JP2682082B2 - Sandblasting equipment - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a sandblasting apparatus suitable for use in, for example, semiconductor surface polishing.

[Summary of the Invention]

The present invention is, for example, in a sandblasting device used for polishing the surface of a semiconductor, comprising a polishing powder depositing part formed in the bottom space of the mixing chamber and a vibration plate provided in the polishing powder depositing part. It is configured to vibrate only the polishing powder in the deposition portion, prevent the polishing powder from agglomerating, and stably mix the polishing powder and air and continuously inject the mixture.

[Conventional technology]

For example, in surface pattern processing of semiconductor wafers,
In general, the IBE (ion beam etching) method has been widely used. However, since the IBE method has problems such as requiring a long processing time, recently, as an alternative processing method,
A sand blasting method in which fine powder is mixed with compressed air and jetted is used.

A conventional example of a sandblasting device used for this sandblasting will be described with reference to FIG.

This sand blasting device is roughly divided into an air compressor 1 for supplying compressed air, a mixing chamber 2 for mixing abrasive powder with the compressed air sent from the air compressor 1, and a blast for spraying the abrasive powder together with the compressed air onto the workpiece. It comprises a chamber 3 and an air blower 4 for collecting and sucking abrasive powder from the blast chamber 3.

An air supply pipe 5 is led out of the air compressor 1, and the air supply pipe 5 is branched into a first supply pipe 6 and a second supply pipe 7 and connected to the mixing chamber 2. Reference numeral 8 denotes an adjusting valve for adjusting the pressure of the compressed air supplied to the mixing chamber 2, 9 denotes an electromagnetic valve for controlling the supply of the compressed air to the mixing chamber 2, and 10 denotes the flow rate of the compressed air in the second supply pipe 7. Is an adjustment valve for adjusting the pressure.

The mixing chamber 2 has an abrasive powder supply section 11 at an upper portion thereof. The abrasive powder 12 stored in the abrasive powder supply section 11 through a wire mesh 11a at an upper portion thereof is supplied by opening and closing a supply valve 13. A suitable amount of abrasive powder in the mixing chamber 2 through the port 14
It is made to be supplied by dropping to 15.

An air compressor 1 is provided at the lower part of the mixing chamber 2.
First flow path 16 to which the first supply pipe 6 from is connected
And a second flow path 17 to which the second supply pipe 7 is connected. The first flow path 16 communicates with the polishing powder accumulating portion 15a which is the bottom of the polishing powder tank 15, while the second flow path 17 The flow paths 17 are each formed so as to penetrate the mixing chamber 2 straightly.

On the lower surface of the polishing powder deposition unit 15a through which the first flow path 16 communicates,
A filter 18 made of cermet (a plate having innumerable fine holes formed by sintering metal powder) is arranged so as to partition the inside of the polishing powder depositing portion 15a from the first flow path 16. The polishing powder 12 dropped and supplied from the polishing powder supply unit 11 is deposited on the 18.

Further, at the bottom of the polishing powder deposition section 15a, a polishing powder extraction nozzle 19 is projected so as to penetrate the center of the filter 18, and a polishing powder extraction port 20 opened to the top surface of the polishing powder extraction nozzle 19 has: At the junction 22 through the abrasive powder flow path 21, the flow path is orthogonal to the second flow path 17.

Further, in the polishing powder tank 15, a polishing powder outlet 20 is provided.
A dust collector 23 is provided corresponding to the upper part of the dust collector 23. At the bottom of the dust collector 23, a dust collecting recess 24 which is trapezoidally recessed so as to face the polishing powder outlet 20 is formed. .

Reference numeral 25 denotes a filter attached to the top opening of the dust collector 23.

And the second in the mixing chamber 2 configured as above
A delivery pipe 26 is connected to a delivery port side of a mixture flow passage 50 formed on an extension of the flow passage 17 and the confluence portion 22, and the delivery pipe 26 is guided into the blast chamber 3 and the tip thereof is provided. A nozzle 27 is attached to the portion, and an object to be polished A, for example, a semiconductor wafer is opposed to the nozzle 27.

An abrasive powder receiving portion 28 is provided at a lower portion in the blast chamber 3, and a reduction pipe 29 is led out from a bottom portion of the abrasive powder receiving portion 28.
And is connected to the inside of the polishing powder tank 15.

