JP2753119B2 - Semiconductor device assembly process management system - Google Patents

Description

Description: Object of the Invention (Industrial Application Field) The present invention relates to a semiconductor device assembly process management system, and more particularly to a management system used for efficient operation of equipment. is there.

(Prior Art) A conventional semiconductor device assembling process will be described with reference to FIG. In the figure, 1 is a host computer, 2 is a block computer, 3 is a line computer, 4 is an assembly line, 5
Denotes a mounter (mounting device), 6 denotes a bonder (bonding device), 7 denotes a molding device, 8 denotes an automatic transfer device, 9 denotes an assembling device, and 10 denotes a signal flow to another process.

(A) That is, the production capacity of each of the mounting, bonding, and molding devices in the conventional semiconductor assembly process depends on, for example, the chip size of the product and the yield of the number of chips formed on one wafer in the mounter 5 and the number of lots to be produced. In the case of the bonder 6, it varies depending on the number of wires to be bonded, and in the case of the molding apparatus 7, the value varies depending on the shape and size of the envelope. Particularly, in the bonder 6 and the molding apparatus 7, since the production capacity is significantly changed due to the difference in the product type, the products are grouped by the type having the same envelope and the number of bonding wires.
For each group, a group (line) 4 of a plurality of bonders 6 and a molding device 7 corresponding to the production capacity of one mounter 5 is formed, and a product is transported between the device groups by a transport device 8. The device group is collectively managed by a line computer 3, a plurality of line computers 3 are managed, and a block computer 2 which performs production management of each assembly line, and a host computer using a production pipe to which the block computer 2 is connected. 1 is managed by a computer system composed of The computer system prepares a production plan for the relevant day by the host computer 1 and sends it to the block computer 2. The block computer 2 groups products based on the production plan and performs setup work at each device of the device group 4. The order of supplying the products is determined so as to maximize the operation rate of each device in consideration of time, and instructions are given to each line computer 3. In each line computer, the setup change work of each device in the device group is performed. The production is performed by determining the order of transporting the products between the respective device groups or the devices within the group where the time is the shortest and the production efficiency is the maximum.

(B) On the other hand, quality control of products completed in conventional individual semiconductor assembly processes is often judged by humans.
Inspection is performed on samples extracted from products produced in the mounting (die bonding) process, wire bonding process, resin molding process, etc. by random sampling or system sampling by machine.
Based on this inspection, the operator determines good or bad from experience, data, and standards. For a defective sample, the production apparatus is stopped to prevent the production of a defective product, and readjustment is performed to resume production. This example is shown in FIG. In this figure, the device A may be considered as a mounting device, a bonding device or a molding device, or a combination of these devices.

(C) In some cases, a computer-based system is used for the purpose of eliminating individual differences among humans and eliminating mistakes made by humans. This example is shown in FIG.

(Problems to be Solved by the Invention) In the system of the above-mentioned conventional item (a), each device group 4 has the maximum production efficiency for the type that has become the reference for the capacity calculation, but the efficiency is reduced for other types. There was a problem of falling off. For example, in a line in which a device group 4 is formed by calculating the performance of a product group of product type a,
In the production of the type a, the maximum production efficiency is exhibited. (FIGS. 7 and 8) That is, the product mounted by the mounter 5 is evenly distributed to all the bonders 6 without stagnation, and is discharged from the molding apparatus. Therefore, when production is being performed continuously, there is no device that does not participate in production. However, when the product group produces a type b different from the type a in this line, the number of bonding wires is smaller than the type a, and when the production capacity of the bonder is increased, the line is changed as shown in FIGS. 9 and 10. A bonder 6a that has surplus capacity inside and does not participate in production comes out. In FIG. 10, reference numeral 11 denotes the surplus bonder capacity. Conversely, when the number of bonding wires of the type b is larger than that of the type a and the production capacity of the bonder is low, the bonder in the line becomes insufficient in capacity (6b) as shown in FIGS. This causes the molding machine to stop or the product to stay. In FIG. 12, reference numeral 12 denotes a surplus mounter capacity, and 13 denotes a surplus mold. Similarly, if the conditions for the products to be produced also change for the mounter and the molding device, the production capacity balance with the device group in other processes will be disrupted, and as in the case of the bonder, product retention and production capacity surplus will occur. Will be. However, in the conventional system shown in FIG. 6, since the line of the devices is basically used, it is not possible to change the configuration of each device group according to the type of product to be produced. As a whole, in each of the mount, bonding, and mold device groups, a plurality of inactive devices exist at the same time. In particular, in multi-product small-quantity production, there is a drawback that the types and quantities vary greatly, and the problems shown in the above examples occur frequently.

