JP2738569B2 - Method for manufacturing photovoltaic device - Google Patents

Method for manufacturing photovoltaic device

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Publication number
JP2738569B2
JP2738569B2 JP1236694A JP23669489A JP2738569B2 JP 2738569 B2 JP2738569 B2 JP 2738569B2 JP 1236694 A JP1236694 A JP 1236694A JP 23669489 A JP23669489 A JP 23669489A JP 2738569 B2 JP2738569 B2 JP 2738569B2
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JP
Japan
Prior art keywords
conductor
insulator
back electrode
semiconductor layer
amorphous semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1236694A
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Japanese (ja)
Other versions
JPH0397273A (en
Inventor
健治 邑田
博之 田中
信一 上妻
浩 井上
靖雄 岸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Denki Co Ltd
Original Assignee
Sanyo Denki Co Ltd
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Filing date
Publication date
Application filed by Sanyo Denki Co Ltd filed Critical Sanyo Denki Co Ltd
Priority to JP1236694A priority Critical patent/JP2738569B2/en
Publication of JPH0397273A publication Critical patent/JPH0397273A/en
Application granted granted Critical
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

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  • Photovoltaic Devices (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は複数の光起電力素子を直列接続してなる光起
電力装置の製造方法に関するものである。
The present invention relates to a method of manufacturing a photovoltaic device in which a plurality of photovoltaic elements are connected in series.

〔従来技術〕(Prior art)

通常この種の光起電力装置は第3図(イ),(ロ)に
示す如く構成されている。第3図(イ)は従来の光起電
力装置の断面構造図、第3図(ロ)は同軸平面図であ
り、透光性絶縁基板1上に、透明電極2,p−i−n接合
型、或いはn−i−p接合型の非晶質半導体層5,裏面電
極6をこの順序に積層形成して構成される光起電力素子
A,B…のうち、相接する一方の光起電力素子Aの裏面電
極6を他方の光起電力素子Bの透明電極2上に形成した
条状の導電体3と接続し、またこの導電体3自体はこれ
と平行に形成した同じく条状の絶縁体4にて当該他方の
光起電力素子Bの透明電極2、非晶質半導体層5と遮断
状態に維持して光起電力素子A,B,…を相互に直列接続す
る方法が採られている。
Usually, this type of photovoltaic device is configured as shown in FIGS. 3 (a) and 3 (b). FIG. 3 (a) is a cross-sectional structural view of a conventional photovoltaic device, and FIG. 3 (b) is a coaxial plan view, in which a transparent electrode 2, a pin junction is formed on a transparent insulating substrate 1. Photovoltaic element formed by laminating an amorphous semiconductor layer 5 and a nip junction type amorphous semiconductor layer 5 and a back electrode 6 in this order.
The back electrode 6 of one of the adjacent photovoltaic elements A among A, B... Is connected to the strip-shaped conductor 3 formed on the transparent electrode 2 of the other photovoltaic element B. The body 3 itself is kept parallel to the transparent electrode 2 and the amorphous semiconductor layer 5 of the other photovoltaic element B by the same strip-shaped insulator 4 and the photovoltaic element A , B,... Are connected to each other in series.

ところでこのような光起電力装置の製造は従来第4図
(イ),(ロ)に示す如くに行われている。
By the way, such a photovoltaic device is conventionally manufactured as shown in FIGS. 4 (a) and 4 (b).

第4図(イ),(ロ)は従来方法の製造過程を示す模
式図であり、先ず第4図(イ)に示す如く透光性絶縁基
板1上に透明電極2を積層形成した後、この透明電極2
を各光起電力素子A,B…を構成する領域毎に切断し、ま
た切断にて区分した各透明電極の一側縁近傍には切断溝
に沿い切断溝側に位置して条状の導電体3を、またこれ
と所要の間隔を隔てて透明電極の中心側寄りに位置して
同じく条状の絶縁体4を夫々並列形成する。
FIGS. 4 (a) and 4 (b) are schematic diagrams showing a manufacturing process of the conventional method. First, as shown in FIG. 4 (a), after a transparent electrode 2 is formed on a transparent insulating substrate 1, This transparent electrode 2
Is cut into each of the regions constituting the photovoltaic elements A, B,... Also, near the one side edge of each of the transparent electrodes divided by the cutting, the strip-shaped conductive material is located along the cutting groove along the cutting groove. A body 3 is also formed in parallel with a strip-shaped insulator 4 which is located near the center of the transparent electrode at a required distance from the body 3.

