JP2710230B2 - Board crack detection device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate crack detecting device capable of easily and reliably detecting a crack in a substrate used for manufacturing a chip resistor, a hybrid IC, or the like.

[0002]

2. Description of the Related Art Conventionally, chip resistors and hybrid I
A ceramic substrate is often used as a material of a substrate used for manufacturing C and the like, and a large number of elements are mounted on one substrate. In particular, in recent years, the trend toward miniaturization of elements has progressed, and accordingly, the substrates have also become thinner. Further, in this type of manufacturing process, a groove called a break line is formed on the substrate in order to easily divide each element mounted on the substrate. As described above, the substrate is very easily broken due to the thinning of the substrate and the grooves formed in the substrate.

[0003] In general, in the process of resistive printing of elements on a substrate and in processes such as laser trimming, automation is progressing. When a substrate crack occurs, the process is automatically stopped. This was a major cause of efficiency loss. In addition, performing various types of processing on the broken substrate wastes processing time, and as a result, reduces production efficiency.

[0004] In order to solve such problems, enable unattended operation for a long time, and improve production efficiency, it is necessary to perform a process of trimming a substrate before trimming a chip resistor or a hybrid IC. It is necessary to take a method of detecting cracks, sending only a substrate without cracks to a processing step such as trimming, and removing a substrate where a crack is detected in advance from the processing step.

[0005] As a conventional substrate crack detecting device, for example, Japanese Patent Application Laid-Open Nos. 5-6930 and 5-23513.
There is a technique disclosed in Japanese Patent Application Publication No. 0-200. The former detects cracks in a semiconductor wafer, but can also be applied to substrate crack detection. Specifically, the cracking of the semiconductor wafer is detected by detecting a breaking sound of the semiconductor wafer and a collision sound generated by collision of fragment particles generated from a cracked portion of the semiconductor wafer with the ultrasonic generator. .
On the other hand, the latter is to detect a substrate crack by optically detecting a chip generated from a cracked portion of the substrate.

[0006]

However, in the prior art disclosed in Japanese Patent Laid-Open No. 5-6930, cracking of a semiconductor wafer is detected by detecting a breakage sound or a collision sound. It has been difficult to accurately detect sound in an automated line, which has caused a malfunction.

On the other hand, according to the conventional technique disclosed in Japanese Patent Application Laid-Open No. 5-235130, only a crack in a substrate that causes a chip of a size that can be detected optically can be detected. In other words, it is very difficult for this conventional substrate crack detection device to detect a crack in the substrate that is in a state in which the substrate is streaked and hardly causes a chip.

As described above, since the conventional substrate crack detection device cannot accurately detect a substrate crack, the substrate having the crack is fed into a processing step, and as a result, the substrate is processed. A situation had to be stopped. Therefore, unattended operation and automatic operation cannot be performed for a long time in the manufacturing process of the chip resistor and the hybrid IC including the crack detection step and the processing step.

Further, even if the processing is not stopped,
Useless processing is performed on the cracked substrate, resulting in a decrease in processing efficiency.

[0010]

In order to solve the above-mentioned problems, a substrate crack detecting apparatus according to the present invention has a hole for ejecting air, a detecting table on which a substrate is mounted, and air from the hole. Air blowing means for blowing up the substrate on the detection table, and the side of the substrate when air is being blown out from the hole.
Positioning means for moving in a direction to hold down the substrate from the other side, and cracking detection means for detecting that the positioning means has moved to a preset position and detecting a crack in the substrate according to the detection result. It is provided. That is,
At the time of positioning of the substrate by the positioning means, a break of the substrate is detected when the positioning means moves beyond a position where the positioning means should move in order to position a substrate without cracks.

Further, in the present invention, means for tilting the detection table is provided in order to remove a cracked substrate from the detection table.

[0012]

Next, an embodiment of the present invention will be described in detail with reference to the drawings.

