JP2751241B2 - Manufacturing method of glass cloth for printed circuit board - Google Patents
Manufacturing method of glass cloth for printed circuit boardInfo
- Publication number
- JP2751241B2 JP2751241B2 JP63236577A JP23657788A JP2751241B2 JP 2751241 B2 JP2751241 B2 JP 2751241B2 JP 63236577 A JP63236577 A JP 63236577A JP 23657788 A JP23657788 A JP 23657788A JP 2751241 B2 JP2751241 B2 JP 2751241B2
- Authority
- JP
- Japan
- Prior art keywords
- glass cloth
- circuit board
- printed circuit
- glass
- cloth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004744 fabric Substances 0.000 title claims description 50
- 239000011521 glass Substances 0.000 title claims description 46
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 239000003365 glass fiber Substances 0.000 claims description 11
- 230000007062 hydrolysis Effects 0.000 claims description 6
- 238000006460 hydrolysis reaction Methods 0.000 claims description 6
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 description 14
- 238000005553 drilling Methods 0.000 description 7
- 238000001035 drying Methods 0.000 description 7
- 238000004381 surface treatment Methods 0.000 description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229910000077 silane Inorganic materials 0.000 description 5
- 239000012756 surface treatment agent Substances 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 3
- 238000006482 condensation reaction Methods 0.000 description 3
- 239000012779 reinforcing material Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 238000012812 general test Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- -1 tetraalkoxysilane Chemical class 0.000 description 1
- 239000005341 toughened glass Substances 0.000 description 1
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はプリント基板用ガラスクロスの製造方法に関
し、特にドリリング加工性に優れたプリント基板を提供
するガラスクロスの製造方法に関するものである。Description: TECHNICAL FIELD The present invention relates to a method for manufacturing a glass cloth for a printed circuit board, and more particularly to a method for manufacturing a glass cloth for providing a printed circuit board having excellent drilling workability.
コンピューターや電子機器、通信機等に使用されるプ
リント配線板には種々のものがあるが補強材としてガラ
スクロスを使用した基板がその優れた特性から主用され
ている。ガラスクロスを補強材としたプリント基板に機
械的特性、電気的特性、耐熱性、耐薬品性等の点で総合
的にみた場合、他種のプリント基板と比較してすぐれて
いるためにこの分野で主用されている。しかし、ガラス
クロスを補強材とするプリント基板も無機物であるガラ
ス繊維を補強材としているためにドリル加工性が悪いと
いう欠点がある。このことは以前からプリント基板業界
では問題とされていたが、最近特にドリル加工性の改良
に対する要望が強くなってきた。There are various types of printed wiring boards used for computers, electronic devices, communication devices and the like, and a substrate using glass cloth as a reinforcing material is mainly used because of its excellent characteristics. Comprehensively, in terms of mechanical properties, electrical properties, heat resistance, chemical resistance, etc., of printed boards using glass cloth as a reinforcement, they are superior to other types of printed boards, so this field It is mainly used in. However, a printed circuit board using a glass cloth as a reinforcing material also has a drawback that drill workability is poor because glass fiber, which is an inorganic material, is used as a reinforcing material. This has been a problem in the printed circuit board industry for a long time, but there has recently been a particularly strong demand for improved drillability.
これはプリント配線板の層密度多層化が進むにつれ、
回路の信頼度に対する要求がきびしくなり、その一つと
してドリル内壁粗さに対する要求も、更に一層平滑度の
良いものが要求されるようになってきている。又、プリ
ント配線板の高密度化、多層化が進んだことにより回路
の配線密度が大きくなり、IC、LSI等のチップが表面実
装されるようになった。その結果として、ドリル穴径の
小径化が進みドリル穴位置の低度の向上が必要となって
きている。This is due to the increasing multilayer density of printed wiring boards.
