JP2717353B2 - Soldering parts removal equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering component removing apparatus for removing a surface mounting component (such as an IC) mounted on a printed circuit board by soldering.

[0002]

2. Description of the Related Art Conventionally, a component removing apparatus for removing a surface mount component (such as an IC, hereinafter referred to as a component) mounted on a wiring board by soldering is a heating trowel that follows the shape of the component or the periphery of the component. Along with a plurality of heating nozzles.

[0003]

In the above prior art,
In order to remove parts having different shapes, a plurality of types of heating trowels and heating nozzle groups were required in accordance with the removal. Therefore, there has been a problem that it is not possible to cope with diversification of component shapes.

[0004] In order to solve this problem, there has been proposed an apparatus which uses four heated gas nozzles to deal with parts having various shapes and sizes (US Pat. No. 497,155).
No. 4), however, there is a problem that the device becomes large and complicated.

[0005]

According to the present invention, however, there is provided a driving means capable of moving the solder melting means along with the solder for mounting the components on the printed circuit board to be installed on the printed circuit board installation section. The above problem has been solved.

That is, according to the present invention, a printed circuit board can be placed.
A heated gas can be ejected to the main body of the apparatus having a substrate
One of the nozzle or optical beam at the bottom
One solder melting machine to be rotated around its upper end as a fulcrum.
Pivotally supported, and the substrate is
Parts were soldered of the printed circuit board attached to the mounting portion each
By dissolving the solder side removing the component device met
Te, the mobile plate provided in an intermediate portion of the solder dissolver, solder
Make sure that the tip of the melter is
Drive means that controls the robot to move
The driving means is connected to a pulse motor in the apparatus main body.
First and second wires tied are arranged in a ring.
And moving the first wire in a substantially horizontal plane XX of the moving plate.
Concatenates the direction, the second wire, directly or drive
Through a moving rod, the moving plate is substantially perpendicular to the XX direction.
While connecting in the YY direction in the horizontal plane,
Movement set when each pulse motor is rotated
The moving plate can be moved in the XX and YY directions by an amount.
A soldering device removing device characterized in that an automatic controller for controlling the same is arranged and configured .

In addition, the solder melting device is supported on the apparatus main body so as to be able to move up and down, and an automatic controller capable of raising the solder melting device to a predetermined height is mounted on the apparatus main body after a set time of solder melting has elapsed. And a soldering component removing device wherein the predetermined height has a gap between a lower end of the solder dissolver and an upper end of the component, at least a gap through which a component suction tool can be interposed .

[0008] the wire over the said wire, belt, strap, a chain or the like, refer to those of the driving of the motor can be conducted through the pulleys or sprockets or the like.

[0009]

The drive means for moving the solder dissolving device along with the solder for mounting the components on the printed circuit board to be installed on the printed circuit board installation portion is provided, so that the solder can be easily melted by one solder melting means. Can be melted.
Since the solder melting means can be moved up and down with respect to the printed circuit board installation portion, the amount of heat applied to the solder can be adjusted, the heating of the printed circuit board can be prevented, and a gap is formed above the component, and the component can be easily removed.

[0010]

An embodiment of the present invention will be described with reference to the drawings.

On one side 2 of the base 1, a board support (printed board installation section) 4 is placed. The board support 4 has a hook 5 that can hook the peripheral edge of the printed board.

An apparatus body 6 is installed on the other side 3 of the base 1.

In the apparatus main body 6, on the side of the substrate support fitting 4,
A chassis 7 is installed so as to be tiltable about a shaft 9, and a tip 7 a of the chassis 7 projects laterally from the apparatus main body 6 and is located above the substrate support 4. A lower plate 10 is fixed to a base end 7b of the chassis 7, and a protruding plate 11 having a horizontally elongated hole 12 is fixed to the lower plate 10. A pulley 14 is fitted on a shaft of a motor 13 installed in the apparatus main body 6, and a projection 15 is provided on the surface of the pulley 14 in the axial direction of the motor 13. Is inserted into the long hole 12. Accordingly, the rotation of the motor allows the base end portion 7b of the chassis 7 to move up and down, and the chassis 7 to be tilted with the up and down movement.

