JP2704796B2 - Jig for plating semiconductor wafers - Google Patents
Jig for plating semiconductor wafersInfo
- Publication number
- JP2704796B2 JP2704796B2 JP11659091A JP11659091A JP2704796B2 JP 2704796 B2 JP2704796 B2 JP 2704796B2 JP 11659091 A JP11659091 A JP 11659091A JP 11659091 A JP11659091 A JP 11659091A JP 2704796 B2 JP2704796 B2 JP 2704796B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- jig
- semiconductor wafer
- contact
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Description
【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION
【０００１】[0001]
【産業上の利用分野】本発明は、半導体ウェハのめっき
に係り、特に半導体ウェハをめっきするためのめっき用
治具に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to plating of a semiconductor wafer, and more particularly to a plating jig for plating a semiconductor wafer.
【０００２】[0002]
【従来の技術】従来、半導体ウェハのバンプめっきは、
歴史的にみると、先ず図６に示されるように、ウェハ２
裏面にワックス又はレジストを被覆してめっき液に漬け
て行う浸漬式に始まり、最近では図７に示されるような
カップ式が主流になっている。いずれの方法でも、図８
に示すように、電気陰極接点部はレジスト２を破り、レ
ジスト下のメタル部分１に突き刺す方法をとっている。
このため、接点部もめっき液にさらされてしまい、接点
先端にもめっきが析出し、接点性能を維持するため頻度
良く接点先端をみがくこと（析出物を除去）や接点交換
が要求されていた。2. Description of the Related Art Conventionally, bump plating of a semiconductor wafer has been performed as follows.
Historically, first, as shown in FIG.
Starting from an immersion type in which a back surface is coated with a wax or a resist and dipped in a plating solution, a cup type as shown in FIG. 7 has recently become mainstream. In either case, FIG.
As shown in (1), the electric cathode contact portion breaks the resist 2 and pierces the metal portion 1 under the resist.
For this reason, the contact portion is also exposed to the plating solution, and plating is also deposited on the contact tip. Frequently, the contact tip must be polished (removed deposits) and contact replaced to maintain contact performance. .
【０００３】[0003]
【発明が解決しようとする課題】本発明は、従来技術の
欠点を解消し、陰極接点の先端部にめっきが析出しない
半導体ウェハめっき用治具を提供することを目的とす
る。SUMMARY OF THE INVENTION An object of the present invention is to provide a jig for plating a semiconductor wafer which solves the drawbacks of the prior art and in which plating does not deposit on the tip of the cathode contact.
【０００４】[0004]
【課題を解決するための手段】上記目的を達成するため
に、本発明では、めっき液中で半導体ウェハを電気めっ
きするためのめっき用治具において、半導体ウェハをめ
っき液中に保持する部材に、半導体ウェハの表面のめっ
き面以外にめっき液が流入しないように、半導体ウェハ
の表面の端部周辺をシールするシリコンやウレタン等の
軟質ゴムを用いシール部材に空間を設けたコ字型をした
Ｗ−リップシール又はＣ型シールからなるシール部材を
設け、該部材内にシールされた半導体ウェハのめっき液
と接触しない表面の端部に陰極接点を設けたことを特徴
とする半導体ウェハめっき用治具としたものである。ま
た、陰極接点は、シール部材内でシール性を低下させな
いバネ状やクッション材で陰極配線と接続するのがよ
い。In order to achieve the above object, the present invention provides a plating jig for electroplating a semiconductor wafer in a plating solution. , Such as silicon or urethane, which seals around the edge of the surface of the semiconductor wafer so that the plating solution does not flow into the plating surface other than the surface of the semiconductor wafer .
U-shape with space in the seal member using soft rubber
W- lip seal or provide a sealing member made of a C-type seal, jig for semiconductor wafer plating, characterized in that a cathode contact on the end of the surface not in contact with the plating solution of the semiconductor wafer that is sealed within the member It was a tool. Further , the cathode contact does not reduce the sealing property in the sealing member.
It is preferable to connect to the cathode wiring with a spring or cushion material.
