JP2729951B2 - Dispersion plating equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION a. Industrial Field of the Invention The present invention relates to a dispersion plating apparatus for mixing a plating solution with a dispersant (such as a composite material).

b. Prior Art FIG. 3 conceptually shows the dispersion plating apparatus conventionally used. In the figure, a is a plating tank, b is an air stirring pipe, c is a plating solution circulation pipe, d is a plating solution circulation pump, e is a number of air jets provided in the air stirring pipe, and f is a mixture of dispersant. It is a plating solution.

The plating solution in the plating tank a is circulated from the vicinity of the bottom of the plating tank a to the upper part thereof by the circulation pipe c, and air is fed into the bottom of the plating tank a from the air jet port e of the air stirring pipe b to form the plating solution. Is stirred, and the plated component (not shown) that has permeated into the plating tank a is plated while the suspension of the plating solution f in the plating tank a is maintained uniformly.

c. Problems to be Solved by the Invention When the plating operation is completed and the air stirring for the plating solution f is stopped, the dispersing material settles and accumulates in the air stirring pipe b as shown in FIG. As a result, the plating solution additive, for example, boric acid or the like is precipitated, and the air jet port e of the air stirring pipe b is blocked as a dispersant by the deposition of the additive. Therefore, when the plating operation is started again, a spout e which is partially blocked by the precipitate (dispersion material / precipitate, etc.) g is generated as shown in FIG.
Affects the speed, volume, and location of the planned air jet,
There has been a problem that the suspension state of the dispersion material of the plating solution f in the plating tank a cannot be kept constant.

The present invention has been made in view of such circumstances,
It is an object of the present invention to provide a dispersion plating apparatus which solves the above problems.

e. Means for Solving the Problems According to the above object, the present invention provides a distributed plating apparatus comprising a plating tank provided with a plating solution circulation pipe and an air stirring pipe. The above problem was solved by connecting a pipe for delivering a liquid.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

In FIG. 1, 1 is a plating tank, 2 is an air stirring pipe, 3 is a circulation pipe, 4 is a branch pipe provided by branching from a part of the circulation pipe 3, and the branch pipe 4 is the air stirring pipe 2 Connected in the middle of Reference numeral 5 denotes a plating solution circulating pump, 2a denotes an air outlet of an air stirring pipe, and 6 denotes a plating solution.

The circulation pipe 3 has a suction port 3a near the bottom of the plating tank 1,
An outlet 3b is provided near the surface of the plating solution 6.

The branch pipe 4 is a suction port 3a and a discharge port of the circulation pipe 3.
3b, the outlet 4a at the end thereof is connected and inserted into a specific position above the plating liquid surface of the air stirring pipe 2, and the plating liquid is supplied in the same direction as the air supply direction. It is configured to be able to.

The parts to be plated are placed in the plating solution 6 in the plating tank 1,
During the plating process, the plating solution 6 near the bottom of the plating tank 1 is supplied by the circulation pump 5 to the suction port 3 a of the circulation pipe 3.
From the outlet 3b at the junction 8 as before.
And the plating solution flowing through the branch pipe 4 and flowing toward the outlet 4a.

At the discharge port 4a of the branch pipe 4, the plating solution is sent in the same direction together with the air flowing in the air stirring pipe 2 in the direction of the arrow. Is discharged inside.

That is, in the air stirring pipe 2 from which the plating solution has been discharged, the air and the plating solution coexist, and both are in a disturbed state. As a result, after stopping the plating work,
The precipitate blocking 2a is physically removed.

In addition, the introduction of the plating solution into the air stirring pipe 2 can dissolve the additive precipitated and solidified in the air stirring pipe 2 as the plating solution temperature rises. And solidification of the deposited dispersing material, and a block of separated solidified solids is prevented from blocking an unblocked jet port.

FIG. 2 shows another embodiment of the apparatus according to the present invention, in which a circulating pipe is not provided with a branch pipe, and a dedicated supply pipe is provided for an air stirring pipe to provide a plating solution. is there. In the figure, 11 is a plating tank, 12 is an air stirring pipe, 13 is a circulation pipe, 14 is a supply pipe for supplying the plating liquid to the air stirring pipe 12, and the supply pipe 14 is a plating liquid suction port in the plating tank 11. 14b and an outlet 14a to the air stirring pipe 12 are provided. 15 is a circulation pump provided in the circulation pipe 13, 19 is a circulation pump provided in the supply pipe 14, 16
Indicates a plating solution.

In this apparatus, the plating solution in the plating tank 11 is
Circulates in the same manner as in the conventional apparatus. Air stirring pipe
The outlet 12a of the supply pipe 14 is inserted into 12, and the plating solution sucked directly from the plating tank 11 through the inlet 14b is supplied.

In this embodiment, since the plating solution to be supplied to the air stirring pipe 12 is configured to be supplied through the dedicated supply pipe 14,
In the above embodiment, the point that the supply amount of the plating solution to the air stirring pipe could not be adjusted is improved, and the supply amount can be adjusted for any reason.

e. Effects of the Invention According to the dispersion plating apparatus of the present invention, it is possible to effectively prevent the air outlet of the air stirring pipe from being blocked by the dispersant or the like.

In addition, the already deposited and deposited dispersing material and precipitates can be scientifically and physically removed to prevent the air outlet from being blocked, and the air flow can be kept constant.

Furthermore, the stirring state becomes constant, and the dispersion material in the plating solution can be maintained in a stable suspension state.

[Brief description of the drawings]

FIG. 1 is an explanatory view conceptually showing one embodiment of a dispersion plating apparatus according to the present invention, FIG. 2 is an explanatory view of another embodiment,
FIG. 3 is an explanatory view of a conventional apparatus, and FIGS. 4 and 5 are cross-sectional explanatory views of an air ejection port portion of an air stirring pipe of the conventional apparatus. 1.11 plating bath, 2.12 air stirring pipe, 3.13 circulation pipe, 4 branch pipe, 14 supply pipe.

Claims (1)

(57) [Claims] In a dispersion plating apparatus having a plating tank provided with a plating solution circulation pipe and an air stirring pipe, a pipe for sending a plating solution in the plating tank is connected to the air stirring pipe. Dispersion plating equipment.