JP2715910B2 - Multilayer printed wiring board and method of manufacturing the same - Google Patents
Multilayer printed wiring board and method of manufacturing the sameInfo
- Publication number
- JP2715910B2 JP2715910B2 JP6144220A JP14422094A JP2715910B2 JP 2715910 B2 JP2715910 B2 JP 2715910B2 JP 6144220 A JP6144220 A JP 6144220A JP 14422094 A JP14422094 A JP 14422094A JP 2715910 B2 JP2715910 B2 JP 2715910B2
- Authority
- JP
- Japan
- Prior art keywords
- terminal pad
- signal terminal
- wiring board
- layer
- ground
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【０００１】[0001]
【産業上の利用分野】本発明は多層印刷配線板に関し、
特に定特性インピーダンスに好適な多層印刷配線板に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer printed wiring board,
In particular, it relates to a multilayer printed wiring board suitable for constant characteristic impedance.
【０００２】[0002]
【従来の技術】従来、端面に内層パターンを引出しそれ
を端子とした多層印刷配線板（以下、多層配線板と記
す）が特開平１−３０９２７１号公報に開示されてい
る。この多層配線板は、図７（Ａ），（Ｂ）に示すよう
に、実装エリア１−１を設けた外層基板と、信号用パタ
ーンと電源用パターンを形成した内層板を積層して一括
焼成した多層配線板１の側端面に外部と接続する信号入
出力用と電源供給用の引出しパターン１７を露出し、そ
の露出したそれぞれの引出しパターン１７に端子パッド
４を形成して接合面１８を設け、絶縁板２１に貫通した
導体、例えばピン状のコネクタ端子２０を端子パッド４
と対向するように配設した端子板１９を端子パッド４と
コネクタ端子２０とを半田パンプ２３により接合し多層
配線板１と端子板１９間に形成された間隙に接合剤１５
を充填して接合部を保護するとともに端子板１９を多層
配線板１に接着し多層配線板１の側端面に信号入出力用
と電源供給用のコネクタ端子２０を配設した構成となっ
ている。2. Description of the Related Art Conventionally, a multilayer printed wiring board (hereinafter, referred to as a multilayer wiring board) having an inner layer pattern drawn out on an end face and using the terminal as a terminal is disclosed in Japanese Patent Application Laid-Open No. 1-309271. As shown in FIGS. 7A and 7B, this multilayer wiring board is formed by laminating an outer layer substrate provided with a mounting area 1-1 and an inner layer plate on which a signal pattern and a power supply pattern are formed. A lead pattern 17 for signal input / output and power supply to be connected to the outside is exposed on the side end surface of the multilayer wiring board 1 thus formed, and a terminal pad 4 is formed on each exposed lead pattern 17 to provide a bonding surface 18. A conductor penetrating through the insulating plate 21, for example, a pin-shaped connector terminal 20 is connected to the terminal pad 4.
The terminal pad 19 and the terminal pad 4 are connected to the terminal pad 4 and the connector terminal 20 by the solder pump 23 so that the bonding agent 15 is inserted into the gap formed between the multilayer wiring board 1 and the terminal plate 19.
And a terminal board 19 is adhered to the multilayer wiring board 1 and connector terminals 20 for signal input / output and power supply are provided on the side end surfaces of the multilayer wiring board 1. .
【０００３】又、特開平２−５８２８９号公報では定特
性インピーダンスとするために内層グランド層を網目状
にする構造や特開平１−２３８０９０号公報ではインピ
ーダンス変化を相殺させるためのインダクタンス成分を
有するパターンを設ける構造が開示されている。Japanese Patent Application Laid-Open No. 2-58289 discloses a structure in which an inner ground layer is meshed in order to obtain a constant characteristic impedance, and Japanese Patent Application Laid-Open No. 1-238090 discloses a pattern having an inductance component for canceling impedance change. Is disclosed.