In this embodiment, compressed air is blown onto a substrate from a hole provided in a crack detection table on which the substrate is mounted, and in this state, the substrate is pressed by a fixed member and a movable member to perform positioning. Here, if there is no crack in the substrate, the substrate can be positioned when the movable member moves to an appropriate position according to the dimensions of the substrate, but if there is a crack in the substrate, the movable member moves to the appropriate position. Even if it moves, the substrate cannot be pressed and positioned, and furthermore, it continues to move. Therefore, cracking of the substrate is detected by detecting that the movable member moves beyond an appropriate position set according to the dimensions of the substrate.

FIG. 1 is a perspective view showing the structure of one embodiment of the present invention, FIG. 2 is a perspective view showing the structure of the compressed air blowing portion in FIG. 1, and FIG. A-
It is A 'sectional drawing. Referring to FIG. 1, a crack detection table 2 on which a substrate 1 to be crack-detected is placed has air ejection holes 3a and 3b for blowing compressed air, fixing members 4a and 4b for positioning the substrate 1, Further, slits 23a and 23b, which are moving spaces for the pressing members 5a and 5b that move to position the substrate 1, are provided. In this embodiment, the air ejection holes 3a and 3
Although only two b's are provided, the number and positions of the holes can be set as appropriate according to the shape, size, and position of the center of gravity of the substrate 1.

The crack detection table 1 is disposed on a stage 9 via four columns 8. In the space between the crack detection table 1 and the stage 9, a structure for blowing compressed air from the air ejection holes 3a and 3b, a holding member 5a
And a structure for driving substrate 5 and 5b to clamp substrate 1 and a structure for detecting the movement position of holding members 5a and 5b and detecting a crack in the substrate.

As shown in FIG. 2, the structure for blowing compressed air from the air ejection holes 3a and 3b is such that compressed air supplied from a compressed air generation source (not shown) is branched by a branch pipe 24. The pipe 10 guides the air to the air ejection holes 3a and 3b. Air outlets 3a and 3b
Is provided on the crack detection table 2 as described above, and blows out compressed air so as to push up the substrate 1 placed on the crack detection table 2. This compressed air ejection pressure is
Depending on various conditions such as the type of substrate, the compressed air pressure regulating valve 11
Can be adjusted.

Next, a configuration for clamping the substrate 1 and a configuration for detecting a substrate crack will be described with reference to FIG.

The cylinder output shaft 17 of the air cylinder 6a
Is connected to the holding member 5a via the connecting lever 15, and by operating the air cylinder 6a, the holding member 5a is driven so as to contact the side surface of the substrate 2. When the pressing member 5a moves to the reference position P1 (P2 in the vertical direction), the normal substrate 2 without cracks is positioned by the pressing member 5a and the fixing member 4a.

When the substrate 2 is cracked, the pressing member 5a cannot position the substrate 2 even if it moves to the reference position P1, and further moves in the same direction to detect the crack detection position. When the substrate 2 has moved to Q1 (Q2 in the vertical direction), it is detected that the substrate 2 is cracked. That is, the crack detecting dowel 12 provided on the lower surface of the connecting lever 15 moves in the same direction as the pressing member 5a moves. When the pressing member 5a moves to the crack detection position Q1, the crack detection dowel 12 operates the crack detection sensor 13 installed on the stage 9 via the sensor mounting plate 16, and outputs a crack detection signal. Let it. Here, when the holding member 5a clamps the substrate 2 at the reference position P1 or when a crack detection signal is output from the crack detection sensor 13, the return spring 7a returns the holding member 5a to the original position. Acts to return.

The vertical direction (direction orthogonal to AA ')
The structure for positioning the substrate and detecting the crack is basically the same as that in the horizontal direction shown in FIG. 3, and the operation is also the same.

Next, the operation of this embodiment will be described with reference to FIGS. 3, 4, 5, 6, and 7. FIG.

FIG. 4 is a flowchart showing the operation procedure of the present embodiment. FIG. 5 shows an example in which no crack has occurred in the substrate. FIG. FIG. 7 shows an example in which the substrate has the same lateral crack.

