CA2317233A1 - Ultrasonically assisted plating bath for vias metallization in printed circuit board manufacturing - Google Patents
Ultrasonically assisted plating bath for vias metallization in printed circuit board manufacturing Download PDFInfo
- Publication number
- CA2317233A1 CA2317233A1 CA002317233A CA2317233A CA2317233A1 CA 2317233 A1 CA2317233 A1 CA 2317233A1 CA 002317233 A CA002317233 A CA 002317233A CA 2317233 A CA2317233 A CA 2317233A CA 2317233 A1 CA2317233 A1 CA 2317233A1
- Authority
- CA
- Canada
- Prior art keywords
- set forth
- printed circuit
- plating
- circuit board
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/20—Electroplating using ultrasonics, vibrations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1518—Vertically held PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
Abstract
A method and apparatus for enhancing the microthrowing power in a plating bath. The method involves the use of ultrasonic vibration of an electrochemical solution to increase the uniformity of copper deposition for blind hole vias. The apparatus includes a series of ultrasonic transducers positioned between anodes for vibration of the solution being electro deposited on the cathode.
Description
ULTRASONICALLY ASSISTED PLATING BATH FOR VIAS
METALLIZATION IN PRINTED CIRCUIT BOARD MANUFACTURING
The present invention relates to vias metallization of printed circuit boards and more particularly, the present invention relates to enhancing the throwing power in the electroplating of the vias.
In view of the continuous advancements in :LO semiconductor performance together with rapid expansion of the demand for sophisticated electronic devices, particularly in mobile and portable applications, the need for fabricating circuit feature of a small size and interconnection substrates is substantially increasing.
Multi-layered printed circuit boards are now using high aspect ratio through hole vias and blind vias openings for high density interconnections. Uniform plating distribution inside these vias represents a main issue for PCB reliability.
:~ 0 New ways to improve mass transport and new electrolyte additives have increased the uniformity of electrodeposition inside blind vias.
Blind vias having a diameter (d) of 150 microns or less and an aspect ratio (AR) (see equation [1]) greater than 1 are difficult to plate properly using conventional techniques. Currently, in order to enhance copper deposition inside blind vias, the technique of reverse pulse plating or the use of complex chemical solutions have been proposed and used. These processes are not without their limitations, despite the fact that they are useful.
As is known, industrial plating solutions can be extremely complex and can contain up to four organic additives.
Additive concentrations require constant monitoring and are usually adjusted because many of these additives are destroyed or sacrificed during the plating process.
.LO Another limitation is that the solution, subsequent to use is environmentally unfriendly and can result in expensive disposal costs.
Regarding a pulse step position, this process also employs complex chemical solutions and involves a significant capital investment since the method does not employ the same current rectifiers typically associated with conventional DC plating. One of the other limitations to this process is that health problems could be an issue 20 for the operators since reverse pulse systems emit strong magnetic fields.
As is known in fluid dynamics, ultrasonic agitation enhances mass transfer and this technique can be applied to electrochemistry. This was proposed by Walker in, Chemistry in Britain, 1990, pp. 251-254.
METALLIZATION IN PRINTED CIRCUIT BOARD MANUFACTURING
The present invention relates to vias metallization of printed circuit boards and more particularly, the present invention relates to enhancing the throwing power in the electroplating of the vias.
In view of the continuous advancements in :LO semiconductor performance together with rapid expansion of the demand for sophisticated electronic devices, particularly in mobile and portable applications, the need for fabricating circuit feature of a small size and interconnection substrates is substantially increasing.
Multi-layered printed circuit boards are now using high aspect ratio through hole vias and blind vias openings for high density interconnections. Uniform plating distribution inside these vias represents a main issue for PCB reliability.
:~ 0 New ways to improve mass transport and new electrolyte additives have increased the uniformity of electrodeposition inside blind vias.
Blind vias having a diameter (d) of 150 microns or less and an aspect ratio (AR) (see equation [1]) greater than 1 are difficult to plate properly using conventional techniques. Currently, in order to enhance copper deposition inside blind vias, the technique of reverse pulse plating or the use of complex chemical solutions have been proposed and used. These processes are not without their limitations, despite the fact that they are useful.
