JP2698275B2 - Die bonding equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die bonding apparatus used in a die bonding process in a semiconductor device manufacturing process.

[0002]

2. Description of the Related Art A conventional die bonding apparatus is configured so that, out of diced chips, only chips determined to be good in a preceding chip test process are sequentially picked up by a suction collet and die-bonded to a lead frame. I was That is, in the chip test process, the chip is discriminated as a non-defective product or a defective product, a defective mark is marked on the defective product with red ink or the like, and the die bonding mechanism recognizes the defective mark by image recognition. Pick up only the chips that are not done with the suction collet,
Die bonding was performed on the lead frame.

[0003] This die bonding apparatus is configured to pick up only non-defective products according to the result of the pass / fail judgment in the chip test process. There is a rank.
Nevertheless, the completed semiconductor device is simply found to be a good product, and it does not know which rank of the good product it belongs to. doing. Therefore, it has been difficult to make a production plan corresponding to the characteristics of the semiconductor device and the number of shipments required by the user. In addition, in order to determine whether a chip is good or bad, all chips must be checked by image recognition for the presence or absence of a defective mark.
The trajectory of the suction collet with respect to the wafer becomes longer, and the time required for the die bonding step becomes longer.

[0004]

Accordingly, the same applicant as the present application has proposed a chip having specific characteristic data based on the characteristic data and position data of all the chips of the wafer in the wafer identifier data obtained in the wafer test process. A die bonding apparatus capable of selectively bonding only die has been devised and filed (Japanese Patent Application No. 23219/1991).

[0005] This die bonding apparatus has an extremely remarkable effect that semiconductor devices can be manufactured according to ranks and that the time required for the die bonding step can be greatly reduced. There are still issues to be addressed. That is, when a power failure occurs during operation and the power supply is cut off, the wafer identifier data, characteristic data, and position data from the wafer test apparatus are lost. Therefore, in order to eliminate the power failure and to return to the operation state, it is necessary to perform a rework adjustment to return the characteristic data and the position data to the state at the time of the power failure, and it takes a considerable time until the operation is resumed. There's a problem. If this problem is solved, the above-mentioned die bonding apparatus should exhibit the intended remarkable effect.

Accordingly, the present invention provides a semiconductor device that can be manufactured for each rank and that can reduce the time required for the die bonding process, but also quickly and accurately when the power failure is resolved after the power failure occurs. An object of the present invention is to provide a die bonding apparatus capable of returning to a state at the time of occurrence.

[0007]

According to the present invention, as a technical means for achieving the above object, a die bonding apparatus is constituted as follows. That is, a die bonding mechanism for selecting and die bonding only chips having the specified characteristic data based on the wafer identifier data transmitted from the wafer test apparatus and the characteristic data and position data of all the chips on the wafer. A computer having a data management unit that manages all data including the identifier data, characteristic data, and position data. A power monitoring unit that monitors and outputs power failure data when a power failure occurs; a position data of a chip being picked up from the die bonding mechanism when the power failure data is input; and a die bonding order of the chip. And storing the count data in the storage unit and monitoring the power supply. The output of the power outage data is configured as characterized by being configured by said data management unit to output to the die bonding mechanism reads the position data and the count data from the storage unit at the time of stopping from.

[0008]

When a power failure occurs, the power monitoring unit of the computer determines that the power failure has occurred and outputs power failure data to the data management unit, whereby the data management unit receives the chip being picked up from the die bonding mechanism unit. Is temporarily stored in the storage unit as backup data, and the data is stored. The power monitoring unit constantly monitors whether or not the power failure state has been resolved, and when it is confirmed that the power failure state has been resolved, the data management unit reads the position data and the count data of the backup data from the storage unit. Is read and set in its own built-in memory, and output to the die bonding mechanism unit, thereby completing the data restoration process and immediately restarting the die bonding operation normally from the state at the time of the power failure. .

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a block diagram of an electric control system according to an embodiment of the present invention. The die bonding mechanism (1) includes identifier data (33) of the wafer from the wafer test device (3) and all of the wafers. The test data (36) of the chip characteristic data (34) and the position data (35) is fetched as test data (24) through the data management unit (21) of the computer device (2), and the designated characteristic data is read. And performing die bonding of only the chip having the data and outputting position data (18) of the chip being picked up and count data (19) of the number of times of die bonding to the data management unit (21) in the die bonding operation. It is.
As shown in FIG. 6, a wafer sheet (52) slightly larger than the wafer (5) is attached to the back surface of the wafer (5) so that the diced chips (51) do not scatter. A wafer identifier (53) such as a bar code is marked on the edge of the wafer sheet (52).