次いで第4図(ロ)に示す如く透明電極2、切断溝及
び導電体3、絶縁体4上にわたって非晶質半導体層5、
裏面電極6をこの順序で積層形成し、導電体3上に対し
ては断続的に、また絶縁体4上に対しては連続的に夫々
破線で示す如くに所要線幅のレーザビームを投射する。
これによって導電体3上にあっては、レーザビームが投
射された部分では夫々スポット状に非晶質半導体層5,裏
面電極6ともに穿孔され、非晶質半導体層5は蒸散せし
められ、また裏面電極6は孔の周縁部が蒸散せしめられ
た非晶質半導体層5の跡に垂れ下って導電体3と電機的
に接触した状態で固化する。
Next, as shown in FIG. 4 (b), the amorphous semiconductor layer 5 over the transparent electrode 2, the cutting groove and the conductor 3, and the insulator 4
The back electrode 6 is laminated in this order, and a laser beam having a required line width is projected on the conductor 3 intermittently and on the insulator 4 continuously as shown by broken lines. .
As a result, on the conductor 3, the amorphous semiconductor layer 5 and the back electrode 6 are perforated in spots at the portions where the laser beam is projected, and the amorphous semiconductor layer 5 evaporates and The electrode 6 solidifies in a state in which the peripheral portion of the hole hangs down on the trace of the amorphous semiconductor layer 5 which has been evaporated and is in electrical contact with the conductor 3.

一方、絶縁体4上にあってはレーザビームが連続的に
投射され、非晶質半導体層5,裏面電極6が共に破断さ
れ、非晶質半導体層5,裏面電極6共に蒸散せしめられる
が、裏面電極6はその破断縁部が蒸散せしめられた非晶
質半導体層5の跡に垂れ下って絶縁体4上に接触した状
態で固化する。
On the other hand, on the insulator 4, a laser beam is continuously projected, the amorphous semiconductor layer 5 and the back electrode 6 are both broken, and both the amorphous semiconductor layer 5 and the back electrode 6 evaporate. The back surface electrode 6 is solidified in a state where its broken edge hangs down on the trace of the evaporated amorphous semiconductor layer 5 and is in contact with the insulator 4.

これによって第3図(イ),(ロ)に示す如く非晶質
半導体層5,裏面電極6は夫々各光起電力素子A,B…毎に
絶縁体4上で切断され、且つ相隣する一方の光起電力素
子における裏面電極6は導電体3を通じて他方の光起電
力素子における透明電極2と接続されて相隣する光起電
力素子は相互に直列接続された状態となる。
As a result, as shown in FIGS. 3A and 3B, the amorphous semiconductor layer 5 and the back electrode 6 are cut on the insulator 4 for each of the photovoltaic elements A, B,. The back electrode 6 of one photovoltaic element is connected to the transparent electrode 2 of the other photovoltaic element through the conductor 3 so that adjacent photovoltaic elements are connected to each other in series.

ところで上述した如き従来の製造方法にあっては導電
体3上に対しては断続的に、また絶縁体4上に対しては
連続的に夫々レーザビームを投射する必要があって、加
工作業が煩わしいこと、又光起電力装置として、例えば
透明電極2,2間、導電体3,絶縁体4下及びこれらに挟ま
れた部分は実際上太陽電池等として機能しない無効部分
となるが、この導電体3,絶縁体4の幅寸法は裏面電極6
と導電体3とを確実に接触維持するため導電体3上に対
するレーザビームスポット径は30〜100μm、また絶縁
体4上にて相隣する光起電力素子の非晶質半導体層5,裏
面電極6を確実に絶縁維持するため絶縁体4上に対する
レーザビームの線幅は150μm程度に設定され、更に導
電体3と絶縁体4は相互の間に100〜200μm程度の幅寸
法を隔てて形成するため全体の無効部分は500〜700μm
程度となり、無効部分の幅が大きいという問題もあっ
た。
By the way, in the conventional manufacturing method as described above, it is necessary to project a laser beam intermittently on the conductor 3 and continuously on the insulator 4, respectively. As a photovoltaic device, for example, between the transparent electrodes 2 and 2, under the conductor 3 and the insulator 4, and the portion sandwiched between them are ineffective portions that do not actually function as a solar cell or the like. The width of the body 3 and insulator 4 is
The laser beam spot diameter on the conductor 3 is 30 to 100 μm in order to surely maintain the contact between the conductor 3 and the conductor 3, and the amorphous semiconductor layer 5 of the adjacent photovoltaic element on the insulator 4 and the back electrode The line width of the laser beam on the insulator 4 is set to about 150 μm in order to reliably maintain the insulation of the conductor 6, and the conductor 3 and the insulator 4 are formed with a width of about 100 to 200 μm therebetween. Therefore, the entire invalid part is 500 to 700 μm
And the width of the invalid portion is large.

