JPH02131871A - Sand blasting device - Google Patents

Abstract

PURPOSE:To eliminate the clogging of an abrasive powder inside a mixing chamber and continuously inject the abrasive powder with good stability by providing a vibration means for vibrating the abrasive powder inside the abrasive powder accumulation part of a mixing chamber inside mixing the abrasive powder and air. CONSTITUTION:The dispersed abrasive powder 12 is stirred by the compressed air blown from a blowoff port 20 with mechanically dispersing the abrasive powder 12 of an accumulation part 15a by a vibration means 36 in a mixing chamber 2. As a result, an air vibrator effector can effectively be continued and this abrasive powder can continuously be injected into a blast chamber 3 with good stability without causing any clogging inside the mixing chamber 2.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a sandblasting device suitable for use, for example, in surface polishing of semiconductors.

[Summary of the invention]

The present invention provides a sandblasting device used for polishing the surface of semiconductors, for example, by providing a vibration means for vibrating the polishing powder in the polishing powder accumulation part in the mixing chamber, so that the polishing powder is dispersed in the mixing chamber and the polishing powder is prevented from clogging. This allows powder to be sprayed continuously in a stable state.

[Conventional technology]

For example, in the surface pattern processing of semiconductor wafers, the IBE (ion beam ethoching) method has generally been widely used, but this IBE method has problems such as requiring a long processing time, so recently, alternative processing methods have been used. As a method, a sandblasting method is used in which fine powder is mixed with compressed air and then injected.

A conventional example of a sandblasting device used for this sandblasting process will be explained with reference to FIG. 16.

This sandblasting device is roughly divided into an air compressor 1 that supplies compressed air, a mixing chamber 2 that mixes abrasive powder with the compressed air sent out from the air compressor 1, and a mixing chamber 2 that injects abrasive powder together with compressed air onto an object to be polished. It is composed of a plast chamber 3 and an exhaust fan 4 that collects and suctions polishing powder from the plast chamber 3.

An air supply pipe 5 is led out from the air compressor 1, and the air supply pipe 5 is further branched into a first supply pipe 6 and a second supply pipe 7, which are connected to the mixing chamber 2. In addition, 8 is an adjustment valve that adjusts the pressure of compressed air supplied to the mixing chamber 2, 9 is a solenoid valve that controls the supply of compressed air to the mixing chamber 2, and 10 is a flow rate of compressed air in the second supply pipe 7. This is a regulating valve that adjusts the

The mixing chamber 2 has an abrasive powder supply section 11 in its upper part, and the abrasive powder l2 stored in the abrasive powder supply section 11 through a wire mesh 11a located at the upper part is supplied by opening and closing the supply valve l3. An appropriate amount of polishing powder is dropped and supplied to a tank 15 in the mixing chamber 2 through the port 14.

Further, at the bottom of the mixing chamber 2, a first flow path 16 to which the first supply pipe 6 from the air compressor 1 is connected, and a second flow path 17 to which the second supply pipe 7 is connected. The first flow path 16 is formed to communicate with the polishing powder accumulation part 15a which is the bottom of the polishing powder tank 15, while the second flow path 17 is formed to pass straight through the mixing chamber 2. ing.

A filter 18 made of cermet (a plate with numerous micropores formed by sintering metal powder) is installed on the lower surface of the polishing powder accumulation section 15a through which the first flow path 16 communicates. The filter 18 is arranged so as to be separated from the first flow path 16, and the polishing powder l2 supplied by the polishing powder supply section 11 is deposited on the filter 18. Further, at the bottom of the polishing powder accumulation section 15a, a polishing powder extraction nozzle l9 is projected so as to penetrate through the center of the filter 18, and a polishing powder extraction port 20 opened at the top surface of this polishing powder extraction nozzle 19 is as follows. It communicates perpendicularly with the second flow path 17 at the confluence section 22 via the polishing powder flow path 21 . In addition, in the polishing powder tank l5, the polishing powder outlet 2
A powder collector 23 is provided above 0, and a trapezoidal powder collecting recess 24 is formed at the bottom of the powder collector 23 so as to face the polishing powder outlet 20. There is.

Moreover, 25 is a filter attached to the upper surface opening of this powder collector 23, and is formed on the extension of the second flow path 17 and the confluence part 22 in the mixing chamber 2 configured as described above. A delivery pipe 26 is connected to the delivery port side of the flow path 50 for the mixed mixture, and this delivery pipe 26 is led into the plast chamber 3 and has a nozzle 27 attached to its tip. An object to be polished A, such as a semiconductor wafer, is opposed to the nozzle 27 .