As is known, industrial plating solutions can be extremely complex and can contain up to four organic additives.
Additive concentrations require constant monitoring and are usually adjusted because many of these additives are destroyed or sacrificed during the plating process.
.LO Another limitation is that the solution, subsequent to use is environmentally unfriendly and can result in expensive disposal costs.
Regarding a pulse step position, this process also employs complex chemical solutions and involves a significant capital investment since the method does not employ the same current rectifiers typically associated with conventional DC plating. One of the other limitations to this process is that health problems could be an issue 20 for the operators since reverse pulse systems emit strong magnetic fields.
As is known in fluid dynamics, ultrasonic agitation enhances mass transfer and this technique can be applied to electrochemistry. This was proposed by Walker in, Chemistry in Britain, 1990, pp. 251-254.
Although there have been advances in the electroplating of the circuit board vias, these methods remain complex to control and run. There is a need in the industry to have a method which is easier to operate and which provides for a similar or more efficient electrodeposition. The present invention satisfies these needs.
One object of the present invention is to provide an :10 improved system and method for enhancing the throwing power in an electroplating cell.
The method is particularly well adapted for industrial applications of PCB plating for high production levels with uniform application of the plating material.
According to one aspect of one embodiment of the present invention, there is provided a method for electroplating blind vias or through holes in an integrated :?0 circuit, comprising the steps of: providing a printed circuit board having blind vias or through holes therein;
providing a plating cell containing solution for plating in the vias of the printed circuit board, the plating cell further including anodes; providing ultrasonic vibration means for vibrating the plating solution during electrodeposition; and vibrating the solution to electroplate the blind vias or through holes.
One object of the present invention is to provide an :10 improved system and method for enhancing the throwing power in an electroplating cell.
The method is particularly well adapted for industrial applications of PCB plating for high production levels with uniform application of the plating material.
According to one aspect of one embodiment of the present invention, there is provided a method for electroplating blind vias or through holes in an integrated :?0 circuit, comprising the steps of: providing a printed circuit board having blind vias or through holes therein;
providing a plating cell containing solution for plating in the vias of the printed circuit board, the plating cell further including anodes; providing ultrasonic vibration means for vibrating the plating solution during electrodeposition; and vibrating the solution to electroplate the blind vias or through holes.
It has been found that ultrasonic agitation in accordance with the present invention substantially increased the microthrowing power improvement for small interconnection blind vias.
The ultrasonic treatment may occur using transducers operating in the range of 20 kHz to 60 kHz suitably positioned within the plating bath. For purposes of the instant application, copper electrodeposition was employed 1.0 and to this end the transducers were positioned within titanium hollow containers in view of the fact that the containers are chemically inert, under certain conditions, to the plating bath and do not interfere with the electroplating procedure. It will be appreciated by those skilled in the art that the container may comprise any suitable material and this will depend on the environment in which the transducers are employed and the nature of the compounds in the solution.
20 It is envisioned that the ultrasonic transducers are positioned directly within the cell at a suitable location to induce hydrodynamic cavitation within the cell and thus increase the uniformity of deposition within the blind vias. To augment the electrodeposition efficiency, chemical additives may be used in combination with the ultrasonic agitation. Suitable additives are known to those skilled in the art.
The ultrasonic treatment may occur using transducers operating in the range of 20 kHz to 60 kHz suitably positioned within the plating bath. For purposes of the instant application, copper electrodeposition was employed 1.0 and to this end the transducers were positioned within titanium hollow containers in view of the fact that the containers are chemically inert, under certain conditions, to the plating bath and do not interfere with the electroplating procedure. It will be appreciated by those skilled in the art that the container may comprise any suitable material and this will depend on the environment in which the transducers are employed and the nature of the compounds in the solution.
20 It is envisioned that the ultrasonic transducers are positioned directly within the cell at a suitable location to induce hydrodynamic cavitation within the cell and thus increase the uniformity of deposition within the blind vias. To augment the electrodeposition efficiency, chemical additives may be used in combination with the ultrasonic agitation. Suitable additives are known to those skilled in the art.