【０００４】[0004]
【発明が解決しようとする課題】以上説明したように端
面に内層パターンを引出しそれを端子とした従来の多層
配線板では、定特性インピーダンスとするためのストリ
ップ回路構造として構成されておらず、その側端面の外
部接続端子も同軸型を用いた被接続回路ブロックの端子
となっていないので定特性インピーダンスを得ることが
できないという問題点があった。As described above, the conventional multilayer wiring board in which the inner layer pattern is drawn out to the end face and used as a terminal is not configured as a strip circuit structure for obtaining a constant characteristic impedance. Since the external connection terminal on the side end face is not a terminal of the connected circuit block using the coaxial type, there is a problem that a constant characteristic impedance cannot be obtained.
【０００５】又、定特性インピーダンスとするために内
層グランド層を網目状にした構造とする方法やインピー
ダンス変化を相殺させるためのインダクタンス成分を有
するパターンを設ける方法ではパターン設計の複雑化と
パターン設計上のリードタイムの短縮が図れないという
問題点があった。[0005] In addition, in order to obtain a constant characteristic impedance, a method of forming the inner ground layer into a mesh structure or a method of providing a pattern having an inductance component for canceling the impedance change complicate the pattern design and increase the pattern design. However, there is a problem that the lead time cannot be shortened.
【０００６】本発明の目的は、設計が容易で設計のリー
ドタイムの短縮ができ定特性インピーダンスが得られる
多層印刷配線板及びその製造方法を提供することにあ
る。SUMMARY OF THE INVENTION An object of the present invention is to provide a multilayer printed wiring board which is easy to design, can shorten the design lead time, and can obtain a constant characteristic impedance, and a method of manufacturing the same.
【０００７】[0007]
【課題を解決するための手段】本発明は、内層パターン
とこの内層パターンに接続する信号端子パッドを備えた
信号配線層と、この信号配線層の両面に絶縁層を介して
配置されたグランド端子パッドを備えたグランド層とを
有するストリップ回路構造の多層印刷配線板において、
前記信号端子パッドと前記グランド端子パッドが端面に
露出し、かつ前記絶縁層に前記信号端子パッド表面が露
出する切欠きを設け、この切欠きにより同軸型ピンコネ
クタとの接続が可能な構造とするか、または前記信号端
子パッドとグランド端子パッドが露出する端面に押圧す
ることにより導電性が得られる異方性導電シートが配置
されている。According to the present invention, there is provided a signal wiring layer having an inner layer pattern and a signal terminal pad connected to the inner layer pattern, and ground terminals arranged on both surfaces of the signal wiring layer via insulating layers. A multilayer printed wiring board having a strip circuit structure having a ground layer with pads,
The signal terminal pad and the ground terminal pad are exposed at an end face, and a cutout is provided in the insulating layer so that the signal terminal pad surface is exposed, so that the cutout can be connected to a coaxial pin connector. Alternatively, an anisotropic conductive sheet is provided in which conductivity is obtained by pressing the exposed end surface of the signal terminal pad and the ground terminal pad.
【０００８】本発明の多層印刷配線板の製造方法は、内
層基材の表面に内層パターンを形成する工程と、前記内
層パターンの形成面に光感光性樹脂フィルムを熱圧着
し、所定の信号端子パッド形成部を露出させたパターン
フィルムのマスクを当接し露光する工程と、炭酸ナトリ
ウム水溶液で現像し、前記信号端子パッドを光感光性樹
脂フィルムでマスクする工程と、このマスクした内層基
材の両面に絶縁層を介してグランド層を組合わせ真空熱
プレスにて圧着し積層板を形成する工程と、この積層板
を穴開け加工，銅めっき及び回路形成加工を行いスルー
ホールを有する多層印刷配線板を形成する工程と、この
多層印刷配線板の外形加工を行い前記信号端子パッドと
この信号端子パッドをマスクした前記光感光性樹脂フィ
ルムと前記グランド層を露出させる工程と、前記光感光
性樹脂フィルムを水酸化ナトリウム水溶液で剥離し前記
信号端子パッド表面が露出した切欠きを形成する工程と
を含む。According to the method for manufacturing a multilayer printed wiring board of the present invention, a step of forming an inner layer pattern on a surface of an inner layer base material, and a method of thermocompression-bonding a photosensitive resin film to a surface on which the inner layer pattern is formed, to form a predetermined signal terminal A step of contacting and exposing a mask of a pattern film exposing a pad forming portion, a step of developing with a sodium carbonate aqueous solution, and a step of masking the signal terminal pads with a photosensitive resin film; Forming a laminated board by combining a ground layer with an insulating layer through a vacuum hot press and forming a laminated board by punching, copper plating, and forming a circuit on the laminated board. Forming the multi-layer printed wiring board, processing the outer shape of the multilayer printed wiring board, the signal terminal pads, the photosensitive resin film masking the signal terminal pads, and the ground. The comprises the step of exposing, and a step in which the signal terminal pad surface was peeled off the light the photosensitive resin film with an aqueous solution of sodium hydroxide to form a notch that is exposed.
