JP2756749B2 - Manufacturing method of moisture sensitive element - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a capacitance type moisture sensitive element using an organic polymer resin material as a moisture sensitive film, and more particularly to a method of forming a moisture sensitive film.

[0002]

2. Description of the Related Art FIG. 3 is a cross-sectional view of a process for explaining a method of forming a moisture-sensitive film as a method of manufacturing a moisture-sensitive element of this type which has been conventionally proposed. In FIG.
As shown in FIG. 1A, after a lower electrode 2 is formed on a substrate 1, a solution of a polymer material is applied on the lower electrode 2, and a heat treatment is performed to form a moisture-sensitive film 3. Next, as shown in FIG. 3B, a resist is applied on the moisture-sensitive film 3 to form a resist pattern 4, and then, as shown in FIG. 3 is etched by an oxygen plasma method to form fine etching. Next, as shown in FIG. 3 (d), the resist 4 remaining on the moisture-sensitive film 3 was removed with a stripper to produce a moisture-sensitive element having a patterned moisture-sensitive film 3 '. Incidentally, a method for manufacturing this kind of moisture-sensitive element has been proposed, for example, in Japanese Patent Application Laid-Open No. 59-204750. As the mask, a metal deposition film, a metal plate mask, or the like has been used.

[0003]

However, the moisture-sensitive element thus constructed uses a resist and a stripper when the moisture-sensitive film 3 is finely processed to form the moisture-sensitive film 3 '. Therefore, there were problems such as contamination of the surface of the moisture-sensitive film 3 and deterioration of the moisture-sensitive film 3 due to the organic solvent. Further, in the method using a resist, the slope of the moisture-sensitive film formed by etching is steep, and it is difficult to cover a step portion with an electrode having good coverage, and the step portion may be disconnected. At the same time, there is a problem that the fine processing step becomes complicated and productivity is lowered. In addition, when a metal plate mask is used, since it does not have a light-transmitting property, it is difficult to finely align patterns.
It was difficult to align the fine opening with the moisture-sensitive film and make the opening with high accuracy.

Accordingly, the present invention has been made to solve the above-mentioned conventional problems, and an object of the present invention is to enable formation of a clean and processed moisture-sensitive film without contamination and deterioration of the moisture-sensitive film. Another object of the present invention is to provide a method of manufacturing a moisture-sensitive element in which the process of forming the moisture-sensitive film can be obtained with a simple process with high productivity.

[0005]

In order to achieve the above object, the present invention provides a method for heat-treating a polymer resin thin film formed on a substrate to form a moisture-sensitive film, and then forming an electrode terminal on the substrate. The moisture-sensitive film in the formation region is patterned by dry etching using a translucent mask.

[0006]

The moisture-sensitive film of the present invention is formed by patterning without contacting an etching member or the like. Further, by this pattern processing, the etched end portion of the electrode terminal forming region is formed to have a smooth curvature on the surface. Also, there is no need to remove the resist,
There is no deterioration of the moisture-sensitive film, the process is simple, and the pattern alignment can be performed easily while looking at the lower pattern through the mask.

[0007]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a sectional view of a process for explaining one embodiment of a method for manufacturing a moisture-sensitive element according to the present invention. In FIG. 1, first, as shown in FIG. 1A, for example, Pt is formed on an electrode forming surface of a substrate 11 having a thickness of about 0.5 mm made of an insulator such as non-alkali glass or quartz or a semiconductor such as silicon. , Au, Nb / Pt, Cr / Pt or T
A metal layer composed of at least one layer such as i / Pt is deposited to a thickness of about 500 to 1 μm by vapor deposition or sputtering, and is patterned to form a lower electrode 12, an electrode connection terminal 12a (not shown) and an upper electrode. Forming connection terminals 14a.

Next, PMMA and cross-linked PMM are formed over the entire area of the substrate 11 on which the lower electrode 12, the electrode connection terminals 12a and the upper electrode connection terminals 14a are formed.
A, a polymer resin material such as polyimide, polysulfone, or polyethersulfone is applied by spin coating or dipping, heated, and dried to form a moisture-sensitive film 13 having a thickness of about 1 to 10 μm.

Next, the moisture-sensitive film 13 thus formed is formed.
As shown in FIG. 1B, a translucent mask 16 made of, for example, non-alkali glass, quartz, or sapphire and having an opening at the electrode terminal forming portion is formed on the moisture-sensitive film 13.
And dry etching is performed from above the substrate 11 in the direction of arrow A in the direction of arrow A to remove the moisture-sensitive film 13 in the electrode connection terminal forming region, and the lower electrode connection terminal 1 is formed.
2a (not shown) and the upper electrode connection terminal 14a are exposed. Thereby, the etching end portion 1 of the moisture-sensitive film 13 is formed.
3a is formed with a smooth curvature on the surface. Here, the conditions for this dry etching are as follows:
₂ , Ar, CF ₄ , etc., used alone or in combination,
The pressure is 0.1 to several Torr, and the high frequency output is 100 to
It went at 500W.