The front end 7a of the chassis 7 has
A box-shaped cover 16 is attached, and the tip 7
An opening 17 is formed in the bottom plate 8 at b. In addition, a first motor 20 and a second motor 21 are installed in parallel at the base end 7b of the chassis 7 with their shafts facing upward, and a through hole through which a nozzle with a heater can be fitted in the center of the opening 17. The moving plate 22 having the hole 23 is arranged (FIG. 4). In FIG. 4, the left-right direction is the XX direction, and the front-rear direction perpendicular to this direction is the YY direction.

An edge 24 of the movable plate 22 in the XX direction,
The both ends 27 and 27a of the first wire 26 are connected to the first wire 26, respectively. The first wire 26 is formed in a ring shape, is interposed with a tension spring 28, and has a pulley 29 and a pulley 29 attached to the shaft of the first motor 20. It is locked by rollers 30, 30a, 30b fixed to the bottom plate 8 of the chassis 7. Ends 27, 27a of the first wire 26
XX of the opening 17 by the rollers 30, 30a
It is arranged at a position crossing substantially the center of the direction.

An edge 25 of the moving plate 22 in the YY direction,
The two ends 31 and 31a of the second wire 31 are connected to the first wire 25a, respectively. The second wire 31 is formed in a ring shape and has a tension spring 33 interposed therebetween and a pulley 34 attached to the shaft of the second motor 21 and It is locked by rollers 35 and 35 a fixed to the bottom plate 8 of the chassis 7. The ends 32 and 32a of the second wire 31 are YY of the opening 17 by a roller 35 and a pulley 34.
It is arranged at a position crossing substantially the center of the direction.

In the above, the moving plate 22 is pulled by the first wire 26 by the rotation of the first motor 20 and is movable in the XX direction. The moving plate 22 is moved by the rotation of the second motor 21 to the second wire. The moving plate 22 can be traced along an arbitrary locus such as a square or a circle by controlling the rotation of both motors 20 and 21 by being pulled by 31.

A sensor 3 for detecting the initial position of the first wire 26 from the reference position is provided on the bottom plate 8 of the chassis 7.
6 and 36a are installed facing each other, and the second wire 31
The sensors 37 and 37a for detecting the initial position of are installed facing each other. With the first wire 26, the sensor 3
6 and 36a, a shielding plate 38 is attached at a position corresponding to the sensor 37, 37 with the second wire 31.
The shielding plate 39 is attached to a position corresponding to a.

A horizontal fixing plate 18 protrudes above the inner wall of the cover 16 of the chassis 7, and an inverted L-shaped fixing pipe 19 is fixed to the fixing plate 18 so as to penetrate downward. I have. The lower end 19a of the fixed pipe 19 is connected to the upper end 41 of the nozzle with heater 40 by a rubber tube 44, and the lower part 42 of the nozzle with heater 40 passes through the through hole 23 of the moving plate 22, and Opening 1
7 protrudes downward. The heater-equipped nozzle 40 has a lower part 42 in which a heater 43 is fitted and inserted.
2a is formed to have a small diameter (FIGS. 2 and 3). In addition, the heater-equipped nozzle 40 is swingable about a rubber tube 44.

The upper end 19b of the fixed pipe 19
Is connected via a rubber tube 48, 48a to a compressor 46 in a case 45 placed separately from the apparatus body 6.

Further, vacuum tweezers 49 for pulling up parts are used.
Has a hollow suction cup-shaped vacuum pad 50 at the distal end, and a vacuum pump 47 in a case 45 and a rubber hose 5 at the proximal end 49a.
1 are connected.

An operation panel 52 is provided on the upper surface of the apparatus main body 6.
The operation panel 52 has a main switch 53, a knob 54 for setting the amount of movement in the X direction, a knob 55 for setting the amount of movement in the Y direction, an operation start switch 57, and an operation stop switch 58 (FIG. 6). ).

As described above, the soldering component removing device 60 is configured (FIG. 1). In FIG. 1, 61 is a power cord, 62 is a power cord for supplying power from the apparatus main body 6 to the compressor 46 and the vacuum pump 47, and 59 is a foot switch.

The use of this device 60 according to the above embodiment will now be described.

The main switch 53 is turned on, and the printed circuit board 64 to which the component 65 is soldered is fixed to the hooking portion 5 of the board support 4. The part 65 is adjusted to the reference position. Here, the lower right position of the component 65 is set to match. Further, the moving plate 22 is XX by the knobs 54 and 55.
The movement is set so as to move along the rectangle on the horizontal plane according to the designated movement amount in the directions YY. At this time, the heater-equipped nozzle 40 is at the raised position.