In the quality control of individual products based only on the human system in the above item (b), since the most important quality judgment and the processing judgment based on the judgment are performed by a specific person, there is a variation in judgments caused by individual differences among humans, especially the operator. Judgment by skill level and speed of action vary. For this reason,
It is highly likely to draw wrong conclusions, the quality itself includes variations due to individual differences, the adjustment work time of the equipment is very uneven, the reliability of the adjustment work is uneven, the personal work for all work Problems such as difficulties in management and the like are included due to differences.

Further, in the case of the computer-assisted system support in the above item (c), the above-mentioned problem relating to the judgment system is only solved, and there are still variations in device adjustment time and certainty. Communication with humans becomes difficult, and management is likely to be complicated. Furthermore, the use of a computer makes the criterion stricter and the quality level higher. On the other hand, it is difficult to take into account individual differences of the equipment and the operator work becomes difficult, and a network system using a computer is constructed. In addition, there is a problem that it is difficult to spread the method to existing processes, and that networking is very costly, so that it is difficult to construct a system limited only to quality control.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problem (a), and minimizes the influence of production quality and quantity fluctuations in a semiconductor assembly process to obtain the maximum production quantity. It was made for the purpose of.

[Constitution of the Invention] (Means and Actions for Solving the Problems) The present invention provides an apparatus for each of semiconductor mounting, bonding, and molding processes, a product buffer between the processes, and a product input to each of the processes. In a semiconductor device assembling process management system having a flow control means for products such as discharge, transfer, and the like, and a computer for controlling the production of the devices in the respective processes, the production capacity of the devices in the respective processes with respect to the product type and the product Calculate with buffer capacity and production plan,
Determine at least the production type or the number of devices for each process so that the operation rate of each device in each process is maximized and the in-process residence time of the product is minimized, and the product is determined in real time. And a control means for giving instructions for loading and transporting the semiconductor device, and for giving instructions for setting up each device in each process.

That is, according to the present invention, the control unit controls the mount group, the bonding group,
Calculate the optimal number of components for each mold group, and configure the line from mounting to bonding and molding process. This is a semiconductor assembly process management system that manages so that stagnation is always minimized. Note that the product buffer serves to temporarily store the products when the products are stored, for example, when the mount device has produced too many products, and to send the products to the bonding device as appropriate. One of the objects of the present invention is to minimize product stagnation in the product buffer as described above and to increase production efficiency as much as possible.

(Embodiment) An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a block diagram of the semiconductor device assembling process control system of the embodiment, which is an example in the case of corresponding to that of FIG. Are omitted, and the characteristic points will be described. In FIG. 1, 14 is a mounter group management computer, 15 is a bonder group management computer, 16 is a mold group management computer, 17
Is an automatic transport management computer, 18 is a mounter group, 19 is a bonder group, 20 is a mold group, 21 is an automatic transport device group, 26 is a product buffer in the bonding process, and 27 is a product buffer in the mold process.