第5図(イ),(ロ)は、上述した如き問題点を解決
すべく開発された他の従来技術であり、第5図(イ)は
断面図、第5図(ロ)は平面図である。また第6図
(イ),(ロ)はその製造過程を示している。
FIGS. 5 (a) and 5 (b) are other prior arts developed to solve the above-mentioned problems. FIG. 5 (a) is a sectional view, and FIG. 5 (b) is a plan view. It is. 6 (a) and 6 (b) show the manufacturing process.

なお、図中の番号は第3図(イ),(ロ)及び第4図
(イ),(ロ)と対応する部分には同じ番号を付してあ
る。
In the figures, parts corresponding to FIGS. 3 (a) and (b) and FIGS. 4 (a) and (b) are given the same numbers.

この従来技術においては、導電体3及び絶縁体4を相
接した状態で並列形成し、次いで透明電極2上、透明電
極2,2間の切断部に露出する透光性絶縁基板1及び導電
体3,絶縁体4上にわたってp−i−n接合型、或いはn
−i−p接合型の非晶質半導体層5及びAl,Ti,Ag製の裏
面電極6をこの順序で所要厚さに積層形成する。
In this conventional technique, a conductor 3 and an insulator 4 are formed in parallel with each other in contact with each other, and then the light-transmitting insulating substrate 1 and the conductor are exposed on the transparent electrode 2 at a cut portion between the transparent electrodes 2 and 2. 3, pin junction type or n over insulator 4
-An ip junction type amorphous semiconductor layer 5 and a back electrode 6 made of Al, Ti, Ag are laminated in this order to a required thickness.

次に第6図(ロ)に破線で示す如く、導電体3,絶縁体
4の両者にわたるように線幅100〜150μmのレーザビー
ムを投射し、これらの上の非晶質半導体層5,裏面電極6
を蒸散せしめて分断すると共に、この分断された裏面電
極6の縁部を溶融状態で垂れ下らせて夫々導電体3,絶縁
体4表面に接触した状態で固化せしめる。
Next, as shown by a broken line in FIG. 6 (b), a laser beam having a line width of 100 to 150 μm is projected so as to extend over both the conductor 3 and the insulator 4, and the amorphous semiconductor layer 5 and the back surface are formed thereon. Electrode 6
Is vaporized and divided, and the edge of the divided rear surface electrode 6 is dripped in a molten state to be solidified in contact with the surface of the conductor 3 and the surface of the insulator 4, respectively.

これによって相隣する光起電力素子における非晶質半
導体層5,裏面電極6は夫々導電体3,絶縁体4上にて相互
に分断され、且つ一方の光起電力素子の裏面電極6は他
方の光起電力素子における導電体3を介して透明電極2
と電気的に接続せしめられて、各光起電力素子A,B…が
直列接続された光起電力装置が構成されることとなる。
Thereby, the amorphous semiconductor layer 5 and the back electrode 6 in the adjacent photovoltaic element are separated from each other on the conductor 3 and the insulator 4, respectively, and the back electrode 6 of one photovoltaic element is connected to the other. Transparent electrode 2 via conductor 3 in the photovoltaic device of FIG.
Are electrically connected to each other to form a photovoltaic device in which the photovoltaic elements A, B,... Are connected in series.