Next, after the translucent mask 16 on the moisture-sensitive film 13 is removed, as shown in FIG. 1C, a connection for the upper electrode is made from the upper surface of the end of the moisture-sensitive film 13 via the etching end 13a. Cr, Pd, Nb, Mo, over the main surface of the terminal 14a.
Ta, Ti, TiW, NiCr, Nb / Pt, Cr / P
A metal layer having high adhesion to the material of the moisture-sensitive film 13 such as t or Ti / Pt is formed by vapor deposition or sputtering.
The metal film 15 is formed by applying a thickness of about 0 ° to 1 μm and performing patterning.

Next, as shown in FIG. 1D, corrosion resistance and moisture permeability of Au, Cr, Pt or Pd are formed on the moisture-sensitive film 13 including the metal film 15 formed on one end of the moisture-sensitive film 13. High metal by vapor deposition or sputtering.
An upper electrode 14 is formed by applying a pattern having a thickness of about 1000 ° and performing patterning. Thereby, as shown in the plan view of FIG. 2, one end of the metal film 15 is formed on the main surface of the connection terminal 14a for the upper electrode, and the other end of the metal film 15 formed on one end of the moisture sensitive film 13 is formed. Upper electrode 14 on side surface
Are formed in contact with each other. FIG.
(D) shows a cross section taken along line AA 'of FIG.

According to such a method, when the moisture-sensitive film 13 is dry-etched, the use of the translucent mask 16 makes it extremely easy to align the substrate 11 with the reference point. A plurality of wafers can be processed at a time with high positional accuracy, and productivity can be improved.

According to such a method, the moisture-sensitive film 1
By not using a photoresist for the pattern processing of No. 3, there is no contact with the resist solution of the moisture-sensitive film 13 and the stripping solution of the moisture-sensitive film 13 and no contact with dust and the like accompanying the processing, so that the moisture-sensitive film 13 having a clean surface can be formed. can get.

Further, according to such a method, the moisture sensitive film 1
3 is formed with a smooth curvature on the surface, so that the metal film 15 is formed in close contact with the curved surface of the etched end 13a of the moisture-sensitive film 13, and the step coverage is improved. And the occurrence of open defects and the like is eliminated. In other words, in the etching with the photoresist, since the step portion of the polymer is sharp, the metal of the step portion of the polymer is easily thinned, and disconnection is apt to occur at the step portion of the polymer. In the mask etching, the etching gas flows under the mask, and the polymer step portion is formed gently.

According to such a method, the metal film 1
5 has good adhesion to the moisture-sensitive film 13,
The adhesion near the etched end 13a of the moisture-sensitive film is improved, and the strength can be improved, so that peeling or the like does not occur.

[0016]

As described above, according to the manufacturing method of the present invention, after the polymer resin thin film formed on the substrate is heat-treated to form a moisture-sensitive film, the electrode terminal forming region on the substrate is formed. By performing pattern processing on the moisture-sensitive film by dry etching using a translucent mask, contamination of the surface of the moisture-sensitive film by the conventional resist solution and stripping solution of the moisture-sensitive film, generation of dust due to processing, and Since the deterioration of the moisture sensitive film due to the organic solvent is completely eliminated, a moisture sensitive element having high quality and high reliability can be obtained. In addition, by using a translucent mask, pattern alignment is easy. In addition, since the steps of applying the resist and removing the resist are not required, the steps can be simplified and the productivity can be improved. Further, according to the manufacturing method of the present invention, the moisture-sensitive film is formed such that the etched end portion of the electrode terminal forming region has a smooth curvature on the surface, and therefore, the upper electrode for the upper electrode formed on the substrate is formed. Since the metal film formed on the upper electrode on the moisture sensitive film from the connection terminal is formed in close contact with the etched end of the moisture sensitive film, the connectivity between the upper electrode and the upper electrode connection terminal is improved, This has an extremely excellent effect that a moisture-sensitive element having high quality and high reliability can be obtained.

[Brief description of the drawings]

FIG. 1 is a sectional view of a manufacturing process for explaining an embodiment of a method for manufacturing a moisture-sensitive element according to the present invention.

FIG. 2 is a plan view showing a configuration of a moisture-sensitive element formed by the manufacturing process of FIG.

FIG. 3 is a cross-sectional view of a manufacturing process for explaining a conventional method for manufacturing a moisture-sensitive element.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Substrate 12 Lower electrode 12a Connection terminal for lower electrodes 13 Moisture sensitive film 13a Etched edge 14 Upper electrode 14a Connection terminal for upper electrode 15 Metal film 16 Translucent mask

Claims (2)

(57) [Claims] A moisture-sensitive element comprising a lower electrode, a moisture-sensitive film made of an organic polymer resin material, and a moisture-permeable upper electrode sequentially laminated on a substrate, wherein the polymer resin thin film formed on the substrate is heat-treated. Forming a moisture-sensitive film, and then patterning the moisture-sensitive film in the electrode terminal formation region on the substrate by dry etching using a translucent mask. 2. The method for manufacturing a moisture-sensitive element according to claim 1, wherein the connection terminal of the upper electrode is formed so as to extend to below the dry-etched moisture-sensitive film.