This system comprises a host computer 1, an assembly process block computer 2, a mounter group 18 including a plurality of mounters 5, and a computer 14 for managing the mounter group.
A bonder group 19 including a plurality of bonders 6 and a product buffer unit 26, a computer 15 for managing the bonder group, a molding device group 20 including a plurality of molding devices 7 and a product buffer unit 27, and a molding device group. Computers to manage 16
And an automatic transfer device group 21 including an automatic transfer device 18 for transferring products between the above-described steps, and a computer 17 for managing the automatic transfer device group. The host computer 1 creates a production plan for a certain period of time for the assembly process, and instructs the block computer 2 to do so. The block computer 2 takes into consideration the product type and lot size included in the production plan, the time required for the type switching work of each device, the state of each device, and the like, and the capabilities of the mounter 5, the bonder 6, and the molding device 7 Determine the configurations of the mounter 5, the bonder 6, and the molding device 7 and the order of supplying the products so that the difference is within the capacity of the product buffer unit between the processes and the number of devices that do not participate in production in the assembly process is minimized. Instruct each group management computer. Here, the capability of the mounter 5 is determined by the average number of non-defective chips in one wafer, the capability of the bonder 6 is determined by the number of bonding wires required for bonding one chip, and the capability of the molding device 7 is determined by the size of the envelope. Each group management computer inputs and conveys a product to each device according to a schedule. In this way, the production is performed while flexibly changing the configuration of each group and the order of introducing the products every fixed time or every time the type is changed.

FIG. 2 shows an assembly process line constructed according to the production plan in the configuration of FIG. 1, and FIG. 3 is a comparison diagram of the production capacity of each process of this line.
Reference numeral 23 denotes the number of products produced for the type d, 24 denotes a line configured for the type a, and 25 denotes a line configured for the type d. In one line 24, “5c”, “6c”, “7
"5", "6", and "7" of "c" indicate a mounter, a bonder, and a molding device, respectively, and the suffix "c" indicates a type. For example, the type a may be considered. The same applies to “5d”, “6d”, and “7d” in 25, and the suffix “d” indicates another type, for example, the type b. Here, the switching from the line 24 to the line 25 is determined in real time (so as not to stop the line). Second
As shown in FIG. 3, it can be seen from FIG. 3 that the mounter, the bonder, and the molding apparatus are all averaged to obtain the maximum operation rate.

According to the above-described embodiment, it is not necessary to form a fixed group of devices based on a specific product type, and a temporary device group 24 or 25 is formed according to a product type to be produced, and the device group is changed according to a change in the product type. Can be reconfigured.
As shown in the prior art example, when different types are flown into the devices grouped so that the maximum operation rate is achieved with the types shown in FIGS. 7 and 8, in the case of FIGS. In the case of FIGS. 11 and 12, the capacity of the bonder is insufficient. When there are a plurality of such groups and a mixture of varieties having the states shown in FIGS. 9 to 12 is mixed and flown, it is possible to avoid simultaneous occurrence of a phenomenon in which one side has insufficient bonders and the other side has excess bonders. Absent. However, in the system according to the present embodiment, when there is excess bonder, the surplus bonder is separated from the device group, and an operation of incorporating the bonder into a device group having insufficient capacity of another bonder is performed according to an instruction of the block computer 2. According to this instruction, the automatic transport device transports the product while distinguishing the group and each device. In this way, since the computer determines the number of devices in the device group, the order of input of the product type, and the transfer instruction, complicated operations by humans are not required, and finely-divided devices can be distributed. Further, by providing the product buffers 26, 27, etc. between the processes, the difference in performance of each device is absorbed, so that the stagnation of the products in the processes can be minimized, and the construction period can be shortened.

Next, it is easy to introduce the quality control of the products completed in the conventional individual semiconductor assembly process (mounting process or bonding process or resin molding process) to eliminate the variation due to individual differences between human system and device system, and to introduce into existing processes. A semiconductor assembly device with a quality control function for the purpose of shortening the operation time of the operator, stabilizing the quality at a high level standard, and reducing the quality control cost will be described. FIG. 4 shows a configuration example of the device 40. In the figure, reference numeral 41 denotes a semiconductor assembly function unit, which corresponds to a mounting device, a wire bonding device, a mounting device, or a combination thereof. 42 is a reference data storage unit for analysis and evaluation for a mounting device, a bonding device and a molding device, 43 is a device control function unit for quality control, 44 is an analysis, evaluation and judgment function unit, and 45 is a mounting device or a bonding device or a mold. An operator's work guide data (in the case of failure) storage unit for the device, a work guide output function unit 45, an inspection result input function unit 47, and an analysis and evaluation result output function unit 48.