この従来技術にあっては導電体と絶縁体とを相隣せし
めて形成し、この上に非晶質半導体層5,裏面電極6を積
層形成してこれを導電体3、絶縁体4上にて同時的に切
断せしめると共に、導電体3上の裏面電極6の縁部を導
電体3と電気的に接触せしめた状態とすることが出来、
レーザビームによる加工が一回で済み、加工が簡略化さ
れ、また導電体3と絶縁体4とを相互に接触せしめて形
成するから相互の間の無効領域を除去することが出来て
無効面積の狭小化も図れる。
In this prior art, a conductor and an insulator are formed adjacent to each other, and an amorphous semiconductor layer 5 and a back electrode 6 are formed on the conductor and an insulator, and this is formed on the conductor 3 and the insulator 4. At the same time, the edge of the back electrode 6 on the conductor 3 can be brought into electrical contact with the conductor 3.
Processing with a laser beam only needs to be performed once, which simplifies the processing. Further, since the conductor 3 and the insulator 4 are formed in contact with each other, an ineffective region between them can be removed, and the ineffective area can be reduced. Narrowing can also be achieved.

〔発明が解決しようとする課題〕[Problems to be solved by the invention]

しかしながら、この従来技術においては各光起電力素
子A,B…の直列接続が導電体3上に垂れ下がった裏面電
極6の一方の端縁部のみで行われることとなり、第3,4
図に示す従来方法ではスポット部分の全周で溶着接続さ
れるのに比べ、接触面積が小さく、接触抵抗が増加する
欠点があり、また温度変化に対してもスポット状の溶着
に比べ、線状の溶着は接続部の強度が弱く断線の危険性
が大きい等の問題があった。
However, in this conventional technique, the series connection of the photovoltaic elements A, B,... Is performed only at one end of the back electrode 6 hanging on the conductor 3, and
The conventional method shown in the figure has the disadvantage that the contact area is small and the contact resistance is increased as compared with the case where welding is performed on the entire periphery of the spot portion. Welding has problems such as a weak connection portion and a high risk of disconnection.

本発明はかかる事情に鑑みなされたものであって、そ
の目的とするところは、レーザビームによる一回の加工
で光起電力素子の分割と直列接続とを同時に行うと共
に、直列接続部において低い接触抵抗と高い接続強度が
得られる光起電力装置の製造方法を提供するものであ
る。
The present invention has been made in view of such circumstances, and an object of the present invention is to simultaneously perform division and serial connection of a photovoltaic element by one processing using a laser beam, and to reduce low contact at a series connection portion. An object of the present invention is to provide a method for manufacturing a photovoltaic device that can obtain resistance and high connection strength.

〔課題を解決するための手段〕[Means for solving the problem]

本発明に係る光起電力装置は、透光性絶縁基板上に各
光起電力素子を形成する領域毎に分離した透明電極の表
面に切断部近傍に沿って相接した状態で条状に導電体及
び絶縁体を形成した後、導電体,絶縁体及び各切断した
透明電極上にわたって非晶質半導体層,裏面電極をこの
順序に積層形成し、前記導電体,絶縁体上において、前
記非晶質半導体層,裏面電極を、前記導電体と絶縁体と
の境界線に対して非対称な形状に成形したエネルギービ
ームを用いて溶融切断し、前記導電体に、相隣する他の
光起電力素子の裏面電極を電気的に接触せしめる過程を
含むことを特徴とする。
In the photovoltaic device according to the present invention, the surface of the transparent electrode separated for each region where each photovoltaic element is formed on the light-transmitting insulating substrate is electrically conductive in a strip shape in a state of being in contact with each other along the vicinity of the cut portion. After forming a body and an insulator, an amorphous semiconductor layer and a back electrode are formed in this order over the conductor, the insulator, and each of the cut transparent electrodes, and the amorphous layer is formed on the conductor and the insulator. The semiconductor layer and the back electrode are melt-cut using an energy beam formed into an asymmetric shape with respect to the boundary between the conductor and the insulator, and another photovoltaic element adjacent to the conductor is formed. And electrically contacting the back electrode.

〔作用〕[Action]

本発明にあってはこれによって、一回のエネルギービ
ームの操作で相隣する光起電力素子間は、広い面積で接
触させ得ることとなる。
According to the present invention, this allows the adjacent photovoltaic elements to be brought into contact over a wide area by one operation of the energy beam.

