JP2735378B2 - Socket for J-type lead semiconductor device - Google Patents

Socket for J-type lead semiconductor device

Info

Publication number
JP2735378B2
JP2735378B2 JP2309694A JP30969490A JP2735378B2 JP 2735378 B2 JP2735378 B2 JP 2735378B2 JP 2309694 A JP2309694 A JP 2309694A JP 30969490 A JP30969490 A JP 30969490A JP 2735378 B2 JP2735378 B2 JP 2735378B2
Authority
JP
Japan
Prior art keywords
lead
pin
contact
socket
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2309694A
Other languages
Japanese (ja)
Other versions
JPH04181172A (en
Inventor
利昭 荒川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP2309694A priority Critical patent/JP2735378B2/en
Publication of JPH04181172A publication Critical patent/JPH04181172A/en
Application granted granted Critical
Publication of JP2735378B2 publication Critical patent/JP2735378B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はＪ型リード半導体装置用ソケットに関し、特
に半導体装置の電気的特性を測定する際のＪ型リード半
導体装置のソケットに関する。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a socket for a J-type lead semiconductor device, and more particularly to a socket for a J-type lead semiconductor device when measuring electrical characteristics of the semiconductor device.

〔従来の技術〕 従来、この種のＪ型リード半導体装置（以下Ｊリード
ICと記す）用ソケットは、第２図に示す如く、Ｊリード
５の外側面を、くの字形に成形されたコンタクトピン14
で接触するか、あるいは、第３図に示す如く、Ｊリード
５の底面である湾曲部をポゴピン24で接触する方法をと
っていた。[Prior Art] Conventionally, this type of J-type lead semiconductor device (hereinafter referred to as J-lead)
As shown in FIG. 2, the socket for the J-lead 5 is formed with a contact pin 14 formed in a V shape.
3 or, as shown in FIG. 3, a method of contacting the curved portion, which is the bottom surface of the J-lead 5, with a pogo pin 24.

〔発明が解決しようとする課題〕[Problems to be solved by the invention]

上述した従来のＪリードIC用ソケットは、第２図の方
式の場合は、相対するコンタクトピン14をＪリードIC2
のＪリード５側面で押し広げながら挿入する為に、Ｊリ
ード５外側面の半田めっきは、コンタクトピン14により
えぐられ、半田の屑となりコンタクトピン14に付着し累
積され、Ｊリード５表面に付着し、絶縁不良等のへい害
を生ずるという欠点がある。In the case of the conventional J-lead IC socket described above, in the case of the method shown in FIG.
The solder plating on the outer surface of the J-lead 5 is removed by the contact pins 14, becomes solder dust and accumulates on the contact pins 14, and accumulates on the surface of the J-lead 5. However, there is a disadvantage that damage such as poor insulation is caused.

また、第３図の方式の場合は、ポゴピン24と接触する
ポゴピン24に傷つけられたＪリード５の湾曲部表面の半
田めっきは、半田付性が劣化するという欠点がある。In the case of the method shown in FIG. 3, the solder plating on the surface of the curved portion of the J-lead 5 that is damaged by the pogo pins 24 coming into contact with the pogo pins 24 has a disadvantage that the solderability is deteriorated.

本発明の目的は、半田屑の発生による絶縁不良等のへ
い害がなく、半田付性のよいＪリードIC用ソケットを提
供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a J-lead IC socket which has no harm such as insulation failure due to generation of solder dust and has good solderability.

〔課題を解決するための手段〕[Means for solving the problem]

本発明のＪリード用ソケットは、ＪリードICを搭載す
る円錐状にテーパのついた摺動ピンと、該摺動ピンに嵌
合し、該Ｊリードの外側面には接触せず該Ｊリードの内
側面に接触して該摺動ピンの軸方向の移動により該軸と
直角方向に開閉するコンタクトピンと、該コンタクトピ
ンを支持するブロックと、該ブロックに固定され該摺動
ピンを押しあげるばねとを有して構成されている。The J-lead socket of the present invention is a conical tapered sliding pin on which a J-lead IC is mounted, fitted to the sliding pin, and does not contact the outer surface of the J-lead. A contact pin that contacts the inner surface and opens and closes in a direction perpendicular to the axis by axial movement of the slide pin, a block that supports the contact pin, and a spring that is fixed to the block and pushes up the slide pin. Is configured.

〔実施例〕〔Example〕

次に、本発明の実施例について図面を参照して説明す
る。Next, embodiments of the present invention will be described with reference to the drawings.

第１図は本発明の一実施例の断面図である。 FIG. 1 is a sectional view of one embodiment of the present invention.

第１図に示すように、本実施例のＪリードIC用ソケッ
トは、ＪリードIC2を搭載する円錐状にテーパのついた
摺動ピン３と、この摺動ピン３に嵌合し、摺動ピン３の
軸方向の移動により軸と直角方向に開閉するコンタクト
ピン４と、このコンタクトピン４を支持するブロック７
と、このブロック７に固定され摺動ピン３を押しあげる
ばね６と、ＪリードIC2を押しつけこのＪリードIC2を装
着するプッシャ１とを有して構成されている。As shown in FIG. 1, the socket for a J-lead IC according to the present embodiment has a conical tapered sliding pin 3 on which a J-lead IC 2 is mounted. A contact pin 4 that opens and closes in a direction perpendicular to the axis by the axial movement of the pin 3, and a block 7 that supports the contact pin 4.
And a spring 6 fixed to the block 7 to push up the sliding pin 3 and a pusher 1 for pressing the J-lead IC2 and mounting the J-lead IC2.

