JP2005317761A - Apparatus and method for cleaving wafer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To surely perform cleaving in a short time as a first purpose, to prevent cracking and chipping due to cleavage as a second purpose, to reduce the defects of a bar shape and a chip shape after the cleavage as a third purpose, and to make a chip without damaging an optical conductor laser element as a fourth purpose. <P>SOLUTION: A wafer cleaving apparatus cleaves a wafer 2 provided with a scribe line 1 from the scribe line 1 and is provided with a plurality of rollers for the cleavage for pressurizing and rotationally moving the wafer 2 provided with the scribe line 1 and cleaving it from the scribe line 1. Also, the wafer cleaving apparatus is provided with the rollers for the cleavage for pressurizing and rotationally moving the wafer 2 provided with the scribe line 1, and cleaving it from the scribe line 1 and a pressing roller for preventing the deformation of the rollers for the cleavage due to a pressure at the time of cleaving the wafer. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a wafer cleaving apparatus and a wafer cleaving method.

  Conventionally, when separating into individual chips, a roller having a shape that becomes thicker toward the center is brought into contact with the back surface of the adhesive tape, and each chip area is individually moved by rotating the rollers separately in the X and Y directions. (For example, Patent Document 1).

  Further, for example, as shown in FIG. 25, when a wafer is made into a bar and formed into a chip by a cylindrical roller, the opposite surface of the wafer 102 provided with the scribe line 101 is attached to the adhesive surface of the expansion sheet 103, and the scribe line The surface provided with the protective sheet 104 is covered with a protective sheet 104, and then set on the rubber plate 106 of the wafer setting table 105 with the surface of the protective sheet 104 covering the surface provided with the scribe line 101 facing downward. Subsequently, the wafer 102 is cleaved by pressurizing and rotating on the adhesive surface of the expansion sheet 103 with a cleaving roller, and separated into bars or chips.

In addition, as shown in FIG. 26, when the wafer 102 on which the optical semiconductor laser element is formed is formed into a bar, a scribe line 101 is partially provided on both sides of the wafer 102 so that the gold 102 is not cleaved by a roller. Using the mold blade 110 and the lower mold 111, the mold blade 110 is individually positioned so as to match the position of the scribe line 101, and then pressed and cleaved. Alternatively, as shown in FIG. 27, the wafer 102 is pressed by the mold 111 and the mold 112 and then pressed by the mold blade 110 to be cleaved.
Japanese Unexamined Patent Publication No. 2000-12694 (pages 1 to 7, FIGS. 1 to 10)

  By the way, as shown in FIG. 28, the wafer 102 provided with the scribe line 101 is sandwiched between the expansion sheet 103 and the protective sheet 104, the wafer 102 is sandwiched, and then pressed and rotated by the cleavage roller 107. However, since there are bubbles A between the expansion sheet 103 and the protective sheet 104, when the cleavage roller 107 is pressurized and cleaved, the pressure of the cleavage roller 107 is not increased by the bubbles A. It becomes stable and it is difficult to form bars and chips by one cleavage operation, and the cleavage operation must be repeated 2-3 times.

  Further, as shown in FIG. 29, when the thick wafer 102 is cleaved, the cleaving roller 107 may be deformed, and the central portion of the wafer 102 may not be cleaved.

  Further, as shown in FIG. 30, it is necessary to change the diameter of the cleaving roller 107 according to the size of the bar and the size of the chip. For example, when the pitch of the scribe lines 101 is 1 mm or more, a cleaving roller 107a having a diameter of 10 mm or more is used, and when the pitch is 1 mm or less, a cleaving roller 107b having a diameter of 10 mm or less is used. That is, if the roller diameter is large, the cleavage angle D is small, so that it is difficult to break with a scribe line pitch size of 1 mm or less. Further, when a scribe line pitch size of 1 mm or more is cleaved with a small roller diameter, the cleavage angle D increases, and the corner portion C of the bar and the top surface of the chip may come into contact with each other, and cracking and chipping may occur.