Further, a polishing powder receiving section 28 is provided at the lower part of the blasting chamber 3, and a reducing pipe 2 is connected from the bottom of this polishing powder receiving section 28.
9 is led out, and the tip of this reducing pipe 29 is connected to the mixing chamber 2 and communicates with the inside of the polishing powder tank 15.

Furthermore, within the mixing chamber 2, an exhaust pipe 30 is led out from the inner space of the dust collector 23, and the tip of this exhaust pipe 30 is connected to the exhaust fan 4. Note that 31 is a solenoid valve that controls the flow of air in the exhaust pipe 30.

The exhaust fan 4 has a filter 32 and a suction fan 33 inside, and the suction fan 33 removes the filter 3 from the filter 32.
Air is sucked from the exhaust pipe 30 through the exhaust port 3
Discharge from 4. Further, 35 is a polishing powder reservoir provided at the lower part of the filter 32.

The sandblasting device configured as described above is operated as follows. That is, the compressed air sent out from the air compressor 1 is divided into the first supply pipe 6 and the second supply pipe 7, and the compressed air diverted to the first supply pipe 6 side is divided into the first supply pipe 6 and the second supply pipe 7. 16 and flows into the polishing powder accumulation section 15a via the filter 18. At this time, compressed air is applied to the polishing powder 1 deposited in the polishing powder accumulation section 15a.
By passing through the polishing powder 2, the polishing powder 12 is agitated by the so-called air pie breaker effect, and a part of it is collected near the outlet 20 by the powder collector 23.

On the other hand, the compressed air diverted to the second supply pipe 7 side is
The polishing powder passes through the second flow path 17 straight, and at this time, the polishing powder flow path 21 side becomes a negative pressure than the second flow path side 17 at the confluence part 22, so that the polishing powder 12 is removed from the polishing powder outlet 20.
is sucked in and mixed with compressed air at the confluence section 22. The mixture of compressed air and polishing powder is then injected from the nozzle 27 into the plast chamber 3 through the delivery pipe 26.
As a result, the object to be polished A, for example, a semiconductor wafer, is polished.

In addition, the air and polishing powder l after being sprayed onto this workpiece A
The mixture in step 2 is sucked by the operation of the exhaust fan 4 and passes from the blasting chamber 3 through the reduction pipe 29 to the polishing powder tank 15.
Here, only the polishing powder 12 falls and is deposited in the polishing powder accumulation part 15a by its own weight. Then, only air passes from the polishing powder tank 15 through the exhaust pipe 30 to the exhaust fan 4.
After the polishing powder remaining in the sucked air is removed by the filter 32, purified air is discharged from the exhaust port 34. Further, the removed polishing powder is accumulated in the polishing powder reservoir 35.

[Problem to be solved by the invention]

In recent years, such sandblasting equipment uses fine powder with a smaller particle size, such as #1000 (
Fine powder with a particle size of 16 μm or more has come to be used.

However, such fine powders tend to agglomerate due to their high adsorption properties, and as a result, the agglomerated abrasive powders cause so-called clogging at the abrasive powder outlet in the mixing chamber.
Furthermore, the agitation caused by the air pie breaker effect is not sustained, and when a large amount of polishing powder is initially injected, only compressed air is subsequently injected, resulting in extremely uneven injection.

SUMMARY OF THE INVENTION An object of the present invention is to provide a sandblasting device that can jet abrasive powder well even when using fine abrasive powder.

[Means to solve the problem]

In order to achieve the above object, the sandblasting device of the present invention has a configuration in which a vibration means for vibrating the polishing powder is provided in the polishing powder accumulation section in the mixing chamber.

[Effect]

In the mixing chamber of the sandblasting device configured as described above, the abrasive powder is mechanically dispersed by the vibration means, and the dispersed abrasive powder can be agitated by compressed air, so that the air vibrator effect can be effectively utilized. There is no risk of the polishing powder clogging the mixing chamber, and stable continuous injection of the polishing powder is achieved.

〔Example〕

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a sandblasting apparatus to which the present invention is applied will be described below with reference to the drawings.

FIG. 1 shows an embodiment of a sandblasting device according to the present invention.

