JP2688024B2 - Insulated wire - Google Patents
Insulated wireInfo
- Publication number
- JP2688024B2 JP2688024B2 JP1213993A JP21399389A JP2688024B2 JP 2688024 B2 JP2688024 B2 JP 2688024B2 JP 1213993 A JP1213993 A JP 1213993A JP 21399389 A JP21399389 A JP 21399389A JP 2688024 B2 JP2688024 B2 JP 2688024B2
- Authority
- JP
- Japan
- Prior art keywords
- polyphenylene ether
- insulated wire
- weight
- insulating layer
- foaming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005187 foaming Methods 0.000 claims description 19
- 229920001955 polyphenylene ether Polymers 0.000 claims description 18
- 239000004020 conductor Substances 0.000 claims description 17
- -1 phosphate compound Chemical class 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- 239000004088 foaming agent Substances 0.000 claims description 11
- 239000004594 Masterbatch (MB) Substances 0.000 claims description 7
- 229910019142 PO4 Inorganic materials 0.000 claims description 7
- 239000010452 phosphate Substances 0.000 claims description 7
- 239000011342 resin composition Substances 0.000 claims description 7
- 238000000354 decomposition reaction Methods 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 5
- 238000001125 extrusion Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 229910052736 halogen Inorganic materials 0.000 claims description 2
- 150000002367 halogens Chemical class 0.000 claims description 2
- 125000003545 alkoxy group Chemical group 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 125000004438 haloalkoxy group Chemical group 0.000 claims 1
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- 239000001257 hydrogen Substances 0.000 claims 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 1
- 125000001424 substituent group Chemical group 0.000 claims 1
- 239000010410 layer Substances 0.000 description 37
- 239000011247 coating layer Substances 0.000 description 11
- 239000004698 Polyethylene Substances 0.000 description 10
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 9
- 239000003063 flame retardant Substances 0.000 description 9
- 229920000573 polyethylene Polymers 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 239000004156 Azodicarbonamide Substances 0.000 description 6
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 6
- XOZUGNYVDXMRKW-AATRIKPKSA-N azodicarbonamide Chemical compound NC(=O)\N=N\C(N)=O XOZUGNYVDXMRKW-AATRIKPKSA-N 0.000 description 6
- 235000019399 azodicarbonamide Nutrition 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- VRFNYSYURHAPFL-UHFFFAOYSA-N [(4-methylphenyl)sulfonylamino]urea Chemical compound CC1=CC=C(S(=O)(=O)NNC(N)=O)C=C1 VRFNYSYURHAPFL-UHFFFAOYSA-N 0.000 description 5
- 239000006260 foam Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 229920001684 low density polyethylene Polymers 0.000 description 4
- 239000004702 low-density polyethylene Substances 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- WHHGLZMJPXIBIX-UHFFFAOYSA-N decabromodiphenyl ether Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br WHHGLZMJPXIBIX-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- LIAWCKFOFPPVGF-UHFFFAOYSA-N 2-ethyladamantane Chemical compound C1C(C2)CC3CC1C(CC)C2C3 LIAWCKFOFPPVGF-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 1
- CGSLYBDCEGBZCG-UHFFFAOYSA-N Octicizer Chemical compound C=1C=CC=CC=1OP(=O)(OCC(CC)CCCC)OC1=CC=CC=C1 CGSLYBDCEGBZCG-UHFFFAOYSA-N 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- 206010047289 Ventricular extrasystoles Diseases 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 229920005601 base polymer Polymers 0.000 description 1
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- YICSVBJRVMLQNS-UHFFFAOYSA-N dibutyl phenyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OC1=CC=CC=C1 YICSVBJRVMLQNS-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- OCWMFVJKFWXKNZ-UHFFFAOYSA-L lead(2+);oxygen(2-);sulfate Chemical compound [O-2].[O-2].[O-2].[Pb+2].[Pb+2].[Pb+2].[Pb+2].[O-]S([O-])(=O)=O OCWMFVJKFWXKNZ-UHFFFAOYSA-L 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Organic Insulating Materials (AREA)
Description
【発明の詳細な説明】 (産業上の利用分野) 本発明は音響機器、OA機器等の機器内配線等に使用す
る良好な機械的強度と難燃性を有し、かつ低静電容量の
絶縁電線に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention has good mechanical strength and flame retardancy used for wiring in equipment such as audio equipment and OA equipment, and has a low capacitance. It relates to insulated wires.