The operation when the substrate 2 is not broken will be described with reference to FIGS. 3, 4 and 5. First, the substrate 2 is placed at a predetermined position on the crack detection table 1 by a substrate transport mechanism (not shown) (S101). When the substrate 2 is placed, the compressed air 18 is ejected from the air ejection holes 3a and 3b provided in the crack detection table 1 (S102). When the compressed air 18 is ejected, the substrate 2 floats due to the ejection pressure as shown in FIG. 5A. The ejection pressure of the compressed air 18 is adjusted by the compressed air pressure regulating valve 11 so that the height of the lift is smaller than the height of the holding member 5a and the fixing member 4a. In this state, the air cylinder 6a is operated to move the holding member 5a to the reference position P1. That is, as shown in FIG. 5B, the substrate 2 is abutted against the fixing member 4a, and the substrate 2 is positioned by the pressing member 5a and the fixing member 4a (S103). Here, the holding member 5a is moved to the reference position P
When the substrate 2 has moved to 1, the substrate 2 cannot be positioned, and it is detected whether or not the substrate 2 moves further beyond the reference position P1 (S104). When the substrate 2 is not cracked, the pressing member 5a can completely position the substrate 2 when the substrate 2 moves to the reference position P1.
No more moving. Accordingly, it is detected that there is no crack in the substrate 2 placed on the crack detection table 1 (S106). When this operation is completed, the pressing member 5a is returned to the original position by the action of the return spring 7a, and prepares for the next processing of the substrate 2. The substrate 2 detected as having no crack is moved to the next processing step. Here, when the substrate crack is detected, the positioning is also performed at the same time, so that the processing efficiency in the subsequent stages is improved. In the above description, the procedure for detecting only the cracks in the horizontal direction is described.

Next, referring to FIG. 3, FIG. 4 and FIG.
The case where the substrate is broken in the vertical direction will be described. The basic operation procedure is the same as the above-described processing for a substrate without cracks. However, after transporting the horizontally cracked substrate 2 onto the crack detection table 1 (S101), the compressed air 18 is ejected from the air ejection holes 3a and 3b (S102).
As shown in FIG. 6A, the substrate 2
Rises higher than the fixing member 4a, and similarly, the broken piece 19b also rises higher than the holding member 5a. That is, unlike the case of the substrate 2 having no crack, the whole does not float uniformly. Therefore, even if the pressing member 5a is moved to the reference position P1 (S103), the substrate 2 cannot be clamped together with the fixing member 4a. Then, the pressing member 5a moves beyond the reference position P1 and further to the crack detection position Q1 inside the substrate 2 (S104). Then, the crack detection dowel 12 operates the crack detection sensor 13 to output a crack detection signal from the crack detection sensor 13 (S105). When the crack detection signal is output, the cracks 19a and 19b of the substrate 2 are removed and discharged from the manufacturing process by a control device (not shown). When this crack detection signal is output, the pressing member 5a is returned to the original position by the action of the return spring 7a, and prepares for processing on the next substrate 2.

Next, referring to FIG. 3 and FIG.
Will be described in the case where is broken in the lateral direction. However,
The basic operation procedure is the same as the procedure in the case where the substrate 2 is cracked in the vertical direction. Referring to FIG. 7A, the compressed air 18 jetted from the air jet holes 3a and 3b causes the broken pieces 20b of the substrate 2 to float higher than the upper surface of the broken pieces 20a. In this state, the pressing member 5b is moved in the direction of the fixing member 4b. Even if the pressing member 5b is moved to the reference position P2, the substrate 2 is not clamped, and the pressing member 5b moves further.
This is because, as shown in FIG. 7B, the fragment 20b floats above the fragment 20a. Then, when the holding member 5b moves to the crack detection position Q2 inside the reference position P2, the crack detection sensor 13 is operated by the crack detection dowel 12, and a crack detection signal is output. Subsequent operations are the same as those performed when the substrate 2 is broken in the horizontal direction, and a description thereof will be omitted.

Further, even in the case where cracks are generated in both the vertical and horizontal directions, the crack detection signal in both directions is output by performing the above-described crack detection operation in both directions. However, in practice, if a crack detection signal is output in either the vertical or horizontal direction, the substrate 2 having the crack is removed and discharged from the manufacturing process.

Next, one configuration for removing cracks of the substrate 2 from the crack detection table 1 will be described with reference to FIG.