  Further, during the manufacturing of the optical semiconductor laser element, the wafer 102 on which the electrodes are formed must be cleaved into a bar shape, and the end surface of the barized wafer 102 must be covered with an antireflection film. At that time, the scribe line 101 is partially provided only on both sides of the wafer 102, and each bar is cleaved by pressurizing each bar individually with a mold blade, so that it takes time to cleave. In addition, when cleaving to a fine size, an expensive cleaving device having an automatic feeding device is necessary, and wear of the mold blade occurs, resulting in defective bar shape and chip shape after cleaving. .

  Further, as shown in FIG. 31, when the optical semiconductor laser element L2 formed into a bar and having an antireflection film formed on its end surface and provided with the scribe line 101 is formed into a chip, the cleavage roller 107 There is a possibility that the rubber plate 106 is dented by the pressurization, and the rubber and the protective sheet 104 come into contact with the light emitting portion P on the element end face and the antireflection films AR and FR covered on the element end face to cause damage.

  The present invention has been made in view of such circumstances, and the first object is to perform cleavage in a short time and with certainty, and the second object is to prevent the occurrence of cracks and cracks due to cleavage. The third object is to reduce the occurrence of defects in the bar shape and chip shape after cleavage, and the fourth object is to make a chip without damaging the optical semiconductor laser element. A wafer cleaving apparatus and a wafer cleaving method are provided.

  In order to solve the above problems and achieve the object, the present invention is configured as follows.

The invention according to claim 1 is a wafer cleaving device for cleaving a wafer provided with a scribe line from the scribe line,
A wafer cleaving apparatus comprising a plurality of cleaving rollers that pressurize and rotate a wafer provided with the scribe line to cleave the scribe line.

The invention according to claim 2 is a wafer cleaving apparatus for cleaving a wafer provided with a scribe line from the scribe line,
A cleaving roller that pressurizes and rotationally moves the wafer on which the scribe line is provided, and cleaves the scribe line;
A wafer cleaving apparatus comprising: a pressing roller that prevents deformation of the cleaving roller due to pressure at the time of cleaving the wafer.

The invention according to claim 3 is a wafer cleaving device for cleaving a wafer provided with a scribe line from the scribe line,
A rotating unit having a plurality of cleaving rollers having different roller diameters;
The wafer cleaving apparatus can be changed to a cleaving roller having a different roller diameter depending on the wafer.

The invention according to claim 4 is a wafer cleaving apparatus for cleaving a wafer provided with a scribe line from the scribe line,
A wafer setting table having a rubber plate for supporting the wafer;
A cleaving roller that pressurizes and rotates the wafer, and
A wafer cleaving apparatus is characterized in that a step is provided on at least one of the rubber plate or the cleaving roller, and only one scribe line portion of a scribe line partially provided on both sides of the wafer is pressurized.

The invention according to claim 5 is a wafer cleaving device for cleaving a wafer provided with a scribe line from the scribe line,
A wafer setting table having a rubber plate for supporting the wafer;
A cleaving roller that pressurizes and rotates the wafer, and
The wafer cleaving apparatus is characterized in that a groove is provided in at least one of the rubber plate or the cleaving roller so that a portion where the wafer is not pressed becomes the groove.

The invention according to claim 6, when separating the wafer on which the semiconductor laser element is formed into bars,
A scribe line is partially provided on both sides of the wafer,
A method for cleaving a wafer, wherein cleaving is performed so that a cleaving roller or a pressing force of a die blade is applied to one side of the scribe line.

In the invention according to claim 7, when separating the wafer on which the semiconductor laser element is formed into bars,
A scribe line is partially provided on one side of the wafer,
A method for cleaving a wafer, wherein cleaving is performed so that a cleaving roller or a pressing force of a die blade is applied to one side of the scribe line.

In the invention according to claim 8, when the semiconductor laser element is formed and the end face is coated with an antireflection film and the wafer separated into bars is separated into chips,
Provide a scribe line inside the end face corner of the bar,
A method for cleaving a wafer, wherein the cleaving line is cleaved by applying a cleaving roller or a pressing force of a die blade.

  With the above configuration, the present invention has the following effects.

