JP2699000B2 - Electrode connection method for multilayer printed circuit board - Google Patents
Electrode connection method for multilayer printed circuit boardInfo
- Publication number
- JP2699000B2 JP2699000B2 JP12939989A JP12939989A JP2699000B2 JP 2699000 B2 JP2699000 B2 JP 2699000B2 JP 12939989 A JP12939989 A JP 12939989A JP 12939989 A JP12939989 A JP 12939989A JP 2699000 B2 JP2699000 B2 JP 2699000B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- solder
- multilayer printed
- connection method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Combinations Of Printed Boards (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、スルーホールを有する配線パターンが形成
された複数の基板を貼りあわせた、多層プリント基板の
内層配線間の電極接続方法に関する。Description: TECHNICAL FIELD The present invention relates to a method for connecting electrodes between inner wirings of a multilayer printed circuit board, in which a plurality of substrates on which wiring patterns having through holes are formed are bonded.
（従来の技術） 従来、多層プリント基板の内層配線間の電極接続方法
には、対向する基板の接続電極部分にクリーム半田を印
刷した後、その半田を加熱、溶融させて半田のバンプを
形成し、基板を重ね合せ、加圧、加熱することで対向し
て形成されていた半田同志が溶融接着して電気的接続を
得る方法がある。(Prior art) Conventionally, in a method of connecting electrodes between inner wiring layers of a multilayer printed circuit board, cream solder is printed on a connection electrode portion of an opposing board, and the solder is heated and melted to form a solder bump. There is a method of obtaining electrical connection by overlapping the substrates, applying pressure and heating, so that the solders formed opposite to each other are melt-bonded.
（発明が解決しようとする課題） 第３図は従来のプリント基板接続直前の断面図を、第
４図は接続後の断面図を示す。図において、１は基板、
２は半田、３は配線パターン、４はスルーホール、５は
電極である。この場合、加圧を強くすると、溶融した半
田２が電極５部分からはみ出し（第４図）、近くの配線
パターン３に接触し、回路として不具合となる。また、
加圧が弱いと半田２のバンプの高さが不均一となり、接
続が不完全となるなど、半田２のバンプの高さを制御す
ることができない等の欠点があった。(Problem to be Solved by the Invention) FIG. 3 is a cross-sectional view just before connection of a conventional printed circuit board, and FIG. 4 is a cross-sectional view after connection. In the figure, 1 is a substrate,
2 is a solder, 3 is a wiring pattern, 4 is a through hole, and 5 is an electrode. In this case, when the pressure is increased, the melted solder 2 protrudes from the electrode 5 (FIG. 4) and comes into contact with the nearby wiring pattern 3 to cause a failure as a circuit. Also,
If the pressure is weak, the height of the bumps of the solder 2 cannot be controlled, for example, the height of the bumps of the solder 2 becomes uneven and the connection is incomplete.
（課題を解決するための手段） 本発明は、これらの欠点を解決するため、一方の基板
のスルーホール部分と、他方の基板の電極間に半田をコ
ーティングした金属ボールを介して基板同志を接続する
ようにしたもので、接続の信頼性を大幅に向上させると
ともに、安価に多層プリント基板の製造を可能にしたも
のである。以下に本発明を図面を用いて詳細に説明す
る。(Means for Solving the Problems) In order to solve these drawbacks, the present invention connects the substrates through a solder-coated metal ball between a through-hole portion of one substrate and an electrode of the other substrate. This greatly improves the reliability of the connection and enables the manufacture of a multilayer printed circuit board at low cost. Hereinafter, the present invention will be described in detail with reference to the drawings.
（実施例） 第１図は本発明による接続部分の断面図、第２図は本
発明による加熱後の状態を示す断面図である。なお、第
３図、第４図と相応する部分には同一符合を付してあ
る。図において、７は半田２をコーティングした金属ボ
ールである。(Embodiment) FIG. 1 is a sectional view of a connecting portion according to the present invention, and FIG. 2 is a sectional view showing a state after heating according to the present invention. Parts corresponding to those in FIGS. 3 and 4 are denoted by the same reference numerals. In the figure, reference numeral 7 denotes a metal ball coated with solder 2.