(従来の技術) 第1図はシールド電線の一般的構造の横断面図で、
(1)は導体、(2)は絶縁層、(3)は多数本の錫メ
ッキ軟銅線を絶縁層(2)上に横巻きして構成したシー
ルド層、(4)は塩化ビニル等の外部被覆層である。(Prior Art) FIG. 1 is a cross-sectional view of a general structure of a shielded wire,
(1) is a conductor, (2) is an insulating layer, (3) is a shield layer formed by winding a large number of tin-plated annealed copper wires on the insulating layer (2), and (4) is an external layer such as vinyl chloride. It is a coating layer.
従来より、上記絶縁層(2)として発泡ポリエチレン
を用いたシールド電線が、テレビのアンテナ、チューナ
ー間の信号伝送用や、ビデオ、オーディオ類の信号伝送
用、コンピューター類のインターフェース用等の信号伝
送用の電線として幅広く使用されている。Conventionally, a shielded electric wire using foamed polyethylene as the insulating layer (2) is used for signal transmission between television antennas and tuners, video signal transmission, audio signal transmission, computer interface transmission, etc. Widely used as electric wire.
第2図は平型絶縁電線の一例の横断面図である。図面
に示すように、複数の導体(1)が間隔をおいて並行に
配列されており、これら導体(1)上には、例えば一括
して絶縁層(2)が形成されており、上記絶縁層(2)
の相隣る絶縁層(2)が互いに連結されて成っている。FIG. 2 is a cross-sectional view of an example of a flat insulated wire. As shown in the drawing, a plurality of conductors (1) are arranged in parallel at intervals, and an insulating layer (2) is collectively formed on these conductors (1), for example. Layer (2)
Adjacent insulating layers (2) are connected to each other.
(解決しようとする課題) ところが、第1図のように絶縁層(2)上にシールド
層(3)を設けた電線では、内部導体(1)とシールド
層(3)との間に静電容量が生じ、高周波信号を伝送す
る場合、伝送損失が大きくなる。従ってこれらのシール
ド電線の内部導体(1)上の絶縁層(2)には誘電率の
小さな材料を使用することが不可欠である。発泡ポリエ
チレンは気泡率(材料中の全気泡体積/材料の全体積)
を変化させることによって、誘電率を未発泡状態の2.3
から、気泡率50%状態の1.4程度までコントロールで
き、内部導体(1)とシールド層(3)間の絶縁層
(2)としては好適である。(Problems to be solved) However, in an electric wire in which the shield layer (3) is provided on the insulating layer (2) as shown in FIG. 1, electrostatic charges are generated between the inner conductor (1) and the shield layer (3). When a capacitance is generated and a high frequency signal is transmitted, the transmission loss becomes large. Therefore, it is essential to use a material having a small dielectric constant for the insulating layer (2) on the inner conductor (1) of these shielded wires. Foamed polyethylene has a cell ratio (total cell volume in material / total volume of material)
By changing the dielectric constant of the unfoamed 2.3
Therefore, it can be controlled to about 1.4 with a bubble ratio of 50%, and is suitable as an insulating layer (2) between the inner conductor (1) and the shield layer (3).
しかし、ポリエチレンは可燃性であるため、火災時の
延焼防止はシールド層(3)上に設けた高難燃性の外部
被覆層(4)の材料に依存している。従って、外部被覆
層(4)が取り除かれた端末部等での安全性が充分では
なく、絶縁層(2)自体が高度の難燃性を有することが
要求されるようになってきた。However, since polyethylene is flammable, fire spread prevention in the case of fire depends on the material of the highly flame-retardant outer coating layer (4) provided on the shield layer (3). Therefore, the safety of the terminal portion or the like from which the outer coating layer (4) has been removed is not sufficient, and the insulating layer (2) itself is required to have high flame retardancy.
ポリエチレンはハロゲン系の難燃剤とアンチモン酸化
物を添加することによって高度の難燃性となることが知
られているが、UL規格の垂直燃焼試験であるUW−1に合
格するような高度の難燃性を付与した場合には、初期強
度が大幅に低下する。絶縁層に要求される初期強度とし
ては、一般に抗張力で1kg/mm2以上であるが、UW−1レ
ベルの高難燃のポリエチレンではこの誘電率2.0以下
で、この抗張力を得ることが困難であった。Polyethylene is known to be highly flame-retardant by adding a halogen-based flame retardant and antimony oxide, but it is highly difficult to pass the UW-1 vertical burning test of UL standard. When imparted with flammability, the initial strength is significantly reduced. The initial strength required for the insulating layer is generally 1 kg / mm 2 or more in tensile strength, but it is difficult to obtain this tensile strength with UW-1 level highly flame-retardant polyethylene with this dielectric constant of 2.0 or less. It was
又第2図のような平型絶縁電線は、音響機器やOA機器
等の小型化に伴なって、小型化が要求されるようになっ
てきている。Further, the flat insulated wire as shown in FIG. 2 is required to be downsized with the downsizing of audio equipment, OA equipment and the like.