The demand for circuit reliability has become severe, and as one of the requirements, the drill inner wall roughness has been required to have even better smoothness. Further, as the density and multilayer structure of printed wiring boards have increased, the wiring density of circuits has increased, and chips such as ICs and LSIs have come to be surface-mounted. As a result, the diameter of the drill hole has been reduced, and it has become necessary to improve the position of the drill hole at a low level.
又、両面板等の汎用品の分野に於ては、低コスト化の
要求に対してドリル加工費の低減のため、ドリル加工時
の重ね枚数の増加が指向され、ドリル摩耗の少ない基材
の検討がはされている。以上のような理由からガラス基
材プリント基板のドリリング性改良が大きな問題となっ
てきている。In addition, in the field of general-purpose products such as double-sided boards, in order to reduce the cost of drilling in response to the demand for cost reduction, the number of laps during drilling has been increased, and the use of substrates with less drill wear has been promoted. Consideration is being given. For the above reasons, the improvement of the drilling property of a glass substrate printed circuit board has become a major problem.
これらの問題を解決するために各種の提案がなされて
いる。例えば特公昭63−5512に於ては、ガラスクロスを
テトラアルコキシシラン、トリアルコキシシラン、ジア
ルコキシシラン等のアルコキシシラン化合物を付着せし
めた状態で高温、長時間の加熱処理をおこなうことによ
り、ガラスクロスの機械的強度を低下せしめる方法が開
示されている。該処理されたガラスクロスを使用して常
法により作られたプリント基板は、従来のプリント基板
と比較してドリリング加工性が改良されることが示され
ている。Various proposals have been made to solve these problems. For example, in Japanese Patent Publication No. Sho 63-5512, a glass cloth is heated at a high temperature for a long time in a state where an alkoxysilane compound such as tetraalkoxysilane, trialkoxysilane, dialkoxysilane or the like is adhered to the glass cloth. Discloses a method for lowering the mechanical strength of a. It has been shown that a printed circuit board made by a conventional method using the treated glass cloth has improved drilling workability as compared with a conventional printed circuit board.
又、本出願人は先に特願昭63−192656に於いて、ガラ
スクロスを500℃〜800℃の高温で連続的に加熱処理する
ことにより、ガラスクロスの強度を低下せしめる方法を
出願している。In addition, the applicant of the present invention has previously filed in Japanese Patent Application No. 63-192656 an application for a method of reducing the strength of a glass cloth by continuously heating the glass cloth at a high temperature of 500 ° C to 800 ° C. I have.
特公昭63−5512によるとアルコキシシラン処理された
ガラスクロスを高温度で長時間加熱する方法がとられて
いる。例えば実施例では400℃、20時間の例が示されて
いる。この様な方法を工業的におこなうには、アルコキ
シシラン処理されたガラスクロスを鉄芯等に巻取り、バ
ッチ式で加熱することが必須となり、その結果、クロス
の巻かれた状態での巻厚方向での表面層、中間層、内
層、及び、クロスの巾方向で端部と中央部の間で熱履歴
が異なるため、ガラス繊維の強度低下の効果にバラツキ
が生ずる。According to JP-B-63-5512, a method is used in which an alkoxysilane-treated glass cloth is heated at a high temperature for a long time. For example, the embodiment shows an example of 400 ° C. for 20 hours. In order to carry out such a method industrially, it is necessary to wind an alkoxysilane-treated glass cloth around an iron core or the like and heat it in a batch system, and as a result, the thickness of the cloth in a wound state In the width direction of the surface layer, the intermediate layer, the inner layer, and the cloth in the direction, the heat history differs between the end portion and the center portion, so that the effect of reducing the strength of the glass fiber varies.
又、バッチ式の加熱工程をはさんでアルコキシシラン
処理と本来の表面処理剤による処理の２回の処理工程が
必要となり、作業能率及び経済性を大巾に低下させると
いう問題もある。In addition, two treatment steps, ie, an alkoxysilane treatment and a treatment with an original surface treatment agent, are required in between the batch-type heating step, and there is a problem that the working efficiency and the economic efficiency are greatly reduced.