Further, in the mixing chamber 2, an exhaust pipe 30 is led out from the inner space of the dust collector 23, and the tip of the exhaust pipe 30 is
It is connected to the. Reference numeral 31 denotes an electromagnetic valve that controls the flow of air in the exhaust pipe 30.

The exhaust fan 4 has a filter 32 and a suction fan inside.
The suction fan 33 sucks air from the exhaust pipe 30 through the filter 32 and discharges the air from the exhaust port 34. Reference numeral 35 denotes a polishing powder reservoir provided below the filter 32.

The sandblasting apparatus configured as described above is operated as follows. That is, the compressed air sent from the air compressor 1 is divided into the first supply pipe 6 and the second supply pipe 7, and the compressed air divided into the first supply pipe 6 side is divided into the first flow path. It passes through the filter 16 through the filter 16 and flows into the polishing powder depositing portion 15a. At this time, the compressed air passes through the abrasive powder 12 accumulated in the abrasive powder accumulating portion 15a, whereby the abrasive powder 21 is agitated by a so-called air vibrator effect, and a part of the abrasive powder 21 is taken out by the dust collector 23. Collected around 20.

On the other hand, the compressed air diverted to the second supply pipe 7 side passes straight through the second flow path 17, and at this time, the abrasive powder flow path 21 at the junction 22 has a negative pressure from the second flow path side 17. As a result, the abrasive powder 12 is sucked from the abrasive powder outlet 20 and mixed with the compressed air at the junction 22. Then, the mixture of the compressed air and the polishing powder is ejected from the nozzle 27 in the blast chamber 3 through the delivery pipe 26, whereby the workpiece A, for example, a semiconductor wafer is polished.

In addition, the air after being sprayed on the object A and the polishing powder
The mixture of 12 is sucked by the operation of the exhaust fan 4 and enters the abrasive powder tank 15 from the blast chamber 3 through the reduction pipe 29, where only the abrasive powder 12 is weighed by its own weight.
Drops and deposits in 15a. Then, only air is sucked from the polishing powder tank 15 into the blower 4 through the discharge pipe 30,
After the abrasive powder remaining in the sucked air is removed by the filter 32, the purified air is discharged from the exhaust port. The removed abrasive powder is stored in the abrasive powder reservoir 35.
Is accumulated in

[Problems to be solved by the invention]

In recent years, such a sand blasting apparatus has been used in order to cope with the polishing of a finer semiconductor surface pattern.
Fine powder having a size of 16 μm or more has been used.

However, such fine fine powders are easily aggregated because of their high adsorptivity between the powders, so that the aggregated abrasive powder causes so-called clogging at the abrasive powder outlet in the mixing chamber, and the stirring by the air vibrator effect is also continued. However, when a large amount of abrasive powder is first injected, only the compressed air is injected thereafter, which causes a problem of extremely uneven injection.

SUMMARY OF THE INVENTION An object of the present invention is to provide a sand blasting device that can satisfactorily eject abrasive powder even when fine abrasive powder is used.

[Means for solving the problem]

In order to achieve the above object, the present invention is a sand blasting apparatus in which polishing powder and air are mixed in a mixing chamber, and the mixture is sprayed onto an object to be polished in a blasting chamber. The polishing powder accumulating portion formed in 1) and the vibration plate provided in the polishing powder accumulating portion are provided, and only the polishing powder in the accumulating powder of the accumulation portion is vibrated.

[Action]

In the mixing chamber of the sandblasting device configured as described above, only the polishing powder in the polishing powder depositing section is vibrated by the vibrating plate, and aggregation of the polishing powder is prevented. This facilitates agitation of the polishing powder with compressed air, the air vibrator effect can be effectively maintained, and stable continuous injection of the polishing powder can be performed.

〔Example〕

Hereinafter, an embodiment of a sandblasting device to which the present invention is applied will be described with reference to the drawings.

FIG. 1 shows an embodiment of the sandblasting device according to the present invention.

First, the overall configuration of the sandblasting apparatus of the present embodiment will be described. The portions corresponding to those of the conventional example of FIG. 16 described above are designated by the same reference numerals and the description thereof is omitted. That is, the blast chamber 3 is disposed at a position near the upper portion of the polishing powder supply unit 11,
It is short-circuited with the polishing powder supply unit 11 by a vertical reduction pipe 45. The polishing powder supply unit 11 is provided with a lid 57, and one end of the lid 57 is provided with an inlet 57b for polishing powder, and the reduction pipe 45 is connected to the inlet 57b. The other end of the lid 57 is provided with an air outlet 57c. The inlet 57b and the outlet 57c are connected by a bypass formed by the inner wall 11b of the abrasive powder supply unit and a ring-shaped partition plate 57a provided below the lid 57.