  According to the first aspect of the present invention, when cleaving the wafer, a plurality of cleaving rollers are used, the bubbles generated in the expansion sheet and the protective sheet are pushed out by the preceding cleaving roller, and the cleaving is performed. The portion that could not be cleaved by the preceding cleaving roller due to the influence of air bubbles can be surely cleaved by the subsequent cleaving roller, and workability is improved.

  According to the second aspect of the present invention, the pressing roller for preventing deformation of the cleaving roller due to pressure at the time of cleaving the wafer is provided, the deformation of the cleaving roller when cleaving a thick wafer is prevented, and the entire wafer is Uniform pressure can be applied and stable cleavage can be achieved.

  According to the third aspect of the present invention, it is possible to change to a cleaving roller having a different roller diameter depending on the wafer, so that the cleaving size of various wafers can be accommodated, and the apparatus can be automated. can do.

  According to the invention described in claim 4, a step is provided on the rubber plate or the cleaving roller, and only the scribe line portion on one side of the scribe line partially provided on both sides of the wafer is pressurized, whereby the cleavage surface is obtained. It becomes a straight line, and the pressure damage to the raised portion can be reduced.

  According to the invention described in claim 5, a groove is provided in the rubber plate or the cleaving roller so that the non-pressurized portion of the wafer becomes a groove, the cleaved surface becomes straight, and pressure is applied to the raised portion. Damage can be reduced.

  According to the invention described in claim 6, by partially providing a scribe line on both sides of the wafer, and cleaving so that the cleaving roller or the pressing force of the mold blade is applied to one side of the scribe line, Unevenness on the end face of the cleavage portion can be eliminated, and defective portions of light output can be eliminated.

  According to the invention described in claim 7, by partially providing a scribe line on one side of the wafer, and cleaving so that the pressing force of the cleaving roller or the mold blade is applied to one side of the scribe line, Unevenness on the end face of the cleavage portion can be eliminated, and defective portions of light output can be eliminated.

  According to the eighth aspect of the present invention, the scribe line is provided on the inner side of the end face corner of the bar, and the scribe line is cleaved so that the pressing force of the cleaving roller or the die blade is applied, thereby the end face core. It is possible to prevent damage to the inner portion, and to eliminate the shape defect after chip formation.

Hereinafter, embodiments of the wafer cleaving apparatus and the wafer cleaving method of the present invention will be described. However, the present invention is not limited to this embodiment. The embodiment of the present invention shows the most preferable mode of the present invention, and the terminology of the present invention is not limited to this.
[First Embodiment]
First, a first embodiment will be described with reference to FIG. The wafer cleaving apparatus of this embodiment cleaves the wafer 2 provided with the scribe line 1 from the scribe line 1. This wafer cleaving device is provided with two cleaving rollers 7a and 7b, and one pressing roller 7c. The two cleaving rollers 7a and 7b have the same roller diameter, and one pressing roller 7c has a larger roller diameter than that of the cleaving rollers 7a and 7b. The two cleaving rollers 7a and 7b and the one pressing roller 7c are rotatably provided on the apparatus main body 10, respectively.

  When the wafer is cleaved, the opposite surface of the wafer 2 on which the scribe line 1 is provided is attached to the adhesive surface of the expansion sheet 3, and the surface on which the scribe line 1 is provided is covered with the protective sheet 4. Subsequently, the surface of the protective sheet 4 that covers the surface on which the scribe line 1 is provided is set on the rubber plate 6 of the wafer setting table 5. Next, the wafer 2 is cleaved by being pressed and rotated by the cleaving rollers 7a and 7b on the adhesive surface of the expansion sheet 3, and separated into bars or chips. In this embodiment, the bubble A generated in the expansion sheet 3 and the protective sheet 4 is pushed out by the preceding cleavage roller 7a and cleaved, and the preceding cleavage roller 7b is used for the preceding cleavage. The portion that could not be cleaved by the bubble A by the roller 7a can be cleaved reliably, and the workability is improved.