The wafer test apparatus (3) reads out the wafer identifier (53) of the wafer (5) to be tested by the wafer identification section (31), and then, by the test section (32), reads all the chips on the wafer (5). The electrical characteristics of (51) were measured, and the characteristic results were classified as characteristic data (34) into four ranks of [excellent], [good], [acceptable] and [impossible]. 34) for each chip (51)
Then, data is created together with the position data (35) and the identifier data (33), and the data is compressed and output as test data (36). In addition, FIG.
The chips (51) of rank (good) are dotted, the chips (51) of rank (good) are shaded, and the chips (5)
1) is a two-parallel line and a chip (5
1) is indicated by crosses.

The computer apparatus (2) sends out the test data (24) received by the data management section (21) to the control section (12) of the die bonding mechanism section (1) as test data (24). The position data (18) during pickup and the count data (19) during die bonding received from the control unit (12) are stored and stored in a memory built in the data management unit (12). Also,
The power monitoring unit (22) constantly determines the power status data (41) input from the uninterruptible power supply (4) and monitors the occurrence of a power failure.
5) is output to the data management unit (21). When the power failure data (25) is input, the data management unit (21) stores the position data (18) and the count data (19) stored in its own memory at that time into the disk unit (2).
3) Temporarily store and save. When the power is restored, the data management unit (21) temporarily stores the position data (18) and the count data (19) in the disk unit (23).
Is read out, set in its own memory, and output to the control unit (12) of the die bonding mechanism unit (1).

Next, the structure of the die bonding mechanism (1) will be described with reference to the flowchart of FIG. When the wafer (5) on which the test has been completed is set on the die bonding mechanism (1), the wafer identification unit (11) of the die bonding mechanism (1) reads the wafer identifier (53) (step S1). The identifier data (15) read here is stored in the wafer test unit (3).
Is compared with the identifier data (33) included in the test data (24) input through the data management unit (21), and it is confirmed that the wafer (5) matches. Then, the test data (24) obtained by compressing the characteristic data (34) and the position data (35) of the set wafer (5) is written to the memory in the control unit (12) (step S2).

Here, the rank of the chip (51) to be die-bonded, for example, the rank of [excellent] is determined by the operation unit (1).
4) (step S3), the control unit (12) returns the position data (17) of the chip (51) belonging to the rank of "excellent". ), Which has a different sign from the position data (17) in the die bonding mechanism (1) ”from the compressed test data (24) (step S4) and decodes it. (Step S4), the required position data (17) is picked up by the pickup unit (1).
The data is sequentially output to 3) (step S6).

The pickup section (13) is provided with a wafer (5).
Is placed on the XY table (132), and the XY table
It has a suction collet (not shown) facing above the table (132) and a driving unit (131) for the suction collet. The above-mentioned position data (17) is input to the XY table (132), and the suction collet driving unit (131)
Is supplied with a pickup signal (16) for picking up a chip (51) having a rank of [excellent]. As a result, the first chip to be die-bonded (5
The XY table (132) is moved so that the suction collet is located directly above 1) (step S7), and the first die bonding is performed (step S8). Thereafter, it is determined whether or not all the die bonding of the chips (51) belonging to the rank of [excellent] has been performed (step S).
Step 9) is performed, and the process jumps to step S5 and repeats the operation up to step S9 until die bonding of all the chips is completed.

Thus, all the chips (51) belonging to the rank of [excellent] are sequentially die-bonded to a lead frame (not shown). Since the pickup unit (13) knows all the positions of the chips (51) belonging to the rank of [excellent] based on the position data (17), as shown by the locus 1 in FIG. ) Can be minimized, and all the chips (51) of rank [excellent] can be die-bonded.

