JP2687535B2 - Method of processing holes by energy beam - Google Patents
Method of processing holes by energy beamInfo
- Publication number
- JP2687535B2 JP2687535B2 JP437789A JP437789A JP2687535B2 JP 2687535 B2 JP2687535 B2 JP 2687535B2 JP 437789 A JP437789 A JP 437789A JP 437789 A JP437789 A JP 437789A JP 2687535 B2 JP2687535 B2 JP 2687535B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- energy beam
- processed
- processed hole
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Treatments Of Macromolecular Shaped Articles (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明はエネルギービームによる加工穴の処理方法
に関し、さらに詳しくは、エネルギービームを用いた穴
あけ加工においてガラス繊維を含有する複合材料の加工
穴の形状を平滑にする処理方法に関する。Description: TECHNICAL FIELD The present invention relates to a method for processing a hole processed by an energy beam, and more specifically, a method for processing a hole formed in a composite material containing glass fibers in a hole drilling process using an energy beam. The present invention relates to a processing method for smoothing a shape.
従来、ガラス繊維を含有する樹脂基材、例えばプリン
ト配線基板に口径の小さい穴（0.3mm以下）をあけよう
とする場合、現状で使用されているドリル加工ではドリ
ルが折れて安定な加工ができない、若しくは加工時間が
非常に長いという短所があつた。そのために口径の小さ
い穴を安定かつ高速に加工できる点でレーザビームや電
子ビーム等のエネルギービームを用いるプリント配線基
板の穴あけ加工が提唱されているが、その際の加工穴の
内壁形状については何も言及されてはいなかつた（特開
昭61−152093号公報）。Conventionally, when trying to make a hole with a small diameter (0.3 mm or less) in a resin base material containing glass fiber, such as a printed wiring board, the drilling used at present cannot break the drill stably. Or, there is a disadvantage that the processing time is very long. For that reason, it has been proposed to drill a printed wiring board using an energy beam such as a laser beam or an electron beam in that it can stably and quickly machine a hole with a small diameter, but what about the inner wall shape of the machined hole at that time? Is also referred to (JP-A-61-152093).
通常、穴あけ加工に用いられるエネルギービームは10
6〜108W/cm3のパワー密度に収束されるので、ビームの
照射された部分は瞬時に溶融、蒸発して加工穴が形成さ
れる。その際、複合材料であるプリント配線基板の加工
穴の内壁は平滑ではなく大きな凹凸が生じており、接続
の信頼性を損う等の問題が残されていた。Normally, the energy beam used for drilling is 10
Since the power density is converged to 6 to 10 8 W / cm 3 , the irradiated part of the beam is instantly melted and evaporated to form a processed hole. At that time, the inner wall of the processed hole of the printed wiring board, which is a composite material, is not smooth but has large irregularities, and there remains a problem that the reliability of the connection is impaired.
現在までにこの方法はIBM社によつて採用された例が
ある（日刊工業新聞社刊「機械技術」第34巻６号ページ
53〜）。これはレーザビームをプリント配線基板のスル
ーホール穴あけに適用した例であるが、日本国内のプリ
ント配線基板メーカ各社は加工穴の内壁の凹凸が激し
く、加工穴にメツキした際の接続信頼性が低いという検
討結果を出し、プリント配線基板製造上のメリツトがあ
るにもかかわらず、採用を見合わせていた。To date, this method has been adopted by IBM Corporation ("Machine Technology", Vol. 34, No. 6, published by Nikkan Kogyo Shimbun).
53 ~). This is an example of applying a laser beam to drilling through-holes in a printed wiring board. However, printed wiring board manufacturers in Japan have severe irregularities on the inner wall of the machined hole, resulting in poor connection reliability when mating into the machined hole. The result of the examination was given, and despite the merit in manufacturing the printed wiring board, the adoption was suspended.