In this embodiment, two cleaving rollers 7a and 7c are provided, and deformation of the cleaving rollers 7a and 7b is prevented by one pressing roller 7c. However, two pressing rollers 7c are not used. Only the cleaving rollers 7a and 7b may be used. In addition, if the wafer 2 provided with the scribe line 1 is pressed and rotated by a plurality of cleavage rollers and cleaved from the scribe line 1, the number, structure, etc. are two, three, four, etc. It is not limited.
[Second Embodiment]
Next, a second embodiment will be described with reference to FIGS. The wafer cleaving apparatus of the embodiment shown in FIG. 2 is configured in the same manner as the embodiment shown in FIG. 1, but, as shown in FIG. 2, for example, when cleaving without using an expansion sheet, The wafer 2 is cleaved by pressurization and rotational movement by the cleaving roller 7a, separated into bars, or separated into chips, and the deformation of the cleaving roller 7a is prevented by the two pressing rollers 7c and 7c. ing. As described above, the presser rollers 7c and 7c for preventing the cleaving roller 7a from being deformed by the pressure at the time of cleaving the wafer are provided, the deformation of the cleaving roller 7a when cleaving the thick wafer 2 is prevented, and the entire wafer is made uniform. Can be pressurized and can be cleaved stably.

In the embodiment shown in FIG. 2, the two pressing rollers 7c and 7c are provided on the cleaving roller 7a so that the cleaving roller 7a is not deformed. As shown in FIG. 3, the cleaving roller is provided. When 7a is a single roller, one pressing roller 7c may be provided.
[Third Embodiment]
Next, a third embodiment will be described with reference to FIG. The wafer cleaving apparatus of this embodiment includes a rotating unit 20 having a plurality of cleaving rollers 7a and 7b having different roller diameters. The rotating body 21 of the rotating unit 20 is provided with cleaving rollers 7a and 7b having different roller diameters at four locations so as to be rotatable, and one cleaving roller 7a and 7b at each location is provided. The presser roller 7c is provided, and the one presser roller 7c prevents the cleavage rollers 7a and 7b from being deformed. The rotating body 21 is rotatably provided on the apparatus main body 10 with the rotating shaft 22 as a fulcrum.

  In this embodiment, the cleaving rollers 7a and 7b having different roller diameters can be changed in accordance with the size of the wafer 2, so that the cleaving sizes of various wafers 2 can be accommodated and the apparatus is automated. It can correspond to.

In this embodiment, a cleaving roller having a different roller diameter is used in the roller configuration of the embodiment shown in FIG. 1, but a cleaving roller having a different roller diameter is used in the roller configuration shown in FIG. 2 or FIG. It may be used.
[Fourth Embodiment]
Next, a fourth embodiment will be described with reference to FIGS. The wafer cleaving apparatus of this embodiment cleaves the wafer 2 provided with the scribe line 1 from the scribe line 1. As shown in FIG. 5, an optical semiconductor laser element is formed on the wafer 2, and scribe lines 1 are partially provided on both end faces 2 a and 2 b of the wafer 2.

  As shown in FIG. 6, the wafer cleaving apparatus includes a wafer setting table 5 having a rubber plate 6 that supports the wafer 2, and a cleaving roller 7 that pressurizes and rotates the wafer 2. The rubber plate 6 is provided with a step 6a, and the cleavage roller 7 is provided with a step 7d.

  When cleaving the wafer 2 by pressing the cleaving roller 7, only the vicinity of the scribe line on one end surface of the wafer 2 can be pressed so that the wafer 2 is cleaved from the one end surface 2a to the other end surface 2b. To do. In this embodiment, the rubber plate 6 and the cleaving roller 7 are provided with steps, but at least one may be provided with steps.

In this way, a step is provided on at least one of the rubber plate 6 or the cleaving roller, and only the scribe line portion on one side of the scribe line 1 partially provided on both sides of the wafer 2 is pressurized so that the cleavage surface is linear. In addition, the pressure damage to the raised portion can be reduced.
[Fifth Embodiment]
Next, a fifth embodiment will be described with reference to FIGS. The wafer cleaving apparatus of this embodiment cleaves the wafer 2 provided with the scribe line 1 from the scribe line 1. As shown in FIG. 7, the wafer 2 is formed with an optical semiconductor laser element and formed into a bar. The wafer 2 has a light emitting portion P and light emitting end surface portions AR and FR.

