JP2695342B2 - Hybrid coupler - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid coupler which can be used in a wireless device such as a cordless phone or a mobile phone, or other various communication devices.

[0002]

2. Description of the Related Art FIG. 4 is an explanatory view of a conventional hybrid coupler, and FIG. 4A is a block diagram of the hybrid coupler.
4B is a circuit example 1 of the hybrid coupler, and FIG. 4C is a circuit example 2.

FIG. 5 shows a concrete example of a conventional hybrid coupler. 4 and 5, C _{1 to} C ₆ and C ₁₁ to
C ₁₄ is a capacitor, L ₁ , L ₂ , L _{11 to} L ₁₄ are coils, P _{1 to} P ₃ are ports (input / output terminals), HY is a hybrid circuit, R _s is a resistor, and P _t is a board (circuit board. )
Is shown.

Conventionally, a coupler using a hybrid circuit (hereinafter, simply referred to as "hybrid coupler") has been used in various wireless devices, other communication devices, and the like.

Hybrid coupler
Is a circuit having three or more ports (input / output terminals), and is used as a power distributor, a combiner, or a phase shifter.

For example, as shown in FIG. 4A, the hybrid coupler includes three ports P _{1 to} P in the hybrid circuit HY.
₃ is provided, and the resistor R _e is connected to a portion that is not a port.

In the hybrid coupler of FIG. 4A, when a signal is input to the port P ₁ , the signal appears at both the ports P ₂ and P ₃ (when used as a distributor). However, when a signal is input to the port P ₂ , a signal appears at the port P ₁ , but no signal appears at the port P ₃ because of isolation between the ports P ₂ and P ₃ .

Also, when a signal is input to the port P ₃ , a signal appears at the port P ₁ but no signal appears at the port P ₂ . Furthermore, when signals are input to the ports P ₂ and P ₃ at the same time, these signals are combined and the port P ₁
Appears when used as a synthesizer.

[0009] Incidentally, if a signal is input to the port P _1, port P _2, when taking out the signal from the P _3, port P _2, P
The signals of ₃ may have the same phase or different phases (depending on the circuit configuration).

FIGS. 4B and 4C show a hybrid coupler in which a 90 ° phase shifter is realized by allowing signals having different 90 ° phases to appear at the ports P ₂ and P ₃ when a signal is input to the port P ₁ . It is a circuit example.

In the circuit example 1 of FIG. 4B, the hybrid circuit HY is composed of the capacitors C _{1 to} C ₆ and the coils L ₁ and L ₂ , and in the circuit example 2 of FIG. 4C, the hybrid circuit HY.
Is composed of capacitors C _{11 to} C ₁₄ and coils L _{11 to} L ₁₄ .

[0012] FIG 4B, in the circuit examples 1 and 2 in FIG. 4C, represent the inductance values of the coil _{L 1, L 2, L 11} ~L 14 in _{L 1, L 2, L 11} ~L 14, capacitor C ₁ ~
The capacitance (electrostatic capacitance) values of C ₆ and C _{11 to} C ₁₄ are set to C _{1 to} C ₆ ,
When expressed by C _{11 to} C ₁₄ , the element constants of each coil and capacitor are set as follows.

That is, L ₁ = L ₂ , C ₂ = C ₅ , C _{1
= C 3 = C 4 = C} 6, L 11 = L 12, L 13 = L 14, C 11 =
C ₁₂ = C ₁₃ = made to be C _14. Of the above circuit examples,
FIG. 5 shows a specific example of the hybrid coupler having the circuit configuration shown in the circuit example 1 shown in FIG. 4B.