現在用いられているプリント配線基板の場合、エポキ
シ樹脂やポリイミド樹脂とガラス織布との複合材料が主
であるが、エネルギービームを用いた加工がビームの熱
エネルギーを利用した除去加工であるため、ガラス織布
とエポキシ樹脂やポリイミド樹脂との耐熱性及び熱伝導
の差によつてエポキシ樹脂やポリイミド樹脂が選択的に
除去されやすい。そのために加工穴の内壁断面形状は例
えば参考写真２、参考写真３に示すように、カラス織布
の繊維束が突出したものとなる。In the case of printed wiring boards currently used, composite materials of epoxy resin or polyimide resin and glass woven cloth are mainly, but since the processing using the energy beam is the removal processing using the thermal energy of the beam, Due to the difference in heat resistance and heat conduction between the glass woven cloth and the epoxy resin or the polyimide resin, the epoxy resin or the polyimide resin is easily removed selectively. Therefore, the cross-sectional shape of the inner wall of the processed hole is such that the fiber bundle of the crow woven cloth is projected, as shown in Reference Photos 2 and 3.
参考写真２は、板厚み0.2mmtの両面銅張ガラスエポキ
シ基板（ガラスクロス織布）に、加速電圧100KV、ビー
ム電流20mAの電子ビームを約0.1ms照射した時に得られ
た加工穴の一例に、穴内壁形状が観察しやすいように、
無電解めつきを施して撮影した加工穴の断面写真であ
る。この場合、ガラスクロスの突出長さは約30μｍであ
り、結果として加工穴の内壁の凹凸が約30μｍあり、プ
リント配線基板用の加工穴としては信頼性の点において
不適であることがわかる。Reference Photo 2 is an example of a machined hole obtained by irradiating an electron beam with a accelerating voltage of 100KV and a beam current of 20mA for about 0.1ms on a double-sided copper-clad glass epoxy substrate (glass cloth woven fabric) with a plate thickness of 0.2mmt. To make it easier to observe the shape of the inner wall of the hole,
It is a cross-sectional photograph of a processed hole taken by applying electroless plating. In this case, the protruding length of the glass cloth is about 30 μm, and as a result, the unevenness of the inner wall of the processed hole is about 30 μm, which is unsuitable in terms of reliability as a processed hole for a printed wiring board.
参考写真３は、産業用プリント基板としては最も一般
的な、板厚み1.6mmtの両面銅張ガラスエポキシ基板に、
加速電圧100KV、ビーム電流20mAの電子ビームを約1ms照
射した時に得られた加工穴の一例に、参考写真２と同様
の方法を用いて撮影した加工穴の断面写真である。この
場合、ガラスクロスの突出長さは約100μｍあり、結果
として加工穴の内壁の凹凸が約100μｍと非常に大き
く、プリント配線板用の加工穴としては信頼性の点にお
いて著しく不適であることがわかる。Reference Photo 3 shows a double-sided copper-clad glass epoxy board with a board thickness of 1.6 mmt, which is the most common industrial printed board.
FIG. 3 is a cross-sectional photograph of a machined hole taken by the same method as Reference Photo 2 as an example of the machined hole obtained when an electron beam having an accelerating voltage of 100 KV and a beam current of 20 mA was irradiated for about 1 ms. In this case, the protruding length of the glass cloth is about 100 μm, and as a result, the unevenness of the inner wall of the processed hole is very large, about 100 μm, which is extremely unsuitable in terms of reliability as a processed hole for a printed wiring board. Recognize.
この発明にかかる問題を解決するためのもので、エネ
ルギービームによる加工穴の内壁形状を平滑にして接続
信頼性を高め、なおかつ結果的に小径の穴を効率良く短
時間で加工できる加工穴の処理方法を提供することを目
的とする。In order to solve the problem according to the present invention, the processing of the processed hole by the energy beam that can smooth the inner wall shape of the processed hole to improve the connection reliability and, as a result, efficiently process a small diameter hole in a short time. The purpose is to provide a method.