〔実施例〕〔Example〕

以下本発明をその実施態様を示す図面に基づき具体的
に説明する。第1図(イ),(ロ)は本発明方法により
製造した光起電力装置の要部を示す模式図であり、図中
1はガラス等を用いた共通の透光性絶縁基板を示してい
る。この共通の透光性絶縁基板1上に各光起電力素子A,
B…が形成されている。各光起電力素子A,B,…は前記し
た共通の透光性絶縁基板1上に夫々SnO2,ITO/SnO2等を
用いた透明電極2を形成し、その上に部分的にAl,Ag等
を用いた導電体3,ガラス等を用いた絶縁体4を相接した
状態に隣接形成した後、これらの表面にアモルファスシ
リコン等を用いたp−i−n接合型、又はn−i−p接
合型の非晶質半導体層5,Al等を用いた裏面電極6をこの
順序に積層形成し、レーザビームの投射によって非晶質
半導体層5,裏面電極6を夫々各光起電力素子A,B…毎に
分断して絶縁体4にて相互に電気的に遮断すると共に、
相隣する光起電力素子A,B…のうち一方の光起電力素子
Aの裏面電極6は他の光起電力素子B上の導電体3を介
してその透明電極2と接触せしめ、光起電力素子A,B,…
を相互に直列接続せしめてある。
Hereinafter, the present invention will be specifically described with reference to the drawings showing the embodiments. FIGS. 1 (a) and 1 (b) are schematic views showing a main part of a photovoltaic device manufactured by the method of the present invention, in which 1 shows a common translucent insulating substrate using glass or the like. I have. Each of the photovoltaic elements A,
B ... are formed. Each of the photovoltaic elements A, B,... Forms a transparent electrode 2 using SnO 2 , ITO / SnO 2 or the like on the common translucent insulating substrate 1 described above, and partially forms Al, After a conductor 3 using Ag or the like and an insulator 4 using glass or the like are formed adjacent to each other in a state of being in contact with each other, a pin junction type using amorphous silicon or the like on their surfaces, or ni is used. A p-junction type amorphous semiconductor layer 5 and a back electrode 6 using Al or the like are laminated in this order, and the amorphous semiconductor layer 5 and the back electrode 6 are respectively formed by photovoltaic elements by projecting a laser beam. A, B, etc., are cut off each other and are electrically isolated from each other by the insulator 4.
The back electrode 6 of one of the adjacent photovoltaic elements A, B... Contacts the transparent electrode 2 via the conductor 3 on the other photovoltaic element B, and Power elements A, B, ...
Are connected in series with each other.

なお、前記裏面電極6と導電体3との接続は、レーザ
ビーム投射部の周辺領域で導電体3の上の領域全域にわ
たって略等間隔で行われている。
The connection between the back electrode 6 and the conductor 3 is made at substantially equal intervals over the entire region above the conductor 3 in the peripheral region of the laser beam projection unit.

次にこのような光起電力装置の製造方法を第2図
(イ),(ロ),(ハ)に基づき説明する。
Next, a method for manufacturing such a photovoltaic device will be described with reference to FIGS. 2 (a), 2 (b) and 2 (c).

先ず第2図(イ)に示す如く、ガラス等を用いて形成
した共通の透光性絶縁基板1上にSnO2,或いはITO/SnO2
等を材料とする透明電極2を全面に積層形成した後、レ
ーザスクライブによって透明電極2を各光起電力素子A,
B…を形成する領域毎に切断分離すると共に、分離した
各透明電極2,2上には切断溝に沿わせて一側縁の全長に
わたるよう導電体3及び絶縁体4を相接した状態で並列
形成せしめる。
First, as shown in FIG. 2 (a), SnO 2 or ITO / SnO 2 is formed on a common light-transmitting insulating substrate 1 formed of glass or the like.
After the transparent electrode 2 made of such material is laminated on the entire surface, the transparent electrode 2 is formed by laser scribing on each photovoltaic element A,
The conductor 3 and the insulator 4 are cut and separated for each region where B is formed, and the separated transparent electrodes 2, 2 are in contact with the conductor 3 and the insulator 4 along the cut groove so as to extend over the entire length of one side edge. Let them be formed in parallel.