First, the overall structure of the sandblasting apparatus of this embodiment will be explained, but the same reference numerals will be given to the parts corresponding to those of the conventional example shown in FIG. 16 mentioned above, and the explanation thereof will be omitted. That is, the plast chamber 3 is arranged near the upper part of the polishing powder supply section 11, and is short-circuited with the polishing powder supply section 1l by a vertical reduction pipe 45. The polishing powder supply unit 1l is provided with a lid 57, and one end of the lid 57 has an inlet 57 for polishing powder.
b is provided, and the above-mentioned return pipe 45 is connected to this population 57b. Further, an air outlet 57c is provided at the other end of the lid 57. This population 57b and exit 5
7c is between the inner wall 1lb of the polishing powder supply section and the lid 57.
They are communicated by a detour formed by a ring-shaped partition plate 57a provided at the bottom of the screen.

A discharge pipe 60 is led out from this air outlet 57c,
Its tip is connected to an exhaust fan 4.

Note that a solenoid valve 59 is provided near the outlet 57c of the discharge hive 60.

Further, the supply valve 13 in the polishing powder supply section 11 is tightly closed around the polishing powder supply port 14 by the upward tension action of the coil spring 58 provided between the upper part of the supply valve 13 and the lid 57. ing.

Also, an exhaust pipe 3 for exhausting the air in the mixing chamber 2
0, a wandering air adjustment valve 61 is provided downstream of the electromagnetic valve 31 described above.

The electromagnetic valve 59 and the electromagnetic valve 31 are connected to a predetermined electric circuit and are controlled so that their open and close states are reversed at regular intervals.

In addition, a moisture absorption means 6 such as silica gel is provided in the upper part of the mixing chamber 2.
2 and a drying stage 63 using a heater or the like.

The sandblasting apparatus of this embodiment configured as described above operates as follows. That is, the polishing powder 12 and air after being injected from the nozzle 27 toward the object A to be polished in the blasting chamber 3 are sucked by the suction force of the exhaust fan 4.
It reaches the inlet 57b of the polishing powder supply section l1. and entrance 5
Since a swirling flow is generated along the detour from 7b toward the outlet 51G, the polishing powder tool 2 collides with the inner wall 1lb of the polishing powder supply part 1b due to centrifugal force and falls, and the polishing powder supply part 1
1. In this way, the polishing powder 12 is recovered and reused.

On the other hand, when the solenoid valve 59 and the solenoid valve 3l are alternately controlled to open and close, and the solenoid valve 31 is opened and the solenoid valve 59 is closed, the pressure inside the polishing powder tank 15 drops from the polishing powder supply section 11. , the supply valve 13 of the polisher 12 is connected to the coil spring 5
8, the polishing powder l2 is pushed down from the supply port 14.
falls.

Then, conversely, the solenoid valve 31 is closed, and the solenoid valve 5
9 is opened, the supply valve l3 is returned to its original state by the coil spring 58, and the polishing powder 12 stops falling. The above cooperative operation is repeated, and the polishing powder 12 is automatically and sequentially supplied into the polishing powder tank 15 from the polishing powder supply section 1l.

Further, when a pressure difference is generated in the polishing powder tank l5 by the opening/closing operation of the electromagnetic valve 31, the polishing powder l2 can be further disturbed in the polishing powder accumulation section 15a. When the amount of exhaust from the tank 15 is reduced to a certain amount, the pressure difference becomes smaller, and the polishing powder 12 is injected almost constantly at the nozzle 27 regardless of the periodic opening and closing operations of the solenoid valves 31 and 59. will be done. FIG. 2 shows the relationship between the amount of abrasive powder sprayed and time, and in the above case, the amount of sprayed powder is approximately constant as shown in C. Note that in the case of a conventional device in which neither the t magnetic valve 31 nor the displacement adjustment valve 6l is provided, the change is as shown in A, and in the case that only the F4 magnetic valve 31 is provided, as shown in B.

Further, by providing the moisture absorbing means 62 and the drying means 63 in the polishing powder tank 15, it is possible to prevent the polishing powder I2 from absorbing moisture and solidifying. In particular, as mentioned above, the polishing powder l2
It is effective to reuse the polishing powder 12 because it often absorbs moisture.

The sandblasting apparatus of this embodiment configured as described above is a circulation system that can recover and reuse the used polishing powder 12.