この発明に係るエネルギービームによる加工穴の処理
方法はガラス繊維を含有する樹脂基材にエネルギービー
ムを照射してあけられた加工穴を、フツ素を含有した気
体の励起種によつてエツチングして平滑化するものであ
る。The method of processing a processed hole with an energy beam according to the present invention is a method of etching a processed hole formed by irradiating a resin base material containing a glass fiber with an energy beam by etching with an excited species of a gas containing fluorine. It is for smoothing.
また、この発明の別の発明に係るエネルギービームに
よる加工穴の処理方法は、上記加工穴を、フツ素化合物
を含有するエツチング液によりエツチングして平滑化す
るものである。Further, a method of treating a processed hole by an energy beam according to another invention of the present invention is to smooth the processed hole by etching with an etching solution containing a fluorine compound.
この発明においては、エネルギービームによる加工穴
を、フツ素を含有した気体の励起種またはフツ素化合物
を含有するエツチング液によりエツチングして平滑化す
るので、加工穴の内壁形状を平滑にして接続信頼性を高
め、結果的に小径の穴を効率良く短時間で加工できる。According to the present invention, the hole machined by the energy beam is etched and smoothed by the etching liquid containing the excited species of the gas containing fluorine or the fluorine compound, so that the inner wall shape of the hole is smoothed and the connection reliability is improved. As a result, holes with a small diameter can be efficiently processed in a short time.
以下、実施例によりこの発明を図を用いて具体的に説
明する。第１図（ａ）〜（ｃ）はこの発明の一実施例に
よるエネルギービームによる加工穴の処理方法を工程順
に示す。Hereinafter, the present invention will be specifically described with reference to the drawings by examples. FIGS. 1 (a) to 1 (c) show a method of processing a machined hole by an energy beam according to an embodiment of the present invention in the order of steps.
第１図（ａ）はエネルギービームにより、ガラスエポ
キシ基材に穴あけした後の断面を模式的に示したもので
ある。この図において、（１）は銅箔、（２）はエポキ
シ樹脂、（３）はガラス織布、（４）は加工時にできた
ばり、（５）は穴内壁に突出したガラス繊維である。エ
ネルギービームを用いた加工は通常、熱を利用した加工
であり、その際ビームを高いパワー密度に収束させて用
いるので、被加工物の構成材料に耐熱性や熱伝導率等の
性質に差がある場合、除去される割合が異なつて断面形
状に凹凸が生じるようになる。そのため、第１図（ａ）
のような形状が生じる。FIG. 1 (a) schematically shows a cross section after a hole has been formed in a glass epoxy substrate with an energy beam. In this figure, (1) is a copper foil, (2) is an epoxy resin, (3) is a woven glass cloth, (4) is burrs formed during processing, and (5) is glass fiber protruding into the inner wall of the hole. Processing using an energy beam is usually processing using heat, and since the beam is used by converging the beam to a high power density at that time, there are differences in properties such as heat resistance and thermal conductivity among the constituent materials of the workpiece. In some cases, unevenness occurs in the cross-sectional shape due to different removal rates. Therefore, Fig. 1 (a)
A shape like the above occurs.