Other known methods may be combined with the ultrasonic treatment of the solution such as agitation of the PCB board or substrate to be treated in addition to the ultrasonic treatment of the solution. Further, it is clearly envisioned that other forms of treatment including reverse pulse deposition could also be used in combination with the ultrasound treatment.
A further aspect of one embodiment of the present invention is to provide a method of plating blind vias in integrated circuits, comprising the steps of: providing a printed circuit board to be plated; providing a plating cell containing solution for plating in the blind vias or through holes of the printed circuit board, the cell further including anodes; providing ultrasonic vibration means for vibrating the plating solution during electrodeposition; introducing a gas adjacent the printed circuit board for localized agitation of the plating solution around the printed circuit board; and vibrating the solution to electroplate the blind vias or through holes.
In yet another aspect of one embodiment of the present invention, there is provided a system for electroplating vias in a printed circuit board, the system comprising: an electroplating cell having a pair of anodes; means for supplying power to the cell; an electrochemical solution; a substrate for receiving material to be electroplated; and ultrasonic vibration means for vibrating the solution.
Having thus described the invention, reference will now be made to the accompanying drawings illustrating preferred embodiments, and in which:
Figure 1 is a schematic illustration of the plating bath system in accordance with one embodiment of the present invention;
Figure 2 is a schematic cross-sectional illustration of a blind via feature;
Figure 3 is a graphical illustration of the variation in mean microthrowing parameters as a function of plating conditions for different vias sizes;
Figure 4 is a graphical illustration of the variation f.0 of the mean deposit quality parameters as a function of plating conditions for different vias sizes;
Figure 5 is a graphical illustration similar to Figure 3 for further vias sizes;
Figure 6 is a graphical illustration similar to Figure 4 for further vias sizes;
A further aspect of one embodiment of the present invention is to provide a method of plating blind vias in integrated circuits, comprising the steps of: providing a printed circuit board to be plated; providing a plating cell containing solution for plating in the blind vias or through holes of the printed circuit board, the cell further including anodes; providing ultrasonic vibration means for vibrating the plating solution during electrodeposition; introducing a gas adjacent the printed circuit board for localized agitation of the plating solution around the printed circuit board; and vibrating the solution to electroplate the blind vias or through holes.
In yet another aspect of one embodiment of the present invention, there is provided a system for electroplating vias in a printed circuit board, the system comprising: an electroplating cell having a pair of anodes; means for supplying power to the cell; an electrochemical solution; a substrate for receiving material to be electroplated; and ultrasonic vibration means for vibrating the solution.
Having thus described the invention, reference will now be made to the accompanying drawings illustrating preferred embodiments, and in which:
Figure 1 is a schematic illustration of the plating bath system in accordance with one embodiment of the present invention;
Figure 2 is a schematic cross-sectional illustration of a blind via feature;
Figure 3 is a graphical illustration of the variation in mean microthrowing parameters as a function of plating conditions for different vias sizes;
Figure 4 is a graphical illustration of the variation f.0 of the mean deposit quality parameters as a function of plating conditions for different vias sizes;
Figure 5 is a graphical illustration similar to Figure 3 for further vias sizes;
Figure 6 is a graphical illustration similar to Figure 4 for further vias sizes;
Figure 7 is a graphical illustration similar to Figures 3 and 5 for different vias; and Figure 8 is a graphical illustration similar to Figures 4 and 6.
Referring now to Figure 1, shown is a schematic illustration of the plating bath according to one embodiment, with the cell being globally referenced by numeral 10. The cell includes a reaction vessel 12 within which an electrochemical solution is known to be included, the solution not being shown. The cell includes a plurality of anodes 14 which are suitably connected to a bus bar 16 with the bus being connected to suitable source of power (not shown). The cathode, shown in the example as the substrate 18 is disposed in the cell 10 as indicated in Figure 1. In this example, the substrate comprises a PCB
having a blind vias openings (not shown) and other small features.
:20 In the embodiment of Figure 1, the ultrasonic transducers 20 (dashed lines) are positioned within hollow containers 22 which, in the example, comprise polygonal titanium containers. Since the plating bath comprises a conventional DC copper bath, the titanium container was selected in view of the chemical inertness in this system.
