JP2704796B2 - Jig for plating semiconductor wafers - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to plating of a semiconductor wafer, and more particularly to a plating jig for plating a semiconductor wafer.

[0002]

2. Description of the Related Art Conventionally, bump plating of a semiconductor wafer has been performed as follows.
Historically, first, as shown in FIG.
Starting from an immersion type in which a back surface is coated with a wax or a resist and dipped in a plating solution, a cup type as shown in FIG. 7 has recently become mainstream. In either case, FIG.
As shown in (1), the electric cathode contact portion breaks the resist 2 and pierces the metal portion 1 under the resist.
For this reason, the contact portion is also exposed to the plating solution, and plating is also deposited on the contact tip. Frequently, the contact tip must be polished (removed deposits) and contact replaced to maintain contact performance. .

[0003]

SUMMARY OF THE INVENTION An object of the present invention is to provide a jig for plating a semiconductor wafer which solves the drawbacks of the prior art and in which plating does not deposit on the tip of the cathode contact.

[0004]

In order to achieve the above object, the present invention provides a plating jig for electroplating a semiconductor wafer in a plating solution. , Such as silicon or urethane, which seals around the edge of the surface of the semiconductor wafer so that the plating solution does not flow into the plating surface other than the surface of the semiconductor wafer .
U-shape with space in the seal member using soft rubber
W- lip seal or provide a sealing member made of a C-type seal, jig for semiconductor wafer plating, characterized in that a cathode contact on the end of the surface not in contact with the plating solution of the semiconductor wafer that is sealed within the member It was a tool. Further , the cathode contact does not reduce the sealing property in the sealing member.
It is preferable to connect to the cathode wiring with a spring or cushion material.

[0005]

According to the present invention, the surface of the semiconductor wafer other than the plating is sealed to prevent the plating solution from flowing in, and the cathode contact is provided on the surface where the plating solution does not flow. And the cathode contact is not plated. Also, the portion of the wafer surface where the cathode contact is provided is
Since the resist is peeled off, the contact between the wafer surface and the cathode contact is easy, and more stable contact performance can be obtained.

[0006]

EXAMPLES Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited thereto. Example 1 FIG. 1 shows a partially enlarged view of a plating jig of the present invention. In FIG. 1, a wafer 1 is sandwiched by plating jigs 3 and 4 which are members for holding the wafer, and a seal 5
(Here, a W lip seal is shown.) The back surface and the end surface of the wafer are sealed so that the plating solution does not flow. Then, in the vicinity of the end surface of the wafer surface sealed 5, the resist peeling portion 6 where the resist 2 is cut is formed.
Is provided and the metal is exposed. Cathode contact 7
Are connected to the resist stripping portion 6 by a spring-like or cushion contact 7 mounted between the lips of the seal 5, and the jig 3
Through to the outside. Further, as shown in FIG. 2, the cathode wiring is connected by a jig 4, and the resist stripping portion 6 in the seal 5 and the contact pins 15 and the contact receiving portions 16 are formed.
Through, a cathode contact 7 connected by foil, conductive rubber, or the like can be used.

Embodiment 2 FIG. 3 is a partially enlarged view showing another embodiment of the plating jig of the present invention. In FIG. 3, the end of the wafer 1 is sealed with a C-shaped seal, and the sealed wafer is sandwiched between jigs 3 and 4 which are members for holding the wafer. By pressing, the back surface and the end surface of the wafer are sealed so that the plating solution does not flow. A spring-like cathode contact 7 is provided at the resist stripping portion 6 on the end surface of the wafer 1 in the C-shaped seal 5 and is in contact with the wafer, and is guided to the outside through the jig 3.

Embodiment 3 FIG. 4 is a perspective view of an assembling jig as an example of a plating jig used in the present invention, and FIG. 5 is a cross-sectional view of a jig in which a wafer is set. As shown in FIGS. 4 and 5, the wafer 1 is set with the surface to be plated on the jig 4 facing upward. A jig 3 having a hole only on a surface to be plated is prepared, and a seal packing (the W lip seal or the C-type seal described above) is provided along an end of the hole. By fitting the jig 3 together with the jig 4 and lightly inserting it with the clamper 13, the state shown in FIG. 5 is obtained. This is immersed in a plating solution to plate the wafer surface. At this time, as shown in Examples 1 and 2, the inside of the seal packing is provided with a cathode contact so that the plating solution does not contact the cathode contact. Good results were obtained by performing plating using such a jig.

[0009]

By using the plating jig of the present invention, the cathode contact does not come into contact with the plating solution, the cathode contact does not deteriorate, and stable plating can be performed for a long period of time.

[Brief description of the drawings]

FIG. 1 is a partially enlarged view showing an example of a plating jig of the present invention.

FIG. 2 is a partially enlarged view showing another example of the plating jig of the present invention.

FIG. 3 is a partially enlarged view showing another example of the plating jig of the present invention.

FIG. 4 is a perspective view of an assembly jig using the plating jig of the present invention.

FIG. 5 is a sectional view of a jig on which the wafer of FIG. 4 is set.

FIG. 6 is a sectional view of an immersion plating apparatus.

FIG. 7 is a sectional view of a cup-type plating apparatus.

FIG. 8 is an explanatory diagram of a conventional circumscribing cathode contact.

[Explanation of symbols]

1: wafer, 2: resist, 3, 4: jig, 5: seal, 6: resist peeling part, 7: cathode contact, 8: pressing lever, 10: plating tank, 11: cathode wiring, 12: anode wiring, 13: clamper, 14: hinge, 15: contact pin, 16: contact receiving.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Manabu Tsujimura 11-1 Haneda Asahimachi, Ota-ku, Tokyo Inside Ebara Works Co., Ltd. (72) Inventor Takuya Kanayama 11-1 Haneda Asahi-cho, Ota-ku, Tokyo (56) References JP-A-60-92497 (JP, A) JP-A-62-133100 (JP, A) JP-B-47-25189 (JP, B1)

Claims (2)

(57) [Claims] 1. A plating jig for electroplating a semiconductor wafer in a plating solution, wherein the plating solution does not flow into a member holding the semiconductor wafer in the plating solution other than the plating surface on the surface of the semiconductor wafer. And a sealing member using a soft rubber for sealing around the edge of the surface of the semiconductor wafer.
U-shaped W-lip seal or C type with space
A seal member made of the seal provided, the semiconductor wafer plating jig, characterized in that a cathode contact on the end of the sealing surfaces not in contact with the plating solution of the semiconductor wafer within the member. Wherein said cathode contacts 1 Symbol mounting a semiconductor wafer plating jig claim, characterized in that it is connected with spring-like or cushion material.