【０００９】[0009]
【実施例】次に、本発明の実施例について図面を参照し
て説明する。Next, embodiments of the present invention will be described with reference to the drawings.
【００１０】図１は本発明の第１の実施例の斜視図、図
２は図１の層ごとの分解斜視図である。本発明の第１の
実施例は、図１及び図２に示すように、厚みが１．６ｍ
ｍの多層配線板１で、銅厚３５μｍの内層パターン３と
内層パターン３に接続する幅が０．５〜１．０ｍｍの信
号端子パッド４ａが形成された信号配線層３ａを絶縁層
を介してグランド層３ｂで狭んだストリップ回路構造
で、信号端子パッド４ａは多層配線板の端面２に露出し
ている。信号配線層３ａの内層パターン３と信号端子パ
ッド４ａと接する厚みが０．１５ｍｍの絶縁層の信号端
子パッド４ａとの接触する面には信号端子パッド４ａと
同一幅で、奥行きが１．０ｍｍ，高さが０．１ｍｍの切
欠き５が設けられている。この時の多層配線板１の板
厚，内層パターン３間の間隔，信号配線層３ａとグラン
ド層３ｂ間の層間の間隔及び銅厚は所定の定特性インピ
ーダンスＺo の値によって設定される。FIG. 1 is a perspective view of a first embodiment of the present invention, and FIG. 2 is an exploded perspective view of each layer of FIG. As shown in FIGS. 1 and 2, the first embodiment of the present invention has a thickness of 1.6 m.
m, a signal wiring layer 3a on which an inner layer pattern 3 having a copper thickness of 35 μm and a signal terminal pad 4a having a width of 0.5 to 1.0 mm connected to the inner layer pattern 3 are formed via an insulating layer. In a strip circuit structure narrowed by the ground layer 3b, the signal terminal pads 4a are exposed on the end face 2 of the multilayer wiring board. The surface of the insulating layer which is in contact with the signal terminal pad 4a and has a thickness of 0.15 mm, which is in contact with the inner layer pattern 3 of the signal wiring layer 3a and the signal terminal pad 4a, has the same width as the signal terminal pad 4a and a depth of 1.0 mm. A notch 5 having a height of 0.1 mm is provided. Thickness of the multilayer wiring board 1 at this time, the spacing between the inner layer pattern 3, the interval and copper thickness of layers between the signal wiring layer 3a and the ground layer 3b is set by the value of the predetermined constant characteristic impedance Z o.