FIG. 8A shows a configuration for removing the cracked substrate 21 from the crack detection table 1, and a rotation mechanism 22 is provided below the stage 9 on which the crack detection table 1 is placed via the support 8. . As shown in FIG. 8B, the rotation mechanism 22 tilts the crack detection table 1 by rotating the stage 9 in the direction of the arrow M, and drops the cracked substrate 21 mounted thereon to the side. It is. When a crack detection signal is output from the crack detection sensor 13, the rotation mechanism 22 operates, and the cracked substrate 1 on the crack detection table 1 is discharged to the side. After the broken substrate 22 is discharged, the rotation mechanism 22
The stage 9 and the like are returned to the original state, and are prepared for processing of the next substrate.

[0029]

As described above, according to the substrate crack detecting device of the present invention, a cracked substrate can be automatically detected in the chip resistor or hybrid IC manufacturing process and removed from the manufacturing process. Unattended operation and automatic operation can be performed for a long time.

Further, since the cracked substrate is discharged from the manufacturing process, unnecessary processing is not performed on the cracked substrate, so that the production efficiency is significantly improved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a configuration of an embodiment of the present invention.

FIG. 2 is a perspective view showing a configuration of a compressed air blowing portion in one embodiment of the present invention.

FIG. 3 is a sectional view taken along line A-A 'in FIG.

FIG. 4 is a flowchart illustrating an operation procedure according to an embodiment of the present invention.

FIG. 5 is a sectional view showing the operation of one embodiment of the present invention when the substrate has no crack.

FIG. 6 is a sectional view showing the operation of the embodiment of the present invention with respect to the substrate having a crack in the vertical direction in FIG.

FIG. 7 is a sectional view showing the operation of the embodiment of the present invention with respect to the substrate having a crack in the lateral direction in FIG.

FIG. 8 is a sectional view showing a configuration for removing a cracked substrate from a crack detection table.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Break detection base 2 Substrate 3a, 3b Air ejection hole 4a, 4b Fixing member 5a, 5b Pressing member 6a, 6b Air cylinder 7a, 7b Return spring 8 Post 9 Stage 10 Compressed air piping 11 Compressed air pressure regulating valve 12 Crack detection Doc 13 Crack detection sensor 14 Spring mounting column 15 Connecting lever 16 Sensor mounting plate 17 Cylinder output shaft 18 Compressed air 19a, 19b, 20a, 20b Cracked piece 21 Cracked board 22 Rotary mechanism 23a, 23b Slit 24 Branch pipe

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification number Agency reference number FI Technical display location H01L 21/68 H01L 21/68 G H05K 13/08 H05K 13/08 Z

Claims (5)

(57) [Claims] 1. A detection table having a hole for ejecting air and mounting a substrate, air ejecting means for ejecting air from the hole and blowing up the substrate, and when air is ejected from the hole. The side of the substrate
Positioning means for moving in a direction to hold the substrate from one side , the positioning means detects that it has moved to a preset position, and according to the detection result, crack detection means for detecting a crack in the substrate. A substrate crack detection device comprising: 2. The apparatus according to claim 1, further comprising: means for tilting the detection table, wherein when the crack detection means detects a crack in the substrate, the detection table is tilted to remove the substrate having the crack from the detection table. The substrate crack detection device according to claim 1, wherein: 3. A detection table having a hole for ejecting air and mounting a substrate, an air ejection unit for ejecting air from the hole and blowing up the substrate, and one side surface of the substrate on the detection table. A fixing member that abuts on the substrate, and one of the substrates when air is blown out of the hole.
Of the substrate so that one side contacts the fixing member.
Move from the other side to the direction that holds down the substrate
A pressing member as positioning means, and a crack detecting means for detecting that the position of the pressing member has moved to a preset detection position, and detecting a crack in the substrate according to the detection result. Substrate crack detection device. 4. The method according to claim 1, wherein the detecting position is a position shifted by a predetermined amount toward the fixing member from a position where the pressing member moves when the substrate having no crack is positioned at a predetermined position. The substrate crack detection device according to claim 3, wherein 5. An air pressure adjusting means for adjusting the pressure of air jetted from the air jetting means so that the substrate blows up within a range not exceeding the height of the fixing member and the pressing member. The said claim 3 characterized by the above-mentioned.
A substrate crack detection device according to any one of the above.