平型絶縁電線が小型化されると、デジタル信号を送る
導体間の距離が小さくなる。このように導体間の距離が
小さい平型絶縁電線では、隣り合った導体と、この導体
に挟まれた絶縁層とによって形成されるコンデンサーの
静電容量が大きくなり、電送信号の減衰が著しく大きく
なる。これを防ぐためには絶縁層に誘電率(比誘電率、
以下ε)の小さな材料を使用すればよい。従来使用され
ている絶縁材料は殆んどがεが4以上の軟質PVCである
から、これをεが3程度の難燃性ポリエチレンに置き換
えれば、減衰率を若干小さくすることができる。又これ
よりεが小さい絶縁材料としては、ポリテトラフルオロ
エチレン等の弗素樹脂(ε2.1〜2.5)がある。When the flat insulated wire is downsized, the distance between conductors for transmitting digital signals becomes smaller. In such a flat insulated wire with a small distance between conductors, the capacitance of the capacitor formed by the adjacent conductors and the insulating layer sandwiched between the conductors becomes large, and the attenuation of the transmission signal is significantly large. Become. To prevent this, the dielectric constant (relative permittivity,
Hereinafter, a material having a small ε) may be used. Most of the conventionally used insulating materials are soft PVCs with ε of 4 or more, so if this is replaced with flame-retardant polyethylene with ε of about 3, the damping rate can be made slightly smaller. As an insulating material having a smaller ε than this, there is a fluororesin (ε2.1 to 2.5) such as polytetrafluoroethylene.
しかしながら、用途によっては絶縁材料のεが2以下
を要求される場合もあり、これには従来の材料を使用す
ることは出来ない。材料のεを小さくする方法として
は、発泡による多孔化が知られているが、軟質PVCや難
燃性ポリエチレンがεが2以下になるまで発泡させると
温度低下が著しく、絶縁材料としては使用できない。又
弗素樹脂の発泡は、樹脂の加工温度が300℃以上と非常
に高いことから、安定した発泡絶縁層を得るのは容易で
はない。However, depending on the application, ε of the insulating material may be required to be 2 or less, and the conventional material cannot be used for this. As a method of reducing the ε of the material, it is known to make it porous by foaming, but when soft PVC or flame-retardant polyethylene is foamed until ε is 2 or less, the temperature drops remarkably and cannot be used as an insulating material. . Further, since foaming of a fluororesin has a very high processing temperature of 300 ° C. or higher, it is not easy to obtain a stable foam insulating layer.
(課題を解決するための手段) 本発明は上述の問題点を解消した絶縁電線を提供する
もので、その特徴は、破断伸びが100%以上の変性ポリ
フェニレンエーテル樹脂組成物を、分解温度が200〜250
℃の範囲にある化学発泡剤を用いて発泡させた絶縁層を
具えていることにある。(Means for Solving the Problem) The present invention provides an insulated wire which solves the above-mentioned problems, and its characteristic is that the elongation at break is 100% or more of the modified polyphenylene ether resin composition, and the decomposition temperature is 200. ~ 250
It is provided with an insulating layer foamed using a chemical foaming agent in the range of ° C.