特願昭63−192656の場合は連続式であるため、前記し
たような問題はないが、500℃〜800℃という高温を使用
するため、高温処理用の専有設備が必用になるという問
題がある。In the case of Japanese Patent Application No. 63-192656, there is no problem as described above since it is a continuous type, but there is a problem that a dedicated equipment for high-temperature processing is required because a high temperature of 500 ° C to 800 ° C is used. .
本願発明は上記したような問題点を解決し、ドリリン
グ加工性の優れたプリント基板を製造可能とするガラス
クロスを提供するものである。The present invention is to solve the above-mentioned problems and to provide a glass cloth capable of manufacturing a printed circuit board having excellent drilling workability.
本願発明は脱油処理されたガラスクロスをテトラアル
コキシシランの加水分解溶液で処理後100〜170℃の温度
で乾燥し、ガラスクロスを構成するガラス繊維の引張強
度を低下せしめ、連続してシランカップリング剤による
処理を行うことを特徴とするプリント基板用ガラスクロ
スの製造方法である。The invention of the present application is to treat the deoiled glass cloth with a hydrolysis solution of tetraalkoxysilane and then dry it at a temperature of 100 to 170 ° C. to lower the tensile strength of the glass fibers constituting the glass cloth, and to continuously remove the silane cup. A method for producing a glass cloth for a printed circuit board, characterized by performing a treatment with a ring agent.
通常の方法で脱油処理されたガラスクロスをテトラア
ルコキシシランの加水分解水溶液に浸漬するか、又は、
該水溶液をガラスクロスに散布して、加圧ローラー等で
絞液後乾燥させる。テトラアルコキシシランのアルコキ
シ基としてはメトキシ基、エトキシ基が使用される。テ
トラアルコキシシラン水溶液の濃度により強度低下の効
果は大きく変化するが、一般に0.01〜3.0重量％の範囲
が好ましい。乾燥は通常の乾燥条件で充分であり、乾燥
温度は100〜170℃の温度で乾燥速度、及びガラスクロス
の種類により適宜選択される。又、乾燥時間も20秒〜10
分の範囲で適宜選択される。The glass cloth that has been deoiled by a normal method is immersed in a hydrolyzed aqueous solution of tetraalkoxysilane, or
The aqueous solution is sprayed on a glass cloth, squeezed with a pressure roller or the like, and dried. As an alkoxy group of the tetraalkoxysilane, a methoxy group or an ethoxy group is used. The effect of decreasing the strength varies greatly depending on the concentration of the aqueous solution of tetraalkoxysilane, but is generally preferably in the range of 0.01 to 3.0% by weight. Drying under ordinary drying conditions is sufficient. The drying temperature is a temperature of 100 to 170 ° C. and is appropriately selected depending on the drying speed and the type of glass cloth. Also, the drying time is 20 seconds to 10
In the range of minutes.
テトラアルコキシシラン処理されたガラスクロスは、
引き続き連続して、通常の表面処理剤による表面処理を
行い、プリント基板用ガラスクロスとして供される。表
面処理剤としては、エポキシシラン等のシラン系の表面
処理剤が使用されるが、マトリックス樹脂の種類に応じ
て適宜選択される。本願発明のガラスクロスと製造方法
は、テトラアルコキシシラン処理と通常のシランカップ
リング剤による表面処理を連続して同一工程内で行うこ
とができるため、生産管理が容易であることおよび生産
効率を上げることができるという利点を有する。Glass cloth treated with tetraalkoxysilane is
Subsequently, surface treatment with a normal surface treatment agent is continuously performed to provide a glass cloth for a printed circuit board. As the surface treatment agent, a silane-based surface treatment agent such as epoxy silane is used, and is appropriately selected according to the type of the matrix resin. Since the glass cloth and the manufacturing method of the present invention can perform the tetraalkoxysilane treatment and the surface treatment with the usual silane coupling agent continuously in the same process, the production management is easy and the production efficiency is increased. It has the advantage of being able to.