Next, the vibration means 36 provided in the polishing powder accumulation section 15a in the mixing chamber 2 will be explained. That is, as shown in FIG. 1, a plurality of vibration means 36 are arranged in an inclined manner on a conical inclined part 15b provided on the outer periphery of the filter 18 at the bottom of the polishing powder accumulation part lsa in the mixing chamber 2. ing. Further, as shown in FIG. 3, the plurality of vibrating means 36 are constituted by, for example, a plurality of rectangular bimorph piezoelectric elements 36a, which are arranged at symmetrical positions with respect to the polishing powder take-out nozzle 19. The free end 36n of the bimorph piezoelectric element 36a is arranged above the filter 18.

Furthermore, as shown in FIG. 4, a bimorph piezoelectric element 36a
is formed by laminating, for example, a pair of upper and lower piezoelectric elements 38a138b and three sets of electrodes 39a, 39b, and 39c, one end of which is fixed on a fulcrum 37 as a fixed end 36m. is, and
One end on the fulcrum 37 side is a fixed end 36m, and the other end is a free end 36n.
The bimorph piezoelectric element 36 is configured to
For example, by applying a predetermined AC voltage to the electrode xXy of a, the free end 36n is caused to vibrate in the vertical direction.

Furthermore, when connecting the electrodes X and Y of the bimorph type piezoelectric elements 36a that are adjacent to each other, it is desirable to connect the electrodes so that the phases of their vibrations are opposite to each other.

Further, the frequency of the AC voltage is, for example, 200 to 400.
It may be a high frequency such as Hz, and is preferably approximately equal to the resonant frequency of the bimorph piezoelectric element 36a.

As described above, by providing the plurality of vibration means 36 in the polishing powder accumulation part 15a in the mixing chamber 2, the polishing powder 12 is mechanically dispersed and the dispersed polishing powder 12 is removed from the filter l8. Since the mixture can be agitated by compressed air, the above-mentioned biply cooling effect can be effectively maintained.

Furthermore, it is even more effective to reverse the phases of the vibrations of the adjacent vibration means 36.

Moreover, the piezoelectric element 3 used for the bimorph type piezoelectric element 36a
As 8a and 38b, known materials exhibiting a piezoelectric phenomenon, such as barium titanate, lead titanate, lead zirconate titanate, and crystal, can be used. Further, it is also possible to use a vibrating means having a structure in which a pair of electric scratchers are superimposed on both sides of these piezoelectric elements.

Next, the plurality of high-speed air outlets 47 shown in FIGS. 1 and 3 will be explained. That is, polishing powder outlet L port 2
A plurality of high-speed air blow-off ports 47 are provided around point 0 at position 1 corresponding to just below the powder collecting recess 24 . These high-speed air outlets 47 are connected to the first flow path 16 for compressed air at the lower part of the mixing chamber 2.

By configuring as described above, the polishing powder outlet 20
By colliding and reflecting the compressed air blown out at high speed from the high-speed air outlet 47 provided near the polishing outlet 20 into the powder collecting recess 24 provided directly above the polishing outlet 20,
A high-speed turbulent flow of compressed air can be generated near the top of the polishing outlet 20. Therefore, since the abrasive powder 12 is strongly stirred near the abrasive outlet 20, the abrasive powder 12 can be smoothly taken out from the abrasive outlet 20 and continuously injected into the blasting chamber 3, resulting in a stable Continuous jetting of polishing powder is possible.

In addition, a suction nozzle 49 as shown in FIG. 1 is provided at the confluence 22 of the polishing powder 12 and the compressed air, which allows the compressed air from the second flow path 17 to flow at a higher speed. Therefore, from the polishing outlet 20 to the polishing powder flow path 2
The polishing material can be taken out more efficiently through the l.

FIG. 5A shows a connecting portion between the mixing chamber 3 and the delivery pipe 26. A tapered portion 5 is formed on the inner surface of the connecting pipe 51a.
3a, a tapered portion 54a is provided on the inner surface of the joint 52a, so that the mixture flow path 50 and the delivery pipe 26 are continuously connected. Further, FIG. 5B shows a connecting portion between the delivery pipe 26 and the injection nozzle 27. As in the case described above, tapered portions 53b and 54b are provided on the inner surfaces of the connecting pipe 5lb and the joint 52b, respectively, so that the delivery pipe 26 and the injection nozzle 27 are continuously connected. By doing this, it is possible to prevent air pockets from forming in the above-mentioned connecting portion, and to prevent the polishing powder 12 from accumulating and causing clogging.