【０００５】[0005]
【作用】本発明によれば、半導体ウェハのめっき以外の
表面をシールしてめっき液が流入しないようにし、その
流入しない面に陰極接点を設けているので、陰極接点自
体はめっき液と接触せず、陰極接点がめっきされること
がない。また、ウェハ表面の陰極接点を設ける部分が、
レジストが剥離されているので、ウェハ表面と陰極接点
との接触が容易であり、より安定した接点性能が得られ
る。According to the present invention, the surface of the semiconductor wafer other than the plating is sealed to prevent the plating solution from flowing in, and the cathode contact is provided on the surface where the plating solution does not flow. And the cathode contact is not plated. Also, the portion of the wafer surface where the cathode contact is provided is
Since the resist is peeled off, the contact between the wafer surface and the cathode contact is easy, and more stable contact performance can be obtained.
【０００６】[0006]
【実施例】以下、本発明を実施例により具体的に説明す
るが、本発明はこれらに限定されるものではない。 実施例１ 図１に、本発明のめっき用治具の部分拡大図を示す。図
１において、ウェハ１はウェハを保持する部材であるめ
っき用治具３及び４によってはさみ込まれ、シール５
（ここではＷリップシールを示す）により、ウェハの裏
面と端面がシールされておりめっき液が流入しないよう
になっている。そして、シール５されたウェハ表面の端
面付近は、レジスト２がカットされたレジスト剥離部６
が設けられメタルがむき出しになっている。陰極接点７
は、このレジスト剥離部６にシール５のリップ間に装着
されたバネ状やクッションの接点７で接続され、治具３
を通って外部に導かれている。また、図２で示されるよ
うに陰極配線は治具４で接続され、シール５内のレジス
ト剥離部６とコンタクトピン１５及びコンタクト受１６
を通して、箔・導電性ゴム等で接続する陰極接点７とす
ることもできる。EXAMPLES Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited thereto. Example 1 FIG. 1 shows a partially enlarged view of a plating jig of the present invention. In FIG. 1, a wafer 1 is sandwiched by plating jigs 3 and 4 which are members for holding the wafer, and a seal 5
(Here, a W lip seal is shown.) The back surface and the end surface of the wafer are sealed so that the plating solution does not flow. Then, in the vicinity of the end surface of the wafer surface sealed 5, the resist peeling portion 6 where the resist 2 is cut is formed.
Is provided and the metal is exposed. Cathode contact 7
Are connected to the resist stripping portion 6 by a spring-like or cushion contact 7 mounted between the lips of the seal 5, and the jig 3
Through to the outside. Further, as shown in FIG. 2, the cathode wiring is connected by a jig 4, and the resist stripping portion 6 in the seal 5 and the contact pins 15 and the contact receiving portions 16 are formed.
Through, a cathode contact 7 connected by foil, conductive rubber, or the like can be used.
【０００７】実施例２ 図３に、本発明のめっき用治具の他の実施例である部分
拡大図を示す。図３において、ウェハ１は端部がＣ型を
したシールで封止されており、この封止されたウェハが
ウェハを保持する部材である治具３と４ではさみ込ま
れ、押付けレバー８を押付けることによってウェハの裏
面と端面にはめっき液が流入しないようにシールされ
る。そして、Ｃ型シール５内のウェハ１端面のレジスト
剥離部６にはバネ状の陰極接点７が設けられて、ウェハ
と接触しており、治具３を通って外部に導かれている。Embodiment 2 FIG. 3 is a partially enlarged view showing another embodiment of the plating jig of the present invention. In FIG. 3, the end of the wafer 1 is sealed with a C-shaped seal, and the sealed wafer is sandwiched between jigs 3 and 4 which are members for holding the wafer. By pressing, the back surface and the end surface of the wafer are sealed so that the plating solution does not flow. A spring-like cathode contact 7 is provided at the resist stripping portion 6 on the end surface of the wafer 1 in the C-shaped seal 5 and is in contact with the wafer, and is guided to the outside through the jig 3.