【００１１】 Ｚo ＝６０・ｌｎ［１．９（２Ｈ＋Ｔ）／（０．８Ｗ＋Ｔ）］／（εｒ）0.5 …ＩＰＣ−１−０００００５ Ｈ：信号層とグランド層の層間の間隔、Ｔ：内層パター
ンの導体厚、Ｗ：内層パターンの幅、εｒ：誘電率 図３（Ａ）〜（Ｇ）及び図４（Ａ）〜（Ｃ）は本発明の
第１の実施例の製造方法を説明する工程順に示した断面
図である。本発明の第１の実施例の製造方法は、まず、
図３（Ａ）に示すように、内層基材１６の表面に内層パ
ターン３を形成する。次に、図３（Ｂ）に示すように、
内層パターン３形成面に厚みが１００μｍのアクリル系
モノマーを主成分とする光感光性樹脂フィルム１０を熱
圧着する。次に、図３（Ｃ）に示すように、所定の信号
端子パッド形成部を露出させたパターンフィルムのマス
ク１１を光感光性樹脂フィルム１０に位置合わせして当
接し超高圧水銀灯で露光する。次に、図３（Ｄ）に示す
ように、未露光部１０ａの光感光性樹脂フィルム１０を
０．５〜５．０％の炭酸ナトリウム水溶液で現象し、図
３（Ｅ）に示すように、所定の信号端子パッド４ａを光
感光性樹脂フィルム１０の硬化部１０ｂでマスクする。Z o = 60 · ln [1.9 (2H + T) / (0.8W + T)] / (εr) 0.5 ... IPC-1-000005 H: distance between signal layer and ground layer, T: inner layer pattern 3 (A) to 3 (G) and FIGS. 4 (A) to 4 (C) illustrate steps for explaining the manufacturing method according to the first embodiment of the present invention. It is sectional drawing shown in order. The manufacturing method of the first embodiment of the present invention
As shown in FIG. 3A, the inner layer pattern 3 is formed on the surface of the inner layer base material 16. Next, as shown in FIG.
A photosensitive resin film 10 having an acrylic monomer as a main component and having a thickness of 100 μm is thermocompression-bonded to the inner layer pattern 3 forming surface. Next, as shown in FIG. 3 (C), the pattern film mask 11 exposing the predetermined signal terminal pad formation portion is positioned in contact with the photosensitive resin film 10 and brought into contact therewith, and is exposed with an ultrahigh pressure mercury lamp. Next, as shown in FIG. 3 (D), the photo-sensitive resin film 10 in the unexposed portion 10a is developed with a 0.5 to 5.0% aqueous solution of sodium carbonate, and as shown in FIG. 3 (E). Then, a predetermined signal terminal pad 4a is masked with a cured portion 10b of the photosensitive resin film 10.
【００１２】次に、図３（Ｆ）に示すように、硬化部１
０ｂでマスクした内層基材１６とその両面に絶縁層上に
形成されたグランド層３ｂを絶縁層１３を介して組合せ
真空熱プレスにより圧着して、内層パターン３の両面に
絶縁層１３を介してグランド層３ｂが配置された積層板
を形成する。次に、図３（Ｇ）に示すように、この積層
板を穴開け加工，銅めっき及び回路形成加工を行いスル
ーホールを有する多層配線板１を形成する。次に、図４
（Ａ）に示すように、多層配線板１の表面にＳＲ（ソル
ダレジスト）インク１２を印刷加工後、図４（Ｂ）に示
すように、多層配線板１の外形加工をＮ／Ｃルータによ
り行い、信号配線層３ａの光感光性樹脂フィルム１０の
硬化部１０ｂでマスクされた信号端子パッド４ａと、絶
縁層１３を介して内層パターン３の両面に配置されたグ
ランド層３ｂを多層配線板１の端面に露出させる。次
に、図４（Ｃ）に示すように、印刷配線板１の端面に露
出した光感光性樹脂フィルム１０の硬化部１０ｂを１．
０〜５．０％の水酸化ナトリウム水溶液で膨潤した後剥
離し、所定の信号端子パッド４ａの表面が露出した切欠
き５を形成して信号端子パッド４ａの表面と端面，これ
を狭んでグランド端子パッド４ｂが端面に露出した多層
配線板１を得る。Next, as shown in FIG.
The inner layer base material 16 masked with 0b and the ground layer 3b formed on the insulating layer on both surfaces thereof are press-bonded by a combined vacuum hot press via the insulating layer 13, and the inner layer pattern 3 is pressed on both surfaces of the inner layer pattern 3 via the insulating layer 13. A laminate on which the ground layer 3b is arranged is formed. Next, as shown in FIG. 3 (G), the laminated board is subjected to drilling, copper plating and circuit forming to form a multilayer wiring board 1 having through holes. Next, FIG.