この導電体3,絶縁体4は、例えばAgを主体とする導電
体ペースト、ガラスを主体とする絶縁体ペーストを従来
知られたペン描画法等にて透明電極2上に条状に付着さ
せた後、これを焼成することによって形成される。
For example, the conductor 3 and the insulator 4 are formed by applying a conductor paste mainly composed of Ag or an insulator paste mainly composed of glass on the transparent electrode 2 in a strip shape by a conventionally known pen drawing method or the like. Later, it is formed by firing.

次いで透明電極2上、及び透明電極2,2間の切断部に
露出する透光性絶縁基板1上及び導電体3,絶縁体4上に
わたってp−i−n接合型、或いはn−i−p接合型の
非晶質半導体層5及びAl,Ti,Ag製の裏面電極6をこの順
序で所要厚さに積層形成する。
Then, on the transparent electrode 2 and on the transparent insulating substrate 1 and the conductors 3 and 4 exposed at the cut portions between the transparent electrodes 2 and 2, a pin junction type or an nip junction type is applied. A junction type amorphous semiconductor layer 5 and a back electrode 6 made of Al, Ti, Ag are laminated in this order to a required thickness.

次に第2図(ロ)に示す如く、レーザビームLBの光路
中に所定の開口パターンを有するアイリス8及び該開口
パターンを裏面電極6上に結像させるためのレンズ7を
配置し、導電体3,絶縁体4の両者にわたる幅でレーザビ
ームLBをパルス状に投射する。アイリス8の開口パター
ン、即ちレーザビーム投射パターン9は、例えば第2図
(ハ)にハッチングを付して示す如く導電体3と絶縁体
4との境界線に関して非対称なパターンであり、長方形
状部分aと円形状部分bとこの両部分a,bを結ぶ細いス
リット状部分cとを有し、長方形状部分aを経たレーザ
ビームは絶縁体4上の裏面電極6上に、また円形状部分
bを経たレーザビームは導電体3上の裏面電極6上に夫
々投射され、更にスリット状部分cは導電体3,絶縁体4
の両者にわたる裏面電極6上に夫々投射されるようにな
っている。
Next, as shown in FIG. 2B, an iris 8 having a predetermined opening pattern and a lens 7 for forming an image of the opening pattern on the back electrode 6 are arranged in the optical path of the laser beam LB. 3. The laser beam LB is projected in a pulse shape with a width extending over both of the insulators 4. The opening pattern of the iris 8, that is, the laser beam projection pattern 9 is a pattern asymmetric with respect to the boundary between the conductor 3 and the insulator 4 as shown by hatching in FIG. a, a circular portion b, and a narrow slit portion c connecting the two portions a and b. The laser beam passing through the rectangular portion a is applied to the back electrode 6 on the insulator 4 and to the circular portion b. The laser beam that has passed through is projected onto the back electrode 6 on the conductor 3, and the slit-shaped portion c is formed of the conductor 3 and the insulator 4.
Are projected onto the back electrode 6 extending over both.

絶縁体4上では長方形状部分aを経たレーザビームが
絶縁体4の長手方向において一部がオーバラップする態
様で、また導電体3上では円形状部分bを経たレーザビ
ームが相互に適長離間した状態で投射されるようレーザ
ビーム光学系と光起電力装置との相対的移動量を適正に
設定する。これによってレーザビームLBは導電体3上に
スポット状に投射され、レーザビームが投射された部分
では非晶質半導体層5,裏面電極6ともに所定の間隔で穿
孔され、非晶質半導体層5は蒸散せしめられ、裏面電極
6は孔の周縁部が蒸散せしめられた非晶質半導体層5の
跡に垂れ下がって導電体3と電気的に接触した状態で固
化する。
On the insulator 4, the laser beam passing through the rectangular portion a partially overlaps in the longitudinal direction of the insulator 4, and the laser beam passing through the circular portion b on the conductor 3 is separated from the laser beam by an appropriate length. The relative movement amount between the laser beam optical system and the photovoltaic device is appropriately set so that the light is projected in the state where the laser beam is projected. As a result, the laser beam LB is projected in a spot shape on the conductor 3, and the amorphous semiconductor layer 5 and the back surface electrode 6 are perforated at predetermined intervals in a portion where the laser beam is projected. The back electrode 6 is evaporated and the peripheral portion of the hole hangs down on the trace of the evaporated amorphous semiconductor layer 5 and solidifies while being in electrical contact with the conductor 3.