  As shown in FIG. 8, the wafer cleaving apparatus includes a wafer setting table 5 having a rubber plate 6 that supports the wafer 2, and a cleaving roller 7 that pressurizes and rotates the wafer 2. The rubber plate 6 is provided with a groove 6e, and the cleavage roller 7 is provided with a groove 7e.

  When the wafer 2 is cleaved by the cleaving roller 7, the non-pressed portion of the wafer 2 becomes a groove, and the light emitting portion P and the light emitting end surface portions AR and FR are in contact with the rubber plate 6 and the protective sheet 4. Therefore, the pressure damage to the raised portion can be reduced.

Further, as shown in FIG. 9, the rubber plate 6 may be provided with a step portion 6d, and the cleavage roller 7 may be provided with a step portion 7d. In this embodiment, the rubber plate 6 and the cleavage roller 7 are provided with grooves and steps, but at least one may be provided with grooves and steps.
[Example 1]
10 to 12 show an embodiment in which an optical semiconductor light-receiving element PD (chip size: 1.0 × 1.0 × 0.35 tmm) is formed into a chip. FIG. 10 is a plan view of the Si wafer, and FIG. 11 is a cross-sectional view of the Si wafer. In the figure, reference numeral 2A denotes an Si wafer on which electrodes are formed and the scribe line 1 is provided, and the scribe line 1 has a scribe line load of 30 g. 3 is an expansion sheet and 4 is a protective sheet.

  FIG. 12 is a plan view of the wafer cleaving apparatus. The wafer cleaving device 30 includes an operation lever 30 for moving the cleaving roller unit 70 forward and backward in the operation unit, a speed adjustment dial 31 for adjusting the moving speed of the cleaving roller unit 70, and a power switch 32. The cleaving roller unit 70 includes the two cleaving rollers 7a and 7b and the one pressing roller 7c according to the first embodiment. The cleavage roller unit 70 is moved on the wafer setting table 5 by the moving mechanism 71.

The wafer covered with the expansion sheet 3 and the protective sheet 4 (scribe surface) is set on the wafer setting table 5 of this apparatus. The wafer setting table 5 is a rotary table, and a silicon rubber plate 6 is installed on the rotary table. The surface on which the scribe line 1 is provided is set on the silicon rubber plate 6. Next, angle adjustment (parallelism <10 degrees) is performed on the rotary table so that the cleavage roller unit 70 and the scribe line 1 are parallel to each other. Next, the cleaving roller unit 70 is pressed and rotated to cleave the X direction. Next, the rotation table is rotated 90 degrees to cleave again in the Y direction, and the operation is completed. The diameter of the cleaving rollers 7a and 7b is φ10 mm, the applied pressure is 8 to 11 kg (the pressure is confirmed by pressure-sensitive paper), the roller moving speed is 10 mm / second, and the silicon rubber hardness is 70.
[Example 2]
13 to 15 show a process of forming a wafer (bar forming size: 5 × 0.9 × 0.13 tmm) on the wafer on which the optical semiconductor laser element is formed and the scribe line 1 is provided. FIG. 13 is a plan view of the InP wafer, and FIG. 14 is a cross-sectional view of the InP wafer. In the figure, reference numeral 2C denotes an InP wafer on which electrodes are formed and the scribe line 1 is provided, and the load when the scribe line 1 is scribed is 30 g. 3 is an expansion sheet and 4 is a protective sheet. The wafer 2C covered with the expansion sheet 3 and the protective sheet 4 (scribe surface) shown in FIG. 14 is set on the silicon rubber plate 6 on which the silicon rubber plate 6 of the wafer cleaving apparatus 30 shown in FIG. To do.