Further, the above-mentioned delivery pipe 26 may be, for example, a urethane tube.
The delivery tube 126 is made of a flexible tube such as a nylon tube or a vinyl tube.
When piping is actually installed, it is arranged so that the corners are bent gently, avoiding sharp bends. Further, the delivery pipe 26 is provided with a vibrating stage 43 as shown in FIG. As this vibration means 43, for example, as shown in FIG. 6A, a high-morph type piezoelectric element 43a may be used, and the high-morph type piezoelectric element 43a is fixed on the delivery pipe 26 via a fulcrum 43b and vibrates in a resonant state. Given.

By configuring as described above, it is possible to prevent clogging due to accumulation of polishing powder inside the delivery pipe 26.

In addition, a plurality of vibration stages 44 are provided in the polishing powder receiving section 28 in the plast chamber 3, and the polishing powder 12 sprayed from the injection nozzle 27 onto the object A to be polished is deposited on the polishing powder receiving section 28. The polishing powder is smoothly fed to the polishing powder supply section 11.

As the vibration means 44, for example, a bimorph type piezoelectric element may be used.

Further, as described above, the moisture absorbing means 62 and the drying means 63 are provided in the mixing chamber 2, but as shown in FIG. The cylindrical plate 64 is attached, and the cylindrical plate 64 is attached.
A large number of spherical silica gels each having a diameter of several days, for example, are arranged as a moisture absorbing means 62 inside the L-shaped plate 64, and a thousand drying stages 63 are arranged outside the L-shaped plate 64, for example. For example, a heater is installed.
In this manner, the moisture in the polishing powder tank 15 is absorbed and removed by the moisture absorbing means 62, and the moisture in the polishing powder tank 15 is evaporated by the drying stage 63. This steam is then exhausted through the exhaust vibrator 30. In this way, it is possible to solve the problem that the polishing powder 12 absorbs moisture and hardens while the polishing plate 12 is reused many times. Further, the finer the polishing powder l2 is, the more hygroscopicity it has, so it is more effective.

When the sandblasting device of this embodiment configured as described above is used, fine powder (5 to 5
80 μm) as well as ultrafine polishing powder 12 on the order of 5 μm or less and 0.01 μm could be continuously jetted without causing jetting unevenness. In addition, by using this equipment, metals, ceramics, glass, plastics, etc. could be processed precisely and at high speed.

For example, fine surface processing of semiconductors can be performed more quickly than dry etching using conventional vacuum equipment, and the preparation period before starting processing can be extremely shortened.

Further, during processing using such a sandblasting device, processing can be performed at higher speed while applying reactive gas, light, heat, electric field, magnetic field, etc. that are effective for processing the sample.

[Modifications] Modifications of the above-described embodiments of the present invention will be described below with reference to the drawings.

7A and 7B show the polishing powder accumulation section 15 in the mixing chamber 2.
A plurality of diaphragms 36b are provided as vibration means 36 at the bottom of the inside of a.
This is an example using . That is, the inner peripheral end is driven by a voice coil drive stage 42 to vibrate. Further, a cylindrical bellows 46 is arranged on the inner peripheral end side of the diaphragm 36b so as to surround the voice coil type driving means 42.
Polishing powder 12 is prevented from entering into 2.

FIG. 8 shows an example in which a larger number of the above-mentioned vibrating means 36 are provided at the bottom of the polishing powder accumulation section 15a, so that the polishing powder 12 is further broken down.

FIG. 9 shows an example in which a plurality of vibrating means 36 are provided above the polishing powder accumulation section 15a in the mixing chamber 2, respectively. That is,
By providing a plurality of vibration means 36 on the inner wall 15b of the polishing powder tank and the outer wall 23a of the powder collector, the polishing powder 12 accumulated near these walls can be dispersed.
Polishing powder can be smoothly sent to the bottom of the polishing powder accumulation section 15a. The shape of the vibration means 36 may be, for example, square, trapezoidal, donut shape, etc. In addition to the above-mentioned shapes, the vibration means 36 may be a magnetostrictive vibration element, a vibration element using electromagnetic induction, etc. may be configured.