第１図（ｂ）は第１図（ａ）で形成された加工穴を平
滑にするのにフツ素を含有した気体め励起種によつてエ
ツチングする場合を示し、図において、（６）は真空容
器、（７）は電極、（８）は基板、（９）はガス導入
管、（10）は排気口、（11）は電源である。容器（６）
内に対向した電源（７）を設置し、その片方に基板
（８）を固定する。ガス導入管（９）より容器（６）内
に例えば四フツ化炭素等のガスを導入して所定の圧力、
例えば１〜10torrにした後、例えば周波数13.56MHz、電
力10〜1000Wにより電極（７）間に放電を生じさせ、生
成したガスの励起種によつて基板（８）の加工穴の内壁
形状を平滑化する。これは、一般にフツ素はガラスに対
するエツチング速度が樹脂に対するそれよりも非常に大
きいので、フツ素の励起種は選択的にガラス繊維（５）
の主成分であるSiO2を分解させ、除去するためと考えら
れる。FIG. 1 (b) shows a case where etching is performed by a gas-containing excited species containing fluorine for smoothing the processed hole formed in FIG. 1 (a). In the figure, (6) shows A vacuum container, (7) an electrode, (8) a substrate, (9) a gas inlet tube, (10) an exhaust port, and (11) a power supply. Container (6)
The power source (7) facing each other is installed inside, and the substrate (8) is fixed to one of them. A gas such as carbon tetrafluoride is introduced into the container (6) through the gas introduction pipe (9) to a predetermined pressure,
For example, after the pressure is set to 1 to 10 torr, a discharge is generated between the electrodes (7) with a frequency of 13.56 MHz and a power of 10 to 1000 W, and the inner wall shape of the processed hole of the substrate (8) is smoothed by the excited species of the generated gas. Turn into. This is because, in general, fluorine has a much higher etching rate for glass than that for resin.
This is considered to be due to the decomposition and removal of SiO 2 which is the main component of.
第１図（ｃ）は第１図（ｂ）によつて平滑化された加
工穴の断面形状を模式的に示すものである。第１図
（ａ）の平滑化処理前のものと比べると、加工時の穴形
状は樹脂がほとんどエツチングされないのでほとんど変
化しないが、内壁に突出していたガラス繊維（５）が処
理によつて除去されている。また、ばり（４）も除去さ
れている。これは主に、ガス励起種の物理的な衝突作用
によるためと考えられる。FIG. 1 (c) schematically shows the cross-sectional shape of the processed hole smoothed according to FIG. 1 (b). Compared with the one before the smoothing treatment in Fig. 1 (a), the hole shape during processing hardly changes because the resin is hardly etched, but the glass fiber (5) protruding on the inner wall is removed by the treatment. Has been done. The flash (4) is also removed. It is considered that this is mainly due to the physical collision action of the gas excited species.
次に平滑化された加工穴に無電解銅メツキおよび電気
銅メツキを施し、所望の導体回路およびスルーホールを
形成した。接続信頼性試験としてヒートサイクルテスト
（条件：−65℃、30分125℃、30分）を行つたが1000
サイクル以上断線せず、スルーホールの高信頼性が確認
された。Next, electroless copper plating and electrolytic copper plating were applied to the smoothed processed holes to form desired conductor circuits and through holes. A heat cycle test (conditions: -65 ° C, 30 minutes 125 ° C, 30 minutes) was performed as a connection reliability test, but 1000
The high reliability of the through hole was confirmed without breaking the wire for more than one cycle.
なお、フツ素を含有した気体としては、上記実施例で
用いた四フツ化炭素の他に、フツ化水素、ヘキサフルオ
ロエタン、パーフルオロプロパン、パーフルオロブタ
ン、トリフルオロメタンなどがあり、これらの各種ガス
に水素、酸素、炭化水素等のガスを単独あるいは必要に
応じて数種混合して用いても差支えない。As the gas containing fluorine, in addition to the carbon tetrafluoride used in the above examples, there are hydrogen fluoride, hexafluoroethane, perfluoropropane, perfluorobutane, trifluoromethane, and the like. Gas such as hydrogen, oxygen and hydrocarbon may be used alone or in combination of several kinds as necessary.
このようなフツ素含有気体の励起種によるエツチング
では強酸、強アルカリ溶液を使用しないため、公害や人
体に対する影響が無い。Etching by the excited species of the fluorine-containing gas does not use a strong acid or strong alkaline solution, and therefore has no pollution or influence on the human body.