As shown in FIG. 4A, after the SR (solder resist) ink 12 is printed on the surface of the multilayer wiring board 1, the external processing of the multilayer wiring board 1 is performed by an N / C router as shown in FIG. Then, the signal terminal pad 4a masked by the cured portion 10b of the photosensitive resin film 10 of the signal wiring layer 3a and the ground layers 3b disposed on both surfaces of the inner layer pattern 3 via the insulating layer 13 are connected to the multilayer wiring board 1. Expose to the end face. Next, as shown in FIG. 4C, the cured portion 10b of the photosensitive resin film 10 exposed on the end surface of the printed wiring board 1 is set to 1.
After swelling with a 0 to 5.0% aqueous sodium hydroxide solution, the sheet is peeled off to form a notch 5 in which the surface of a predetermined signal terminal pad 4a is exposed, and the surface and the end surface of the signal terminal pad 4a are narrowed to ground. The multilayer wiring board 1 with the terminal pads 4b exposed at the end faces is obtained.
【００１３】図５（Ａ），（Ｂ）は本発明の第１の実施
例の接続構造を示す断面図及び回路ブロックの一部切欠
き斜視図である。図５（Ａ），（Ｂ）に示すように、多
層配線板の端面２に信号端子パッド４ａと切欠き５及び
グランド端子パッド４ｂを形成した多層配線板１に接続
する回路ブロック６は、多層配線板の端面２の切欠き５
に嵌入するように植立され信号端子パッド４ａの表面に
接触する中心導体、例えば直径が０．１〜０．２ｍｍの
ピン状の同軸型ピンコネクタ７と、この同軸型ピンコネ
クタ７を中心に円筒状に形成された直径が〔回路ブロッ
クの板厚−０．２〕ｍｍ以下でグランド端子パッド４ｂ
に接触する外側導体のグランド８によって構成され、多
層配線板１を回路ブロック６に挿入した時に、同軸型ピ
ンコネクタ７は信号端子パッド４ａの表面と、グランド
８はグランド端子パット４ｂの端面と２点から４接点で
接続する。FIGS. 5A and 5B are a sectional view showing a connection structure of a first embodiment of the present invention and a partially cutaway perspective view of a circuit block. As shown in FIGS. 5A and 5B, the circuit block 6 connected to the multilayer wiring board 1 having the signal terminal pads 4a, the cutouts 5 and the ground terminal pads 4b formed on the end face 2 of the multilayer wiring board has a multilayer structure. Notch 5 in end face 2 of wiring board
A central conductor, such as a pin-shaped coaxial pin connector 7 having a diameter of 0.1 to 0.2 mm, which is planted so as to fit into the surface of the signal terminal pad 4a. Ground terminal pad 4b having a diameter of not more than [circuit block thickness-0.2] mm
When the multilayer wiring board 1 is inserted into the circuit block 6, the coaxial pin connector 7 is connected to the surface of the signal terminal pad 4a, and the ground 8 is connected to the end face of the ground terminal pad 4b. Connect with 4 contacts from the point.
【００１４】図６（Ａ），（Ｂ）は本発明の第２の実施
例の接続構造を示す断面図及び回路ブロックの一部切欠
き斜視図である。本発明の第２の実施例は、図６
（Ａ），（Ｂ）に示すように、第１の実施例の多層配線
板の端面２に異方性導電シート１４を配置した構造とす
る。この多層配線板１に接続する回路ブロック６は、多
層配線板の端面２の信号端子パッド４ａと対応する位置
に積層面と平行な方向に移動可能な中心導体、例えばピ
ン状の同軸型摺動ピンコネクタ７ａとこの同軸型摺動ピ
ンコネクタ７ａを中心に円筒状に形成された直径が〔回
路ブロックの板厚−０．２〕ｍｍ以下でグランド端子パ
ッド４ｂに接触する外側導体のグランド８によって構成
され、多層配線板１を回路ブロックに挿入し押圧接合す
る。この時、異方性導電シート１４に例えば日本合成ゴ
ム製ＪＰ−１０００を用いた場合２５％の歪量を与える
ことによって導電性が得られるので、同軸型摺動ピンコ
ネクタ７ａとグランド８の異方性導電シート１４との接
触部を異方製導電シート１４に２５％以上の歪量が与え
られるような凸形状とし、押圧力を同軸型摺動ピン７ａ
によって調整する。本実施例は第１の実施例と比べ接続
がより確実になるという効果がある。FIGS. 6A and 6B are a sectional view showing a connection structure according to a second embodiment of the present invention and a partially cutaway perspective view of a circuit block. A second embodiment of the present invention is shown in FIG.