A discharge pipe 60 is led out from the outlet 57c of the air, and the tip thereof is connected to the blower 4. An electromagnetic valve 59 is provided near the outlet 57c of the discharge pipe 60.

The supply valve 13 in the polishing powder supply unit 11 has an upper part and a lid.
It is tightly closed around the abrasive powder supply port 14 by the upward pulling action of the coil spring 58 provided between the supply port 57 and the coil spring 58 and is closed.

Also, an exhaust pipe for exhausting the air in the mixing chamber 2
A displacement adjusting valve 61 is provided in the middle of the downstream side of the solenoid valve 31 described above.

The solenoid valve 59 and the solenoid valve 31 are connected to a predetermined electric circuit, and are controlled so that the open / close state is reversed at a constant cycle.

The upper part of the mixing chamber 2 is provided with a moisture absorbing means such as silica gel.
A drying means 63 including a heater 62 and the like is provided.

The sandblasting apparatus of the present embodiment configured as described above operates as follows. That is, the abrasive powder after being sprayed from the nozzle 27 toward the workpiece A in the blast chamber 3.
The air 12 and the air are sucked by the suction force of the blower 4 and reach the inlet 57b of the abrasive powder supply unit 11. Then, since a swirl flow is generated from the inlet 57b toward the outlet 57c along the bypass, the polishing powder 12 is centrifugally applied to the inner wall 11 of the polishing powder supply unit.
It collides with b, falls, and accumulates on the polishing powder supply unit 11. The polishing powder 12 is thus collected and reused.

On the other hand, the solenoid valve 59 and the solenoid valve 31 are alternately opened and closed,
When the electromagnetic valve 31 is opened and the electromagnetic valve 59 is closed, the pressure in the polishing powder tank 15 drops from the polishing powder supply unit 11, so that the supply valve 13 of the polishing powder 12 is opposed to the coil spring 58. The abrasive powder 12 is pushed down and falls from the supply port 14. And
Conversely, when the electromagnetic valve 31 is closed and the electromagnetic valve 59 is opened, the supply valve 13 returns to its original state by the coil spring 58, and the falling of the abrasive powder 12 stops. The above-described cooperative operation is repeated, and the polishing powder 12 is automatically and sequentially supplied from the polishing powder supply unit 11 into the polishing powder tank 15.

Further, when a pressure difference is generated in the polishing powder tank 15 by opening and closing the electromagnetic valve 31, the polishing powder 12 can be further disturbed in the polishing powder depositing part 15a, and further the exhaust amount adjusting valve 61 polishes the polishing powder 12. When the amount of exhaust gas from the powder tank 15 is reduced to a certain amount, the pressure difference becomes small, and the nozzle 27 is not affected by the periodic opening / closing operation of the solenoid valves 31, 59.
At, the polishing powder 12 comes to be sprayed almost constantly.
FIG. 2 shows the relationship between the abrasive powder injection amount and the time. In the above case, the injection amount is almost constant as indicated by C. In the case of a conventional apparatus in which neither the solenoid valve 31 nor the displacement adjusting valve 61 is provided, the state changes as A, and when only the solenoid valve 31 is provided, the state changes as B.

Further, a moisture absorbing means 62 and a drying means 63 are provided in the polishing powder tank 15.
By providing this, it is possible to prevent the abrasive powder 12 from absorbing moisture and hardening. In particular, when the polishing powder 12 is reused as described above, it is effective because the polishing powder 12 often absorbs moisture.

The sand blasting apparatus of the present embodiment configured as described above is a circulation system that can collect and reuse the used polishing powder 12.

Next, the vibration means 36 provided in the polishing powder depositing portion 15a in the mixing chamber 2 will be described. That is, as shown in FIG. 1, the filter 1 is placed at the bottom of the polishing powder deposition portion 15a in the mixing chamber 2.
A plurality of vibrating means 36 are arranged to be inclined on a conical inclined portion 15b provided on the outer periphery of 8. Further, as shown in FIG. 3, the vibrating plate of each vibrating means 36 is composed of, for example, a plurality of rectangular bimorph type piezoelectric elements 36a, which are arranged at positions symmetrical with respect to the polishing powder take-out nozzle 19. It Then, the bimorph type piezoelectric element 36
The free end 36n of a is arranged so as to be located above the filter 18.