In this example, the coil L₁, L_Two, Conden
Sa C₁~ C₆And resistance R_eConsists of discrete parts
Then, these parts are_tImplemented on. Place
Then, in the hybrid coupler having the circuit configuration of FIG. 4B,
And port P ₁Input signal to port P_Two, P_ThreeOr
When extracting a signal with a 90 ° phase difference from the
Error ε_pDepends on the value of Δ

[0015] Now, representing the inductance value of the coil L _1, L ₂ with L _1, L _2, when representing the capacitance of the capacitor C ₁ -C ₆ with C ₁ -C _6, delta is as follows . Δ = L ₁ / L ₂ , Δ = C ₁ / C ₃ , Δ = C ₂ / C ₅ , Δ
= C ₆ / C ₄ and if Δ = 1, ε _p = 0, Δ> 1 or Δ <1
Then, ε _p = E (with error).

Further, in the hybrid coupler shown in FIG. 4C, the error ε _p of the phase difference between the signals obtained from the ports P ₂ and P ₃ depends on the following value of Δ. In this case, represent the inductance values of the coil L ₁₁ ~L ₁₄ in L ₁₁ ~L _14, when representing a capacitance value of the capacitor C ₁₁ -C ₁₄ in C ₁₁ -C _14, delta is: .

Δ = L ₁₃ / L ₁₄ , Δ = L ₁₁ / L ₁₂ , Δ = C
₁₁ / C ₁₂ , Δ = C ₁₃ / C _14, and if Δ = 1, ε _p = 0, Δ> 1 or Δ <1
Then, ε _p = E (with error).

Therefore, when the discrete hybrid coupler is constructed as shown in FIG. 5, since the respective parts have variations, the value may deviate from Δ = 1 during mass production. Therefore, adjustment such as replacement of parts was required.

The signals at the ports P ₂ and P ₃ are 90 °
Even if there is any other phase difference than the phase difference of, ε _p depends on the value of Δ described above.

[0020]

The above-mentioned conventional apparatus has the following problems. (1) In the hybrid coupler having the circuit configuration shown in FIGS. 4B and 4C, when a signal is input from the port P ₁ and a signal having a phase difference is extracted from the ports P ₂ and P ₃ , an error ε of the phase difference is generated. _p depends on the ratio of the inductance value or the value of Δ which is the ratio of the capacitance values (if Δ = 1, ε _p =
0).

Therefore, the element constant (inductance value, inductance value,
If the capacitance value) varies, the value of Δ also varies and the phase difference error ε _p increases.

(2) For example, as shown in FIG. 5, when a coil and a capacitor which form a hybrid coupler are composed of discrete parts and these parts are mounted on a board, each part has a variation. Therefore, Δ may not be 1 at the time of mass production.

As a result, the error ε _p of the phase difference between the signals obtained from the ports P ₂ and P ₃ becomes large. SUMMARY OF THE INVENTION It is an object of the present invention to solve such a conventional problem, to reduce variations in components forming a hybrid coupler, and to reduce an error in a phase difference between signals obtained from an output side port.

[0024]

Means for Solving the Problems The present invention has the following construction to solve the above-mentioned problems. (1) In a hybrid coupler using a hybrid circuit, among the elements that form the hybrid circuit, a set of a plurality of elements that need to have the same element constant, and a conductor pattern in the same layer of the multilayer substrate. It was set using.

(2) In the configuration (1), a set of a plurality of elements for which the element constants need to have the same value is a plurality of coils. (3) In the configuration (1), a set of a plurality of elements for which the element constants need to have the same value is a plurality of capacitors.

[0026]

The operation of the present invention based on the above configuration will be described. In order to input a signal from the input side port of the hybrid coupler and obtain two signals with a predetermined phase difference from the two output side ports, a set of predetermined elements among the elements forming the hybrid circuit Must be set to the same element constant (inductance value or capacitance value).

Therefore, a set of elements (coils, capacitors) whose element constants need to be set to the same value is set in the same layer of the multilayer board by using a conductor pattern. In this case, for example, a coil pattern or a capacitor electrode pattern is formed by printing a conductor paste.

By doing so, since a plurality of elements that require the element constants in the substrate to have the same value can be manufactured under the same conditions, the variation among the elements in the above relationship can be minimized. It becomes possible to suppress.