(作用) 変性ポリフェニレンエーテル樹脂組成物は、一般にポ
リ(2.6−ジメチルフェニレンエーテル)とポリスチレ
ン樹脂等の混合物、あるいはポリフェニレンエーテルに
スチレン等をクラフト重合させたグラフトマーとして知
られており、これにホスフェート化合物を添加して難燃
化したものも市販されている。この難燃変性ポリフェニ
レンエーテルのεは2.7以下であり、εを2以下にする
ためには、気孔率を34%以上にすればよい。変性ポリフ
ェニレンエーテルの初期抗張力は3〜4kg/mm2であるか
ら、均一な発泡が行なえれば発泡後も絶縁層として十分
な2kg/mm2程度の抗張力を保持させうる。一方、軟質PVC
ではεが4以上であるため、εを2以下とするためには
気孔率を60%以上とする必要があり、発泡後の抗張力は
1kg/mm2以下となる。又難燃性ポリエチレンは初期抗張
力が1.5kg/mm2、εが3〜3.5であるから、εを2以下に
するように発泡させた場合には、気孔率は44%以上とな
り、この場合も発泡後の抗張力は1kg/mm2を下回る。(Function) The modified polyphenylene ether resin composition is generally known as a mixture of poly (2.6-dimethylphenylene ether) and polystyrene resin, or a grafter obtained by kraft-polymerizing styrene or the like on polyphenylene ether, to which a phosphate compound is added. It is commercially available as a flame-retardant additive. The ε of this flame-retardant modified polyphenylene ether is 2.7 or less, and in order to reduce ε to 2 or less, the porosity should be 34% or more. The initial tensile strength of the modified polyphenylene ether can because it is 3-4 kg / mm 2, after foaming if Re performed uniform foam also is held sufficient 2 kg / mm 2 approximately tensile strength as an insulating layer. On the other hand, soft PVC
Since ε is 4 or more, the porosity must be 60% or more in order to reduce ε to 2 or less, and the tensile strength after foaming is
It will be less than 1kg / mm 2 . Also, since flame retardant polyethylene has an initial tensile strength of 1.5 kg / mm 2 and ε of 3 to 3.5, when it is foamed so that ε is 2 or less, the porosity becomes 44% or more. The tensile strength after foaming is less than 1 kg / mm 2 .
ホスフェート化合物としては、クレジルジフェニルホ
スフェート、2−エチルヘキシルジフェニルホスフェー
ト、トリクレジルホスフェート、トリイソプロピルフェ
ニルホスフェート、トリフェニルホスフェート、ジブチ
ルフェニルホスフェート等が使用可能である。As the phosphate compound, cresyl diphenyl phosphate, 2-ethylhexyl diphenyl phosphate, tricresyl phosphate, triisopropylphenyl phosphate, triphenyl phosphate, dibutylphenyl phosphate and the like can be used.
発泡剤としては、p−トルエンスルホニルセミカルバ
ジドやアゾジカルボンアミドのような発泡温度が200〜2
50℃のものが好ましく、これより低温で発泡するもので
は、樹脂の溶融が充分でないため独立気泡が形成され
ず、これより高温発泡タイプを使用すると変性ポリフェ
ニレンエーテル樹脂の溶融粘度が低くなりすぎて均一な
発泡が得られない。As a foaming agent, a foaming temperature such as p-toluenesulfonyl semicarbazide or azodicarbonamide is 200 to 2
50 ° C is preferable, and those that foam at a lower temperature than this do not form closed cells because the resin is not sufficiently melted, and when a high temperature foaming type is used, the melt viscosity of the modified polyphenylene ether resin becomes too low. Uniform foaming cannot be obtained.
発泡絶縁層の形成方法としては、ポリフェニレンエー
テル樹脂組成物を導体上に押し出すと同時に発泡させる
方法と、発泡剤を発泡温度以下でポリフェニレンエーテ
ル樹脂に混合し、これを発泡温度以下で絶縁電線に成形
後、この電線を発泡温度以上に加熱して発泡させる方法
があるが、後者の絶縁電線成形後に加熱発泡させると気
孔率が安定しないことや、平均の気泡径が大きくなるこ
とから好ましくない。As the method for forming the foamed insulation layer, a method in which the polyphenylene ether resin composition is extruded onto the conductor and simultaneously foamed, and a foaming agent is mixed with the polyphenylene ether resin at a foaming temperature or lower, and this is molded into an insulated wire at a foaming temperature or lower. After that, there is a method of heating the electric wire to a foaming temperature or higher for foaming. However, if the latter is heated and foamed after the insulated electric wire is formed, the porosity is not stable and the average bubble diameter becomes large, which is not preferable.
押し出しと同時に発泡を行なう場合、発泡剤をあらか
じめ変性ポリフェニレンエーテル樹脂に発泡温度以下で
混合する方法と、発泡剤をポリエチレン等の低温で溶融
混合できる樹脂に分散させたマスターバッチと変性ポリ
フェニレンエーテル樹脂をドライブレンドして押し出す
方法とがあるが、前者のあらかじめ変性ポリフェニレン
エーテル樹脂に発泡混合する方法では混合時の若干の発
泡がさけられない。この混合段階で気泡が生じると続く
押出時の発泡の際に絶縁層のピンホールの原因となる大
型の気泡の発生がさけられず好ましくない。When performing foaming at the same time as extrusion, a method in which a foaming agent is mixed with a modified polyphenylene ether resin in advance at a foaming temperature or less, and a masterbatch in which a foaming agent is melt-mixed at a low temperature such as polyethylene and a modified polyphenylene ether resin are dispersed. There is a method of dry blending and extruding, but the former method of foaming and mixing with a modified polyphenylene ether resin cannot avoid some foaming during mixing. If bubbles are generated in this mixing stage, large bubbles causing pinholes in the insulating layer are not generated during foaming during subsequent extrusion, which is not preferable.