In addition, as shown in FIG.
Is, for example, a pair of upper and lower piezoelectric elements 38a and 38b and three pairs of electrodes 39
a, 39b, and 39c are formed by laminating each other, and one end thereof is fixed on the fulcrum 37 as a fixed end 36m. Then, by applying a predetermined AC voltage, for example, to the electrodes X and Y of the bimorph type piezoelectric element 36a configured such that one end on the fulcrum 37 side is a fixed end 36m and the other end is a free end 36n, the free end is provided. The end 36n is vibrated up and down.

Further, when connecting the electrodes X and Y of the bimorph type piezoelectric element 36a adjacent to each other, it is desirable to connect the electrodes so that the phases of the vibrations are opposite to each other.

Further, the frequency of the AC voltage may be a high frequency such as 200 to 400 Hz, for example, and is desirably substantially equal to the resonance frequency of the bimorph piezoelectric element 36a.

The plurality of vibrating means 36 configured as described above vibrate only the polishing powder 12 in the polishing powder depositing portion 15a in the mixing chamber 2,
Aggregation of the polishing powder 12 in the polishing powder depositing portion 15a is prevented, stirring of the polishing powder 12 by the compressed air from the filter 18 is effectively performed, and the above-described air vibrator effect can be effectively maintained. it can.

Further, it is more effective to reverse the phase of the vibration of the adjacent vibration means 36.

The piezoelectric element 38 used for the bimorph type piezoelectric element 36a
As a and 38b, known materials exhibiting a piezoelectric phenomenon, for example, barium titanate, lead titanate, lead zirconate titanate,
Crystal or the like can be used. Further, a structural means having a structure in which a pair of electrodes are superposed on both surfaces of these piezoelectric elements can also be used.

Next, the plurality of high-speed air outlets 47 shown in FIGS. 1 and 3 will be described. That is, a plurality of high-speed air outlets 47 are provided at positions around the polishing powder outlet 20 and directly below the powder-collecting recess 24. These high-speed air outlets 47 are connected to the first compressed air flow path 16 at the lower part of the mixing chamber 2.

With the above configuration, the abrasive powder outlet 20
The compressed air blown out at a high speed from a high-speed air outlet 47 provided in the vicinity of the polishing outlet 20 collides with the dust collecting recess 24 provided immediately above the polishing outlet 20 and reflects the compressed air. High-speed turbulence of compressed air can be generated in the vicinity of the upper part of the air. Therefore, the polishing powder 12 is strongly agitated in the vicinity of the polishing powder outlet 20, so that the polishing powder 12 can be smoothly taken out from the polishing outlet 20 and continuously injected into the blast chamber 3 for stable operation. It is possible to continuously spray the abrasive powder.

A suction nozzle 49 as shown in FIG. 1 is provided at the junction 22 between the polishing powder 12 and the compressed air, so that the compressed air from the second flow path 17 flows at a higher speed. Therefore, the polishing powder can be more efficiently extracted from the polishing outlet 20 through the polishing powder flow path 21.

FIG. 5A shows a connecting portion between the mixing chamber 3 and the delivery pipe 26. A tapered portion 53a on the inner surface of the connecting pipe 51a,
A tapered portion 54a is provided on the inner surface of the joint 52a, so that the mixture flow path 50 and the delivery pipe 26 are continuously connected. FIG. 5B shows a connection portion between the delivery pipe 26 and the injection nozzle 27. Connecting pipe 51b as described above
Tapered portions 53b and 54b are provided on the inner surface of the joint 52b, respectively, so that the delivery pipe 26 and the injection nozzle 27 are continuously connected. By doing so, it is possible to prevent the accumulation of air or the like in the above-mentioned connecting portion, and to prevent the polishing powder 12 from accumulating and causing clogging.

Further, the delivery pipe 26 is, for example, a urethane tube,
The delivery pipe 26 is constituted by a flexible tube such as a nylon tube or a vinyl tube. When the delivery pipe 26 is actually installed, the delivery pipe 26 is arranged so as not to bend sharply at a corner portion but to bend slowly. Furthermore,
The delivery pipe 26 is provided with vibration means 43 as shown in FIG. The vibrating means 43 may be, for example, one utilizing a bimorph type piezoelectric element 43a as shown in FIG. 6A, and the bimorph type piezoelectric element 43a is fixed on the delivery pipe 26 via a fulcrum 43b and vibrates in a resonance state. Given.

