - Fee Related JP2780324B2 (en) 1989-04-13 1989-04-13 X-ray thickness gauge

Country Status (1)

Country Link
JP (1) JP2780324B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6171940B2 (en) * 2014-01-07 2017-08-02 富士通株式会社 X-ray analysis method and X-ray analysis apparatus

Also Published As

Publication number Publication date
JPH02271212A (en) 1990-11-06

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