As shown in (A) and (B), a structure in which an anisotropic conductive sheet 14 is disposed on the end face 2 of the multilayer wiring board of the first embodiment. The circuit block 6 connected to the multilayer wiring board 1 has a center conductor, for example, a pin-shaped coaxial slide, which can move in a direction parallel to the lamination surface at a position corresponding to the signal terminal pad 4a on the end face 2 of the multilayer wiring board. The pin connector 7a and the outer conductor ground 8 which is formed in a cylindrical shape around the coaxial type sliding pin connector 7a and has a diameter of [circuit board thickness-0.2] mm or less and contacts the ground terminal pad 4b. Then, the multilayer wiring board 1 is inserted into the circuit block and is joined by pressing. At this time, for example, when JP-1000 made of Japan Synthetic Rubber is used for the anisotropic conductive sheet 14, conductivity can be obtained by giving a strain amount of 25%, so that the difference between the coaxial sliding pin connector 7a and the ground 8 is obtained. The contact portion with the anisotropic conductive sheet 14 is formed in a convex shape so that a distortion amount of 25% or more is given to the anisotropic conductive sheet 14, and the pressing force is set to the coaxial sliding pin 7a.
Adjust by This embodiment has an effect that the connection is more reliable than the first embodiment.
【００１５】[0015]
【発明の効果】以上説明したように本発明は定特性イン
ピーダンスとするためのストリップ回路構造を有する印
刷配線板の信号端子パッドとグランド端子パッドをスト
リップ回路構造として端面に露出させ同軸型ピンコネク
タとの接続を可能とすることにより、容易に定特性イン
ピーダンス多層配線板が得られ、また入出力端子の数を
増大できるので、実装密度を大幅に向上できる効果があ
る。As described above, according to the present invention, a signal terminal pad and a ground terminal pad of a printed wiring board having a strip circuit structure for obtaining a constant characteristic impedance are exposed to the end face as a strip circuit structure. Is possible, a multilayer board having a constant characteristic impedance can be easily obtained, and the number of input / output terminals can be increased, so that the mounting density can be greatly improved.
【図１】本発明の第１の実施例の斜視図である。FIG. 1 is a perspective view of a first embodiment of the present invention.
【図２】図１の層ごとの分解斜視図である。FIG. 2 is an exploded perspective view of each layer in FIG.
【図３】（Ａ）〜（Ｇ）は本発明の第１の実施例の製造
方法を説明する工程順に示した断面図である。FIGS. 3A to 3G are cross-sectional views showing a manufacturing method according to the first embodiment of the present invention in the order of steps for explaining the manufacturing method.
【図４】（Ａ）〜（Ｃ）は本発明の第１の実施例の製造
方法を説明する工程順に示した断面図である。FIGS. 4A to 4C are cross-sectional views illustrating a manufacturing method according to a first embodiment of the present invention in the order of steps for explaining the manufacturing method.
【図５】（Ａ），（Ｂ）は本発明の第１の実施例の接続
構造を示す断面図及び回路ブロックの一部切欠き斜視図
である。FIGS. 5A and 5B are a cross-sectional view showing a connection structure according to the first embodiment of the present invention and a partially cutaway perspective view of a circuit block.
【図６】（Ａ），（Ｂ）は本発明の第２の実施例の接続
構造を示す断面図及び回路ブロックの一部切欠き斜視図
である。FIGS. 6A and 6B are a sectional view and a partially cutaway perspective view of a circuit block showing a connection structure according to a second embodiment of the present invention.
【図７】（Ａ），（Ｂ）は従来の多層配線板の一例の断
面図及び分解斜視図である。FIGS. 7A and 7B are a cross-sectional view and an exploded perspective view of an example of a conventional multilayer wiring board.