With the above configuration, it is possible to prevent clogging due to the accumulation of abrasive powder in the delivery pipe 26.

Further, a plurality of vibrating means 44 are provided in the abrasive powder receiving portion 28 in the blast chamber 3, and the abrasive powder 12 injected from the injection nozzle 27 to the workpiece A does not accumulate in the abrasive powder receiving portion 28. As a result, the powder is smoothly fed to the polishing powder supply unit 11. As the vibration means 44, for example, a means using a bimorph type piezoelectric element or the like may be used.

Further, the moisture absorbing means 62 and the drying means 63 are provided in the mixing chamber 2 as described above, but are bent in a ring shape along the upper portion of the inner wall 15b in the polishing powder tank 15 as shown in FIG. The L-shaped plate 64 is attached, and a large number of spherical silica gels having a diameter of several mm, for example, are arranged in the L-shaped plate 64 as a moisture absorbing means 62. Further, as a drying means 63 outside the L-shaped plate 64,
For example, a heater is arranged.

In this manner, the moisture in the polishing powder tank 15 is absorbed and removed by the moisture absorbing means 62, and the moisture in the polishing powder tank 15 is evaporated by the drying means 63. Then, the steam is exhausted through the exhaust pipe 30. In this way, it is possible to solve the problem that the polishing powder 12 absorbs moisture and solidifies while the polishing powder 12 is reused many times. Further, as the polishing powder 12 becomes thinner, its hygroscopicity becomes remarkable, which is effective.

Using the sandblasting apparatus of the present embodiment configured as described above, the fine powder (5-80 μm) specified in JISR6001 is used.
m) as well as the ultrafine abrasive powder 12 of the order of 0.01 μm or less of 5 μm or less could be continuously jetted without causing jetting unevenness. Moreover, by using this apparatus, metal, ceramics, glass, plastic, etc. could be processed precisely and at high speed. For example,
The fine surface processing of the semiconductor can be performed faster than the dry etching by the conventional vacuum apparatus, and the preparation period before starting the processing can be extremely shortened.

In addition, at the time of processing using such a sandblasting device, a reactive gas, light, heat,
Processing can be performed at a higher speed while applying an electric field or a magnetic field.

(Modification)

Modifications of the above-described embodiment according to the present invention will be described below with reference to the drawings.

7A and 7B show an example in which a plurality of vibrating plates 36b are used as the vibrating means 36 at the bottom of the polishing powder depositing portion 15a in the mixing chamber 2. That is, a plurality of diaphragms 36b are arranged parallel to the upper part of the filter 18, the outer peripheral end of which is fixed to the polishing powder tank inclined part 15b, and the inner peripheral end is driven by the voice coil type driving means 42 to vibrate. It is the one. Further, a cylindrical bellows 46 is arranged on the inner peripheral end side of the diaphragm 36b so as to surround the voice coil type driving means 42 so that the polishing powder 12 does not enter the voice coil type driving means 42. ing.

FIG. 8 shows an example in which a large number of the above-mentioned vibrating means 36 are provided at the bottom of the polishing powder depositing portion 15a, and the polishing powder 12 is further dispersed.

FIG. 9 shows an example in which a plurality of vibrating means 36 are provided above the polishing powder accumulating portion 15a in the mixing chamber 2. That is, by providing a plurality of vibrating means 36 on the inner wall 15b of the polishing powder tank and the outer wall 23a of the dust collector, the polishing powder 12 accumulated near these walls can be dispersed, and the polishing powder depositing section
Polishing powder can be sent to the bottom of 15a smoothly.

The shape of the vibrating means 36 may be, for example, a square, a trapezoid, a donut shape, or the like, and as the vibrating means 36, a magnetostrictive vibrating element, a vibrating element utilizing electromagnetic induction, or the like is used. May be done.

10A to 10C are examples in which the shape of the filter 18 is changed. That is, the filter 18a shown in FIG. 10A has a filter portion 18d through which compressed air passes formed radially in a cross shape. Further, the filter 18b shown in FIG. 10B has the same filter portion 18d radially arranged as shown by *, and the filter 18c shown in FIG. 10C has a plurality of relatively small holes 18d.
It is constituted in. In this case, it is desirable that many holes 18d are arranged around the polishing powder removal nozzle 19. Further, FIGS. 10A to 10C also show the arrangement of the above-mentioned vibrating means 36 provided at the bottom of the polishing powder depositing portion 15a. That is, the plurality of vibrating means 36 are arranged above the filter portions 18d corresponding to the positions where the filter portions 18d of the filters 18a, 18b, 18c described above are provided.

