CN116520643A - Substrate preparation method and display panel - Google Patents
Substrate preparation method and display panel Download PDFInfo
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- CN116520643A CN116520643A CN202210084370.2A CN202210084370A CN116520643A CN 116520643 A CN116520643 A CN 116520643A CN 202210084370 A CN202210084370 A CN 202210084370A CN 116520643 A CN116520643 A CN 116520643A
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- alignment mark
- fixing
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- 239000000758 substrate Substances 0.000 title claims abstract description 157
- 238000002360 preparation method Methods 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 23
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 claims abstract description 15
- 239000011248 coating agent Substances 0.000 claims abstract description 11
- 238000000576 coating method Methods 0.000 claims abstract description 11
- 239000004642 Polyimide Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 238000000059 patterning Methods 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 238000005530 etching Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000004984 smart glass Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
- G03F7/2032—Simultaneous exposure of the front side and the backside
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70466—Multiple exposures, e.g. combination of fine and coarse exposures, double patterning or multiple exposures for printing a single feature
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Abstract
The invention discloses a substrate preparation method and a display panel, wherein the substrate preparation method comprises the following steps: providing a substrate to be processed, wherein the substrate to be processed is provided with a first surface and a second surface which are opposite, and the first surface is provided with an alignment mark part; turning over the substrate to be processed so as to enable the first surface and the second surface to exchange positions; coating photoresist on the second surface of the substrate to be processed; fixing the substrate to be processed on a fixing plate, wherein the first surface and the fixing plate are oppositely arranged, and the difference value between the thicknesses of the fixing plate and the substrate to be processed is smaller than or equal to a preset value; and aligning the exposure part and the alignment mark part, and exposing the second surface of the substrate to be processed through the exposure part. The thickness of the fixing plate is set to be smaller than or equal to the preset value, so that the elevation height of the fixing plate to the alignment mark part can be ensured to enable exposure to be focused and positioned, the process is simple and easy to operate, and the production efficiency of the substrate is effectively improved.
Description
Technical Field
The invention belongs to the technical field of electronic products, and particularly relates to a substrate preparation method and a display panel.
Background
Double-sided exposure is a processing technology developed for silicon and other semiconductor substrates, aims to manufacture photoetching patterns on two sides of the substrate and realize mapping alignment exposure, is limited by the focusing positioning range of the existing exposure machine, cannot accurately overlay the patterns on the front side when back exposure is carried out, and influences the production efficiency of the substrate.
Therefore, a new substrate preparation method and a display panel are needed.
Disclosure of Invention
The embodiment of the invention provides a substrate preparation method and a display panel, wherein the difference between the thickness of a fixed plate and the thickness of a substrate to be processed is smaller than or equal to a preset value, so that the elevation height of the fixed plate to a counterpoint mark part can ensure that exposure can be focused and positioned, the process is simple and easy to operate, and the production efficiency of the substrate is effectively improved.
In one aspect, the embodiment of the invention provides a method for preparing a substrate, which comprises the following steps: providing a substrate to be processed, wherein the substrate to be processed is provided with a first surface and a second surface which are opposite, and the first surface is provided with an alignment mark part; turning over the substrate to be processed so as to enable the first surface and the second surface to exchange positions; coating photoresist on the second surface of the substrate to be processed; fixing the substrate to be processed on a fixing plate, wherein the first surface and the fixing plate are arranged oppositely, and the difference value between the thicknesses of the fixing plate and the substrate to be processed is smaller than or equal to a preset value; and aligning the exposure part with the alignment mark part, and exposing the second surface of the substrate to be processed through the exposure part.
According to one aspect of the present invention, between the steps of providing a substrate to be processed and flipping the substrate to be processed, further comprising: and coating photoresist on one side of the alignment mark part, which is away from the substrate to be processed, and the part of the first surface, which is not covered by the alignment mark part.