１ 多層配線板 １−１ 実装エリア ２ 多層配線板の端面 ３ 内層パターン ３ａ 信号配線層 ３ｂ グランド層 ４ 端子パッド ４ａ 信号端子パッド ４ｂ グランド端子パッド ５ 切欠き ６ 回路ブロック ７ 同軸型ピンコネクタ ７ａ 同軸型摺動ピンコネクタ ８ グランド ９ 搭載部品 １０ 光感光性樹脂フィルム １０ａ 未露光部 １０ｂ 硬化部 １１ マスク １２ ＳＲインク １３ 絶縁層 １４ 異方性導電シート １５ 接合材 １６ 内層基材 １７ 引出しパターン １８ 接合面 １９ 端子板 ２０ コネクタ端子 ２１ 絶縁板 ２２ 接合パッド ２３ 半田パンプ Reference Signs List 1 multilayer wiring board 1-1 mounting area 2 end face of multilayer wiring board 3 inner layer pattern 3a signal wiring layer 3b ground layer 4 terminal pad 4a signal terminal pad 4b ground terminal pad 5 notch 6 circuit block 7 coaxial pin connector 7a coaxial type Sliding pin connector 8 Ground 9 Mounting part 10 Photosensitive resin film 10a Unexposed part 10b Cured part 11 Mask 12 SR ink 13 Insulating layer 14 Anisotropic conductive sheet 15 Joining material 16 Inner layer base material 17 Lead-out pattern 18 Joining surface 19 Terminal board 20 Connector terminal 21 Insulating board 22 Bonding pad 23 Solder pump
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｒ 9/09 7815−5Ｂ Ｈ０１Ｒ 9/09 Ｚ ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 6 Identification code Agency reference number FI Technical display location H01R 9/09 7815-5B H01R 9/09 Z
Claims (3)
する信号端子パッドを備えた信号配線層と、この信号配
線層の両面に絶縁層を介して配置されたグランド端子パ
ッドを備えたグランド層とを有するストリップ回路構造
の多層印刷配線板において、前記信号端子パッドと前記
グランド端子パッドが端面に露出し、かつ前記絶縁層に
前記信号端子パッド表面が露出する切欠きを設け、この
切欠きにより同軸型ピンコネクタとの接続が可能な構造
としたことを特徴とする多層印刷配線板。1. A signal wiring layer having an inner layer pattern and a signal terminal pad connected to the inner layer pattern, and a ground layer having ground terminal pads disposed on both surfaces of the signal wiring layer via an insulating layer. In the multi-layer printed wiring board having a strip circuit structure, the signal terminal pad and the ground terminal pad are exposed at an end face, and the insulating layer is provided with a cutout at which the signal terminal pad surface is exposed. A multilayer printed wiring board having a structure that can be connected to a pin connector.
ドが露出する端面に押圧することにより導電性が得られ
る異方性導電性シートを配置したことを特徴とする請求
項１記載の多層印刷配線板。2. The multi-layer printed wiring board according to claim 1, wherein an anisotropic conductive sheet which is made conductive by pressing the end surface where the signal terminal pad and the ground terminal pad are exposed is arranged. .