10A to 10C are examples in which the shape of the filter 18 is changed. That is, in the filter 18a shown in FIG. 10A, a filter portion 18d through which compressed air passes is configured radially in the shape of a cross. Also, the first OB
The filter 18b shown in the figure also includes filter portion 1.
The filter 18d shown in FIG. 10C has a radial shape like a * shape, and a portion of the filter 18d has a plurality of relatively small holes 18d. In this case, it is desirable that many of the holes 18d be arranged around the polishing powder extraction nozzle l9. Also, the 10th A
10C also show the arrangement of the above-mentioned vibrating means 36 provided at the bottom of the polishing powder accumulation section 15a. That is, the plurality of vibrating means 36 are arranged above the filter portions 18d of the filters 18a, 18b, and 18c, corresponding to the positions where the filter portions 18d of the filters 18a, 18b, and 18c are provided.

With the above configuration, the polishing powder is dispersed at the bottom of the polishing powder accumulation section 15a by the vibrating means 36, and the dispersed polishing powder is transmitted to the filter portion 18.
This has the effect of further stirring due to the compressed air coming out more strongly from d.

FIG. 11 is a diagram for explaining, for example, a method of manufacturing the above-mentioned filter 18c. That is, for example, the filter 18c can be easily made by superimposing a disk-shaped metal plate 48 having a plurality of holes 18d at predetermined positions on the filter 18 described above.

FIG. 12 shows an example of a method of fixing the above-mentioned bimorph type piezoelectric element 36a provided at the bottom of the polishing powder accumulation section 15a. That is, the fixed end 3 of the bimorph piezoelectric element 36a
6m is the wall of polishing tank 15 Bimorph type piezoelectric element 36
Since the glue wire #IA41 can be directly drawn out from the electrode a, polishing powder l2 will not be deposited on the lead wire 41.

6B to 6D are examples of the vibration stage 43 of the sending pipe 26, and in the case of FIG. 6B, the driving part 43d of the voice coil drive means 43C is fixed to the sending pipe 26 and vibrated. There is. In the case of FIGS. 6C and 6D, the delivery pipe 26 is vibrated by a vibration arm 55c which is vibrated by a motor 55a via a crank arm 55b.

FIG. 13 shows an example of the arrangement of 1,000 moisture absorbing stages 62 and 1,000 drying stages 63, in which a large number of moisture absorbing means 62, for example, spherical silica gel with a diameter of several centimeters, are mixed into the polishing powder accumulation section 15a, and drying means 63, for example, A heater is attached to the outer wall of the polishing powder tank. In this way, the above-mentioned predetermined effects can be obtained.

Although the embodiments and modifications have been described above, the present invention is not limited to these and other modifications are possible.

[Application example]

Below, two examples of applications using the above-mentioned sandblasting device will be shown.

First, an example of use in ceramic processing will be explained.

In other words, the press method and the roll method have been used to date to make dense ceramics, but it is impossible to make thin film-like ceramics using these methods; As a method,
There are spraying methods, coating methods, screen printing methods, plasma spraying methods, etc., but the ceramics produced by any of these methods is porous and it is not possible to create dense ceramics.

FIG. 14 shows the principle of producing dense thin film ceramics. That is, a fine powder (for example, 0.1 to several μm), which is a raw material for ceramics, is replaced with the polishing powder of this embodiment, and this is sprayed onto the substrate 65 from the spray nozzle 27 . This substrate 65 has a hardness equal to or less than that of the fine powder of the raw material for the ceramic socks. Since the fine powder hits the substrate 65 at high speed, this turns into thermal energy and the fine powder adheres to the substrate.

This adhered fine powder is layered to form a thin film-like ceramic sock 6
5a is formed on a substrate 65. Further, the thickness of the ceramic sox 65a can be easily changed by changing the injection time and the like.

Furthermore, the finer the powder, the greater its surface energy and the easier it is to convert into thermal energy. The spray pressure from the injection nozzle 27 is 1-7 kg/c+a, preferably 4-1 kglcr&. Further, the distance (d) between the tip 27a of the injection nozzle and the substrate surface is preferably about 1 to 20 mm. In order to further improve the density of the ceramic sox, it may be fired at a normal firing temperature.

By using the processing method described above, not only general thin-film ceramic socks but also superconducting ceramic socks can be easily made into thin films. Furthermore, by narrowing the tip 27a of the injection nozzle 27 to narrow the injection beam, when superconducting ceramics are used for wiring of electronic circuits for computers, for example, it can be formed into various shapes at high speed.

