JP2712344B2 - Manufacturing method of square electronic components - Google Patents
Manufacturing method of square electronic componentsInfo
- Publication number
- JP2712344B2 JP2712344B2 JP21394688A JP21394688A JP2712344B2 JP 2712344 B2 JP2712344 B2 JP 2712344B2 JP 21394688 A JP21394688 A JP 21394688A JP 21394688 A JP21394688 A JP 21394688A JP 2712344 B2 JP2712344 B2 JP 2712344B2
- Authority
- JP
- Japan
- Prior art keywords
- metal layer
- manufacturing
- solder
- square
- rectangular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は電子機器の回路基板のアース部に用いられる
アース用の角形電子部品の製造方法に関するものであ
る。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a square electronic component for grounding used in a grounding portion of a circuit board of electronic equipment.
従来の技術 従来、電子チューナを始めとする電子機器におけるシ
ャーシと、その内部に設けられた回路基板のアース部と
の間のアース接続は、人手または自動ハンダごてによる
ハンダ付けによって行われていた。2. Description of the Related Art Conventionally, a ground connection between a chassis of an electronic device such as an electronic tuner and a ground portion of a circuit board provided therein has been performed manually or by soldering with an automatic soldering iron. .
発明が解決しようとする課題 一方、セットメーカーにおいては、近年の電子機器の
軽薄短小化及び多機能化に応えるべく、チップ形電子部
品及びチップ部品実装機を導入し、電子チューナを始め
とする各電子機器回路における電子部品の高密度化を図
っている。そのため微細なハンダ量をコントロールでき
ない従来のハンダ付け方法では、ハンダ量が多い場合、
近接する周辺の部品の位置まで余分なハンダが流れてい
き、回路のショートや近接部品の損傷を招くといった問
題があった。一方、はんだ量が少ない場合はアース部の
接続不良を引き起すという問題があった。Problems to be Solved by the Invention On the other hand, set makers have introduced chip-type electronic components and chip component mounters in order to respond to the recent trend toward smaller, thinner, and more multifunctional electronic devices. Higher density electronic components in electronic equipment circuits. Therefore, with the conventional soldering method that cannot control the fine solder amount, if the solder amount is large,
There is a problem that excess solder flows to the position of a nearby peripheral component, thereby causing a short circuit or damage to a nearby component. On the other hand, when the amount of solder is small, there is a problem that poor connection of the ground portion is caused.
本発明はこのような問題点を解決するもので、近年の
チップ部品の自動実装化に追従することができるアース
用の角形電子部品を提供することを目的とするものであ
る。An object of the present invention is to solve such a problem, and an object of the present invention is to provide a grounded rectangular electronic component that can follow automatic mounting of chip components in recent years.
課題を解決するための手段 この課題を解決するために本発明は、セラミックある
いは樹脂などの絶縁材料からなる角形素子の全表面にAg
ペーストを塗布し、焼付を行い、その上に電解メッキ法
にてNiの金属層を形成し、その後、電解メッキ法にてSn
−Pbの金属層を形成した後、前記角形素子の厚み方向の
一方の面を任意の方法によって研磨することにより、Ag
層、Niの金属層、Sn−Pbの金属層を除去して角形素子面
を露出させることを特徴とするものである。Means for Solving the Problems In order to solve this problem, the present invention provides a method for forming an Ag element on an entire surface of a rectangular element made of an insulating material such as ceramic or resin.
The paste is applied, baked, and a Ni metal layer is formed thereon by electrolytic plating.
-After forming a metal layer of Pb, by polishing one surface in the thickness direction of the rectangular element by any method, Ag
The layer, the Ni metal layer, and the Sn-Pb metal layer are removed to expose the square element surface.
作用 次に、各金属層を役割について述べる。Agペーストは
角形素子に以後のメッキを行うための導電面を形成する
ためのもので、Niはハンダ付け時のハンダ喰われを防止
する役割を持ち、Sn−Pbはハンダ濡れ性を確保する役割
を持っている。このように形成された角形電子部品を回
路基板のアース部に用いる場合には、角形素子面の露出
部を接着剤で回路基板に接着して実装し、その後ハンダ
槽への浸漬を行う。すると、このハンダ浸漬時に角形素
子表面に応じた一定のハンダ量のみハンダ付け部に供さ
れるため、ハンダ量の多少のバラツキがなく、従来の問
題を解決することができ、しかもこの角形電子部品の自
動実装が可能で生産工数のダウンに大きな効果が得られ
ることになる。Operation Next, the role of each metal layer will be described. Ag paste is for forming a conductive surface for subsequent plating on the square element, Ni has a role of preventing solder erosion at the time of soldering, and Sn-Pb has a role of ensuring solder wettability. have. When the thus formed rectangular electronic component is used as a ground portion of a circuit board, the exposed portion of the rectangular element surface is bonded to the circuit board with an adhesive and mounted, and then immersed in a solder bath. Then, since only a fixed amount of solder corresponding to the surface of the square element is supplied to the soldering portion at the time of immersion of the solder, there is no slight variation in the amount of solder, and the conventional problem can be solved. Can be automatically mounted, and a great effect can be obtained in reducing production man-hours.