発泡剤のマスターバッチを使用する方法は、マスター
バッチのベースポリマーに160℃以下で溶融混合できる
ものを使用することによって発泡剤の分解を完全に防止
することができる。このマスターバッチに使用するポリ
マーとしては160℃以下で溶融混合できるものであれば
よく、ポリエチレンやエチレン−酢酸ビニル共重合体、
エチレン−アクリル酸エチル共重合体、エチレン−プロ
ピレン共重合体等のエチレン−α−オレフィン共重合体
その他が使用可能である。The method using the masterbatch of the foaming agent can completely prevent decomposition of the foaming agent by using a base polymer of the masterbatch that can be melt-mixed at 160 ° C. or lower. The polymer used in this masterbatch may be any that can be melt-mixed at 160 ° C or lower, such as polyethylene or ethylene-vinyl acetate copolymer,
Ethylene-α-olefin copolymers such as ethylene-ethyl acrylate copolymer, ethylene-propylene copolymer and the like can be used.
(実施例) 実施例1: 樹脂分100重量部に対し約30重量部のホスフェート化
合物を含む変性ポリフェニレンエーテル樹脂(抗張力3.
5kg/mm2、伸び150%、誘電率2.6/1KHz)のペレット100
重量部に対して、p−トルエンスルホニルセミカルバジ
ド(分解温度220〜230℃)を低密度ポリエチレンに30重
量%となるように分散させたマスターバッチを5重量部
ドライブレンドし、これを押出機によりダイ部の設定温
度230℃で導体(直径0.5mmφの軟銅線)上に0.5mmの厚
さに押し出して発泡電線を作製した。(Example) Example 1: Modified polyphenylene ether resin containing about 30 parts by weight of a phosphate compound to 100 parts by weight of a resin component (tensile strength 3.
5kg / mm 2 , elongation 150%, dielectric constant 2.6 / 1KHz) pellet 100
5 parts by weight of a master batch in which 30 parts by weight of p-toluenesulfonyl semicarbazide (decomposition temperature of 220 to 230 ° C) was dispersed in low density polyethylene was dry-blended with respect to parts by weight. A foamed electric wire was manufactured by extruding a 0.5 mm thick piece onto a conductor (0.5 mm diameter soft copper wire) at a set temperature of 230 ° C.
この電線の被覆層には平均径20μmの均一な独立気泡
が形成されており、100μm以上の径の大きな気泡は見
られなかった。この気泡層の誘電率と抗張力を測定した
ところ、誘電率は1.6、抗張力は1.8kg/mm2であった。又
この発泡電線を1.5mm径の銅線に巻付け、巻戻しを行な
ったが、被覆層に亀裂や座屈は見られなかった。さらに
この電線でUL規格の垂直燃焼試験であるVW−1を実施し
たところ合格した。Uniform closed cells having an average diameter of 20 μm were formed in the coating layer of this electric wire, and no large bubbles having a diameter of 100 μm or more were observed. When the dielectric constant and tensile strength of this bubble layer were measured, the dielectric constant was 1.6 and the tensile strength was 1.8 kg / mm 2 . The foamed electric wire was wound around a copper wire having a diameter of 1.5 mm and unwound, but no crack or buckling was observed in the coating layer. Furthermore, this wire passed the UL standard vertical burning test VW-1 and passed.
実施例2: 発泡剤としてp−トルエンスルホニルセミカルバジド
の代りにアゾジカルボンアミドを使用し、実施例1と同
様にして発泡電線を作製した。Example 2: A foamed electric wire was prepared in the same manner as in Example 1 except that azodicarbonamide was used as the foaming agent instead of p-toluenesulfonyl semicarbazide.