It is also possible to create thin film-like ceramics with curved surfaces.

Further, by scanning the injection nozzle 27 using an appropriate device, it is also possible to manufacture thin film ceramics in various shapes in large quantities.

Next, an example of application to surface processing of a Glisodo rolling type pen block or a paper feed roller of a printer will be shown.

Conventionally, paper feeding in grid rolling type pen blotters has been carried out by sandwiching the recording paper between a metal roller with a sanded surface and a rubber roller, and rotating these rollers. The surface of this metal roller was plasma sprayed or machined.

These metal rollers have the following drawbacks.

1. When plasma spraying is used, a coating film is formed on the entire roller, so it is impossible to form irregularities of any shape.

2. If machining is used, the unevenness will be quite large, making the recording paper more likely to slip.

3. Requires some processing time.

As shown in FIG. 15, in this example, a plurality of ring-shaped rough surfaces 66c are processed on the surfaces of a pair of cylindrical paper feed rollers 66a and 66b made of metal, for example, using the above-mentioned sandblasting device. . Since the roughness and machining width of the ring-shaped rough surface 66c can be easily set within an appropriate range,
The coefficient of friction can be increased, and the recording paper 67 will not slip or shift its position. This makes the running of the recording paper 67 by the pair of paper feed rollers 66a and 66b extremely stable. Further, as materials that can be used for the paper feed roller, ceramics, resin materials, etc. can also be used. Further, the shape of the rough surface processed on the surface of the paper feed roller can be any other arbitrary shape such as a spiral shape.

〔Effect of the invention〕

Since the present invention is configured as described above, it produces the effects described below.

Since there is no risk of clogging of the abrasive powder in the mixing chamber of the sandblasting device and stable continuous injection of abrasive powder is possible, extremely fine abrasive powder can be used and good and stable abrasive processing can be performed. Furthermore, since it has become possible to use extremely fine abrasive powder, fine surface processing can be performed on various materials.

[Brief explanation of the drawing]

1 to 6A relate to the sandblasting apparatus of this embodiment, in which FIG. 1 is an overall view, FIG. 2 is a diagram showing changes in the amount of abrasive powder sprayed over time, and FIG. 3 is a diagram similar to that of FIG. 1. Fig. 4 is a view taken from the IV-1 arrow in Fig. 3, Figs. 5A and 5B are enlarged cross-sectional views of the connecting parts between the delivery pipe, the mixing chamber, and the injection nozzle. Figure 6A is a diagram showing the vibration means provided on the delivery pipe. Figures 6B to 13 relate to modifications of this embodiment, in which Figures 6B to 6D are examples of vibration means provided in the delivery pipe, and Figure 7A is an example of the vibration means provided in the mixing chamber. Front view of the mixing chamber showing an example of the vibration means provided at the bottom, No. 7
Figure B is a plan view of the mixing chamber, Figure 8 is a plan view of the mixing chamber showing an example in which a large number of vibrating means are provided, and Figure 9 is a mixing chamber showing an example of the arrangement of the vibrating means provided in the mixing chamber. 10A to 10C are a plan view of a mixing chamber showing an example of a filter, FIG. 11 is a perspective view showing a method of manufacturing a filter, and FIG. 12 is an enlarged view showing an example of a method of fixing a vibrating means. The sectional view and FIG. 13 are front views of the mixing chamber showing an example of the arrangement of moisture absorbing means and drying means. Figures 14 and 15 relate to an application example of the sandblasting device of this embodiment, with Figure 14 showing a method for manufacturing ceramics, and Figure 15 showing a rough surface formed on the surface of the paper feed roller. FIG. FIG. 16 is an overall view of a conventional sandblasting device. In addition, in the symbols used in the drawings, 1 ・1 --
11-1.
1......1-1-1 Mixing chamber 3 -・----1...------------Blast chamber 4 ・-・・−・−・−−−１−・−・・１・
・1 Exhaust fan 15a...1・1・1---1-1---1-1---Abrasive powder accumulation section 3 6-11------
·································1 is a vibration means.

Claims (1)

[Scope of Claims] A sandblasting device in which abrasive powder and air are mixed in a mixing chamber and the mixture is injected onto a workpiece in a blasting chamber, the abrasive powder being vibrated in an abrasive powder accumulation section in the mixing chamber. A sandblasting device characterized by being provided with a vibration means for causing vibration.