JP2636350B2 - Transparent insulating substrate and method of transporting the same - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transparent insulating substrate (abbreviated as a substrate) used for a liquid crystal display device, and a method of transporting the same.

[Summary of the Invention] In a substrate used in a liquid crystal display device, by inserting a projection of a handle having projections corresponding to a plurality of holes provided on an outer peripheral portion of the substrate into the hole of the substrate,
The substrate can be transported.

[Related Art] Liquid crystal display devices include an active matrix system using a thin film transistor formed on one substrate and a simple matrix system using a substrate provided with a transparent conductive film pattern. In manufacturing such a liquid crystal display device, it is necessary to repeatedly perform steps such as thin film formation or patterning. In particular, in the manufacture of a thin film transistor used in an active matrix method, heat treatment such as formation of a semiconductor thin film serving as an active element and formation of an oxide film serving as a gate insulating film is often used.

The heat treatment method in this case is performed by setting the substrate 12 on the substrate holding device 11 as shown in FIG. 2A and inserting the substrate 12 into a heat treatment furnace.

The substrate is transported by sandwiching the substrate 12 with tweezers 13 as shown in FIG. 2 (b).

[Problems to be Solved by the Invention] In the above-mentioned conventional technology, since the substrate is held only under the substrate, the substrate 12 tilts and comes into contact with an adjacent substrate, which adversely affects diffusion and oxidation.

Further, for example, when a glass substrate is used as a substrate, a large warp is generated in the substrate if processing is performed in a state close to the softening point of the glass substrate. In this case as well, the cause is the holding only under the substrate.

In recent years, liquid crystal display devices have tended to have large display sizes, and accordingly, the substrates used have been forced to have large diameters. For this reason, the transfer of the substrate is not easy, and there is a problem in terms of drop prevention and contamination prevention.

The present invention is intended to solve such a problem, and an object thereof is to surely hold a large-diameter substrate, eliminate warpage of the substrate, and facilitate the transfer of the substrate. It is an object of the present invention to provide a substrate and a method of transporting the substrate.

[Means for Solving the Problems] The transparent insulating substrate of the present invention is a transparent insulating substrate used in a liquid crystal display device, wherein a plurality of the transparent insulating substrates are suspended around an outer peripheral portion of the transparent insulating substrate. Holes are formed.

In the method for transporting a transparent insulating substrate according to the present invention, in the method for transporting a transparent insulating substrate used in a liquid crystal display device, a protrusion provided on a handle of the substrate holding device is inserted into a hook hole formed in an outer peripheral portion of the transparent insulating substrate. In this case, the transparent insulating substrate is held by the substrate holding device, and the transparent insulating substrate is transported. Further, the transport is
It is characterized in that it is used in a step of heat-treating the transparent insulating substrate.

Further, the transparent insulating substrate of the present invention is a transparent insulating substrate used for a liquid crystal display device, wherein an outer peripheral portion of the transparent insulating substrate is provided with a substrate for holding the transparent insulating substrate when transporting the transparent insulating substrate. A hole for insertion into a projection provided on a handle of the holding device is formed. Further, a plurality of the holes are provided.

[Examples] Hereinafter, the present invention will be described in detail based on examples.

1 (a) to 1 (c) are views showing an embodiment of the present invention.

By inserting the protrusion of the handle 4 having the protrusion 3 corresponding to the hole 2 of the substrate 1 provided with a plurality of holes in the outer peripheral portion into the hole of the substrate 1, the substrate 1 can be securely held.

In this case, the number of holes in the substrate can be equal to or greater than the number of protrusions of the handle. In particular, when the substrate is set on a jig such as the substrate holding device 5, holes provided for holding the substrate are provided so as to correspond to the projections of the substrate holding device, so that the substrate mounted on the handle 4 can be mounted on the substrate 4. It can be easily installed on the holding device.

By providing a plurality of protrusions 3 of the handle 4, the substrate 1 can be reliably held by the handle 4. Although it is necessary to consider the center of gravity, by installing multiple
There is much room, and there is no need to consider the positional accuracy of the protrusions.

Next, regarding the drilling of the substrate, the drilling of the insulating substrate can usually be easily performed by ultrasonic processing.
Processing by laser processing can also be performed.

Usually, a substrate on which a pattern is formed is provided with an orientation flat, and the orientation of the substrate or the positional accuracy between the substrate and the pattern is determined. In the substrate according to the present invention, holes formed in the substrate can be used as substitutes for the orientation flat. .

[Effects of the Invention] As described above, according to the present invention, by using the holes in the substrate, it is possible to easily carry the substrate, prevent the substrate from falling,
It is possible to prevent contamination by holding with tweezers. or,
By using a substrate holding device with projections corresponding to the holes drilled in the substrate, the substrate can be suspended vertically, and the substrate is held securely, preventing warpage of the substrate and preventing quality deterioration due to contact between substrates It is possible.

Furthermore, in recent liquid crystal display devices, the display size tends to be large, and automation of substrate transport is also an urgent need. However, by using the substrate of the present invention and using the transport method, it can be easily dealt with. can do.

Also, when a hole drilled in a substrate is used as an orientation flat, an image recognition method can be used, and positioning can be performed with high accuracy, as compared with a pin guide method that normally uses the end face of the orientation flat. .

BRIEF DESCRIPTION OF THE DRAWINGS FIGS. 1 (a) to 1 (c) are views of an embodiment according to the present invention. 2 (a) to 2 (c) are diagrams of a conventional example. 5, 11 ... board holding device 1, 12 ... board 3 ... projection 4 ... handle 2 ... board hole 13 ... tweezers

Claims (5)

(57) [Claims] 1. A transparent insulating substrate used in a liquid crystal display device, wherein a plurality of holes for suspending and holding the transparent insulating substrate are formed in an outer peripheral portion of the transparent insulating substrate. Insulating substrate. 2. A method for transporting a transparent insulating substrate used in a liquid crystal display device, comprising: inserting a projection provided on a handle of a substrate holding device into a hook hole formed in an outer peripheral portion of the transparent insulating substrate; Holding a substrate in the substrate holding device,
A method for transporting a transparent insulating substrate, comprising transporting the transparent insulating substrate. 3. The method for transporting a transparent insulating substrate according to claim 2, wherein the transporting is used in a step of heat-treating the transparent insulating substrate. 4. A transparent insulating substrate used in a liquid crystal display device, wherein an outer peripheral portion of the transparent insulating substrate is provided with a handle of a substrate holding device for holding the transparent insulating substrate when transporting the transparent insulating substrate. A transparent insulating substrate, wherein a hole for insertion into the provided projection is formed. 5. The transparent insulating substrate according to claim 4, wherein said plurality of holes are provided.