本願発明のガラスクロスの製造方法において、テトラ
アルコキシシラン処理された状態でのガラスクロスの引
張強度は、脱油処理されていないもとのガラスクロスの
引張強度を100とすると、５〜15％に低下する。この値
はテトラアルコキシシランの濃度によって任意に選択す
ることができる。この値が低すぎると、後工程の表面処
理工程やプリプレグ工程での作業性に不都合が生じ、反
対に高すぎると効果の点で不十分となる。In the method for producing a glass cloth of the present invention, the tensile strength of the glass cloth in the state where the tetraalkoxysilane treatment has been performed is 5 to 15%, where the tensile strength of the original glass cloth which has not been deoiled is 100. descend. This value can be arbitrarily selected depending on the concentration of the tetraalkoxysilane. If this value is too low, the workability in the subsequent surface treatment step or prepreg step will be inconvenient, and if it is too high, the effect will be insufficient.
一般にガラスクロスの引張強度は、通常の加熱による
脱油処理により、もとの引張強度の20〜30％に低下する
がシラン系の表面処理剤による表面処理により40〜60％
に回復する。本願発明の場合も表面処理工程を通ること
により、10〜35％程度に回復する。In general, the tensile strength of glass cloth is reduced to 20 to 30% of the original tensile strength by oil removal treatment by normal heating, but 40 to 60% by surface treatment with a silane-based surface treatment agent.
To recover. Also in the case of the present invention, it is recovered to about 10 to 35% by passing through the surface treatment step.
ガラス繊維は１種の強化ガラスであり、板ガラス等と
比較して非常に大きな強度を有している。その強度はガ
ラス繊維が紡糸される際に、千数百度から瞬時に常温ま
で超急冷されて、表面に大きな圧縮応力が残留すること
に起因する。本願発明の脱油処理されたガラスクロスに
テトラアルコキシシランを処理することにより、大きな
強度低下がもたらされることは、ガラス繊維表面に付着
したテトラアルコキシシランの加水分解生成物であるテ
トラシラノールが三次元的に、且つ緻密に縮合すること
により、又その１部はガラス表面のOH基と縮合すること
により、ガラス表面に残留する圧縮応力を打ち消す大き
な引張応力を発生させるためと考えられる。従って強度
低下をもたらすための条件としては、テトラアルコキシ
シランの加水分解生成物であるテトラシラノールの三次
元縮合物がガラス繊維表面に形成されることが必要であ
る。そのためにはテトラアルコキシシランでガラスクロ
スを処理する際にアルコキシシランがほぼ完全に加水分
解されていることが重要であり、更にガラス繊維表面に
付着したテトラシラノールが三次元縮合反応を行うため
のエネルギーが必要である。乾燥温度を100℃以上とす
るのはこのためで、これより低い温度では縮合反応が不
十分となるため強度低下が起こりにくい。また、乾燥温
度を170℃より高くすると縮合反応のコントロールが難
しく必要以上に強度が低下してしまう。Glass fiber is one type of tempered glass, and has extremely large strength as compared with sheet glass or the like. The strength is due to the fact that when the glass fiber is spun, it is rapidly quenched from a few hundred degrees to an ordinary temperature, and a large compressive stress remains on the surface. Treating the deoiled glass cloth of the present invention with tetraalkoxysilane significantly reduces the strength because tetrasilanol, which is a hydrolysis product of tetraalkoxysilane attached to the glass fiber surface, is three-dimensional. It is considered that a large tensile stress that counteracts the compressive stress remaining on the glass surface is generated by specifically and densely condensing, and a part thereof condensing with the OH group on the glass surface. Therefore, as a condition for lowering the strength, it is necessary that a three-dimensional condensate of tetrasilanol, which is a hydrolysis product of tetraalkoxysilane, be formed on the surface of the glass fiber. For that purpose, it is important that the alkoxysilane is almost completely hydrolyzed when the glass cloth is treated with tetraalkoxysilane, and the energy required for the tetrasilanol attached to the surface of the glass fiber to undergo a three-dimensional condensation reaction. is required. This is the reason why the drying temperature is set to 100 ° C. or higher. At a lower temperature, the condensation reaction becomes insufficient, so that the strength hardly decreases. On the other hand, when the drying temperature is higher than 170 ° C., it is difficult to control the condensation reaction, and the strength is reduced more than necessary.