ＪリードIC2をＪリードIC用ソケットに装着する場合
には、まず、摺動ピン３上に搭載されたＪリードIC2を
プッシャ１にて押しつける。押しつけられたＪリードIC
2は、摺動ピン３を軸方向に押しつけ、摺動ピン３に形
成されたテーパにより、コンタクトピン４は、徐々に外
側に押し広げられる。押し広げられたコンタクトピン４
は、ＪリードIC2のＪリード５の内側面に接触して装着
される。When mounting the J-lead IC 2 on the socket for the J-lead IC, the J-lead IC 2 mounted on the sliding pin 3 is first pressed by the pusher 1. J-lead IC pressed
2 presses the sliding pin 3 in the axial direction, and the contact pin 4 is gradually pushed outward by the taper formed in the sliding pin 3. Contact pins 4 spread out
Are mounted in contact with the inner surface of the J-lead 5 of the J-lead IC2.

測定を終えたＪリードIC2は、プッシャ１を上部に引
きあげることにより、ばね６により摺動ピン３は上部に
押しあげられ、これにともなってコンタクトピン４は、
自身が持つばね性により、摺動ピン３に追従して徐々に
内側に移動し、Ｊリード５との接触が解除される。After the measurement, the J-lead IC 2 pulls the pusher 1 upward, and the sliding pin 3 is pushed upward by the spring 6.
Due to its own resiliency, it gradually moves inward following the sliding pin 3 and the contact with the J lead 5 is released.

〔発明の効果〕〔The invention's effect〕

以上説明したように本発明は、ＪリードIC用ソケット
外側に向い可動なコンタクトピンを摺動ピンにより相対
するコンタクトピンの間隔を広げ、ＪリードICのＪリー
ドとコンタクトピンを接触させ摺動ピンの押し込み量に
よりその接触の圧力を調整することが可能となり、Ｊリ
ードICのＪリード表面の半田めっきに大きな傷をつける
ことなく、けずりとられた半田の屑による絶縁不良等の
へい害を減じることができる効果がある。As described above, according to the present invention, a movable contact pin facing the outside of a J-lead IC socket is extended by a sliding pin to increase the interval between the contact pins, and the J-lead of the J-lead IC is brought into contact with the contact pin to form a sliding pin. The contact pressure can be adjusted by the amount of indentation, and the damage such as insulation failure due to scraped solder debris is reduced without significantly damaging the solder plating on the J-lead surface of the J-lead IC. There is an effect that can be.

又、ＪリードICのボードへの実装の際に半田付けされ
るＪリードの湾曲部の表面のめっきに傷をつけることな
く、半田付性を劣化させることがないという効果があ
る。Also, there is an effect that the plating on the surface of the curved portion of the J-lead to be soldered when mounting the J-lead IC on the board is not damaged, and the solderability is not deteriorated.

【図面の簡単な説明】[Brief description of the drawings]

第１図は本発明の一実施例の断面図、第２図は従来のＪ
リードIC用ソケットの一例の断面図、第３図は従来のＪ
リードIC用ソケットの他の例の断面図である。 １……プッシャ、２……ＪリードIC、３……摺動ピン、
4,14……コンタクトピン、５……Ｊリード、６……ば
ね、７……ブロック、24……ポゴピン。FIG. 1 is a sectional view of an embodiment of the present invention, and FIG.
FIG. 3 is a cross-sectional view of an example of a lead IC socket, and FIG.
It is sectional drawing of another example of the socket for lead ICs. 1 ... Pusher, 2 ... J-lead IC, 3 ... Sliding pin,
4, 14 contact pins, 5 J leads, 6 springs, 7 blocks, 24 pogo pins.

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】ＪリードICを搭載する円錐状にテーパのつ
いた摺動ピンと、該摺動ピンに嵌合し、該Ｊリードの外
側面には接触せず該Ｊリードの内側面に接触して該摺動
ピンの軸方向の移動により該軸と直角方向に開閉するコ
ンタクトピンと、該コンタクトピンを支持するブロック
と、該ブロックに固定され該摺動ピンを押しあげるばね
とを有することを特徴とするＪ型リード半導体装置用ソ
ケット。1. A conical tapered sliding pin on which a J-lead IC is mounted, fitted on the sliding pin, and not in contact with the outer surface of the J-lead but in contact with the inner surface of the J-lead. And a contact pin that opens and closes in a direction perpendicular to the axis by moving the slide pin in the axial direction, a block that supports the contact pin, and a spring that is fixed to the block and pushes up the slide pin. Characteristic socket for J-type lead semiconductor device.
JP2309694A 1990-11-15 1990-11-15 Socket for J-type lead semiconductor device Expired - Lifetime JP2735378B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2309694A JP2735378B2 (en) 1990-11-15 1990-11-15 Socket for J-type lead semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2309694A JP2735378B2 (en) 1990-11-15 1990-11-15 Socket for J-type lead semiconductor device

Publications (2)

Publication Number Publication Date
JPH04181172A JPH04181172A (en) 1992-06-29
JP2735378B2 true JP2735378B2 (en) 1998-04-02

Family

ID=17996160

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2309694A Expired - Lifetime JP2735378B2 (en) 1990-11-15 1990-11-15 Socket for J-type lead semiconductor device

Country Status (1)

Country Link
JP (1) JP2735378B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997006585A1 (en) * 1995-08-09 1997-02-20 Advantest Corporation Ic socket for j-shaped leads

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56135172U (en) * 1980-03-14 1981-10-13

Also Published As

Publication number Publication date
JPH04181172A (en) 1992-06-29

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