The operation switch 57 is pressed. The compressor 46 operates to blow air from the tip of the nozzle 40 with heater. At the same time, the motor 13 operates to raise the base end 7b of the chassis 7 via the pulley 14, the projection 15, and the elongated hole 12 of the protruding plate, and lower the tip 7a of the chassis and the nozzle 40 with the heater (the nozzle 40 with the heater). Is a chain line 40a) in FIG.

Further, the operation switch 57 is pressed. The first motor 20 and the second motor 21 are operated, and the moving plate 22 starts to move in a rectangular shape by being pulled by the first wire 26 and the second wire 31.
2a also starts the rectangular movement.

While adjusting the knobs 54 and 55, the trajectory of the tip 42 a of the nozzle 40
Of the solder 66 in accordance with the position of the solder 66. The automatic control circuit controls the operation of the motors 20 and 21 so that the sensors 36, 36a, 37 and 37a and the shield plates 38 and 39 cooperate to control the operation of the motors 20 and 21 in accordance with the movement amount designated by operating the knobs 54 and 55. (Automatic controller).

Press the foot switch 59 (keep it pressed). Heater 4 for nozzle 40 with heater
3 operates, and injects hot air (about 400 to 500 ° C.) from the tip 42 a of the nozzle 40 with a heater. The nozzle 40 with the heater makes a rectangular motion along the solder 66 for a predetermined time (time for melting the solder) while injecting hot air.

After a predetermined time (after the solder is melted), a timer is activated by an automatic control circuit (automatic controller),
The motor 13 is operated, and the tip 42a of the heater-equipped nozzle 40 rises by about 10 mm (at this time, the position of the heater-equipped nozzle 40 is indicated by a dashed line 40b in FIG. 6) and makes a rectangular movement at this position. Subsequently, the vacuum pad 50 of the vacuum tweezers 49 is inserted between the nozzle 40 with the heater and the component 65, the vacuum pad 50 is pressed against the component 65, and the component 65 is pulled up by the vacuum tweezers 49. In the above, by performing a rectangular motion while injecting hot air with the heater-equipped nozzle 40 raised, the temperature of the solder 66 is kept substantially constant on average for the time required for component removal operation, and the solder 66 The heating of the printed circuit board 64 can be prevented while maintaining the dissolved state. Further, in the above, the nozzle 40 with the heater at the position of the chain line 40b
A circuit for automatically correcting the moving amount of the moving plate 22 set at the position of the chain line 40a is incorporated so that the hot air is always sprayed toward the solder 66 even in the rectangular movement of FIG.

When the component 65 is subsequently removed, the printed board 64 is detached from the board support 4, the next printed board 64 is mounted on the board support 4, and the above operation is repeated.

After the operation is completed, the foot switch 59 is released. The motor 13 operates, and the nozzle 40 with the heater moves up to the initial position. After a few seconds, the motors 20 and 21 stop, and the rectangular movements of the moving plate 22 and the heater nozzle 40 also stop. After a few more seconds, the compressor 46 stops, and the blowing of air also stops.

The main switch 53 is turned off.

Next, another embodiment will be described.

In the above embodiment, another solder melting machine can be used in place of the nozzle 40 with a heater. For example, as shown in FIG. 7, an optical beam generator 70 is attached to the lower end of a rod 69 to form a solder melting machine, and the upper end of the rod 69 is fixed to a fixing pipe 68 via a rubber tube 44. (FIG. 7).

In the above embodiment, the first wire 26 and the second wire 31 were also directly connected to the moving plate 22. However, as shown in FIG.
2 can also be connected via a drive rod 71. In this case, the second wire 31 is hooked on the pulley 34 of the second motor 21 and the other pulley 72 such that one side 31a of the second wire 31 is parallel to the YY direction. One end 71a of the driving rod 71 is fixed to one side of the second wire 31 with a stopper 73, and the other end 7b of the driving rod 71 is
2 is fixed to the edge 25 in the YY direction. At this time, the opening 17 of the bottom plate 8 of the chassis 7 can be formed in a cutout shape with an open end, and the moving plate 22 can be viewed directly from the side to be operated, so that the moving amount can be easily set. In this case, the tension spring 33 interposed in the second wire 31 is unnecessary.