For example, even when the multi-layer substrate is a ceramic multi-layer substrate, the contraction of the substrate and the pattern on which the elements are formed by firing occurs under the same conditions, so that the variation among the elements in the substrate in the above relationship is extremely large. Get smaller. That is, the above Δ has a relationship very close to Δ = 1.

As a result, the error in the phase difference between the signals obtained from the output side port can be reduced.

[0031]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 3 are views showing an embodiment of the present invention, FIG. 1 is an exploded perspective view of a hybrid coupler, FIG. 2A is a perspective view of the hybrid coupler, FIG. 2B is a circuit diagram of the hybrid coupler, and FIG. It is explanatory drawing of FIG.

1 to 3, the same symbols as those in FIGS. 4 and 5 indicate the same components. Further, 1 is a multilayer substrate, 1-1 to 1
-6 is the first to sixth layers (dielectric layer) of the multilayer substrate, 3-1
~ 3-4 is a coil pattern, 4-1 to 4-8 is a capacitor electrode pattern, 5 is a GND electrode pattern, 7-1 to 7
-6 is an external terminal.

The hybrid coupler of this embodiment is an example realized as an SMD (Surface Mount Component) module using a multilayer substrate, and its circuit configuration is as shown in FIG. 2B (compared with the conventional example shown in FIG. 4B). The same circuit configuration).

As shown in FIG. 1, the hybrid coupler uses a multilayer substrate (ceramic multilayer substrate in this example), and on the first layer 1-1 to the sixth layer 1-6 (dielectric layer) thereof, capacitor C ₁ -C _6, is a coil L _1, L _2, and the resistance R _e which is formed as a thick film element.

The specific structure will be described below. The resistance pattern 2 is formed on the first layer 1-1 of the multilayer substrate, and the coil patterns 3-1 and 3-3 are formed on the second layer 1-2.
To form a coil pattern 3-2 on the third layer 1-3,
3-4 is formed.

Further, capacitor electrode patterns 4-1, 4-2, 4-3, 4-4 are formed on the fourth layer 1-4, and capacitor electrode patterns 4 are formed on the fifth layer 1-5. -5, 4
-6, 4-7, 4-8 are formed, and on the fifth layer 1-5,
A GND electrode pattern (solid pattern) 5 is formed.

The above resistance pattern 2 and coil pattern 3
-1 to 3-4, capacitor electrode patterns 4-1 to 4-
8. The GND electrode patterns 5 are all formed as independent patterns, and at the portions connected to the external terminals, the patterns are formed by extending to the side surface portions of the multilayer substrate.

The resistance pattern 2 is formed, for example, by printing a resistor paste, and the coil patterns 3-1 to 3-3 are formed.
-4, capacitor electrode patterns 4-1 to 4-8 and GN
The D electrode pattern 5 is formed by printing a conductor paste, for example.

As described above, the first layer 1-1 to the sixth layer 1-
Each pattern formed on 6 connects the portion shown by the dotted line in FIG. 1 by a blind through hole (a through hole whose inside is filled with a conductor), and as shown in FIG. External terminals 7-1 to 7 provided on the
By -6, a predetermined part is connected.

Of the external terminals 7-1 to 7-6 shown in FIG. 2A, 7-1 is port P ₁ and 7-4 is port P ₂ and 7-6.
Is used as port P ₃ and 7-2 and 7-5 are GND
Used as the side electrode.

Further, 7-3 corresponds to the point of FIG. 2B. In this way, the external terminals 7-
By providing 1 to 7-6 and connecting to the internal circuit, the hybrid coupler is realized as an SMD module.

The correspondence between the configuration of the hybrid coupler shown in FIGS. 1 and 2A and the circuit diagram shown in FIG. 2B will be described below with reference to FIG. In FIG. 3, points (1) to (3) shown in the circuit diagram of FIG.