第２図はこの発明の他の実施例による加工穴の処理方
法を説明する断面構成図であり、図において、（12）は
水槽、（13）はエツチング液である。第１図（ａ）と同
様にして加工穴があけられた基板を、例えばフツ酸230m
l/、フツ化アンモニウム180g/、残り水で50℃に調
整されたエツチング液（13）に10分間浸漬することによ
り、加工穴内壁に突出したガラス繊維（５）を選択的に
エツチング処理する。FIG. 2 is a cross-sectional configuration diagram for explaining a method of treating a processed hole according to another embodiment of the present invention. In the figure, (12) is a water tank and (13) is an etching liquid. In the same manner as in Fig. 1 (a), a substrate with a drilled hole, for example, 230m hydrofluoric acid
The glass fiber (5) protruding on the inner wall of the processed hole is selectively etched by immersing the glass fiber (5) in the inner wall of the processed hole for 10 minutes by immersing it in an etching solution (13) adjusted to 50 ° C. with l /, ammonium fluoride 180 g /, and residual water.
参考写真１はこの第２図に示された方法によつて処理
された加工穴の一例を示す断面写真である。この加工穴
は参考図２に示されたこの発明に係わる処理を行わない
加工穴を上記のようにエツチング処理し、穴内壁形状が
観察しやすいように無電解めつきを施して撮影した加工
穴の断面写真である。参考写真２（処理なし）と参考写
真１（処理あり）を比較すればわかるように、この発明
に係わる処理により、加工穴内壁から突出したガラス繊
維（５）が選択的に除去され、内壁の凹凸が大幅に低減
された加工穴が得られる。Reference photograph 1 is a sectional photograph showing an example of a machined hole processed by the method shown in FIG. This machined hole is the machined hole shown in FIG. 2 which is not machined according to the present invention and is subjected to the etching process as described above, and is electrolessly plated to facilitate observation of the inner wall shape of the hole. It is a cross-sectional photograph of. As can be seen by comparing Reference photograph 2 (without treatment) and Reference photograph 1 (with treatment), the glass fiber (5) protruding from the inner wall of the processed hole is selectively removed by the treatment according to the present invention, and It is possible to obtain a machined hole in which unevenness is significantly reduced.
次に、スムージング化された加工穴に無電解銅めつ
き、電気銅めつきを施し所望の導体回路及びスルーホー
ルを形成した。スルーホール接続信頼性テストとしてヒ
ートサイクルテスト（条件：−65℃、30分125℃、30
分）を行つたところ1000サイクルまで断線せずスルーホ
ールの高信頼性が確認された。Next, electroless copper plating and electrolytic copper plating were applied to the smoothed processed holes to form desired conductor circuits and through holes. Heat cycle test (conditions: -65 ℃, 30 minutes 125 ℃, 30
Min), the high reliability of the through hole was confirmed without breaking up to 1000 cycles.
このようなフツ素化合物を含有するエツチング液によ
るエツチングでは、被処理物をエツチング液に浸すだけ
なので、装置および操作が簡単である。In etching with an etching liquid containing such a fluorine compound, the object to be treated is simply immersed in the etching liquid, and therefore the apparatus and operation are simple.
なお、上記実施例では何れもガラス繊維を含有する樹
脂基材がプリント配線基板である場合について説明した
が、これに限るものではなく、軽くて金属以上の強度を
有する繊維強化プラスチック等を用いた自動車部材や飛
行機部材であつてもよく、上記実施例と同様の効果を奏
する。In each of the above examples, the case where the resin base material containing the glass fiber is the printed wiring board has been described, but the present invention is not limited to this, and a fiber reinforced plastic or the like that is light and has strength higher than that of metal is used. It may be an automobile member or an airplane member, and has the same effect as the above embodiment.