According to an aspect of the present invention, in the step of fixing the substrate to be processed to a fixing plate, it includes: the fixing plate is provided with a containing groove for containing the alignment mark part, and the depth of the containing groove is greater than or equal to the height of the alignment mark part.
According to an aspect of the present invention, in the step of fixing the substrate to be processed to a fixing plate, it includes: the fixing plate is provided with at least one limiting piece so as to limit the movement of the substrate to be processed through the limiting piece.
According to one aspect of the invention, the number of the limiting pieces is greater than or equal to two, and each limiting piece is symmetrically distributed about the center of the accommodating groove.
According to an aspect of the present invention, in the step of fixing the substrate to be processed to a fixing plate: the thickness of the fixing plate is equal to that of the substrate to be processed.
According to an aspect of the present invention, in the step of fixing the substrate to be processed to a fixing plate: the preset value is 10-20 mu m.
According to an aspect of the present invention, in the step of fixing the substrate to be processed to a fixing plate, it includes: the fixed plate is a transparent plate body; preferably, the transparent plate body is transparent glass or transparent polyimide.
According to one aspect of the present invention, in the step of providing a substrate to be processed, it includes: and patterning the first surface of the substrate to be processed to form a first pattern layer, wherein the first pattern layer comprises the alignment mark part.
Another aspect of an embodiment of the present invention provides a display panel, including: the substrate prepared using the substrate preparation method in any of the above embodiments.
Compared with the prior art, the substrate preparation method provided by the embodiment of the invention needs to expose the first surface and the second surface of the substrate respectively, namely double-sided exposure, and because the positioning focusing range of the exposure part is limited, the exposure part can only focus and position the plane of the first surface before the substrate to be processed is turned over or the plane of the difference value between the plane of the first surface and the plane of the first surface is smaller than or equal to a preset value. Therefore, when the substrate to be processed is turned over and the first surface and the second surface are interchanged to expose the second surface, the plane of the alignment mark part is required to be fixedly lifted by the fixing plate, so that the alignment mark part can be focused and positioned by the exposure part. Specifically, because the second surface and the first surface where the alignment mark part is located are different by the thickness of the substrate to be processed, the difference between the thickness of the fixing plate and the thickness of the substrate to be processed is smaller than or equal to a preset value, so that the elevation of the fixing plate to the alignment mark part can enable exposure to be focused and positioned, the process is simple and easy to operate, and the production efficiency of the substrate is effectively improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments of the present invention will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort to a person of ordinary skill in the art.
FIG. 1 is a flow chart of a method for preparing a substrate according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a substrate manufacturing process according to an embodiment of the present invention;
FIG. 3 is a schematic view of a substrate manufacturing process according to another embodiment of the present invention;
FIG. 4 is a schematic view of a substrate manufacturing process according to another embodiment of the present invention;
FIG. 5 is a schematic view of a substrate manufacturing process according to another embodiment of the present invention;
fig. 6 is a top view of a fixing plate provided in an embodiment of the present invention.
In the accompanying drawings:
1-a substrate to be processed; 2-alignment mark parts; 3-photoresist; 4-a fixing plate; 5-limiting pieces; k-holding groove; p1-a first surface; p2-second surface.
Detailed Description
Features and exemplary embodiments of various aspects of the present invention will be described in detail below, and in order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings and the detailed embodiments. It should be understood that the specific embodiments described herein are merely configured to illustrate the invention and are not configured to limit the invention. It will be apparent to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the invention by showing examples of the invention.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other like elements in a process, method, article or apparatus that comprises the element.
It will be understood that when a layer, an area, or a structure is described as being "on" or "over" another layer, another area, it can be referred to as being directly on the other layer, another area, or another layer or area can be included between the layer and the other layer, another area. And if the component is turned over, that layer, one region, will be "under" or "beneath" the other layer, another region.