この電線の被覆層にも平均径30μmの均一な独立気泡
が形成されており、100μm以上の径の大きな気泡は見
られなかった。この発泡層の誘電率と抗張力を測定した
ところ、誘電率は1.8、抗張力は1.6kg/mm2であった。又
この発泡電線を1.5mm径の銅線に巻付け、巻戻しを行な
ったが被覆層に亀裂や座屈は見られず、さらにVW−1に
も合格した。Uniform closed cells having an average diameter of 30 μm were also formed in the coating layer of this electric wire, and no large bubbles having a diameter of 100 μm or more were observed. When the dielectric constant and tensile strength of this foam layer were measured, the dielectric constant was 1.8 and the tensile strength was 1.6 kg / mm 2 . Further, this foamed electric wire was wound around a copper wire having a diameter of 1.5 mm and unwound, but no crack or buckling was observed in the coating layer, and it passed VW-1.
比較例1: 低密度ポリエチレン(メルトインデックス1)100重
量部にデカブロモジフェニルエーテル40重量部、三酸化
アンチモン30重量部、シリカ15重量部、酸化亜鉛5重量
部、アゾジカルボンアミド1重量部を混合した樹脂組成
物を、ダイ部設定温度180℃で、実施例1と同様に誘電
率1.6となるように発泡電線を作製した。Comparative Example 1: 100 parts by weight of low-density polyethylene (melt index 1) was mixed with 40 parts by weight of decabromodiphenyl ether, 30 parts by weight of antimony trioxide, 15 parts by weight of silica, 5 parts by weight of zinc oxide, and 1 part by weight of azodicarbonamide. A foamed electric wire was produced from the resin composition at a die temperature setting of 180 ° C. so as to have a dielectric constant of 1.6 as in Example 1.
この場合、発泡層の発泡状態や巻付け、巻戻し、及び
難燃性に問題はなかったが、抗張力は0.8kg/mm2と、1.0
kg/mm2以下であった。In this case, there were no problems in the foamed state of the foam layer, winding, rewinding, and flame retardancy, but the tensile strength was 0.8 kg / mm 2 , 1.0
It was less than kg / mm 2 .
比較例2: 樹脂分100重量部に対しホスフェート化合物を15重量
部を含む変性ポリフェニレンエーテル樹脂(抗張力4.2k
g/mm2、伸び60%、誘電率2.5/1KHz)を使用して実施例
1と全く同様に発泡電線を作製した。Comparative Example 2: Modified polyphenylene ether resin containing 15 parts by weight of a phosphate compound based on 100 parts by weight of a resin component (tensile strength 4.2 k
A foamed electric wire was manufactured in exactly the same manner as in Example 1 using g / mm 2 , elongation of 60%, and dielectric constant of 2.5 / 1 KHz).
この電線について誘電率と抗張力を測定したところ、
誘電率は1.7、抗張力は2.1kg/mm2と良好であり、VW−1
にも合格したが、1.5mm径の銅線に巻付けたところ被覆
層に亀裂が生じた。When the dielectric constant and tensile strength of this wire were measured,
The dielectric constant is 1.7 and the tensile strength is 2.1 kg / mm 2 , which is good, and VW-1
Although it passed the test, when it was wound on a copper wire having a diameter of 1.5 mm, a crack was generated in the coating layer.
実施例3: 樹脂分100重量部に対し約30重量部のホスフェート化
合物を含む変性ポリフェニレンエーテル樹脂(抗張力3.
5kg/mm2、伸び150%、ε2.6/1KHz)のペレット100重量
部に対して、p−トルエンスルホニルセミカルバジド
(分解温度220〜230℃)を低密度ポリエチレンに30重量
%になるように分散させたマスターバッチを5重量部ド
ライブレンドし、この組成物を押出機によりダイ部の設
定温度230℃で押し出して、第1図の構造の平型絶縁電
線を作成した。平型絶縁電線の導体径は0.4mmφ、絶縁
厚さ0.2mm、導体間隔(P)1.0mmである。Example 3: Modified polyphenylene ether resin containing about 30 parts by weight of a phosphate compound based on 100 parts by weight of a resin component (tensile strength 3.
Disperse p-toluenesulfonyl semicarbazide (decomposition temperature 220-230 ° C) in low density polyethylene to 30% by weight per 100 parts by weight of pellets of 5 kg / mm 2 , elongation 150%, ε2.6 / 1KHz). 5 parts by weight of the prepared masterbatch was dry blended, and this composition was extruded by an extruder at a die part set temperature of 230 ° C. to prepare a flat insulated wire having the structure shown in FIG. The conductor diameter of the flat insulated wire is 0.4 mmφ, the insulation thickness is 0.2 mm, and the conductor interval (P) is 1.0 mm.