同様な理由から澱粉などのガラス繊維表面に付着して
いる集束剤などは、加熱による脱油処理により完全に除
去されていることが必要である。For the same reason, it is necessary that the sizing agent and the like adhering to the surface of glass fiber such as starch have been completely removed by a deoiling treatment by heating.
アルコキシシラン化合物としては、加水分解により４
個のシラノール基を有するようになるテトラアルコキシ
シランが効果的であり、トリアルコキシシラン、ジアル
コキシシランではそのような効果はみられない。As the alkoxysilane compound, 4
Tetraalkoxysilane having two silanol groups is effective, and trialkoxysilane and dialkoxysilane have no such effect.
又、テトラアルコキシシランにトリアルコキシシラ
ン、ジアルコキシシランをブレンドすることもシロキサ
ン結合による架橋密度が減少するために有効ではない。Also, blending a trialkoxysilane or a dialkoxysilane with a tetraalkoxysilane is not effective because the crosslink density due to the siloxane bond decreases.
アルコキシ基の種類としては、特に限定しないが、加
水分解が容易であるという点でメトキシ基、エトキシ基
が望ましい。The type of the alkoxy group is not particularly limited, but a methoxy group and an ethoxy group are preferable in that hydrolysis is easy.
本願発明による強度の低下したガラスクロスを基材と
して使用したプリント基板はガラスクロスが脆くなって
いるため、ドリル加工した場合にドリルに対する抵抗が
通常のガラスクロスを使用したプリント基板と比較して
小さい。従って、ドリルの摩耗も少なくなり又ドリル内
壁の粗さも平滑になる。又小径ドリルの場合のドリル先
端の逃げも小さいため穴位置精度も良くなる。A printed board using a glass cloth with reduced strength according to the present invention as a base material has a weak resistance to a drill when drilled as compared with a printed board using a normal glass cloth because the glass cloth is brittle. . Therefore, the wear of the drill is reduced and the roughness of the inner wall of the drill is also smoothed. Also, in the case of a small diameter drill, the clearance at the tip of the drill is small, so that the hole position accuracy is improved.
〔実施例１〕 ガラスクロス WEA18W［日東紡績（株）製］を400℃
で25時間脱油処理をする。この脱油クロスをテトラエト
キシシラン0.3％加水分解溶液に浸漬し、絞液後110℃に
て５分間熱風乾燥をおこなう。更にエポキシシラン1.0
％加水分解水溶液に浸漬し、絞液後乾燥し処理クロスを
得る。該処理クロスをFR−４タイプのエポキシ樹脂ワニ
スに含浸、乾燥させプリプレグを作る。このプリプレグ
８枚を積層し、両側に35μ銅箔を重ね、170℃で60分間
加熱加圧して、厚さ1.6mmの銅張積層板を得る。[Example 1] Glass cloth WEA18W [manufactured by Nitto Boseki Co., Ltd.] was heated to 400 ° C.