It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Accordingly, it is intended that the present invention covers the modifications and variations of this invention provided they come within the scope of the appended claims (the claims) and their equivalents. The embodiments provided by the embodiments of the present invention may be combined with each other without contradiction.
Embodiments of the present invention provide a substrate manufacturing method and a display panel, and embodiments of the substrate manufacturing method and the display panel will be described below with reference to fig. 1 to 6 of the accompanying drawings.
Referring to fig. 1 to 5, a substrate preparation method according to an embodiment of the present invention includes:
s110: providing a substrate to be processed 1, wherein the substrate to be processed 1 is provided with a first surface P1 and a second surface P2 which are opposite, and the first surface P1 is provided with an alignment mark part 2 as shown in FIG. 2;
s120: the substrate 1 to be processed is turned over so that the first surface P1 and the second surface P2 are interchanged,
as shown in fig. 3;
s130: coating a photoresist 3 on the second surface P2 of the substrate 1 to be processed, as shown in fig. 4;
s140: fixing the substrate 1 to be processed on the fixing plate 4, wherein the first surface P1 and the fixing plate 4 are oppositely arranged, and the difference between the thicknesses of the fixing plate 4 and the substrate 1 to be processed is smaller than or equal to a preset value, as shown in FIG. 5;
s150: the exposure portion and the alignment mark portion 2 are aligned, and the second surface P2 of the substrate 1 to be processed is exposed by the exposure portion.
According to the substrate preparation method provided by the embodiment of the invention, the first surface P1 and the second surface P2 of the substrate are required to be respectively exposed, namely double-sided exposure, and the positioning focusing range of the exposure part is limited, so that the exposure part can only focus and position the plane of the first surface P1 before the substrate 1 to be processed is turned over or the plane where the difference value between the plane and the plane of the first surface P1 is smaller than or equal to a preset value. Therefore, when the substrate 1 to be processed is turned over and the first surface P1 and the second surface P2 are interchanged to expose the second surface P2, the plane on which the alignment mark 2 is located needs to be fixed and lifted by the fixing plate 4 so that the alignment mark 2 can be focused and positioned by the exposure part. Specifically, since the second surface P2 where the alignment mark portion 2 is located and the first surface P1 differ by a thickness of the substrate 1 to be processed, the difference between the thickness of the fixing plate 4 and the thickness of the substrate 1 to be processed is smaller than or equal to a preset value, so that the elevation height of the fixing plate 4 relative to the alignment mark portion 2 can be ensured to enable focusing and positioning, overlay exposure is realized, the process is simple and easy to operate, and the production efficiency of the substrate is effectively improved.
In step S110, the substrate 1 to be processed may be a hard substrate such as a glass substrate; the flexible substrate can also be made of polyimide, polystyrene, polyethylene terephthalate, parylene, polyethersulfone or polyethylene naphthalate. The substrate 1 to be processed may further include a conductive layer, and devices such as wirings, thin film transistors, and the like may be formed by means of exposure etching or the like.
In step S120, in order to facilitate the subsequent processes of gluing, exposing, developing, etching, etc. on the second surface P2 of the substrate 1 to be processed, the substrate 1 to be processed needs to be turned over so that the second surface P2 faces upward.
In step S130, a photoresist 3 is coated on the second surface P2 of the substrate 1 to be processed, and the photoresist 3 is also called photoresist, and refers to a resist etching film material whose solubility is changed by irradiation or radiation of ultraviolet light, electron beam, ion beam, X-ray, etc. A light-sensitive mixed liquid composed of 3 main components of photosensitive resin, sensitizer and solvent. When a semiconductor material is surface-processed, a desired image can be obtained on the surface by using a photoresist 3 having a proper selectivity. The photoresist 3 is classified into two main categories, positive and negative, according to the image it forms. During the photoresist 3 process, after the coating is exposed and developed, the exposed portions are dissolved and the unexposed portions remain, the coating material being positive photoresist 3. If the exposed portions remain and the unexposed portions are dissolved, the coating material is a negative photoresist 3.
In this step, the photoresist 3 coated on the second surface P2 of the substrate 1 to be processed may employ either one of the positive photoresist 3 or the negative photoresist 3, and is not particularly limited.
In step S140, the substrate 1 to be processed is fixed on the fixing plate 4, and the height of the alignment mark portion 2 on the first surface P1 is raised by the thickness of the fixing plate 4, so as to facilitate the focus alignment of the subsequent exposure portion.
In step S150, the exposure portion performs focus alignment on the alignment mark portion 2 first to determine the position of the entire substrate 1 to be processed, then exposes the second surface P2 of the substrate 1 to be processed coated with the photoresist 3 with the exposure portion, and then forms a desired pattern by development and etching, and the exposure portion can perform alignment with a CCD (charge coupled device ) camera.
In order to protect the alignment mark 2 and the first surface P1 of the substrate 1 to be processed, in some alternative embodiments, between the steps of providing the substrate 1 to be processed and flipping the substrate 1 to be processed, further comprises: a photoresist 3 is coated on a side of the alignment mark 2 facing away from the substrate 1 to be processed and a portion of the first surface P1 not covered by the alignment mark 2.
The alignment mark part 2 and the part of the first surface P1, which is not covered by the alignment mark part 2, are shielded and protected by coating the photoresist 3, so that the patterns of the alignment mark part 2 and the first surface P1 are prevented from being damaged after the substrate 1 to be processed is turned over.
In some alternative embodiments, in the step of fixing the substrate 1 to be processed to the fixing plate 4, it includes: the fixing plate 4 is formed with a receiving groove K for receiving the alignment mark portion 2, and the depth of the receiving groove K is greater than or equal to the height of the alignment mark portion 2.
It should be noted that, since the first surface P1 of the substrate 1 to be processed has been subjected to patterning processes such as exposure and etching, and the patterned alignment mark portion 2 is formed on the first surface P1, in order to avoid interference between the alignment mark portion 2 and the fixing plate 4, for example, and damage to the alignment mark portion 2, the pattern on the first surface P1 of the substrate 1 to be processed may be protected by forming the accommodating groove K for accommodating the alignment mark portion 2 on the fixing plate 4, and making the depth of the accommodating groove K greater than or equal to the height of the alignment mark portion 2 after fixing the substrate 1 to be processed on the fixing plate 4. Alternatively, the shape of the accommodating groove K may be a circular shape, a rectangular shape, or the like, and the shape and size of the accommodating groove K may be specifically selected according to the pattern of the substrate 1 to be processed and the first surface P1 thereof. Alternatively, the depth of the accommodating groove K is 2. Mu.m.
In some alternative embodiments, in the step of fixing the substrate 1 to be processed to the fixing plate 4, it includes: the orthographic projection of the fixing plate 4 on the substrate 1 to be processed is one of a circle and a polygon. The size of the fixing plate 4 may be slightly larger than the size of the substrate 1 to be processed, so that the accommodating groove K of the fixing plate 4 protects the pattern, such as the alignment mark 2, on the first surface P1, and the shape and size of the fixing plate 4 may be specifically selected according to the substrate 1 to be processed.
Referring to fig. 6, in order to avoid the substrate 1 to be processed from moving during the steps of alignment or exposure, and affecting the alignment accuracy or exposure effect, in some alternative embodiments, the step of fixing the substrate 1 to be processed to the fixing plate 4 includes: the fixing plate 4 is formed with at least one stopper 5 to restrict the movement of the substrate 1 to be processed by the stopper 5.
It can be appreciated that the limiting piece 5 can specifically adopt structural forms such as a limiting column and a baffle plate to fix the substrate 1 to be processed, so as to effectively limit the movement of the substrate 1 to be processed, and the limiting piece 5 can specifically be arranged at the edge part of the fixing plate 4, which is close to the accommodating groove K, so as to fix the substrate 1 to be processed.
In order to further increase the stability of the fixing of the substrate 1 to be processed, in some alternative embodiments, the number of the stoppers 5 is greater than or equal to two, and each stopper 5 is symmetrically distributed about the center of the receiving groove K.
In this embodiment, the limiting members 5 are symmetrically distributed about the center of the accommodating groove K, so that the acting forces of the limiting members 5 on the substrate 1 to be processed are uniformly distributed, and the movement of the substrate 1 to be processed in different directions can be effectively prevented. Optionally, four limiting pieces 5 are symmetrically arranged on the fixing plate 4, and stable fixing of the substrate 1 to be processed is achieved through the plurality of limiting pieces 5.
In order to achieve accurate alignment of the exposure portion with respect to the alignment mark portion 2 of the substrate 1 to be processed, in some alternative embodiments, in the step of fixing the substrate 1 to be processed to the fixing plate 4: the thickness of the fixing plate 4 is equal to that of the substrate 1 to be processed.
It should be noted that, if the influence of the alignment error and other factors is not considered, the plane where the exposure part can focus and align and the plane where the first surface P1 is located before the substrate 1 to be processed is turned are in the same horizontal plane, and when the substrate 1 to be processed is turned, the position of the alignment mark part 2 is lower than the plane where the exposure part can focus and align, and the height difference between the two is the thickness of the substrate 1 to be processed. Therefore, in the embodiment of the invention, the fixing plate 4 is additionally arranged, and the thicknesses of the fixing plate 4 and the substrate 1 to be processed are equal, so that the alignment mark part 2 is lifted and the plane of the exposure part which can be aligned in a focusing way is positioned on the same horizontal plane, the alignment of the exposure part to the alignment mark part 2 is realized, and the subsequent exposure process is convenient to realize. Alternatively, the thickness of the fixing plate 4 and the substrate 1 to be processed are both 0.5mm.
In some alternative embodiments, in consideration of the influence of the alignment error, the processing error, and the like, in the step of fixing the substrate 1 to be processed to the fixing plate 4: the preset value is 10-20 mu m.
Specifically, the thicknesses of the fixing plate 4 and the substrate 1 to be processed are not necessarily equal as long as they are within the tolerance range, that is, the difference between the thicknesses of the fixing plate 4 and the substrate 1 to be processed is less than or equal to 10 μm to 20 μm.
In order to facilitate alignment and avoid affecting the exposure effect of the substrate 1 to be processed, in some alternative embodiments, in the step of fixing the substrate 1 to be processed to the fixing plate 4, it includes: the fixing plate 4 is a transparent plate body.
Alternatively, the transparent plate body is transparent glass or transparent polyimide, and in order to reduce the production cost, the fixing plate 4 may be formed by the same material process as the substrate 1 to be processed.
In some alternative embodiments, in the step of providing the substrate 1 to be processed, it comprises: the first surface P1 of the substrate 1 to be processed is patterned to form a first pattern layer including the alignment mark portion 2.
It should be noted that the patterning process specifically includes steps of coating the photoresist 3, exposing, developing, etching, and the like to form a first pattern layer, and the first pattern layer may include other portions that need to be formed on the substrate, such as a thin film transistor, a trace, and the like, except for the alignment mark portion 2.
The embodiment of the invention also provides a display panel, which comprises: the substrate prepared using the substrate preparation method in any of the above embodiments.
The display panel provided in the embodiment of the present invention has the technical effects of the technical solution of the substrate in any of the above embodiments, and the explanation of the same or corresponding structure and terms as those of the above embodiments is not repeated herein. The display panel provided by the embodiment of the invention can be applied to a mobile phone and can also be any electronic product with a display function, including but not limited to the following categories: television, notebook computer, desktop display, tablet computer, digital camera, smart bracelet, smart glasses, vehicle-mounted display, medical equipment, industrial control equipment, touch interactive terminal, etc., which are not particularly limited in this embodiment of the invention.
In the foregoing, only the specific embodiments of the present invention are described, and it will be clearly understood by those skilled in the art that, for convenience and brevity of description, the specific working processes of the systems, modules and units described above may refer to the corresponding processes in the foregoing method embodiments, which are not repeated herein. It should be understood that the scope of the present invention is not limited thereto, and any equivalent modifications or substitutions can be easily made by those skilled in the art within the technical scope of the present invention, and they should be included in the scope of the present invention.
It should also be noted that the exemplary embodiments mentioned in this disclosure describe some methods or systems based on a series of steps or devices. However, the present invention is not limited to the order of the above-described steps, that is, the steps may be performed in the order mentioned in the embodiments, or may be performed in a different order from the order in the embodiments, or several steps may be performed simultaneously.
Claims (10)
1. A method of manufacturing a substrate, comprising:
providing a substrate to be processed, wherein the substrate to be processed is provided with a first surface and a second surface which are opposite, and the first surface is provided with an alignment mark part;
turning over the substrate to be processed so as to enable the first surface and the second surface to exchange positions;
coating photoresist on the second surface of the substrate to be processed;
fixing the substrate to be processed on a fixing plate, wherein the first surface and the fixing plate are arranged oppositely, and the difference value between the thicknesses of the fixing plate and the substrate to be processed is smaller than or equal to a preset value;
and aligning the exposure part with the alignment mark part, and exposing the second surface of the substrate to be processed through the exposure part.
2. The substrate preparation method according to claim 1, further comprising, between the steps of providing a substrate to be processed and inverting the substrate to be processed:
and coating photoresist on one side of the alignment mark part, which is away from the substrate to be processed, and the part of the first surface, which is not covered by the alignment mark part.
3. The substrate preparation method according to claim 1, wherein in the step of fixing the substrate to be processed to a fixing plate, comprising:
the fixing plate is provided with a containing groove for containing the alignment mark part, and the depth of the containing groove is greater than or equal to the height of the alignment mark part.
4. A substrate preparation method according to claim 3, wherein in the step of fixing the substrate to be processed to a fixing plate, it comprises:
the fixing plate is provided with at least one limiting piece so as to limit the movement of the substrate to be processed through the limiting piece.
5. The method according to claim 4, wherein the number of the stoppers is two or more, and each of the stoppers is symmetrically distributed about the center of the receiving groove.
6. The substrate preparation method according to claim 1, wherein in the step of fixing the substrate to be processed to a fixing plate:
the thickness of the fixing plate is equal to that of the substrate to be processed.
7. The substrate preparation method according to claim 1, wherein in the step of fixing the substrate to be processed to a fixing plate:
the preset value is 10-20 mu m.
8. The substrate preparation method according to claim 1, wherein in the step of fixing the substrate to be processed to a fixing plate, comprising:
the fixed plate is a transparent plate body;
preferably, the transparent plate body is transparent glass or transparent polyimide.
9. The substrate preparation method according to claim 1, wherein in the step of providing a substrate to be processed, comprising:
and patterning the first surface of the substrate to be processed to form a first pattern layer, wherein the first pattern layer comprises the alignment mark part.
10. A display panel, comprising: a substrate produced by the substrate production method according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210084370.2A CN116520643A (en) | 2022-01-24 | 2022-01-24 | Substrate preparation method and display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210084370.2A CN116520643A (en) | 2022-01-24 | 2022-01-24 | Substrate preparation method and display panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116520643A true CN116520643A (en) | 2023-08-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210084370.2A Pending CN116520643A (en) | 2022-01-24 | 2022-01-24 | Substrate preparation method and display panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116520643A (en) |
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2022
- 2022-01-24 CN CN202210084370.2A patent/CN116520643A/en active Pending
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