Other variations for the material of which the container is made will depend on the nature of the solution and the overall cell. To augment deposition, an apertured air hose 24 is connected to a source of pressurized gas (not shown) such as air, nitrogen, noble gases etc. The gas is bubbled in the solution to cause localized agitation of the solution at the cathode 18. Further, the cathode 18 may be moved relative to vessel 12 laterally in the direction of arrow A to further assist in deposition. This may be moved manually or mechanically.
:l0 The titanium containers include a plurality of ultrasonic transducers 20 as indicated with the total power for a single container comprising 500 watts at between 20 kHz and 60 kHz and preferably 40 kHz operating frequency.
The two cans employed were inserted between and behind two pairs of anodes 14 as illustrated in Figure 1 in 600 L of copper plating bath. The cathode consisted of a blind vias drilled test panel of a printed circuit board.
with reference to Figure 2, shown is a schematic 20 cross-sectional illustration blind via feature. The feature is denoted by numeral 26 and includes a metal clad layer 28, a dielectric layer 30, a second metal clad layer 32 positioned beneath layer 30 and a plated metal layer broadly denoted by 34. With respect to the symbology used in Figure 2, the following is representative of the physical meaning and value/units of the symbols used in Figure 2:
Referring now to Figure 1, shown is a schematic illustration of the plating bath according to one embodiment, with the cell being globally referenced by numeral 10. The cell includes a reaction vessel 12 within which an electrochemical solution is known to be included, the solution not being shown. The cell includes a plurality of anodes 14 which are suitably connected to a bus bar 16 with the bus being connected to suitable source of power (not shown). The cathode, shown in the example as the substrate 18 is disposed in the cell 10 as indicated in Figure 1. In this example, the substrate comprises a PCB
having a blind vias openings (not shown) and other small features.
:20 In the embodiment of Figure 1, the ultrasonic transducers 20 (dashed lines) are positioned within hollow containers 22 which, in the example, comprise polygonal titanium containers. Since the plating bath comprises a conventional DC copper bath, the titanium container was selected in view of the chemical inertness in this system.
Other variations for the material of which the container is made will depend on the nature of the solution and the overall cell. To augment deposition, an apertured air hose 24 is connected to a source of pressurized gas (not shown) such as air, nitrogen, noble gases etc. The gas is bubbled in the solution to cause localized agitation of the solution at the cathode 18. Further, the cathode 18 may be moved relative to vessel 12 laterally in the direction of arrow A to further assist in deposition. This may be moved manually or mechanically.
:l0 The titanium containers include a plurality of ultrasonic transducers 20 as indicated with the total power for a single container comprising 500 watts at between 20 kHz and 60 kHz and preferably 40 kHz operating frequency.
The two cans employed were inserted between and behind two pairs of anodes 14 as illustrated in Figure 1 in 600 L of copper plating bath. The cathode consisted of a blind vias drilled test panel of a printed circuit board.
with reference to Figure 2, shown is a schematic 20 cross-sectional illustration blind via feature. The feature is denoted by numeral 26 and includes a metal clad layer 28, a dielectric layer 30, a second metal clad layer 32 positioned beneath layer 30 and a plated metal layer broadly denoted by 34. With respect to the symbology used in Figure 2, the following is representative of the physical meaning and value/units of the symbols used in Figure 2:
Symbol Physical Meaning Value and/or Units AR Blind via aspect ratio - -d Blind via diameter um h Blind via depth ~tm lb Copper blind via bottom thickness ~.lm lmin Minimum copper blind vias um thickness ltl and Surface copper thickness um 1t2 lWl and Copper blind via wall thickness ~.zm lWz P1 Mean microthrowing power parameter P2 Mean deposit quality parameter In order to calculate the points for the graphical illustrations to be discussed hereinafter, the following formula were used:
[1] AR- h d :?0 [2] p _ 2 l,'~+IW+lb x100 ' 3 1; + IZ
[3]
31,~ x 100 Iw + lw + Ib Regarding Figures 3 through 8, Table 1 represents the experimental conditions used to generate the data points.
Experiment Air Ultrasonic Current Agitation Agitation Density (W.cni z) (A.dm-z) A Yes No 2.2 B No 0.093 2.2 C No 0.19 2.2 D Yes 0.093 2.2 E Yes 0.19 2.2 F Yes No 1.65 G Yes 0.045 1.65 H Yes 0.093 1.65 I Yes 0.19 1.65 J Yes 0.045 2.2 For the data in Figures 3 through 8, a plating time corresponding to a 25 micron deposit thickness and a side-to-side motion of the PCB were used. These two conditions together with air agitation are representative of conventional conditions used in the PCB plating industry.
All of the lengths (lX) were evaluated using cross-sectional samples taken at different locations on the PCB.
High P1 values are indicative of uniformity in the deposit while high PZ are representative of the absence of defects in the deposits.
The results shown in Figure 3 and 4 demonstrate that the combination of air and ultrasonic agitation (condition D and E) were crucial and yielded high P, and Pz relative to conditions A through C. It was determined that ultrasonic agitation in the absence of air agitation was not sufficient.
With respect to Figure 5 through 8, experimentation involved the combined effect of air and ultrasonic agitation with the exception of condition F (air agitation only) .
From an analysis of Figure 3 through 8 significant improvements in both P1 and P2 values were obtained when using the combination of air and ultrasonic agitation relative to those results from condition F. This was found particularly valid when small apertures with high aspect ratios were plated. High aspect ratio data is provided in Figures 5 and 6.
With reference to the combination of Figures 3, 5 and 7, P1 values were noted to approach and in some instances exceed the 100% level therefore demonstrating the efficiency of the instant process.
Although embodiments of the invention have been described above, it is not limited thereto and it will be apparent to those skilled in the art that numerous modifications form part of the present invention insofar as they do not depart from the spirit, nature and scope of the claimed and described invention.
[1] AR- h d :?0 [2] p _ 2 l,'~+IW+lb x100 ' 3 1; + IZ
[3]
31,~ x 100 Iw + lw + Ib Regarding Figures 3 through 8, Table 1 represents the experimental conditions used to generate the data points.
Experiment Air Ultrasonic Current Agitation Agitation Density (W.cni z) (A.dm-z) A Yes No 2.2 B No 0.093 2.2 C No 0.19 2.2 D Yes 0.093 2.2 E Yes 0.19 2.2 F Yes No 1.65 G Yes 0.045 1.65 H Yes 0.093 1.65 I Yes 0.19 1.65 J Yes 0.045 2.2 For the data in Figures 3 through 8, a plating time corresponding to a 25 micron deposit thickness and a side-to-side motion of the PCB were used. These two conditions together with air agitation are representative of conventional conditions used in the PCB plating industry.
All of the lengths (lX) were evaluated using cross-sectional samples taken at different locations on the PCB.
High P1 values are indicative of uniformity in the deposit while high PZ are representative of the absence of defects in the deposits.
The results shown in Figure 3 and 4 demonstrate that the combination of air and ultrasonic agitation (condition D and E) were crucial and yielded high P, and Pz relative to conditions A through C. It was determined that ultrasonic agitation in the absence of air agitation was not sufficient.
With respect to Figure 5 through 8, experimentation involved the combined effect of air and ultrasonic agitation with the exception of condition F (air agitation only) .
From an analysis of Figure 3 through 8 significant improvements in both P1 and P2 values were obtained when using the combination of air and ultrasonic agitation relative to those results from condition F. This was found particularly valid when small apertures with high aspect ratios were plated. High aspect ratio data is provided in Figures 5 and 6.
With reference to the combination of Figures 3, 5 and 7, P1 values were noted to approach and in some instances exceed the 100% level therefore demonstrating the efficiency of the instant process.
Although embodiments of the invention have been described above, it is not limited thereto and it will be apparent to those skilled in the art that numerous modifications form part of the present invention insofar as they do not depart from the spirit, nature and scope of the claimed and described invention.