For 25 hours. This deoiled cloth is immersed in a 0.3% hydrolyzed solution of tetraethoxysilane, squeezed, and dried with hot air at 110 ° C. for 5 minutes. Further epoxy silane 1.0
% Hydrolyzed aqueous solution, squeezed liquid and dried to obtain a treated cloth. The treated cloth is impregnated with FR-4 type epoxy resin varnish and dried to prepare a prepreg. Eight such prepregs are laminated, 35 μ copper foil is laminated on both sides, and heated and pressed at 170 ° C. for 60 minutes to obtain a copper-clad laminate having a thickness of 1.6 mm.
〔実施例２〕 テトラエトキシシラン濃度を1.0％とする他は、実施
例１と同様にして銅張積層板を得る。Example 2 A copper-clad laminate was obtained in the same manner as in Example 1, except that the concentration of tetraethoxysilane was changed to 1.0%.
〔比較例１〕 ガラスクロス WEA18Wを400℃で25時間脱油処理をす
る。この脱油クロスをエポキシシラン1.0％加水分解溶
液に浸漬し、絞液後、乾燥し処理クロスを得る。処理ク
ロスをFR−４タイプのエポキシ樹脂ワニスに含浸、乾燥
させ、プリプレグを作り、プリプレグを８枚を積層し、
両側に35μ銅箔を重ね、170℃で60分間加圧加熱して、
厚さ1.6mmの銅張積層板を得る。[Comparative Example 1] A glass cloth WEA18W is deoiled at 400 ° C for 25 hours. The deoiled cloth is immersed in a 1.0% hydrolysis solution of epoxysilane, squeezed, and dried to obtain a treated cloth. The treated cloth is impregnated with FR-4 type epoxy resin varnish and dried to make a prepreg, and eight prepregs are laminated,
Overlay 35μ copper foil on both sides, pressurize and heat at 170 ° C for 60 minutes,
A copper clad laminate 1.6 mm thick is obtained.
〔比較例２〕 実施例１に於てテトラエトキシシランの代りにメチル
トリメトキシシランとする他は、実施例１と同様にして
銅張積層板を得る。Comparative Example 2 A copper-clad laminate was obtained in the same manner as in Example 1, except that methyltrimethoxysilane was used instead of tetraethoxysilane.
ガラスクロスの引張り強度 実施例１、２及び比較例１、２の４種類のガラスクロ
スのエポキシシラン処理後の引張り強度を測定。測定結
果を表１に示す。Tensile strength of glass cloth The tensile strength of the four types of glass cloths of Examples 1 and 2 and Comparative Examples 1 and 2 after the epoxysilane treatment was measured. Table 1 shows the measurement results.
測定法はJIS Ｒ 3420 ５・４ ガラス繊維一般試
験法による。The measuring method is based on JIS R 3420 5.4 General Test Method for Glass Fiber.
小径ドリルの穴位置精度 実施例１、２及び比較例１、２で作成した４種類の銅
張積層板について小径ドリルの穴位置精度測定。Hole position accuracy of small diameter drill Hole position accuracy of small diameter drill for four types of copper-clad laminates prepared in Examples 1 and 2 and Comparative Examples 1 and 2.
測定法は、夫々の積層板を３枚重ね、径0.4mmのドリ
ルで、送り速度1.6mm/min、回転数60,000rpmでドリリン
グし、３枚目の積層板の穴の上下位置のずれを測定。測
定結果を表１に示す。The measuring method is to stack three sheets of each laminate, drill at a feed rate of 1.6 mm / min and a rotation speed of 60,000 rpm with a drill of 0.4 mm in diameter, and measure the displacement of the holes in the third laminate up and down . Table 1 shows the measurement results.
ドリル内壁粗さ 実施例１、２及び比較例１、２で作成した４種類の銅
張積層板について、ドリリング条件を穴位置精度測定の
場合と同じにし、8,000hit後の穴内壁の粗さを顕微鏡に
より観察した。Drill inner wall roughness For the four types of copper-clad laminates prepared in Examples 1 and 2 and Comparative Examples 1 and 2, the drilling conditions were the same as for the hole position accuracy measurement, and the hole inner wall roughness after 8,000 hits was reduced. Observed under a microscope.