本発明では、一方のプリント基板のスルーホール４と
他方のプリント基板の電極５間に予め半田２をメッキ手
法により均一にコーティングした金属ボール６をスルー
ホール４部に置き加圧することにより一定量埋めこんで
プリント基板からの金属ボール７の高さを一定にしてお
き、もう一方のプリント基板の電極５を重ね合せる。こ
の状態で、加圧、加熱することにより、半田が溶融し電
極同志の接続が完了する。金属ボール７（例えば、Cu、
Ni）はスルーホール４の孔径より僅かに大きいものを使
用することにより、確実に基板相互の隙間が確保され、
接続部分以外の配線パターン同志が接触することは無
い。スルーホール４部に半田２を被覆した金属ボール７
を埋め込むことにより、金属ボールの高さは一定とな
り、基板相互を重ね合せたときスルーホール４に対向し
た電極５と半田２を被覆した金属ボール７は接触するこ
ととなり半田接合が確実となる。According to the present invention, a metal ball 6 coated with solder 2 uniformly by a plating method in advance between the through hole 4 of one printed board and the electrode 5 of the other printed board is placed in the through hole 4 and pressurized to fill a certain amount. Then, the height of the metal ball 7 from the printed board is kept constant, and the electrodes 5 of the other printed board are overlapped. By applying pressure and heating in this state, the solder melts and the connection between the electrodes is completed. Metal ball 7 (for example, Cu,
Ni) uses a hole slightly larger than the diameter of the through hole 4 to ensure the gap between the substrates.
Wiring patterns other than the connection portion do not come into contact with each other. Metal ball 7 with solder 2 coated on through holes 4
, The height of the metal ball becomes constant, and when the substrates are overlapped, the electrode 5 facing the through hole 4 and the metal ball 7 coated with the solder 2 come into contact with each other, so that the solder joining is ensured.
また、余分な半田２はスルーホール４の内壁に付着
し、電極５からのはみ出しは無くなる。Further, the excess solder 2 adheres to the inner wall of the through hole 4 and does not protrude from the electrode 5.
さらに、配線パターン３をスルーホール４以外の部分
にも設ける必要もなく、配線密度も向上する利点があ
る。Further, there is no need to provide the wiring pattern 3 in a portion other than the through hole 4, and there is an advantage that the wiring density is improved.
（発明の効果） 以上説明したように、本発明によれば、確実に均一し
た基板相互の隙間が得られ、半田が配線パターンからは
み出すことがなく、さらには、配線パターンを特別に設
ける必要がなく、高密度の配線パターンを構成すること
が出来る等の利点がある。(Effects of the Invention) As described above, according to the present invention, a uniform gap between the substrates can be surely obtained, the solder does not protrude from the wiring pattern, and the wiring pattern needs to be specially provided. However, there is an advantage that a high-density wiring pattern can be formed.
第１図および第２図は本発明の多層プリント配線基板の
断面図、第３図および第４図は従来の多層プリント配線
基板の断面図を示す。 １……基板、２……半田、３……配線パターン、４……
スルーホール、５……電極、６……金属ボール。1 and 2 are sectional views of a multilayer printed wiring board of the present invention, and FIGS. 3 and 4 are sectional views of a conventional multilayer printed wiring board. 1 ... board 2 ... solder 3 ... wiring pattern 4 ...
Through-hole, 5 ... electrode, 6 ... metal ball.
Claims (2)
された複数のプリント基板を貼りあわせた多層プリント
基板において、一方の基板のスルーホールに半田を被覆
した金属ボールをはめ込み、該金属ボールと他方のプリ
ント基板の電極とを接合し、加熱溶融せしめて複数の基
板を接合したことを特徴とする多層プリント基板の電極
接続方法。1. A multilayer printed circuit board comprising a plurality of printed circuit boards on which a wiring pattern having a through-hole is formed, wherein a metal ball coated with solder is fitted into the through-hole of one of the boards, and the metal ball and the other of the other are mounted. An electrode connection method for a multi-layer printed circuit board, comprising joining a plurality of boards by joining the electrodes of a printed board and melting them by heating.
Cu、Niから成ることを特徴とする多層プリント基板の電
極接続方法。2. The metal ball according to claim 1, wherein
An electrode connection method for a multilayer printed circuit board, comprising a Cu and a Ni.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12939989A JP2699000B2 (en) | 1989-05-23 | 1989-05-23 | Electrode connection method for multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12939989A JP2699000B2 (en) | 1989-05-23 | 1989-05-23 | Electrode connection method for multilayer printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02307297A JPH02307297A (en) | 1990-12-20 |
| JP2699000B2 true JP2699000B2 (en) | 1998-01-19 |
Family
ID=15008605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12939989A Expired - Fee Related JP2699000B2 (en) | 1989-05-23 | 1989-05-23 | Electrode connection method for multilayer printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2699000B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6208022B1 (en) * | 1997-03-27 | 2001-03-27 | Nec Corporation | Electronic-circuit assembly |
-
1989
- 1989-05-23 JP JP12939989A patent/JP2699000B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02307297A (en) | 1990-12-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |