JP2664551B2 - Wiring board exposure processing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for exposing a wiring substrate of a liquid crystal display device to light.

[0002]

2. Description of the Related Art In the case of a liquid crystal display device using an active matrix drive system, for example, a thin film transistor (hereinafter referred to as T
FT) is formed, and connection terminals are formed around the display section. The TFT and the connection terminal are formed by exposing the pattern formed on the reticle onto the substrate using a stepper exposure apparatus and etching the substrate. In a large-sized liquid crystal display element, it is not possible to expose a TFT or a connection terminal on a substrate of the liquid crystal display element using one reticle. In this case, the liquid crystal display element substrate is divided into a plurality of regions, and exposure is performed using a plurality of reticles corresponding to the regions. The number of divisions of the liquid crystal display element substrate is determined based on the maximum exposure area of the reticle, the area of the liquid crystal display element substrate, the step distance of the stepper exposure device, and the like.

FIG. 11 is a diagram showing conventional reticles 1a and 1b, FIG. 12 is a plan view of a substrate 2 of a liquid crystal display element patterned by using conventional reticles 1a and 1b, and FIG. FIG. 3 is a plan view of a substrate 3 when a plurality of liquid crystal display elements are formed. Since the substrate 2 of the liquid crystal display element shown in FIG. 12 cannot be patterned with one reticle, it is divided into two parts in the left-right direction in FIG. 12 and each of the regions 2a and 2b is exposed.

FIG. 11 shows reticles 1a and 1b for exposing a substrate 2 divided into two parts. FIG. 11A shows a reticle 1 a for exposing an area 2 a of the substrate 2.
(2) is a reticle 1b for exposing a region 2b of the substrate 2.

[0005] Each reticle 1a, 1b is provided with a maximum exposure area 4a, 4b.
Patterns 5a and 5b corresponding to the respective regions 2a and 2b of the liquid crystal display element are formed in b. Pattern 5a, 5b
Includes a connection terminal of a liquid crystal display element and a TF serving as a display unit.
T is patterned. Light shielding bands 6a, 6b are formed on the outer periphery of the patterns 5a, 5b. A plurality of markers 7 for positioning the reticles 1a, 1b and the main body of the stepper exposure apparatus are formed on the outer periphery of the maximum exposure areas 4a, 4b.

The pattern 5 formed on the reticle 1a
Pattern A, reticle 1b
Assuming that a portion corresponding to the display portion of the pattern 5b formed on the substrate 2 is a pattern B, the display portion formed on the substrate 2 has a pattern A in a region 2a and a pattern B in a region 2b. Will be formed by

When a plurality of liquid crystal display elements are formed on one substrate 3 as shown in FIG. 13, each liquid crystal display element is formed by being divided into two parts in the horizontal direction of FIG. 13 as shown in FIG. In this case, the left half of the display section of each liquid crystal display element is formed by pattern A, and the right half is formed by pattern B.

[0008]

One display section is formed by the pattern A in the reticle 1a and the pattern B in the reticle 1b. Since the display section is formed uniformly, the same plurality of pixels are formed in the pattern A and the pattern B. However, when manufacturing the patterns A and B, a manufacturing error of ± 1.0 μm occurs, and the reticle 1a,
At the time of replacement of 1b, a positioning error occurs between the marker 7 of ± 0.5 μm and the main body of the stepper exposure apparatus. These errors are ± 1.5 μm.

When a TFT is formed, a plurality of exposures are performed on a pattern such as a gate electrode and a source electrode, and another pattern is formed. Each reticle to be exposed includes a manufacturing error, and an alignment error occurs at the time of exposure. Therefore, in the regions 2a and 2b of the liquid crystal display element, a source electrode, a gate electrode, and a drain electrode are provided. Since the overlapping area of the gate electrode and the gate electrode is different or the distance between the source electrode and the drain electrode is different, the characteristics of the TFT are different, and the display brightness is not the same. Therefore, display cannot be performed uniformly, and display quality is degraded.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method of processing an exposure of a wiring board which improves display quality by making display characteristics of circuit wiring in each individual area divided into individual areas uniform.

[0011]

SUMMARY OF THE INVENTION The present invention comprises a circuit wiring;
In a method of exposing a wiring board, wherein a connection terminal formed around a periphery of the circuit wiring is formed, the connection terminal corresponds to one of a plurality of individual regions obtained by dividing the wiring board. , A circuit wiring mask having a first region for forming circuit wiring, a second region for forming circuit wiring, and a first region for forming connection terminals of each individual region corresponding to the remaining individual regions. A connection terminal area mask having an area set therein is prepared, and the circuit wiring of the wiring board is formed using the circuit wiring mask, and the connection terminal is formed by using the circuit wiring mask and the connection terminal area mask. An exposure treatment method for a wiring substrate, characterized in that the method is performed by using the method.

[0012]

According to the present invention, in a method for exposing a circuit board, in which a circuit wiring and connection terminals formed around the circuit wiring and surrounding the circuit wiring are formed, the exposure of the wiring board is performed by the circuit wiring. This is performed using a mask and a mask for a connection terminal area.

First, a circuit wiring mask and a connection terminal area mask are prepared. The circuit wiring mask corresponds to one of a plurality of individual regions obtained by dividing the wiring substrate, and includes a first region for forming a terminal and a second region for forming a circuit wiring. have. The connection terminal area mask corresponds to the remaining individual areas other than the individual area corresponding to the circuit wiring mask, and a first area for forming a connection terminal of each individual area is set.

The entire circuit wiring on the wiring board is exposed using the second region of the circuit wiring mask, and the connection terminals are exposed using the connection terminal region mask and the first region of the circuit wiring mask.

[0015]

FIG. 1 is a view showing reticles 11a and 11b used in an embodiment of the present invention, and FIG. 2 is a substrate 12 of a liquid crystal display device patterned using the reticles 11a and 11b shown in FIG. 3 is a diagram showing an optical configuration of the stepper exposure apparatus 20, and FIG. 4 is an enlarged perspective view showing an optical configuration of the stepper exposure apparatus 20. As shown in FIG. 3, light from a mercury lamp 21 as a light source is reflected by an elliptical mirror 22 and is incident on a total reflection mirror 23. The light reflected by the total reflection mirror 23 is
, And thereafter, is reflected by a total reflection mirror 26, and is irradiated on a reticle 28 via a condenser lens 27. The light passes through the projection lens 29 and irradiates the substrate 30 via the exposure pattern formed on the reticle 28, and the pattern of the reticle 28 is exposed on the substrate 30. As shown in FIG. 4, the pattern formed on the reticle 28 is exposed upside down, left and right on the substrate 30 via the projection lens 29.

The reticle 28 is aligned with the reticle 2
This is performed by aligning the marker 17 formed on the reticle 8 with a marker on a reticle table (not shown). The alignment between the substrate 30 and the table 31 is performed by bringing the plurality of positioning pieces 32 provided on the table 31 into contact with the substrate 30.

When a plurality of liquid crystal display elements are formed on the substrate 30, or when the liquid crystal display element is divided into a plurality of regions to form a pattern, the base 31 is moved and the exposure position on the substrate 30 and the stepper are changed. Exposure is performed after the exposure position of the exposure device 20 is matched.

As shown in FIG. 2, when exposing a substrate 12 which is a wiring substrate of a liquid crystal display element to two regions 12a and 12b which are individual regions in the left-right direction of FIG. Two reticles 11a, 11 as shown
b is used. At this time, the pattern of the liquid crystal display element is
The display section 18, which is a second area indicated by oblique lines, is equally divided into two. The reticle 11a, which is a circuit wiring mask shown in FIG. 1A, has a pattern corresponding to the region 12a, and the reticle 11b, which is a connection terminal region mask shown in FIG. It has a pattern corresponding to the connection terminal portion 19 in the region 12b of the connection terminal portion 19 which is the first region surrounding the display portion 18. This is because the display section 18 in the area 12b is patterned at a position corresponding to the display section 18 of the reticle 11a, which is a pattern of the display section 18 in the area 12a.

The reticle 11a has a maximum exposure area 14a.
A pattern corresponding to the area 12a is formed in the reticle 11b, and a pattern corresponding to the connection terminal portion 19 in the area 12b is formed in the maximum exposure area 14b. Maximum exposure area 14 of reticles 11a and 11b
A plurality of markers 17 for aligning the reticle table (not shown) with the reticle 11a, 11b are provided outside the a and 14b.

The patterns a, c, d, and f formed on the reticle 11a are divided into three patterns a,
c and f. These patterns a, c,
d and f are rectangles in which all corners are right angles.

A blind (not shown) is provided between the reticle 28 and the condenser lens 27 shown in FIG. The blind prevents the light applied to the reticle 28 from being applied to an area other than the exposure pattern. Four blinds are provided and surround the pattern from four directions in a direction orthogonal to each piece of the reticle 28. Since the area surrounded by the blinds is a square in which all corners are right angles, the patterns a, c, d, and f are squares in which all corners are right angles. A light-shielding band 16a formed around each of the patterns a, c, d, and f
Is provided so that only the areas of the patterns a, c, d, and f to be exposed are exposed.

Similarly, the patterns b, e, and g of the connection terminal portion 19 formed on the reticle 11b are divided by the light-shielding band 16b into three rectangular patterns b, e, and g, all corners of which are right angles. ing.

Therefore, as shown in FIG.
The connection terminal portions 19 of the second region 12a are exposed by the patterns a, c, and f of the reticle 11a, the connection terminal portions 19 of the region 12b are exposed by the patterns b, e, and g of the reticle 11b. Both 12a and 12b are exposed by the pattern d of the reticle 11a.

FIG. 5 shows the reticle 11a shown in FIG.
It is a flowchart showing an example of the exposure procedure using 11b. In step a1, the substrate 12 is placed on the table 31, and positioning is performed using the positioning pieces 32. In step a2, the reticle 11a is positioned on the reticle table (not shown) using the marker 17. In step a3, the pattern a is surrounded by the shutter, and the substrate 12 is exposed. In step a4, the pattern d to be exposed in step a5 is
The pedestal 31 is moved on the reticle 1a so as to be connected to the pattern a separated by the light-shielding band. In the step a5, the pattern d is surrounded by the shutter, and the substrate 12 is exposed.

In step a6, the stage 31 is moved so that the display 18 in the area 12b can be exposed with the pattern d in step a7.
Exposure.

In the step a8, when the pattern c is exposed in the step a9, the table 31 is moved so that the display portion 18 in the area 12a is connected to the pattern c, and the pattern c is surrounded by the shutter in the step a9. The substrate 12 is exposed. In step a10, the display unit 1 exposed with the pattern d
The table 31 is moved so that the pattern 8 is connected to the pattern f exposed in the step a11. In the step a11, the pattern f is surrounded by the shutter, and the substrate 12 is exposed.

In step a12, the reticle 11a positioned in step a2 is removed, and then the reticle 11b is placed on a reticle table (not shown), and positioning is performed using the marker 17.

In step a13, the table 31 is moved so that the pattern b exposed in step a14 is connected to the display section 18 in the area 12b exposed in step a7.
Then, the pattern b is surrounded by the shutter, and the substrate 12 is exposed. In step a15, the base 31 is moved so that the pattern e exposed in step a16 is connected to the display unit 18 in the area 18b. In step a16, the pattern e is surrounded by a shutter, and the exposure of the substrate 12 is performed. Done. In step a17, the platform 31 is moved so that the pattern g exposed in step a18 and the display unit 18 in the area 12b are connected. In step a18, the pattern g is surrounded by a shutter, and the substrate 12 is exposed. Then, the exposure of the substrate 12 is completed. The order of exposure of the patterns a to g is not limited to this.

FIG. 6 is a plan view of a substrate 16 having a plurality of liquid crystal display elements, and FIG. 7 is a plan view showing exposure of the substrate 16 by the exposure method of the present invention. The substrate 16 has six liquid crystal display elements formed thereon. This is reticle 11
Exposure can be performed using a and 11b. Each display element is exposed using the same patterns a to g as those in FIG. Although the exposure step is performed as shown in FIG. 5, when a plurality of liquid crystal display elements are simultaneously formed, the table 31 is moved by moving the base 31.
Is preferably exposed after the exposure of the next pattern d.

FIG. 8 is a process chart showing a manufacturing process of an example of a thin film transistor (hereinafter, referred to as TFT), and FIG.
FIG. 10 is a cross-sectional view illustrating a manufacturing process of an example of the FT.
It is a top view which shows the manufacturing process of an example of FT. However, in FIG. 10, a substrate 32, a SiNx layer 35, and an a-Si layer 36, which will be described later, are not shown for easy understanding of the configuration. In a step b1, (Ta) tantalum is sputtered on the substrate 32, and in a step b2, the tantalum is patterned to form a gate electrode 33. In step b3, the surface of the gate electrode 33 is anodized, and FIG.
And the gate insulating film 34 as shown in FIG.
Is formed.

In step b4, the SiNx layer 35, a-Si
The layer 36 and the SiNx layer serving as the etch stopper 37 are laminated, and in a step b5, FIG.
As shown in (2), the etch stopper 37 is patterned.