The wafer 2C is set on the wafer setting table 5 on which the scribe line is provided, and then adjusted by the wafer setting table 5 so that the cleavage roller 7 and the scribe line 1 are parallel (parallelism: < 10 degrees). Next, the cleaving roller 7 is pressed and rotated to cleave it to form a bar. The roller diameter of the cleavage roller 7 is φ10 mm, the applied pressure is 8 to 11 kg, the roller moving speed is 10 mm / second, and the silicon rubber hardness is 70.
[Example 3]
FIGS. 16 to 18 show an optical semiconductor laser element formed and formed into a bar, and the end surface of the bar-shaped wafer having an antireflection film coated thereon and a scribe line is formed into chips. Indicates. 16 is a plan view of the bar-shaped wafer, and FIG. 17 is a cross-sectional view of the bar-shaped wafer. In the figure, 2D is a bar-shaped wafer, AR and FR are antireflection films, and 1 is a scribe line. The load during scribing is 30 g. 3 is an expansion sheet, 4 is a protective sheet, and 6 is a silicon rubber plate provided with a groove 6d so that the end face of the element is not pressurized.

The bar-shaped wafer 2D covered with the expansion sheet 3 and the protective sheet (scribe surface) is placed on the silicon rubber plate 6 of this apparatus with the scribe surface down, and the element end surface portion is in the groove 6d of the silicon rubber plate 6. Set it to come. Subsequently, the cleaving roller 7 and the scribe line 1 are adjusted to be parallel (parallelism: <10 degrees) on the wafer setting table 5 on which the silicon rubber plate 6 is installed. Next, the cleaving roller 7 is pressed and rotated and cleaved to form chips. The cleaving roller has a roller diameter of φ8 mm, a pressing force of 8 to 11 kg, a roller moving speed of 10 mm / second, and a silicon rubber hardness of 70.
[Sixth Embodiment]
Next, a sixth embodiment will be described with reference to FIGS. In this embodiment, when the wafer 2 on which the semiconductor laser element is formed is separated into bars, the scribe lines 1 are partially provided on both sides of the wafer 2. The scribe line 1 is cleaved in such a manner that the pressing force of the cleaving roller 7 or the die blade is applied.

In this way, the scribe line 1 is partially provided on both sides of the wafer 2, and the cleavage roller 7 or the die blade is cleaved so that one side of the scribe line 1 is applied, so that the cleavage portion 1 The unevenness of the end face can be eliminated, and the defective portion of the light output can be eliminated.
[Seventh Embodiment]
Next, a seventh embodiment will be described with reference to FIGS. In this embodiment, the scribe line 1 is partially provided on one side of the wafer 2 when the wafer 2 on which the semiconductor laser element is formed is separated into bars. The scribe line 1 is cleaved in such a manner that the pressing force of the cleaving roller 7 or the die blade is applied.

In this way, the scribe line 1 is partially provided on one side of the wafer 2, and the cleaved roller 7 or the die blade is cleaved so as to be subjected to the pressing force of one side of the scribe line 1, thereby The unevenness of the end face can be eliminated, and the defective portion of the light output can be eliminated.
[Eighth Embodiment]
Next, an eighth embodiment will be described with reference to FIGS. In this embodiment, a semiconductor laser element is formed, and its end face is coated with an antireflection film, and when the wafer 2 separated into bars is separated into chips, it is located inside the end face corner of the bar. A scribe line 1 is provided. The scribe line 1 is formed long except for both end portions 2f and 2g in FIG. 23A, FIG. 23B is formed in the central portion 2h, and FIG. 23C is formed in both end portions 2f and 2g. Is done. The scribe line 1 is formed by a diamond tool DT as shown in FIG. The wafer 2 shown in FIG. 23 is cleaved by applying the cleaving roller 7 or the die blade to the scribe line 1 to prevent damage to the end corner portion. The shape defect can be eliminated.

  In this invention, a wafer on which a scribe line is provided in advance is covered with an expansion sheet and a protective sheet, and a cleaving roller is pressed and rotated and moved in parallel with the scribe line to cleave the scribe line to form a bar. The present invention can be applied to a wafer cleaving apparatus and a wafer cleaving method for forming chips.