この平型絶縁電線の絶縁層には平均径20μmの均一な
独立気泡が形成されており、100μm以上の径の大型の
気泡は見られなかった。又この発泡絶縁層のεと抗張力
を測定したところ、それぞれの値は1.75及び1.66kg/mm2
であった。In the insulating layer of this flat insulated wire, uniform closed cells having an average diameter of 20 μm were formed, and large bubbles having a diameter of 100 μm or more were not seen. The ε and tensile strength of this foamed insulation layer were measured and found to be 1.75 and 1.66 kg / mm 2 respectively.
Met.
実施例4: 発泡剤としてp−トルエンスルホニルセミカルバジド
の代りにアゾジカルボンアミドを使用して実施例3と同
様の平型絶縁電線を作成した。Example 4: A flat insulated wire similar to that of Example 3 was prepared by using azodicarbonamide instead of p-toluenesulfonyl semicarbazide as a foaming agent.
この平型絶縁電線の絶縁層にも平均径30μmの均一な
独立気泡が形成されており、100μm以上の径の大型の
気泡は見られなかった。又この発泡絶縁層のεと抗張力
を測定したところ、それぞれ1.82及び1.68kg/mm2であっ
た。Uniform closed cells having an average diameter of 30 μm were also formed in the insulating layer of this flat insulated wire, and large bubbles having a diameter of 100 μm or more were not seen. The ε and tensile strength of this foamed insulating layer were measured and found to be 1.82 and 1.68 kg / mm 2 , respectively.
比較例3: 低密度ポリエチレン(メルトインデックス1)100重
量部にデカブロモジフェニルエーテル40重量部、三酸化
アンチモン30重量部、シリカ15重量部、酸化亜鉛5重量
部、アゾジカルボンアミド1重量部を混合し、これをダ
イ設定温度180℃で押し出し、実施例3と同様のεとな
るように平型絶縁電線を作成し、その抗張力を測定した
ところ、0.78kg/mm2であり、実施例1の1/2以下であっ
た。Comparative Example 3: 100 parts by weight of low-density polyethylene (melt index 1) was mixed with 40 parts by weight of decabromodiphenyl ether, 30 parts by weight of antimony trioxide, 15 parts by weight of silica, 5 parts by weight of zinc oxide, and 1 part by weight of azodicarbonamide. Then, this was extruded at a die set temperature of 180 ° C., a flat type insulated wire was prepared so as to have the same ε as in Example 3, and its tensile strength was measured to be 0.78 kg / mm 2 , which was 1 of Example 1. It was less than / 2.
比較例4: PVC樹脂(重合度1050)100重量部に対し、ジオクチル
フタレート50重量部、三酸化アンチモン2重量部、三塩
基性硫酸鉛5重量部、クレー10重量部、アゾジカルボン
アミド2重量部を配合し、実施例3と同様のεとなるよ
うに平型絶縁電線を作成し、その抗張力を測定したとこ
ろ0.42kg/mm2で、実施例1の約1/4であった。Comparative Example 4: 50 parts by weight of dioctyl phthalate, 2 parts by weight of antimony trioxide, 5 parts by weight of tribasic lead sulfate, 10 parts by weight of clay, 2 parts by weight of azodicarbonamide, relative to 100 parts by weight of PVC resin (degree of polymerization: 1050). Was added to prepare a flat insulated wire with the same ε as in Example 3, and the tensile strength was measured to be 0.42 kg / mm 2 , which was about 1/4 of that in Example 1.
なお、本発明の絶縁電線は第1図及び第2図に示す構
造の絶縁電線に限定されるものではなく、例えば、絶縁
層の外側にシールド層を具えた電線の複数条を並列に配
列し、これらに共通に外部被覆層を設けた平型シールド
電線、あるいは導体上に絶縁層を設けた電線の複数条を
並列に配列し、これらに共通にシールド層を設け、その
上に外部被覆層を設けた平型シールド電線等にも適用で
きるのは勿論である。The insulated wire of the present invention is not limited to the insulated wire having the structure shown in FIGS. 1 and 2, and for example, a plurality of wires of a wire having a shield layer on the outside of the insulating layer may be arranged in parallel. , A flat shielded electric wire having an outer coating layer common to them, or a plurality of wires of an electric wire having an insulating layer formed on a conductor are arranged in parallel, a common shield layer is provided on them, and an outer coating layer is provided thereon. Of course, it can also be applied to a flat shielded electric wire provided with.