With the above configuration, the polishing powder is dispersed by the vibrating means 36 at the bottom of the polishing powder depositing portion 15a, and the dispersed polishing powder is further agitated by the compressed air coming out more strongly from the filter portion 18d. There is an effect that is said to be done.

FIG. 11 is a diagram for explaining a method of producing the above-described filter 18c, for example. That is, for example, the filter 18c can be easily formed by stacking the above-described filter 18 with a disc-shaped metal plate 48 having a plurality of holes 18d at predetermined positions.

FIG. 12 shows an example of a method of fixing the above-mentioned bimorph type piezoelectric element 36a provided at the bottom in the polishing powder depositing portion 15a.
That is, the fixed end 36m of the bimorph type piezoelectric element 36a is fixed by penetrating the wall of the polishing tank 15. In this way, the lead wire 41 from the electrode of the bimorph type piezoelectric element 36a can be taken out directly to the outside, and thus the lead wire 41
The polishing powder 12 does not accumulate on the top.

6B to 6D are examples of the vibrating means 43 of the delivery pipe 26. In the case of FIG. 6B, the drive portion 43d of the voice coil type drive means 43c is fixed to the delivery pipe 26 to vibrate. . In the case of FIGS. 6C and 6D, the vibration arm 55c vibrated by the motor 55a via the crank arm 55b.
The delivery pipe 26 is vibrated at.

FIG. 13 is an arrangement example of the moisture absorbing means 62 and the drying means 63,
A large number of moisture absorbing means 62, for example, spherical silica gel having a diameter of several mm is mixed in the polishing powder depositing portion 15a, and a drying means 63, for example, a heater is attached to the outer wall of the polishing powder tank.
In this way, the above-described predetermined effect can be obtained.

Although the embodiments and modifications have been described above, the present invention is not limited to these and other modifications are possible.

[Application example]

Two examples of application using the above-mentioned sandblasting device will be shown below.

First, an example used for ceramics processing will be described. In other words, as a method of making dense ceramics until now,
Although the pressing method and the roll method are performed, it is impossible to make thin film ceramics by using this method, and as a method of making thin film ceramics,
Although there are spraying method, coating method, screen printing method, plasma spraying method, etc., the ceramics produced by any of the methods have a porous shape, and dense ceramics cannot be produced.

Fig. 14 shows the principle of making dense thin film ceramics. That is, fine powder (for example, 0.1 to several μm) which is a raw material of ceramics is replaced with the polishing powder of this embodiment, and this is sprayed from the spray nozzle 27 to the substrate 65.
The substrate 65 has a hardness equal to or less than that of the fine powder of the ceramic raw material. Since the fine powder impinges on the substrate 65 at high speed, it is converted into thermal energy and the fine powder adheres to the substrate. The adhered fine powders are laminated to form a thin-film ceramics 65a on the substrate 65. Further, the thickness of the ceramics 65a can be easily changed by changing the injection time and the like.

Further, the finer the fine powder, the larger the surface energy and the more likely it is to change into heat energy. The spray pressure from the injection nozzle 27 is 1 to 7 kg / cm ² , preferably 4 to 7 kg / cm ^2.
It is. The distance (d) between the tip 27a of the jet nozzle and the substrate surface is preferably about 1 to 20 mm. It may be fired at a usual firing temperature in order to further improve the denseness of the ceramics.

By using the above processing method, not only general thin film ceramics but also superconducting ceramics can be easily thinned. Further, by narrowing the tip 27a of the jet nozzle 27 and narrowing the jet beam, when superconducting ceramics are used for wiring of an electronic circuit for a computer, for example, various shapes can be formed at high speed.

It is also possible to make thin-film ceramics having a curved surface.

It is also possible to produce a large amount of thin film ceramics of various shapes by operating the jet nozzle 27 using an appropriate device.

Next, an example applied to the surface processing of a paper rolling roller of a grid rolling type pen plotter or a printer will be shown.