The resistance pattern 2 formed on the first layer 1-1 of the multilayer substrate 1 constitutes the resistance R _e . One end of this resistance pattern 2 is connected to the GND electrode pattern 5 on the sixth layer 1-6 by the external terminal 7-2, and the other end is connected to the external terminal 7
-3, it is connected to the capacitor electrode pattern 4-8 on the fifth layer 1-5, and this point becomes.

Coil pattern 3-1 on the second layer 1-2
And the coil pattern 3-2 on the third layer are connected by a dotted line portion in the drawing to form the coil L ₁ , and the coil pattern 3-3 on the second layer 1-2 and the coil on the third layer 1-3 are connected. The patterns 3-4 are connected by a dotted line portion in the drawing to form a coil L ₂ .

Further, the respective ends of the coil patterns 3-1 to 3-4 are connected to the capacitor electrodes on the fifth layer 1-5 by the external terminals 7-1, 7-3, 7-4 and 7-6, respectively. It is connected to the patterns 4-5 to 4-8 and becomes.

The capacitor electrode patterns 4-1 to 4-4 on the fourth layer 1-4 and the capacitor electrode patterns 4-5 to 4-8 on the fifth layer 1-5 are connected by dotted lines in the figure.
It becomes an electrode of the same potential as.

That is, the capacitor electrode pattern 4-1
Of 4-8, 4-4 and 4-6 have the same potential as 4-2,
4-8 has the same potential as 4-3 and 4-5 has the same potential as 4
-1, 4-7 have the same potential as.

Then, the capacitor electrode patterns 4-1 to 4-1
In the capacitor between 4-8, the capacitor C ₂₁ between 4-2 and 4-6 and the capacitor C ₂₂ between 4-4 and 4-8 constitute a capacitor C ₂ (C ₂ = C ₂₁ + C ₂₂ ). , 4-
A capacitor C ₅₁ between 1 and 4-5 and a capacitor C ₅₂ between 4-3 and 4-7 is a capacitor C ₅ (C ₅ = C ₅₁ + C ₅₂ ).
Is composed.

The GND electrode pattern 5 constitutes a capacitor electrode on the GND side, and this GND electrode pattern 5
And the capacitor electrode patterns 4-5 to 4-8 form a capacitor.

First, the capacitor electrode patterns 4-6 and G
A capacitor C ₁ is formed between the ND electrode patterns 5, and a capacitor C ₃ is formed between the capacitor electrode patterns 4-8 and the GND electrode pattern 5.

Also, the capacitor electrode patterns 4-7 and G
A capacitor C ₄ is formed between the ND electrode pattern 5 and
Capacitor electrode pattern 4-5 and GND electrode pattern 5
And a capacitor C ₆ is formed therebetween.

As described above, the coils L ₁ and L ₂ are
It is configured by using the layer 1-2 and the third layer, and the capacitors C ₂ , C
₅ is composed of the fourth layer 1-4 and the fifth layer 1-5, and the capacitors C ₁ , C ₃ , C ₄ and C ₆ are composed of the fifth layer 1-5 and the sixth layer 1-6. I am configuring.

[0053] That is, the coil L₁And L_TwoOf the multi-layer board
Constituting with the same layer, capacitor C_TwoAnd C_FiveMulti-layer base
A capacitor C is constructed by using the same layer of the plate.₁, C_Three, C
_Four, C₆Also uses the same layer of the multilayer substrate.

Thus, the coils L ₁ and L ₂ , the capacitors C ₂ and C ₅ , and the capacitors C ₁ , C ₃ , C _4, and C ₆
If and are respectively produced using the same layer of the multilayer substrate,
Since the shrinkage due to firing and the like is the same, the distance between each element (L ₁ and L ₂ , C ₂ and C ₅ , C ₁ and C ₃ and C ₄ and C ₆ )
Can be extremely reduced.

That is, Δ = L ₁ / L ₂ = 1 and Δ = C ₁
/ C ₃ = 1, Δ = C ₂ / C ₅ = 1, Δ = C ₆ / C ₄ = 1
Then, it is possible to approach as close as possible to the ideal state where ε _p = 0 (the error in the phase difference between the signals at the ports P ₂ and P ₃ is 0).