In step b6, the n ⁺ -a-Si layer 38
Is deposited, and in step b7, FIG. 9 (3) and FIG.
0 (3), the a-Si layer 36 and n ⁺ −
The a-Si layer 38 is patterned.

In step b8, Ti is deposited by sputtering, and in step b9, as shown in FIGS. 9 (4) and 10 (4), the Ti is patterned into a source electrode 39 and a drain electrode 40.

In step b10, an ITO (indium oxide) film is deposited by sputtering, and step b1 is performed.
In FIG. 1, as shown in FIG. 9 (5) and FIG. 10 (5), the IT is formed on the pixel electrode 41 and the Ti source electrode 39.
The source electrode 39a of O is patterned, and step b12 is performed.
Thus, SiNx is formed on the entire surface to complete the TFT.

According to this embodiment, one reticle 11a
Of the region 12 using the pattern d forming the display portion 18 of FIG.
Since both a and 12b are exposed, areas 12a and 12b
Since no reticle manufacturing error and reticle positioning error occur between the two, the display characteristics of the display unit 18 become uniform, and the display quality is improved.

In this embodiment, the display section 18 and the connection terminal section 19
Although a manufacturing error and a positioning error occur between the display unit 18 and the connection terminal unit 19, the connection between the display unit 18 and the connection terminal unit 19 only needs to be able to perform electrical conduction, and is not affected by this error.

In this embodiment, the case where the liquid crystal display element is divided into two parts has been described, but the number of divisions is not limited to this. When increasing the number of divisions, it is necessary to divide the display unit 18 equally into each divided part.
In the case of four or more divisions, the liquid crystal display element may be divided vertically and horizontally into two parts. Further, when the liquid crystal display element is divided into three or more in the vertical and horizontal directions, a region having no connection terminal portion 19 occurs. According to the present embodiment, there is no need to prepare a reticle corresponding to this area, and the number of reticles can be reduced as compared with the related art.

In this embodiment, the patterning of the TFT has been described. However, the present invention can be used for forming all active matrix type liquid crystal display elements, and the present invention is not limited thereto.

[0039]

According to the present invention, since the circuit wiring of each individual region of the wiring board is formed using the second region of the circuit wiring mask, the circuit wiring of each individual region is formed uniformly. Can be. Therefore, the display characteristics of each circuit wiring in each individual region can be made uniform, and the display quality can be improved.

[Brief description of the drawings]

FIG. 1 is a reticle 11 used in one embodiment of the present invention.
It is a figure showing 11a and 11b.

FIG. 2 is a plan view of a substrate 12 of a liquid crystal display element patterned using the reticles 11a and 11b shown in FIG.

FIG. 3 is a diagram showing an optical configuration of a stepper exposure apparatus 20.

FIG. 4 is an enlarged perspective view showing an optical configuration of the stepper exposure apparatus 20.

FIG. 5 is a process chart showing an example of an exposure procedure using the reticles 11a and 11b shown in FIG.

FIG. 6 is a plan view of a substrate 16 having a plurality of liquid crystal display elements.

FIG. 7 is a plan view showing exposure of the substrate 16 by the exposure method of the present invention.

FIG. 8 is a process chart showing a manufacturing process of an example of a thin film transistor.

FIG. 9 is a cross-sectional view illustrating a manufacturing process of an example of a thin film transistor.

FIG. 10 is a plan view illustrating a manufacturing process of an example of a thin film transistor.

FIG. 11 is a view showing conventional reticles 1a and 1b.

FIG. 12 is a plan view of a substrate 2 of a liquid crystal display device using conventional reticles 1a and 1b.

FIG. 13 is a plan view of the substrate 3 when a plurality of liquid crystal display elements are formed on the substrate 3.

[Explanation of symbols]

 11a, 11b Reticle 12, 13, 30 Substrate 12a, 12b Area 18 Display section 19 Connection terminal section

Claims (1)

(57) [Claims] 1. A method of exposing a wiring board in which circuit wiring and connection terminals formed around the circuit wiring and surrounding the circuit wiring are formed, wherein a plurality of individual regions obtained by dividing the wiring board are provided. And a circuit wiring mask having a first region for forming a connection terminal and a second region for forming a circuit wiring, and corresponding to the remaining individual regions. A connection terminal area mask in which a first area for forming a connection terminal is set is prepared. Circuit wiring of the wiring board is formed using the circuit wiring mask, and the connection terminal is formed by the circuit wiring mask. An exposure processing method for a wiring board, characterized in that the wiring board is formed using a mask and a connection terminal area mask.