Claims (20)
1. A method for electroplating blind vias or through holes in an integrated circuit, comprising the steps of:
providing a printed circuit board having blind vias or through holes therein;
providing a plating cell containing solution for plating in said vias of said printed circuit board, said plating cell further including anodes;
providing ultrasonic vibration means for vibrating said plating solution during electrodeposition; and vibrating said solution to electroplate said blind vias or through holes.
providing a printed circuit board having blind vias or through holes therein;
providing a plating cell containing solution for plating in said vias of said printed circuit board, said plating cell further including anodes;
providing ultrasonic vibration means for vibrating said plating solution during electrodeposition; and vibrating said solution to electroplate said blind vias or through holes.
2. The method as set forth in claim 1, further including the step of positioning said ultrasonic vibration means within said plating bath.
3. The method as set forth in claim 1, further including the step of enclosing said ultrasonic vibration means within a chemically inert container in said cell.
4. The method as set forth in claim 1, further including the step of moving said printed circuit board during plating.
5. The method as set forth in claim 1, wherein said ultrasonic vibration means has a signal of between 20 kHz and 60 kHz.
6. A method of plating blind vias in integrated circuits, comprising the steps of:
providing a printed circuit board to be plated;
providing a plating cell containing solution for plating in said blind vias or through holes of said printed circuit board, said cell further including anodes;
providing ultrasonic vibration means for vibrating said plating solution during electrodeposition;
introducing a gas adjacent said printed circuit board for localized agitation of the plating solution around the printed circuit board; and vibrating said solution to electroplate said blind vias or through holes.
providing a printed circuit board to be plated;
providing a plating cell containing solution for plating in said blind vias or through holes of said printed circuit board, said cell further including anodes;
providing ultrasonic vibration means for vibrating said plating solution during electrodeposition;
introducing a gas adjacent said printed circuit board for localized agitation of the plating solution around the printed circuit board; and vibrating said solution to electroplate said blind vias or through holes.
7. The method as set forth in claim 6, wherein said gas comprises air.
8. The method as set forth in claim 7, wherein said gas is introduced in said solution under said printed circuit board.
9. The method as set forth in claim 6, further including the step of moving said printed circuit board during plating.
10. A system for electroplating vias in a printed circuit board, said system comprising:
an electroplating cell having a pair of anodes;
means for supplying power to said cell;
an electrochemical solution;
a substrate for receiving material to be electroplated; and ultrasonic vibration means for vibrating said solution.
an electroplating cell having a pair of anodes;
means for supplying power to said cell;
an electrochemical solution;
a substrate for receiving material to be electroplated; and ultrasonic vibration means for vibrating said solution.
11. The apparatus as set forth in claim 10, wherein said substrate comprises a printed circuit board having blind vias or through holes.
12. The apparatus as set forth in claim 10, wherein said ultrasonic vibration means comprises at least a pair of ultrasonic transducers.
13. The apparatus as set forth in claim 12, wherein said apparatus includes a hollow container for retaining said transducers.
14. The apparatus as set forth in claim 13, wherein said hollow container comprises a titanium cylinder.
15. The apparatus as set forth in claim 10, wherein said cell is a copper electroplating cell.
16. The apparatus as set forth in claim 15, wherein said blind vias have a diameter of 150 microns or less.
17. The apparatus as set forth in claim 10, wherein said apparatus further includes means for introducing a gas into said solution.
18. The apparatus as set forth in claim 17, wherein said means for introducing a gas into said solution comprises an apertured tube.