Further, in the above embodiment, since the driving means of the moving plate 22 uses the wires 26 and 31,
The inertia can be made extremely small, the rectangular movement can be performed at a relatively high speed, and the weight of the system can be reduced, so that there are various effects that the motor can be downsized. However, other driving means can also be used .

In the above embodiment, the raising and lowering of the heater-equipped nozzle 40 is performed by rotating the chassis 7 about the shaft 9. However, a mechanism for fixing the chassis 7 and elevating only the heater-equipped nozzle 40 is provided. Other mechanisms may be used (not shown). In addition, nozzle 4 with heater
The mechanism for raising and lowering 0 can be omitted.

[0039]

Effects of the Invention is provided with the drive means capable of moving the like tip of the nozzle of the solder dissolver along the mounting solder components on a printed circuit board to be installed in-flop phosphorus <br/> preparative substrate holding unit, There is an effect that components can be efficiently removed with a small amount of heat.

Further , the upper end of the solder melting device is supported and rotated.
Because it can swing freely, one independent solder melting machine can be used.
Rotate along the solder position on each side of one part.
Using one solder dissolver, four rounds of the part
Can be melted.

Also, the solder melting device supports the upper end portion.
As the intermediate part is connected to the driving means,
However, it is necessary to increase the movement distance of the lower end of the solder dissolver.
The effect can be. In addition, moving the middle part of the solder dissolver
Connected to the pulse motor in the XX direction and YY direction of the plate respectively
Connected the wires and configured the driving means.
Smooth turning while keeping the turning speed of the
There are effects that can be made possible. Therefore, multiple solder melters
It was not necessary, for the different sizes of the parts, a single of the
And a small pulse motor.
To reduce the size and simplicity of the overall mechanism and improve operability.
There is an effect that a component removing device can be provided.

[Brief description of the drawings]

FIG. 1 is a front view illustrating a configuration of an embodiment of the present invention.

FIG. 2 is an enlarged front view of a solder melting device (a nozzle with a heater) used in an embodiment of the present invention.

FIG. 3 is an enlarged vertical sectional view of the nozzle with a heater.

FIG. 4 is an enlarged plan view of the driving device.

FIG. 5 is an enlarged side view of a state of use showing solder melting.

FIG. 6 is an enlarged front view of an operation panel used in the embodiment of the present invention.

FIG. 7 is an enlarged front view of another solder melting device (a rod with an optical beam generating portion).

FIG. 8 is an enlarged plan view of another driving device.

[Explanation of symbols]

 Reference Signs List 1 base 2 one side 3 other side 4 substrate support bracket 6 device body 7 chassis 9 axis 20 first motor 21 second motor 22 moving plate 24, 24a XX edge of moving plate 25, 25a moving plate YY Edge in the direction 26 First wire 31 Second wire 40 Nozzle with heater 60 Soldering component removal device 64 Printed circuit board 65 Components 66 Solder 69 Rod 70 Optical beam generator 71 Drive rod

Claims (2)

(57) [Claims] A substrate mounting portion on which a printed circuit board can be mounted is provided.
The apparatus main body having a nozzle or light can ejecting heated gas
One of the beams with one of the science beams at the lower end
The smelter is pivotally supported by the upper end as a fulcrum.
And attached to the substrate mounting part by the solder dissolver.
That the printed circuit board by dissolving the solder soldered parts each side a device to remove the component, the solder
Place the tip of the solder melter on the moving plate provided in the middle of the melter.
Can move along the solder mounting position of the component.
Driving means for controlling the driving means,
A first wire connected to a pulse motor is provided in the device body.
Wire and a second wire are respectively arranged in a ring shape, and the first wire
Connecting the ears in the XX direction in a substantially horizontal plane of the moving plate,
The second wire, directly or via a drive rod,
YY direction in a substantially horizontal plane of the moving plate orthogonal to the XX direction
And the respective pulse modes in the apparatus main body.
When the motor is rotated, it moves by the set amount.
Control the board to move in XX and YY directions
An apparatus for removing a solder component , comprising an automatic controller arranged and configured . 2. An automatic controller capable of supporting a solder melting device in a vertically movable manner on an apparatus main body and raising the solder melting apparatus to a predetermined height after a set approximately solder melting time has elapsed. 2. The apparatus according to claim 1, wherein the predetermined height has a gap between a lower end of the solder dissolver and an upper end of the component, at least a gap through which a component suction tool can be interposed.