【０００８】実施例３ 図４に本発明に用いるめっき用治具の一例である組付治
具の斜視図を示し、図５にウェハをセットとした治具の
断面図を示す。図４及び図５に示すように、治具４にめ
っきをすべき面を上にして、ウェハ１をセットする。め
っきをすべき面だけ穴のあいた治具３を用意し、該穴の
端部に沿ってシールパッキン（前記のＷリップシール又
はＣ型シール）を配備する。該治具３を治具４と合わせ
て、クランパ１３で軽くはさみこむことにより、図５の
状態となる。これをめっき液に浸漬することにより、ウ
ェハ表面をめっきする。このとき、シールパッキン内は
実施例１及び２で示したように、陰極接点が設けられて
おり、陰極接点にはめっき液が接触しないようになって
いる。このような治具を用いてめっきを行うことによ
り、良好な結果が得られた。Embodiment 3 FIG. 4 is a perspective view of an assembling jig as an example of a plating jig used in the present invention, and FIG. 5 is a cross-sectional view of a jig in which a wafer is set. As shown in FIGS. 4 and 5, the wafer 1 is set with the surface to be plated on the jig 4 facing upward. A jig 3 having a hole only on a surface to be plated is prepared, and a seal packing (the W lip seal or the C-type seal described above) is provided along an end of the hole. By fitting the jig 3 together with the jig 4 and lightly inserting it with the clamper 13, the state shown in FIG. 5 is obtained. This is immersed in a plating solution to plate the wafer surface. At this time, as shown in Examples 1 and 2, the inside of the seal packing is provided with a cathode contact so that the plating solution does not contact the cathode contact. Good results were obtained by performing plating using such a jig.
【０００９】[0009]
【発明の効果】本発明のめっき用治具を用いることによ
り、陰極接点はめっき液と接触せず、陰極接点が変質す
ることがなく、長期間にわたって安定しためっきができ
る。By using the plating jig of the present invention, the cathode contact does not come into contact with the plating solution, the cathode contact does not deteriorate, and stable plating can be performed for a long period of time.
【図１】本発明のめっき用治具の一例を示す部分拡大図
である。FIG. 1 is a partially enlarged view showing an example of a plating jig of the present invention.
【図２】本発明のめっき用治具の他の例を示す部分拡大
図である。FIG. 2 is a partially enlarged view showing another example of the plating jig of the present invention.
【図３】本発明のめっき用治具のもう一つの例を示す部
分拡大図である。FIG. 3 is a partially enlarged view showing another example of the plating jig of the present invention.
【図４】本発明のめっき用治具を用いた組付治具の斜視
図である。FIG. 4 is a perspective view of an assembly jig using the plating jig of the present invention.
【図５】図４のウェハをセットした治具の断面図であ
る。FIG. 5 is a sectional view of a jig on which the wafer of FIG. 4 is set.
【図６】浸漬式めっき装置の断面図である。FIG. 6 is a sectional view of an immersion plating apparatus.
【図７】カップ式めっき装置の断面図である。FIG. 7 is a sectional view of a cup-type plating apparatus.
【図８】従来の外接型陰極接点の説明図である。FIG. 8 is an explanatory diagram of a conventional circumscribing cathode contact.
１：ウェハ、２：レジスト、３，４：治具、５：シー
ル、６：レジスト剥離部、７：陰極接点、８：押付けレ
バー、１０：めっき槽、１１：陰極配線、１２：陽極配
線、１３：クランパ、１４：ヒンジ、１５：コンタクト
ピン、１６：コンタクト受。1: wafer, 2: resist, 3, 4: jig, 5: seal, 6: resist peeling part, 7: cathode contact, 8: pressing lever, 10: plating tank, 11: cathode wiring, 12: anode wiring, 13: clamper, 14: hinge, 15: contact pin, 16: contact receiving.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 辻村 学 東京都太田区羽田旭町11番１号 株式会 社荏原製作所内 (72)発明者 金山 拓也 東京都太田区羽田旭町11番１号 株式会 社荏原製作所内 (56)参考文献 特開 昭60−92497（ＪＰ，Ａ) 特開 昭62−133100（ＪＰ，Ａ) 特公 昭47−25189（ＪＰ，Ｂ１) ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Manabu Tsujimura 11-1 Haneda Asahimachi, Ota-ku, Tokyo Inside Ebara Works Co., Ltd. (72) Inventor Takuya Kanayama 11-1 Haneda Asahi-cho, Ota-ku, Tokyo (56) References JP-A-60-92497 (JP, A) JP-A-62-133100 (JP, A) JP-B-47-25189 (JP, B1)
Claims (2)
するためのめっき用治具において、半導体ウェハをめっ
き液中に保持する部材に、半導体ウェハの表面のめっき
面以外にめっき液が流入しないように、半導体ウェハの
表面の端部周辺をシールする軟質ゴムを用いシール部材
に空間を設けたコ字型をしたＷ−リップシール又はＣ型
シールからなるシール部材を設け、該部材内にシールさ
れた半導体ウェハのめっき液と接触しない表面の端部に
陰極接点を設けたことを特徴とする半導体ウェハめっき
用治具。1. A plating jig for electroplating a semiconductor wafer in a plating solution, wherein the plating solution does not flow into a member holding the semiconductor wafer in the plating solution other than the plating surface on the surface of the semiconductor wafer. And a sealing member using a soft rubber for sealing around the edge of the surface of the semiconductor wafer.