19. The apparatus as set forth in claim 18, wherein said gas comprises air.
20. The apparatus as set forth in claim 16, wherein said blind vias have an aspect ratio of greater than 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA002317233A CA2317233A1 (en) | 2000-09-01 | 2000-09-01 | Ultrasonically assisted plating bath for vias metallization in printed circuit board manufacturing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA002317233A CA2317233A1 (en) | 2000-09-01 | 2000-09-01 | Ultrasonically assisted plating bath for vias metallization in printed circuit board manufacturing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2317233A1 true CA2317233A1 (en) | 2002-03-01 |
Family
ID=4167006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002317233A Abandoned CA2317233A1 (en) | 2000-09-01 | 2000-09-01 | Ultrasonically assisted plating bath for vias metallization in printed circuit board manufacturing |
Country Status (1)
| Country | Link |
|---|---|
| CA (1) | CA2317233A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102291948A (en) * | 2011-07-29 | 2011-12-21 | 江西鑫力华数码科技有限公司 | Method for metallizing hole walls of flexible printed circuit boards |
| CN103572344A (en) * | 2013-09-29 | 2014-02-12 | 杭州电子科技大学 | Ultrasonic wave precise electroplating device |
| CN105316737A (en) * | 2015-11-23 | 2016-02-10 | 深圳崇达多层线路板有限公司 | High density interconnector (HDI) board blind hole electroplating device |
| CN106011962A (en) * | 2016-07-13 | 2016-10-12 | 中南大学 | TSV electroplating method and TSV electroplating system under action of ultrasonic outfield |
-
2000
- 2000-09-01 CA CA002317233A patent/CA2317233A1/en not_active Abandoned
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102291948A (en) * | 2011-07-29 | 2011-12-21 | 江西鑫力华数码科技有限公司 | Method for metallizing hole walls of flexible printed circuit boards |
| CN103572344A (en) * | 2013-09-29 | 2014-02-12 | 杭州电子科技大学 | Ultrasonic wave precise electroplating device |
| CN103572344B (en) * | 2013-09-29 | 2016-03-09 | 杭州电子科技大学 | Ultrasonic precision electroplanting device |
| CN105316737A (en) * | 2015-11-23 | 2016-02-10 | 深圳崇达多层线路板有限公司 | High density interconnector (HDI) board blind hole electroplating device |
| CN106011962A (en) * | 2016-07-13 | 2016-10-12 | 中南大学 | TSV electroplating method and TSV electroplating system under action of ultrasonic outfield |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6398937B1 (en) | Ultrasonically assisted plating bath for vias metallization in printed circuit board manufacturing | |
| US5648125A (en) | Electroless plating process for the manufacture of printed circuit boards | |
| KR930010062B1 (en) | Process and device for cleaning activating and/or metallizing bore holes in horizontally transported | |
| US6783654B2 (en) | Electrolytic plating method and device for a wiring board | |
| EP1390568A2 (en) | Direct electrolytic metallization of non-conducting substrates | |
| JP2001308477A (en) | Surface treated copper foil, electrolytic copper foil with carrier foil and method of production, and copper clad laminate plate | |
| TWI757927B (en) | Single step electrolytic method of filling through holes in printed circuit boards and other substrates | |
| KR20040057979A (en) | Method for depositing lead-free tin alloy | |
| Kothuru et al. | Plasma treatment and copper metallization for reliable plated-through-holes in microwave PCBS for space electronic packaging | |
| JP4521147B2 (en) | Method and apparatus for electrolytic treatment of conductive surfaces of sheet or foil material pieces isolated from each other and method of applying said method | |
| KR20020081042A (en) | Method and apparatus for fabricating printed circuit board using atmospheric pressure capillary discharge plasma shower | |
| CA2317233A1 (en) | Ultrasonically assisted plating bath for vias metallization in printed circuit board manufacturing | |
| EP1438446B1 (en) | System and method for electrolytic plating | |
| US6265020B1 (en) | Fluid delivery systems for electronic device manufacture | |
| Singh et al. | Plasma-generated etchback to improve the via-reliability in high-Tg substrates used in multilayer PWBs for space electronic packaging | |
| JP2687535B2 (en) | Method of processing holes by energy beam | |
| JPH0354887A (en) | Method and apparatus for treatment of fine hole in printed board | |
| US6003225A (en) | Fabrication of aluminum-backed printed wiring boards with plated holes therein | |
| CN113061881A (en) | Copper treatment device and method for electrolytic copper plating | |
| Abe et al. | The electroless copper plating of small via holes | |
| CN108738379B (en) | Metallized hole forming method, circuit board manufacturing method and circuit board | |
| US6919011B2 (en) | Complex waveform electroplating | |
| GB2181743A (en) | Metal plating of through holes in printed circuit boards | |
| JP2006032476A (en) | Via filling plating method | |
| JPH08148810A (en) | Manufacture of printed wiring board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Discontinued |