実施例 以下に本発明の一実施例を図面とともに説明する。第
１図は本発明の一実施例による製造方法により得られた
角形電子部品の構造を示す一部断面斜視図である。第２
図は本発明の工程フロー概要及び各工程事の素子概略構
成を示す説明図である。An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a partially sectional perspective view showing a structure of a rectangular electronic component obtained by a manufacturing method according to an embodiment of the present invention. Second
FIG. 1 is an explanatory diagram showing an outline of a process flow of the present invention and a schematic configuration of an element in each process.
次に、工程概要を第２図を用いて説明する。まず、セ
ラミックあるいは樹脂などの絶縁材料からなる角形素子
の全表面にAgペーストを塗布し、焼付を行いAg金属層２
を形成する。次いで、電解メッキ法によりNiメッキを行
い、全表面にNi金属層３を形成し、その後、電解メッキ
によりSn−Pbメッキを行い、全表面にSn−Pb金属層４を
形成した後、角形素子の厚み方向の一方の面（具体的に
は第１図の下面側）を任意の方法により研磨することに
よって角形素子面を露出させる。Next, an outline of the process will be described with reference to FIG. First, an Ag paste is applied to the entire surface of a rectangular element made of an insulating material such as ceramic or resin, and baked to form an Ag metal layer 2.
To form Next, Ni plating is performed by an electrolytic plating method, a Ni metal layer 3 is formed on the entire surface, and then Sn-Pb plating is performed by an electrolytic plating, and a Sn-Pb metal layer 4 is formed on the entire surface. One surface in the thickness direction (specifically, the lower surface side in FIG. 1) is polished by an arbitrary method to expose the rectangular element surface.
第１図はこのようにして得られた角形電子部品を示し
ており、５は角形電子部品である。FIG. 1 shows a rectangular electronic component obtained in this manner, and numeral 5 denotes a rectangular electronic component.
発明の効果 本発明にて形成された角形電子部品をアース部に用い
た場合、ハンダ浸漬時のハンダ付け性がよく、かつハン
ダ喰われがなく、しかも部品表面の面積に応じた一定の
ハンダ量のみ回路基板とシャーシ間に供給されることに
なる。このため、従来のハンダ付け時に発生していたハ
ンダ過多による近接部分の損傷及び回路のショートおよ
び、ハンダが少ないことによるアース部の接続不良とい
った問題が解決できるとともに、この角形電子部品自体
の自動実装による生産工程の大幅な削減が図れるもので
ある。Effect of the Invention When the rectangular electronic component formed by the present invention is used for the ground portion, the solderability during solder immersion is good, the solder is not eroded, and a constant amount of solder according to the surface area of the component. Only the power is supplied between the circuit board and the chassis. For this reason, it is possible to solve problems such as damage to a nearby portion due to excessive soldering and short-circuiting of the circuit due to excessive soldering and poor connection of a ground portion due to a small amount of soldering, and automatic mounting of this square electronic component itself. Can greatly reduce the production process.
第１図は本発明の一実施例による製造方法により得られ
た角形電子部品の構造を示す一部断面斜視図、第２図は
本発明の工程フロー概略及び各工程毎の素子概略構成を
示す説明図である。 １……セラミックまたは樹脂などの絶縁材料からなる角
形素子、２……Ag金属層、３……Ni金属層、４……Sn−
Pb金属層、５……角形電子部品。FIG. 1 is a partial cross-sectional perspective view showing the structure of a rectangular electronic component obtained by a manufacturing method according to one embodiment of the present invention, and FIG. 2 shows a schematic process flow of the present invention and a schematic configuration of an element for each process. FIG. 1 ... Square element made of insulating material such as ceramic or resin, 2 ... Ag metal layer, 3 ... Ni metal layer, 4 ... Sn-
Pb metal layer, 5 ... Square electronic parts.
Claims (1)
らなる角形素子の全表面にAgペーストを塗布し、焼付を
行い、その上に電解メッキ法にてNiの金属層を形成し、
その後、電解メッキ法にてSn−Pbの金属層を形成した
後、前記角形素子の厚み方向の一方の面を任意の方法に
より研磨することにより、Ag層、Niの金属層、Sn−Pbの
金属層を除去して角形素子面を露出させることを特徴と
する角形電子部品の製造方法。1. An Ag paste is applied to the entire surface of a rectangular element made of an insulating material such as ceramic or resin, baked, and a Ni metal layer is formed thereon by electrolytic plating.
Thereafter, after forming a Sn-Pb metal layer by an electrolytic plating method, by polishing one surface in the thickness direction of the rectangular element by an arbitrary method, an Ag layer, a Ni metal layer, and a Sn-Pb metal layer. A method for manufacturing a square electronic component, comprising removing a metal layer to expose a square element surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21394688A JP2712344B2 (en) | 1988-08-29 | 1988-08-29 | Manufacturing method of square electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21394688A JP2712344B2 (en) | 1988-08-29 | 1988-08-29 | Manufacturing method of square electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0262097A JPH0262097A (en) | 1990-03-01 |
| JP2712344B2 true JP2712344B2 (en) | 1998-02-10 |
Family
ID=16647667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21394688A Expired - Lifetime JP2712344B2 (en) | 1988-08-29 | 1988-08-29 | Manufacturing method of square electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2712344B2 (en) |
-
1988
- 1988-08-29 JP JP21394688A patent/JP2712344B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0262097A (en) | 1990-03-01 |
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