Conventionally, the paper feeding of the grid rolling type pen plotter has been performed by sandwiching the recording paper with a metal roller and a rubber roller, the surfaces of which are filed, and rotating these rollers. The surface of this metal roller was plasma sprayed or machined.

 These metal rollers have the following drawbacks.

1. When plasma spraying is performed, a coating film is formed on the entire roller, so it is impossible to form irregularities of any shape.

2. In the case of machining, the recording paper tends to slip rather than have large irregularities.

3. Some processing time is required.

As shown in FIG. 15, in this example, a plurality of ring-shaped rough surfaces 66c are processed on the surfaces of a pair of cylindrical paper feed rollers 66a, 66b made of, for example, metal by using the above sandblasting device. . Since it is easy to set the roughness and the working width of the ring-shaped rough surface 66c within appropriate ranges, the coefficient of friction can be increased and the recording paper 67 will not slip or shift in position. By this, a pair of paper feed rollers 66
The traveling of the recording paper 67 by the c and 66b becomes extremely stable. Further, as a material that can be used for the paper feed roller, ceramics, resin material, or the like can be used. Further, the shape of the rough surface processed on the surface of the paper feed roller can be any other shape such as a spiral shape.

〔The invention's effect〕

Since the present invention is configured as described above, the following effects can be obtained.

Agglomeration of the polishing powder is prevented in the polishing powder deposition part in the mixing chamber of the sandblasting device, and stable continuous spraying of the polishing powder is possible, so it is possible to use extremely fine polishing powder, and perform good and stable polishing processing. You can

Further, by using extremely fine polishing powder, fine surface processing can be performed on various materials.

Moreover, since only the polishing powder in the polishing powder depositing section in the mixing chamber is vibrated, the aggregation of the polishing powder can be prevented with a small amount of energy.

In addition, since the mixing chamber does not vibrate, it is not necessary to make the mixing chamber and various pipes connected to the mixing chamber seismic-resistant or seismic isolation structure, and the structure around the mixing chamber and the mixing chamber is simplified, and the reliability of the device is improved. It is possible to improve the sex.

[Brief description of the drawings]

FIGS. 1 to 6A relate to the sandblasting apparatus of the present embodiment. FIG. 1 is an overall view, FIG. 2 is a view showing the time change of the abrasive powder injection amount, and FIG. 3 is a view of FIG. III-III arrow view, FIG. 4 is an IV-IV arrow view of FIG. 3, and FIGS. 5A and 5B are enlarged cross-sectional views of the connection portion between the delivery pipe and the mixing chamber and the injection nozzle. FIG. 6A is a diagram showing a vibrating means provided on the delivery pipe. FIGS. 6B to 13 relate to a modification of the present embodiment, FIGS. 6B to 6D show examples of the vibrating means provided in the delivery pipe, and FIG. 7A shows the polishing deposit part in the mixing chamber. The front view of the mixing chamber showing an example of the vibrating means provided at the bottom, FIG. 7B is a plan view of the same mixing chamber, and FIG. 8 is the plan view of the mixing chamber showing an example in which a large number of vibrating means are also provided. FIG. 9 is a front view of the mixing chamber showing an arrangement example of the vibrating means provided in the mixing chamber, 10A.
Figures 10C are plan views of a mixing chamber showing an example of a filter,
FIG. 11 is a perspective view showing a method for manufacturing a filter, FIG. 12 is an enlarged cross-sectional view showing an example of a method for fixing a vibrating means, and FIG. 13 is a front view of a mixing chamber showing an arrangement example of a moisture absorbing means and a drying means. is there. FIGS. 14 and 15 relate to an application example of the sandblasting apparatus of this embodiment, FIG. 14 is a diagram showing a method for producing ceramics, and FIG. 15 shows that a rough surface is formed on the surface of the paper feed roller. FIG. FIG. 16 is an overall view of a conventional sandblasting device. In the symbols used in the drawings, 1 is an air compressor, 2 is a mixing chamber, 3 is a blast chamber, 4 is an exhaust fan, and 15a is an abrasive powder depositing unit, which is a vibrating unit.

Claims (1)

(57) [Claims] 1. A sand blasting apparatus in which polishing powder and air are mixed in a mixing chamber and the mixture is sprayed onto an object to be polished in a blasting chamber, wherein the polishing powder deposit formed in the bottom space of the mixing chamber. And a vibrating plate provided in the polishing powder accumulating portion, and configured to vibrate only the polishing powder in the polishing powder accumulating portion.