JP2710492B2 - Method for manufacturing multilayer printed wiring board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer printed wiring board, and more particularly to a method for forming a contact via for connecting a lower layer pattern and an upper layer pattern.

[0002]

2. Description of the Related Art FIG. 2 is a perspective view showing an example of a conventional method for forming a contact via of a multilayer printed wiring board in the order of manufacturing steps.

A conventional method for forming a contact via for connecting a lower layer pattern and an upper layer pattern in a method for manufacturing a multilayer printed wiring board is as follows. First, as shown in FIG. A pattern 12 is formed, and then a dielectric paste 1 is formed thereon as shown in FIG.
4 is applied by a screen printing method or a photolithography method to form a through hole 16, and then FIG.
As shown in FIG. 2, a conductive paste 13 is applied to the through holes 16 by screen printing or plating to form a contact via, and finally, as shown in FIG. 2D, an upper layer pattern 15 is formed thereon. The procedure to do it is adopted.

[0004]

In the conventional method for manufacturing a multilayer printed wiring board as described above, when a dielectric paste is applied by a screen printing method to form a through hole, a dielectric material is formed in the through hole. There is a drawback that the paste bleeds or drools and the through-holes are filled. In the case of forming a through hole by applying a dielectric paste by photolithography method, there is a drawback that filled the through hole of the residue of the developer in the developing step, thus defective products are not multi
There is a drawback to say.

[0005]

According to the present invention, a multilayer printed wiring board is manufactured by forming a lower layer pattern on a substrate by a photolithography method, and then forming a hydrophobic layer on a connection portion between the lower layer pattern and the upper layer pattern. A conductive paste having a property is applied by a screen printing method to form a thick film of the contact via, and then a dielectric paste having a hydrophilic property is screened on the lower layer pattern excluding the substrate and the contact via portion. Forming a thick film of an insulating layer by applying by a printing method, and then forming the upper layer pattern by photolithography on the contact via of the conductive paste and the insulating layer of the dielectric paste. In.

[0006]

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view showing an example of a multilayer printed wiring board to which one embodiment of the present invention is applied in the order of manufacturing steps.

In this embodiment, first, as shown in FIG. 1A, a lower layer pattern 2 is formed on a substrate 1 by photolithography. Next, as shown in FIG. 1B, a conductive paste 3 having hydrophobicity (for example,
For example, gold (Au) as a conductor powder and lead borosilicate glass (Si
_{O 2 -PbO-B 2 O 3} ) as a main component, Terupi Ne O
(1-p-menten-8-ol) or dipentene
(1,8-p-menthadiene) or xylene or its
A mixture containing two or three of these as the main solvent
Body paste) is applied by a screen printing method to form a thick film of the contact via. Then 1 (c), the on the lower pattern 2 excluding the substrate 1 and the contact vias, dielectric paste 4 has a hydrophilic (e.g.
Alumina (Al ₂ O ₃ ) and lead borosilicate glass (Si
O ₂ -PbO-B ₂ O ₃ )
Induction using lenglycol or a mixture thereof as the main solvent
An electric paste is applied by a screen printing method to form a thick insulating layer. In this case, since the conductive paste 3 has hydrophobicity, the dielectric paste 4 is not separated from the conductive paste 3 and does not enter the conductive paste 3 , so that a normal contact via can be formed. The thick conductive paste 3 and the dielectric paste 4 thus formed are cured to form contact vias and insulating layers, respectively. Finally, Fig. 1 (d)
As shown in (1), an upper layer pattern 5 is formed on the contact via of the conductive paste 3 and the insulating layer of the dielectric paste 4 by photolithography. Thereby, the lower layer pattern 2 and the upper layer pattern 5 are connected by the contact via, and a multilayer printed wiring board is completed.

[0009]

As described above, according to the method of manufacturing a multilayer printed wiring board of the present invention, a lower layer pattern is formed on a substrate by photolithography, and then a lower layer pattern is formed on a portion connected to an upper layer pattern. A conductive paste having a hydrophobic property is applied by a screen printing method to form a thick film of the contact via, and then a dielectric paste having a hydrophilic property is screened on the substrate and the lower layer pattern excluding the contact via portion. By applying a printing method to form a thick insulating layer, and then forming an upper layer pattern by photolithography on the contact via of the conductive paste and the insulating layer of the dielectric paste, the inside of the through hole Since no bleeding or dripping of the dielectric paste and no residue of the developing solution are generated, it is possible to reduce the occurrence of defective products. There is a result.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of a multilayer printed wiring board to which an embodiment of the present invention is applied in the order of manufacturing steps.

FIG. 2 is a perspective view showing an example of a conventional method for forming a contact via of a multilayer printed wiring board in the order of manufacturing steps.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Lower layer pattern 3 Conductor paste 4 Dielectric paste 5 Upper layer pattern 11 Substrate 12 Lower layer pattern 13 Conductor paste 14 Dielectric paste 15 Upper layer pattern 16 Through hole

Claims (1)

(57) [Claims] 1. A lower layer pattern is formed on a substrate by a photolithography method, and a conductive paste having a hydrophobic property is applied by a screen printing method on a connection portion with the upper layer pattern of the lower layer pattern to form a contact via. thick film is formed, then the substrate and the contact vias of
The dielectric paste having a hydrophilic on the lower pattern to form a thick film of the coating to the insulating layer by screen printing except, then the insulation of the dielectric paste and the contact via the conductive paste A method for manufacturing a multilayer printed wiring board, comprising forming the upper layer pattern on a layer by photolithography.