It is a schematic block diagram of a wafer cleaving apparatus. It is a schematic block diagram of a wafer cleaving apparatus. It is a figure which shows the cleaving roller part of a wafer cleaving apparatus. It is a figure which shows the cleaving roller part of a wafer cleaving apparatus. It is a top view of a wafer. It is a schematic block diagram of a wafer cleaving apparatus. It is a perspective view of a wafer. It is a schematic block diagram of a wafer cleaving apparatus. It is a schematic block diagram of a wafer cleaving apparatus. It is a top view of a wafer. It is sectional drawing of a wafer. It is a top view of a wafer cleaving apparatus. It is a top view of a wafer. It is sectional drawing of a wafer. It is a schematic block diagram of a wafer cleaving apparatus. It is a top view of a wafer. It is sectional drawing of a wafer. It is a schematic block diagram of a wafer cleaving apparatus. It is a top view of a wafer. It is a schematic block diagram of a wafer cleaving apparatus. It is a top view of a wafer. It is a schematic block diagram of a wafer cleaving apparatus. It is a top view of a wafer. It is a figure which forms a scribe line in a wafer. It is a schematic block diagram of the conventional wafer cleaving apparatus. It is a schematic block diagram of the conventional wafer cleaving apparatus. It is a schematic block diagram of the conventional wafer cleaving apparatus. It is a schematic block diagram of the conventional wafer cleaving apparatus. It is a schematic block diagram of the conventional wafer cleaving apparatus. It is a schematic block diagram of the conventional wafer cleaving apparatus. It is a schematic block diagram of the conventional wafer cleaving apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Scribe line 2 Wafer 3 Expansion sheet 4 Protection sheet 5 Wafer set table 6 Rubber plate 7a, 7b Cleaving roller 7c Pressing roller 10 Device main body 20 Rotating unit 21 Rotating body

Claims (8)

A wafer cleaving apparatus for cleaving a wafer provided with a scribe line from the scribe line,
A wafer cleaving apparatus comprising a plurality of cleaving rollers that pressurize and rotate a wafer provided with the scribe line to cleave the scribe line. A wafer cleaving apparatus for cleaving a wafer provided with a scribe line from the scribe line,
A cleaving roller that pressurizes and rotationally moves the wafer on which the scribe line is provided, and cleaves the scribe line;
A wafer cleaving apparatus comprising: a pressing roller that prevents deformation of the cleaving roller due to pressure at the time of cleaving the wafer. A wafer cleaving apparatus for cleaving a wafer provided with a scribe line from the scribe line,
A rotating unit having a plurality of cleaving rollers having different roller diameters;
A wafer cleaving apparatus that can be changed to a cleaving roller having a different roller diameter depending on the wafer. A wafer cleaving apparatus for cleaving a wafer provided with a scribe line from the scribe line,
A wafer setting table having a rubber plate for supporting the wafer;
A cleaving roller that pressurizes and rotates the wafer, and
A wafer cleaving device, wherein a step is provided on at least one of the rubber plate or the cleaving roller, and only one scribe line portion of a scribe line partially provided on both sides of the wafer is pressurized. A wafer cleaving apparatus for cleaving a wafer provided with a scribe line from the scribe line,
A wafer setting table having a rubber plate for supporting the wafer;
A cleaving roller that pressurizes and rotates the wafer, and
A wafer cleaving apparatus, wherein a groove is provided in at least one of the rubber plate or the cleaving roller, and a portion where the wafer is not pressed becomes the groove. When separating the wafer on which the semiconductor laser element is formed into bars,
A scribe line is partially provided on both sides of the wafer,
A wafer cleaving method, wherein cleaving is performed so that a cleaving roller or a pressing force of a mold blade is applied to one side of the scribe line. When separating the wafer on which the semiconductor laser element is formed into bars,
A scribe line is partially provided on one side of the wafer,
A wafer cleaving method, wherein cleaving is performed so that a cleaving roller or a pressing force of a mold blade is applied to one side of the scribe line. When a semiconductor laser element is formed and an end surface thereof is coated with an antireflection film and a wafer separated into bars is separated into chips,
Provide a scribe line inside the end face corner of the bar,
A wafer cleaving method comprising cleaving the scribe line while applying a cleaving roller or a pressing force of a mold blade.

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