U-shaped W-lip seal or C type with space
A seal member made of the seal provided, the semiconductor wafer plating jig, characterized in that a cathode contact on the end of the sealing surfaces not in contact with the plating solution of the semiconductor wafer within the member.
材で接続されていることを特徴とする請求項１記載の半
導体ウェハめっき用治具。Wherein said cathode contacts 1 Symbol mounting a semiconductor wafer plating jig claim, characterized in that it is connected with spring-like or cushion material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11659091A JP2704796B2 (en) | 1991-04-22 | 1991-04-22 | Jig for plating semiconductor wafers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11659091A JP2704796B2 (en) | 1991-04-22 | 1991-04-22 | Jig for plating semiconductor wafers |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06108285A JPH06108285A (en) | 1994-04-19 |
| JP2704796B2 true JP2704796B2 (en) | 1998-01-26 |
Family
ID=14690908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11659091A Expired - Lifetime JP2704796B2 (en) | 1991-04-22 | 1991-04-22 | Jig for plating semiconductor wafers |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2704796B2 (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU3105400A (en) * | 1998-11-28 | 2000-06-19 | Acm Research, Inc. | Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces |
| US6251235B1 (en) | 1999-03-30 | 2001-06-26 | Nutool, Inc. | Apparatus for forming an electrical contact with a semiconductor substrate |
| US7427337B2 (en) | 1998-12-01 | 2008-09-23 | Novellus Systems, Inc. | System for electropolishing and electrochemical mechanical polishing |
| US7022211B2 (en) * | 2000-01-31 | 2006-04-04 | Ebara Corporation | Semiconductor wafer holder and electroplating system for plating a semiconductor wafer |
| US20140251798A1 (en) * | 2011-10-19 | 2014-09-11 | Jcu Corporation | Substrate electroplating jig |
| JP6893142B2 (en) | 2017-07-25 | 2021-06-23 | 上村工業株式会社 | Work holding jig and electroplating equipment |
| JP7132135B2 (en) | 2019-01-23 | 2022-09-06 | 上村工業株式会社 | Work holding jig and electroplating device |
| JP7132136B2 (en) | 2019-01-23 | 2022-09-06 | 上村工業株式会社 | Work holding jig and electroplating device |
| JP7132134B2 (en) | 2019-01-23 | 2022-09-06 | 上村工業株式会社 | Work holding jig and electroplating device |
| JP7256027B2 (en) * | 2019-02-20 | 2023-04-11 | 株式会社荏原製作所 | Substrate holder and plating apparatus equipped with the substrate holder |
| JP7264545B1 (en) * | 2022-02-22 | 2023-04-25 | 有限会社クズハラゴム | Partial plating jig |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6092497A (en) * | 1983-10-27 | 1985-05-24 | Nec Corp | Plating device |
| JPS62133100A (en) * | 1985-12-03 | 1987-06-16 | Nec Corp | Metal plating apparatus |
-
1991
- 1991-04-22 JP JP11659091A patent/JP2704796B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06108285A (en) | 1994-04-19 |
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