また絶縁体4上の非晶質半導体層5,裏面電極6が共に
蒸散せしめられて分断すると共に、この分断された裏面
電極6の縁部を蒸散した非晶質半導体層5の跡に溶融状
態で垂れ下らせて絶縁体4表面に接触した状態で固化せ
しめる。
In addition, the amorphous semiconductor layer 5 and the back electrode 6 on the insulator 4 are both evaporated and separated, and the edge of the separated back electrode 6 is melted on the trace of the evaporated amorphous semiconductor layer 5. And solidify in a state of being in contact with the surface of the insulator 4.

これによって相隣する光起電力素子A,Bにおける非晶
質半導体層5,裏面電極6は共に導電体3,絶縁体4上にて
相互に分断され、且つ一方の光起電力素子Aの裏面電極
6は他方の光起電力素子Bにおける導電体3を介して透
明電極2と電気的に接続せしめられ、各光起電力素子A,
B…が直列接続された光起電力装置が構成されることと
なる。
As a result, the amorphous semiconductor layer 5 and the back electrode 6 in the adjacent photovoltaic elements A and B are both separated from each other on the conductor 3 and the insulator 4 and the back surface of one of the photovoltaic elements A The electrode 6 is electrically connected to the transparent electrode 2 via the conductor 3 of the other photovoltaic element B, and each of the photovoltaic elements A,
B ... are connected in series to form a photovoltaic device.

なお、上述の実施例ではレーザビーム投射パターン9
として長方形部分a,円形状部分b,スリット状部分cを一
連とした場合について説明したが、何らこれに限るもの
ではなく、導電体3上ではスポット状に、また絶縁体4
上では矩形状に独立して溶断を行い得るパターンであっ
てもよい。
In the above embodiment, the laser beam projection pattern 9
Has been described as a series of a rectangular part a, a circular part b, and a slit part c. However, the present invention is not limited to this, and a spot on the conductor 3 and an insulator 4
Above, a pattern that can be independently blown in a rectangular shape may be used.

〔効果〕〔effect〕

上述した如く本発明方法にあっては導電体と絶縁体と
を相隣せしめて形成し、この上に非晶質半導体層,裏面
電極を積層形成し、これらを導電体と絶縁体との境界線
に対して非対称に成形したエネルギービームを用いて導
電体、絶縁体上にて同時的に切断せしめると共に、導電
体上における裏面電極の縁部をスポット状に導電体と電
気的に接触せしめた状態とすることが出来、エネルギー
ビームによる加工が一回で済むことは勿論、加工が簡略
化され、また導電体上における裏面電極と導電体との接
続面積が広く、しかも高い接続強度が得られることとな
り、低接触抵抗で高い信頼性が得られるなど、本発明は
優れた効果を奏するものである。
As described above, in the method of the present invention, a conductor and an insulator are formed adjacent to each other, and an amorphous semiconductor layer and a back electrode are formed on the conductor and the insulator, and these are formed on the boundary between the conductor and the insulator. Using an energy beam asymmetrically shaped with respect to the line, the conductor was cut simultaneously on the conductor and insulator, and the edge of the back electrode on the conductor was brought into electrical contact with the conductor in a spot shape In this state, the processing with the energy beam can be performed only once, and the processing is simplified, and the connection area between the back electrode and the conductor on the conductor is large, and high connection strength can be obtained. As a result, the present invention has excellent effects such as high reliability with low contact resistance.