(発明の効果) 以上説明したように、本発明の絶縁電線によれば、高
難燃性で機械的強度にすぐれ、かつ低誘電率の発泡絶縁
層を具えており、電子機器等の機器内配線用電線として
利用するとき、極めて効果的である。(Effects of the Invention) As described above, according to the insulated wire of the present invention, the insulated wire is provided with the foamed insulating layer having high flame retardancy, excellent mechanical strength, and low dielectric constant. It is extremely effective when used as an electric wire for wiring.
第1図はシールド電線の一例の横断面図、第2図は平型
絶縁電線の一例の横断面図である。 1……導体、2……絶縁層、3……シールド層、4……
外部被覆層。FIG. 1 is a transverse sectional view of an example of a shielded electric wire, and FIG. 2 is a transverse sectional view of an example of a flat insulated electric wire. 1 ... Conductor, 2 ... Insulation layer, 3 ... Shield layer, 4 ...
Outer coating layer.
Claims (3)
ンエーテル樹脂組成物を、分解温度が200〜250℃の範囲
にある化学発泡剤を用いて発泡させた絶縁層を具えてい
ることを特徴とする絶縁電線。1. A modified polyphenylene ether resin composition having a breaking elongation of 100% or more, comprising an insulating layer formed by foaming with a chemical foaming agent having a decomposition temperature in the range of 200 to 250 ° C. Insulated wire to be used.
下記の構造式で示される基本骨格を有するポリフェニレ
ンエーテルとホスフェート化合物を含むものであること
を特徴とする請求項(1)記載の絶縁電線。 ここで、R1、R2、R3及びR4は水素、アルキル基、ハロゲ
ン、アルコキシ基及びハロアルコキシ基の中から選んだ
一価置換基、nは自然数である。2. The insulated wire according to claim 1, wherein the modified polyphenylene ether resin composition contains a polyphenylene ether having a basic skeleton represented by the following structural formula and a phosphate compound. Here, R 1 , R 2 , R 3 and R 4 are monovalent substituents selected from hydrogen, alkyl groups, halogens, alkoxy groups and haloalkoxy groups, and n is a natural number.
ある化学発泡剤を混合温度が150℃以下である樹脂に分
散させたマスターバッチと変性ポリフェニレンエーテル
樹脂組成物を導体上に押出すと同時に発泡させて形成し
たものであることを特徴とする請求項(1)記載の絶縁
電線。3. A masterbatch in which a chemical foaming agent having a decomposition temperature in the range of 200 to 250 ° C. is dispersed in a resin having a mixing temperature of 150 ° C. or less, and a modified polyphenylene ether resin composition are formed on a conductor as an insulating layer. The insulated wire according to claim 1, which is formed by foaming at the same time as extrusion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1213993A JP2688024B2 (en) | 1989-02-15 | 1989-08-18 | Insulated wire |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3716989 | 1989-02-15 | ||
| JP1-37169 | 1989-02-15 | ||
| JP1213993A JP2688024B2 (en) | 1989-02-15 | 1989-08-18 | Insulated wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02291605A JPH02291605A (en) | 1990-12-03 |
| JP2688024B2 true JP2688024B2 (en) | 1997-12-08 |
Family
ID=26376263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1213993A Expired - Fee Related JP2688024B2 (en) | 1989-02-15 | 1989-08-18 | Insulated wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2688024B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4363716B2 (en) | 1999-06-25 | 2009-11-11 | 株式会社東芝 | LSI wiring structure design method |
| JP2001052537A (en) * | 1999-08-09 | 2001-02-23 | Sumitomo Electric Ind Ltd | Non-halogen flame-retardant shielded wire |
| JP2007280762A (en) * | 2006-04-06 | 2007-10-25 | Hitachi Cable Ltd | Non-halogen coaxial cable and multi-core cable using the same |
| WO2011004839A1 (en) * | 2009-07-07 | 2011-01-13 | 株式会社フジクラ | Foamed electric wire, and transmitting cable comprising same |
| JP5420662B2 (en) * | 2009-07-07 | 2014-02-19 | 株式会社フジクラ | Foamed electric wire and transmission cable having the same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL8301569A (en) * | 1983-05-04 | 1984-12-03 | Gen Electric | POLYMER MIXTURE WITH FLAME-RESISTANT PROPERTIES, SUITABLE FOR WIRE COAT EXTRUSION, BASED ON POLYPHENYLENE OXIDE AND ELECTRICALLY CONDUCTIVE WIRE. |
-
1989
- 1989-08-18 JP JP1213993A patent/JP2688024B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02291605A (en) | 1990-12-03 |
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