る工程と、前記内層パターンの形成面に光感光性樹脂フ
ィルムを熱圧着し、所定の信号端子パッド形成部を露出
させたパターンフィルムのマスクを当接し露光する工程
と、炭酸ナトリウム水溶液で現像し、前記信号端子パッ
ドを光感光性樹脂フィルムでマスクする工程と、このマ
スクした内層基材の両面に絶縁層を介してグランド層を
組合わせ真空熱プレスにて圧着し積層板を形成する工程
と、この積層板を穴開け加工，銅めっき及び回路形成加
工を行いスルーホールを有する多層印刷配線板を形成す
る工程と、この多層印刷配線板の外形加工を行い前記信
号端子パッドとこの信号端子パッドをマスクした前記光
感光性樹脂フィルムと前記グランド層を露出させる工程
と、前記光感光性樹脂フィルムを水酸化ナトリウム水溶
液で剥離し前記信号端子パッド表面が露出した切欠きを
形成する工程とを含むことを特徴とする多層印刷配線板
の製造方法。3. A step of forming an inner layer pattern on a surface of an inner layer base material, and a step of forming a predetermined signal terminal pad forming portion by exposing a photosensitive resin film to the surface on which the inner layer pattern is formed by thermocompression bonding. A step of contacting and exposing a mask, a step of developing with an aqueous solution of sodium carbonate and a step of masking the signal terminal pad with a photosensitive resin film, and assembling a ground layer on both sides of the masked inner layer base material via an insulating layer A step of forming a laminated board by pressure bonding with a combined vacuum hot press, a step of forming a multilayer printed wiring board having through holes by punching, copper plating and forming a circuit of the laminated board; Exposing the signal terminal pads, the photosensitive resin film masking the signal terminal pads, and the ground layer to form an outer shape of a board; Forming a notch in which the surface of the signal terminal pad is exposed by peeling off the oil film with an aqueous solution of sodium hydroxide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6144220A JP2715910B2 (en) | 1994-06-27 | 1994-06-27 | Multilayer printed wiring board and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6144220A JP2715910B2 (en) | 1994-06-27 | 1994-06-27 | Multilayer printed wiring board and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0818243A JPH0818243A (en) | 1996-01-19 |
| JP2715910B2 true JP2715910B2 (en) | 1998-02-18 |
Family
ID=15357045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6144220A Expired - Fee Related JP2715910B2 (en) | 1994-06-27 | 1994-06-27 | Multilayer printed wiring board and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2715910B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004319257A (en) | 2003-04-16 | 2004-11-11 | Japan Aviation Electronics Industry Ltd | Balanced transmission connector |
| CN107479414A (en) * | 2017-08-14 | 2017-12-15 | 奥士康科技股份有限公司 | A kind of preparation method of impedance strip |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02273484A (en) * | 1989-04-12 | 1990-11-07 | Nec Corp | Printed wiring board structure |
-
1994
- 1994-06-27 JP JP6144220A patent/JP2715910B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0818243A (en) | 1996-01-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2004098251A1 (en) | Printed wiring board connection structure | |
| JPWO2004066691A1 (en) | Circuit board device and wiring board connection method | |
| WO2004079755A1 (en) | Flat shield cable | |
| JP3227681B2 (en) | Composite flexible printed circuit board | |
| JP3226959B2 (en) | Manufacturing method of multilayer flexible printed circuit board | |
| JP2715910B2 (en) | Multilayer printed wiring board and method of manufacturing the same | |
| KR100789531B1 (en) | Fabricating method of rigid flexible printed circuit board | |
| JP2000151112A (en) | Wiring board and its manufacture | |
| CN110366310B (en) | Soft and hard composite board and its making method | |
| JP2565387B2 (en) | Printed wiring board for IC card and manufacturing method thereof | |
| JPH11112150A (en) | Multilayered substrate and its manufacture | |
| JP2001015868A (en) | Circuit board, package, lead frame, and manufacture of it | |
| JP2000294931A (en) | Multilayer wiring board and manufacture thereof | |
| CN211297147U (en) | Buried plane resistor mixed-voltage step multilayer circuit board | |
| JPH01183196A (en) | Manufacture of multilayer printed wiring board device | |
| JP3329699B2 (en) | Multilayer wiring board and method of manufacturing the same | |
| CN217405406U (en) | Multilayer substrate | |
| CN114391304B (en) | Board-to-board connection structure and manufacturing method thereof | |
| CN111263511A (en) | Buried plane resistor mixed-voltage step multilayer circuit board | |
| JPH01183195A (en) | Manufacture of multilayer printed wiring board device | |
| KR200157893Y1 (en) | Regid-flexible laminate pcb | |
| JP4112479B2 (en) | connector | |
| JP2000357857A (en) | Manufacture of printed wiring board | |
| JP3117012B2 (en) | Card edge type connector provided with pad inside and method of manufacturing the same | |
| JPH03178193A (en) | Multilayer printed board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19971007 |
|
| LAPS | Cancellation because of no payment of annual fees |