以上のようにこの発明によれば、ガラス繊維を含有す
る樹脂基材にエネルギービームを照射してあけられた加
工穴を、フツ素を含有した気体の励起種、またはフツ素
化合物を含有するエツチング液によつてエツチングして
平滑化するので、接続信頼性を高め、結果的に小径の穴
を効率良く短時間で加工できる効果がある。As described above, according to the present invention, the processed hole formed by irradiating the resin base material containing the glass fiber with the energy beam is an etching species containing the excited species of the gas containing fluorine or the fluorine compound. Since the solution is etched and smoothed, the connection reliability is improved, and as a result, a hole having a small diameter can be efficiently processed in a short time.
第１図（ａ）〜（ｃ）はこの発明の一実施例によるエネ
ルギービームによる加工穴の処理方法を説明する工程
図、第２図はこの発明の他の実施例によるエネルギービ
ームによる加工穴の処理方法の要部を説明する断面構成
図である。 図において、（２）はエポキシ樹脂、（３）はガラス織
布、（５）はガラス繊維、（６）は真空容器、（７）は
電極、（８）は基板、（９）はガス導入管、（11）は電
源、（12）は水槽、（13）はエツチング液である。 なお、図中、同一符号は同一、または相当部分を示す。FIGS. 1 (a) to 1 (c) are process diagrams for explaining a method of processing a processed hole by an energy beam according to an embodiment of the present invention, and FIG. 2 is a process drawing of a processed hole by an energy beam according to another embodiment of the present invention. It is a section lineblock diagram explaining the important section of a processing method. In the figure, (2) is epoxy resin, (3) is glass woven fabric, (5) is glass fiber, (6) is vacuum container, (7) is electrode, (8) is substrate, and (9) is gas introduction. A pipe, (11) a power supply, (12) a water tank, and (13) an etching liquid. In the drawings, the same reference numerals indicate the same or corresponding parts.
Claims (2)
ービームを照射してあけられた加工穴を、フツ素を含有
した気体の励起種によつてエツチングして平滑化するエ
ネルギービームによる加工穴の処理方法。1. An energy-beam-processed hole in which a machined hole formed by irradiating a resin base material containing glass fibers with an energy beam is etched and smoothed by an excited species of a gas containing fluorine. Processing method.
ービームを照射してあけられた加工穴を、フツ素化合物
を含有するエツチング液によりエツチングして平滑化す
るエネルギービームによる加工穴の処理方法。2. A method of treating a processed hole by an energy beam, wherein a processed hole formed by irradiating a resin base material containing glass fiber with an energy beam is etched and smoothed by an etching solution containing a fluorine compound. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP437789A JP2687535B2 (en) | 1989-01-10 | 1989-01-10 | Method of processing holes by energy beam |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP437789A JP2687535B2 (en) | 1989-01-10 | 1989-01-10 | Method of processing holes by energy beam |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02184423A JPH02184423A (en) | 1990-07-18 |
| JP2687535B2 true JP2687535B2 (en) | 1997-12-08 |
Family
ID=11582673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP437789A Expired - Lifetime JP2687535B2 (en) | 1989-01-10 | 1989-01-10 | Method of processing holes by energy beam |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2687535B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115304291A (en) * | 2022-09-13 | 2022-11-08 | 江西沃格光电股份有限公司 | Method for processing through hole on glass substrate |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1252921T1 (en) | 1995-08-11 | 2003-11-27 | Zenon Environmental Inc., Oakville | Device for permeate removal from a liquid substrate with several components |
| KR20030033633A (en) * | 2001-10-24 | 2003-05-01 | 울트라테라 코포레이션 | Manufacturing method of printed circuit board through hole |
| KR100938451B1 (en) * | 2002-04-17 | 2010-01-25 | 스트래터시스,인코포레이티드 | Smoothing method for layered deposition modeling |
| TW573327B (en) * | 2002-12-27 | 2004-01-21 | Ultratera Corp | Plasma etching method |
-
1989
- 1989-01-10 JP JP437789A patent/JP2687535B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115304291A (en) * | 2022-09-13 | 2022-11-08 | 江西沃格光电股份有限公司 | Method for processing through hole on glass substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02184423A (en) | 1990-07-18 |
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