FIG. 5 is a specific example of the apparatus shown in FIG. A keyboard 51 corresponds to the function unit 47. 52 is a printer, and a functional unit 46
And print 48. Reference numeral 53 denotes a CRT display for displaying the function units 46 and 48. 54 is a CPU, and functional units 41 and 43
And 44 are controlled. Reference numeral 55 denotes a device operation unit, which corresponds to the function unit 41. Reference numeral 56 denotes a floppy disk which stores the storage contents of the storage units 42 and 45 and the correction value of the individual difference for each device (mount, bonding, mold). Reference numeral 57 denotes a quality control RAM disk which stores data in the storage units 42 and 45 from the floppy disk 56. Reference numeral 58 denotes a device control RAM disk, which stores data for operating the function unit 41. Disc 56
Is an external memory, and the disks 57 and 58 are computer internal memories.

In the configuration as described above, first, the quality inspection evaluation reference data of the storage unit 42 relating to the product to be produced from the floppy disk 56, the operator guidance data at the time of the quality defect determination of the storage unit 45, and the function unit 41 Data for correcting the individual difference of the device 55 itself is stored in the RAM disk 57. A sample sampled from a product produced by this apparatus is inspected by a human for items determined, and the result is input from the apparatus keyboard 51. The CPU 54 analyzes the result using the evaluation reference data and the like previously input, and determines whether the product is good or bad. From this result and the guidance data on the disk 57, the CPU 54 determines a guidance item for the operator. Inspection results and guidance items are output as characters from the printer 52 and recorded. When a defect is determined, the operator guidance is also given to the CRT as the display device 53, and the operation of the device 55 is automatically stopped in order to prevent the production of defective products. The operator performs appropriate processing on the device 55 according to the guidance, and resumes production.

FIGS. 3 and 4 show a semiconductor product assembly function unit (41), a quality inspection result input function unit (47), and a defective product determination function unit (42, 44) using reference data. , Quality analysis / judgment and analysis result output functions (44,48), and a function part (44,45,46) for giving adjustment instructions with the work guide to the operator to prevent defects, and to prevent the production of defective products And an automatic production stop function section (41, 43).

In this way, since the computer performs quality evaluation and judgment from standardized data, it is possible to eliminate variations in time and content due to human systems from conclusions, eliminate false conclusions, and make adjustment work. With respect to the above, since the computer outputs variations due to individual differences in equipment, the level of skill of operators, and the like as work guidance from past data, an operator of any level can perform optimal processing for each individual equipment. In addition, since most of the things that humans have to think about are done by the computer from past data, the work time can be reduced, the standardized stable quality can be guaranteed with little variation, and Because it has functional parts, it can be easily introduced into existing assembly sites, the cost can be kept low because there is no need for system construction, and it can be developed according to the required quality level because it is individual, and the range of cost selection is also possible The effect of widening can be expected.

Note that the present invention is not limited to the embodiments, and various applications are possible. For example, in the present invention, the total number of bonding wires of a product to be mounted within a certain period is the sum of the capacity of a product buffer before bonding and the number of bonding wires bonded by a bonder within a certain period, that is, the production capacity of the bonding process. It is preferable to determine the product type to be input to the mounter, the input order, and the number of devices in each process so as not to exceed. Also, with respect to the production capacity of the molding apparatus which varies according to the type of the envelope by the mold, the product types to be put into the mounter, the order of the loading, and the It is preferable to determine the number of devices in each process. Further, it is preferable to indicate each device and the type of product to be produced in accordance with a predetermined number of devices in each process. Further, according to a predetermined number of apparatuses in each process, it is preferable that the products produced by the mounter are transported to the bonder while the products produced by the bonder are automatically distinguished to the molding apparatus. In addition, a product buffer is provided between each step of mounting, bonding and molding, and the order of inputting the products into each of the above-described steps is adjusted so that a product can be continuously produced while absorbing a difference in production capacity generated between the respective steps. It is better to decide.