積層板の曲げ強度、及び剪断強度についても夫々測
定。測定結果を表１に示す。The bending strength and shear strength of the laminate were also measured. Table 1 shows the measurement results.
測定法は曲げ強度 MIL−Ｐ−13949/2A 剪断強度 ASTM−Ｄ−732−78 〔発明の効果〕 以上説明したように本発明によるガラスクロスの製造
法により作られたガラスクロスを用いてプリント基板を
作ると、小径ドリルの場合の穴位置精度が従来品と比較
して50％以上良くなり、且つ穴内壁粗さの平滑度の良い
プリント基板が得られる。ドリル加工性が良くなる結
果、ドリルの摩耗も少なくなり、又ドリル加工時の加工
枚数も増やすことが可能となった。The measuring method is bending strength MIL-P-13949 / 2A shear strength ASTM-D-732-78 [Effects of the Invention] As described above, when a printed circuit board is manufactured using a glass cloth manufactured by the method for manufacturing a glass cloth according to the present invention, the hole position accuracy in the case of a small-diameter drill is 50% as compared with a conventional product. As a result, a printed circuit board having good hole inner wall roughness and good smoothness can be obtained. As a result of the improved drill workability, the wear of the drill is reduced, and the number of drills can be increased.
尚、本発明の製造方法はガラスクロスを連続的に処理
することができること及び高温を使わずに処理できるた
め、実施のために特別の装置を必要とせず、一般に使用
されている、ガラスクロスの表面処理装置で処理可能で
ある。In addition, since the manufacturing method of the present invention can continuously process the glass cloth and can perform processing without using high temperature, a special device is not required for implementation, and a glass cloth generally used is not used. It can be processed with a surface treatment device.
Claims (1)
コキシシランの加水分解溶液で処理後100〜170℃の温度
で乾燥し、ガラスクロスを構成するガラス繊維の引張強
度を低下せしめ、連続してシランカップリング剤による
処理を行うことを特徴とするプリント基板用ガラスクロ
スの製造方法。1. De-oiled glass cloth is treated with a hydrolysis solution of tetraalkoxysilane and then dried at a temperature of 100 to 170 ° C. to reduce the tensile strength of glass fibers constituting the glass cloth. A method for producing a glass cloth for a printed circuit board, comprising performing a treatment with a silane coupling agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63236577A JP2751241B2 (en) | 1988-09-22 | 1988-09-22 | Manufacturing method of glass cloth for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63236577A JP2751241B2 (en) | 1988-09-22 | 1988-09-22 | Manufacturing method of glass cloth for printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0288448A JPH0288448A (en) | 1990-03-28 |
| JP2751241B2 true JP2751241B2 (en) | 1998-05-18 |
Family
ID=17002697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63236577A Expired - Fee Related JP2751241B2 (en) | 1988-09-22 | 1988-09-22 | Manufacturing method of glass cloth for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2751241B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2506196B2 (en) * | 1989-06-28 | 1996-06-12 | ナショナル住宅産業株式会社 | Flame retardant treated material |
| EP0837090B1 (en) | 1995-06-27 | 2001-08-29 | Hitachi Chemical Co., Ltd. | Prepreg for printed wiring boards, resin varnish, resin composition, and laminate for printed wiring boards produced by using these substances |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS635512A (en) * | 1986-06-25 | 1988-01-11 | Nec Corp | Operation monitoring system for semiconductor manufacture device |
-
1988
- 1988-09-22 JP JP63236577A patent/JP2751241B2/en not_active Expired - Fee Related
Non-Patent Citations (2)
| Title |
|---|
| カップリング剤最適利用技術（１９８８年１月）科学技術総合研究所発行 |
| 複合材料と界面（１９８６年２月）総合技術出版発行 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0288448A (en) | 1990-03-28 |
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