【図面の簡単な説明】 第1図(イ)は本発明方法により製造した光起電力装置
の断面構造図、第1図(ロ)は同じくその平面図、第2
図(イ),(ロ),(ハ)は本発明方法の主要工程を示
す模式的断面図、第3図(イ)は従来の方法で製造され
た光起電力装置の断面構造図、第3図(ロ)は同じくそ
の平面図、第4図(イ),(ロ)は従来方法の主要工程
を示す模式的断面図、第5図(イ)は他の従来方法によ
り製造された光起電力装置の断面構造図、第5図(ロ)
は同じくその平面図、第6図(イ),(ロ)は他の製造
方法の主要工程を示す模式的断面図である。 1……透光性絶縁基板、2……透明電極、3……導電
体、4……絶縁体、5……非晶質半導体層、6……裏面
電極、7……レンズ、8……アイリス、9……レーザビ
ーム投射パターン
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 (a) is a sectional structural view of a photovoltaic device manufactured by the method of the present invention, FIG. 1 (b) is a plan view thereof, and FIG.
FIGS. 3A, 3B and 3C are schematic sectional views showing main steps of the method of the present invention, and FIG. 3A is a sectional structural view of a photovoltaic device manufactured by a conventional method. 3 (b) is a plan view of the same, FIGS. 4 (a) and 4 (b) are schematic sectional views showing main steps of the conventional method, and FIG. 5 (a) is a light beam manufactured by another conventional method. Sectional view of electromotive force device, FIG. 5 (b)
6 is a plan view of the same, and FIGS. 6A and 6B are schematic sectional views showing main steps of another manufacturing method. DESCRIPTION OF SYMBOLS 1 ... Translucent insulating substrate, 2 ... Transparent electrode, 3 ... Conductor, 4 ... Insulator, 5 ... Amorphous semiconductor layer, 6 ... Back electrode, 7 ... Lens, 8 ... Iris, 9: Laser beam projection pattern

───────────────────────────────────────────────────── フロントページの続き (72)発明者 井上 浩 大阪府守口市京阪本通2丁目18番地 三 洋電機株式会社内 (72)発明者 岸 靖雄 大阪府守口市京阪本通2丁目18番地 三 洋電機株式会社内 (56)参考文献 特開 昭62−88371(JP,A) 特開 昭63−102278(JP,A) 特開 昭63−156371(JP,A) 特開 昭63−280465(JP,A) ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Hiroshi Inoue 2--18 Keihanhondori, Moriguchi-shi, Osaka Sanyo Electric Co., Ltd. (72) Inventor Yasuo Kishi 2-18-18 Keihanhondori, Moriguchi-shi, Osaka (56) References JP-A-62-88371 (JP, A) JP-A-63-102278 (JP, A) JP-A-63-156371 (JP, A) JP-A-63-280465 (JP JP, A)

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】透光性絶縁基板上に各光起電力素子を形成
する領域毎に分離した透明電極の表面に、切断部近傍に
沿って相接した状態で条状に導電体及び絶縁体を形成し
た後、導電体,絶縁体及び各切断した透明電極上にわた
って非晶質半導体層,裏面電極をこの順序に積層形成
し、前記導電体,絶縁体上において、前記非晶質半導体
層,裏面電極を、前記導電体と絶縁体との境界線に対し
て非対称な形状に成形したエネルギービームを用いて溶
融切断し、前記導電体に、相接する他の光起電力素子の
裏面電極を電気的に接触せしめる過程を含むことを特徴
とする光起電力装置の製造方法。
1. A conductor and an insulator which are formed in a strip shape on a surface of a transparent electrode which is separated for each region where each photovoltaic element is formed on a light-transmitting insulating substrate and which are in contact with each other along the vicinity of a cut portion. Is formed, an amorphous semiconductor layer and a back electrode are laminated in this order over the conductor, the insulator, and each of the cut transparent electrodes, and the amorphous semiconductor layer and the backside electrode are formed on the conductor and the insulator. The back electrode is melt-cut using an energy beam formed into an asymmetric shape with respect to the boundary between the conductor and the insulator, and the conductor is contacted with the back electrode of another photovoltaic element in contact with the conductor. A method for manufacturing a photovoltaic device, comprising a step of making electrical contact.
JP1236694A 1989-09-11 1989-09-11 Method for manufacturing photovoltaic device Expired - Fee Related JP2738569B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1236694A JP2738569B2 (en) 1989-09-11 1989-09-11 Method for manufacturing photovoltaic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1236694A JP2738569B2 (en) 1989-09-11 1989-09-11 Method for manufacturing photovoltaic device

Publications (2)

Publication Number Publication Date
JPH0397273A JPH0397273A (en) 1991-04-23
JP2738569B2 true JP2738569B2 (en) 1998-04-08

Family

ID=17004388

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1236694A Expired - Fee Related JP2738569B2 (en) 1989-09-11 1989-09-11 Method for manufacturing photovoltaic device

Country Status (1)

Country Link
JP (1) JP2738569B2 (en)

Also Published As

Publication number Publication date
JPH0397273A (en) 1991-04-23

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