(Other Embodiments) Although the embodiments have been described above, the present invention can be implemented as follows. (1) The hybrid coupler with the circuit configuration shown in FIG.
Similar to the above-mentioned embodiment, it is possible to make an SMD module by using a multilayer substrate.

In this case, the coil L₁₃And L₁₄, Coil L₁₁
And L₁₂, Capacitor C₁₁And C₁₂And C ₁₃And C₁₄That
Set on the same layer of a multi-layer board. (2) Has a circuit configuration other than the circuits shown in FIGS. 4B and 4C
The same can be done for hybrid couplers
It is.

(3) As the multilayer substrate, not only a ceramic multilayer substrate but also a resin (eg glass-epoxy resin) multilayer substrate can be used. (4) The number of layers of the multilayer substrate may be arbitrary.

(5) It is also possible to mount a discrete component on the surface of the multi-layer substrate to form a hybrid IC. (6) When the hybrid coupler is used as a phase shifter, it can be applied not only to the 90 ° phase shifter but also to a phase shifter having an arbitrary phase difference.

(7) The hybrid coupler can be used not only as a phase shifter but also as a duplexer .

[0061]

As described above, the present invention has the following effects. (1) Among the elements that make up the hybrid coupler, if the elements that need to have the same element constant (inductance value, capacitance value) are formed in the same layer of the multilayer board using a thick film pattern, The variation between the elements can be reduced.

As a result, when the hybrid coupler is used as the phase shifter, the error (ε _p ) generated in the phase difference between the signals on the output side can be made extremely small. (2) By using a multilayer substrate, the hybrid coupler can be downsized. In addition, cost reduction is possible.

(3) It is also possible to easily mount a discrete component on the surface of the multilayer substrate constituting the hybrid coupler to form a hybrid IC.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of a hybrid coupler according to an embodiment of the present invention.

FIG. 2 is a diagram showing a hybrid coupler according to an embodiment of the present invention, FIG. 2A is a perspective view of the hybrid coupler, and FIG. 2B is a circuit diagram of the hybrid coupler.

FIG. 3 is an explanatory diagram of FIG. 1;

FIG. 4 is an explanatory diagram of a conventional hybrid coupler, FIG. 4A is a block diagram of the hybrid coupler, FIG. 4B is a circuit example 1 of the hybrid coupler, and FIG. 4C is a circuit example 2 of the hybrid coupler.

FIG. 5 is a specific example of a conventional hybrid coupler.

[Explanation of symbols]

1 Multilayer Substrate 1-1 to 1-6 First to Sixth Layers (Dielectric Layer) of Multilayer Substrate 2 Resistance Pattern 3-1 to 3-4 Coil Pattern 4-1 to 4-8 Capacitor Electrode Pattern 5 GND Electrode Pattern 7-1 to 7-6 External terminal

 ─────────────────────────────────────────────────── ─── Continuation of front page (56) References JP-A-56-105619 (JP, A) 1972 National Conference of IEICE 719

Claims (3)

(57) [Claims] 1. In a hybrid coupler using a hybrid circuit (HY), a set of a plurality of elements, which are required to have the same element constant among the elements constituting the hybrid circuit (HY), is formed on a multilayer substrate. A hybrid coupler characterized in that conductor patterns are set in the same layer. 2. A set of a plurality of elements for which the element constants need to have the same value are a plurality of coils (L ₁ and L ₂ , L ₁₁ and L ₁₂ , L ₁₃ and L ₁₄ ).
The hybrid coupler according to claim 1, wherein 3. A set of a plurality of elements for which the element constants need to have the same value is a plurality of capacitors (C ₂ and C ₅ , C ₁ and C ₃ and C ₄ and C).
_6, C ₁₁ and C ₁₂ and hybrid coupler according to claim 1, wherein the wherein the C ₁₃ and a C _14).