The means for storing data when a power failure occurs will be described with reference to the flowchart of FIG.
When the power supply is stopped, the power monitoring unit (22) of the computer unit (2) determines whether a power failure or an instantaneous interruption has occurred based on the power status data (41) input from the uninterruptible power supply (4). Is determined (step S10). If it is determined that a power failure has occurred, the power supply monitoring unit (2
2) Power outage data (25) for the data management unit (21)
Is output, whereby the data management unit (21) temporarily stores the position data (18) and the count data (19) input from the bonding mechanism unit (1) as backup data in the disk unit (23). (Step S11). Subsequently, the data management unit (21) sets the start-up data, which is data for managing whether to start up after the restoration of the power supply from the continuous state or from the initial state, as the continuous state, and sets the data in the disk unit (23). By temporarily storing and storing (step S12), the data storing process ends. If the power supply monitoring unit (22) determines that an instantaneous interruption has occurred based on the power supply state data, no processing is performed.

Next, data recovery means at the time of power recovery will be described with reference to FIG. The power monitoring unit (22) constantly monitors whether or not the power failure state has been resolved based on the power supply state data (step S13). When it is confirmed that the power failure state has been resolved, the data management unit (22) executes Start-up data is read from the disk unit (23) (step S
Along with 14), it is determined whether the operation starts from the continuation state or the operation starts from the initial state based on the contents of the start-up data (step S15). If it is determined that the startup data indicates a continuous state,
The data management unit (21) reads the backup data from the disk unit (22) (step S16), and sets the position data (18) and the count data (19) of the backup data in a memory built therein, And the control unit (1) of the die bonding mechanism unit (1).
In response to 2), the data restoration process ends (step S17), and the die bonding operation can be resumed normally from the state at the time of the power failure.

[0018]

As described above, according to the die bonding apparatus of the present invention, the characteristic data designated based on the identifier data of the wafer sent from the wafer test apparatus and the characteristic data and position data of all the chips of the wafer. Is selected and die-bonded, and only chips belonging to the specified rank can be selectively die-bonded and produced according to rank, but when a power failure occurs and the problem is resolved, a power failure occurs The operation can be restarted easily and accurately in a very short time by returning to the state of the time. MTTR (Mean Tim)
eToRepair), that is, the average time to repair can be reduced, and the production efficiency can be increased.

[Brief description of the drawings]

FIG. 1 is a block diagram of an electric control system according to an embodiment of the present invention.

FIG. 2 is a flowchart of a die bonding operation.

FIG. 3 is a flowchart of a process for storing data at the time of the occurrence of a power failure.

FIG. 4 is a flowchart of a data recovery process at the time of the blackout of power;

FIG. 5 is an explanatory diagram of a trajectory for picking up chips of a wafer set in the same apparatus.

FIG. 6 is an explanatory diagram of a wafer set in the same apparatus.

[Explanation of symbols]

Reference Signs List 1 die bonding mechanism unit 2 computer device 3 wafer test device 5 wafer 18 position data output from die bonding mechanism unit 19 count data output from die bonding mechanism unit 21 data management unit 22 power supply monitoring unit 23 disk unit (storage unit) 25 Power failure data 33 Wafer streak device identifier data 34 Wafer streat device characteristic data 35 Wafer streat device position data 51 Chip 53 Wafer identifier

 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-4-9275 (JP, A) JP-A-3-227029 (JP, A) JP-A-1-194331 (JP, A) JP-A-63- 93120 (JP, A) JP-A-63-40327 (JP, A) JP-A-63-86528 (JP, A) JP-A-61-112337 (JP, A) JP-A-3-270554 (JP, A) JP-A-3-252786 (JP, A) JP-A-3-217935 (JP, A) JP-A-3-50615 (JP, A) JP-A-2-236747 (JP, A)

Claims (1)

(57) [Claims] 1. Die bonding for selecting and die bonding only chips having specified characteristic data based on wafer identifier data sent from a wafer test apparatus and characteristic data and position data of all chips on the wafer. A computer unit having a data management unit that manages all data including the identifier data, the characteristic data, and the position data; and a storage unit that temporarily stores the data; A power monitoring unit that constantly monitors the state and outputs power failure data when a power failure occurs, a position data of a chip being picked up from the die bonding mechanism unit when the power failure data is input, and a die bonding of the chip. In addition to storing the count data, which is the order, in the storage unit, A data management unit configured to read position data and count data from the storage unit when the output of the power failure data from the power monitoring unit stops, and output the read data to the die bonding mechanism unit. apparatus.