[Effects of the Invention] As described above, according to the present invention, advantages such as the ability to minimize the influence of variations in production types and quantities in the process of assembling a semiconductor device and to obtain the maximum production quantity can be obtained. Have

[Brief description of the drawings]

FIG. 1 is a block diagram of one embodiment of the present invention, FIGS. 2 and 3 are explanatory diagrams of the operation of the same configuration, FIGS. 4 and 5 are block diagrams of a semiconductor assembly device with quality control, FIG. FIG. 12 to FIG. 12 are explanatory diagrams of a conventional semiconductor assembly process management system, and FIGS. 13 and 14 are explanatory diagrams of a good / defective product management system using a conventional semiconductor assembly device. 1 ... Host computer, 2 ... Block computer, 5 ... Mounter, 5c ... Mounter producing type a, 5d ... Mounter producing type d, 6 ... Bonder, 6a ... Surplus Bonder, 6b ... Insufficient bonder, 6c ... Bonder producing type a, 6d ... Bonder producing type b, 7 ... Molding device, 7c ... Molding device producing type a , 7d: a molding apparatus that also produces the type b; 8, an automatic transfer apparatus; 14, a mounter group management computer; 15, a bonder group management computer;
… Mold group management computer, 17… Automatic conveyance management computer, 18… Mounter group, 19 …… Bonder group, 20…
... Mold group, 21 ... Automatic transfer device group, 24 ... Line configured according to type a, 25 ... Line configured according to type b, 26 ... Product buffer in bonding process, 27 ... Product buffer in the molding process.

 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Masaaki Shida 25-1 Ekimae Honcho, Kawasaki-ku, Kawasaki-shi, Kanagawa Prefecture Toshiba Microelectronics Corporation

Claims (6)

(57) [Claims] An apparatus for mounting, bonding, and molding semiconductors; a product buffer between the steps; a product flow control unit for inputting, discharging, and transporting products to and from each of the steps; In a semiconductor device assembling process management system having a computer for performing production control of a process device, the production capacity of the device in each process, the product buffer capacity, and the production plan for a product type are calculated and calculated.
Determine at least the production type or the number of devices for each process so that the operation rate of each device in each process is maximized and the in-process residence time of the product is minimized, and the product is determined in real time. A semiconductor device assembling process management system, comprising: control means for issuing instructions for loading and transporting the semiconductor device, and for instructing a setup change to each device in each process. 2. The method according to claim 1, wherein the total number of bonding wires of a product to be mounted within a predetermined period is determined by the capacity of a product buffer before bonding and the number of bonding wires to be bonded by a bonder within a predetermined period. (Production capacity of the bonding process) The semiconductor device assembling process management system wherein the product type to be put into the mounting device or the number of devices in each of the processes is determined so as not to exceed the sum. 3. The method according to claim 1, wherein the production capacity in the mounting and bonding steps is the same or balanced with respect to the production capacity of the molding apparatus, which varies according to the type of the envelope by the mold. A semiconductor device assembling process management system for determining a product type to be put into a mounting device or the number of devices in each of the processes. 4. The semiconductor device according to claim 1, wherein the number of devices in each process is determined in advance, and the type of product to be produced is specified according to the predetermined number of devices in each process. Equipment assembly process management system. 5. The method according to claim 1, wherein a product type is determined in advance, and a product produced by a mounting device is automatically transferred to a bonding device and a product produced by the device is automatically transferred to a molding device according to the product type. A semiconductor device assembly process management system characterized in that the semiconductor device is transported while being distinguished. 6. A method according to claim 1, wherein a product buffer is provided between each of the mounting, bonding, and molding steps, and the production of products is continuously performed while absorbing a difference in production capacity generated between the respective steps. An assembling process management system for a semiconductor device, wherein the order in which products are supplied to the respective steps is determined as much as possible.