JP2634483B2 - Antibacterial and antifungal wiping ointment and wiping method for optical equipment - Google Patents
Antibacterial and antifungal wiping ointment and wiping method for optical equipmentInfo
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- JP2634483B2 JP2634483B2 JP2160282A JP16028290A JP2634483B2 JP 2634483 B2 JP2634483 B2 JP 2634483B2 JP 2160282 A JP2160282 A JP 2160282A JP 16028290 A JP16028290 A JP 16028290A JP 2634483 B2 JP2634483 B2 JP 2634483B2
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Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、光学機器に使用する防菌防黴清拭軟膏に関
する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an antibacterial and antifungal wiping ointment used for optical instruments.
光学機器は、まれに微生物による不具合が起きる。即
ち、光学素子上に糸状菌（一般にレンズかびと呼ばれ
る）が発生して、光学系の品位を著しく低下させる。こ
のレンズかびは、光学機器の保管環境等に大きく影響を
受けるため、根絶が難しく、また光学機器を分解して手
入れしなければならないために、製造者側のメンテナン
スが重要となる場合が多い。Occasionally, optical equipment suffers from microbial failure. That is, filamentous fungi (generally called lens mold) are generated on the optical element, and the quality of the optical system is significantly reduced. Since the lens mold is greatly affected by the storage environment of the optical device, it is difficult to eradicate the lens device, and the optical device must be disassembled and maintained, so that maintenance by the manufacturer is often important.
従来、実際に分解修理を行う場合には、有機溶剤で清
拭することが多い。また、菌の繁殖が顕著な場合には、
プラスチックによって汚れとかびを剥ぎ取ることが行わ
れていた。Conventionally, when actually performing disassembly and repair, wiping with an organic solvent is often performed. Also, if the growth of bacteria is remarkable,
It was used to remove dirt and mold from plastic.
ところが、従来の有機溶剤やプラスチックによる清拭
では、レンズかびの再発に関しての考慮が欠けていた。However, in the conventional wiping with an organic solvent or plastic, consideration for recurrence of lens mold has been lacking.
本発明は、かかる従来の問題点に鑑みてなされたもの
で、レンズかびの再発を防止することができる防菌防黴
清拭軟膏および光学機器の清拭方法を提供することを目
的とする。The present invention has been made in view of such conventional problems, and an object of the present invention is to provide a germicidal and antifungal wiping ointment capable of preventing the recurrence of lens mold and a method of wiping optical equipment.
上記目的を達成するために、本発明は、光学機器を清
拭する清拭軟膏であって、クリーム状軟膏原料と、２−
（４−チアゾリル）ベンズイミダゾール0.01〜５重量
％,10,10′−オキシビスフェノキシアルシン10〜100PP
M,α−ブロムシンナムアルデヒド0.01〜５重量％,O−フ
ェニルフェノール５〜30重量％，レゾルシノール１〜20
重量％，β−ツヤプリシン0.01〜５重量％,3,3,4′−ト
リクロロカルバニリド0.1〜５重量％，塩化デカリニウ
ム0.01〜５重量％，ジョードメチル−ｐ−トリスルホン
0.01〜５重量％，塩化メチルロザリニン0.1〜10重量
％，テトラメチルイソフタロニトリル0.5重量％，ジク
ロフェン0.01〜５重量％,p−オキシ安息香酸エステル0.
01〜５重量％，サリチル酸0.1〜20重量％，サリチル酸
塩0.1〜20重量％,2−｛3,5−ジメチルピラゾリル｝−４
−ヒドロキシ−６−フェニルピリミジン0.1〜５重量
％，安息香酸0.05〜20重量％，安息香酸ナトリウム0.05
〜20重量％，安息香酸アルミニウム0.05〜20重量％，デ
ヒドロ酢酸0.01〜５重量％，デヒドロ酢酸ナトリウム0.
01〜５重量％，マンデル酸ヘキサミン0.01〜５重量％、
ホウ酸0.1〜10重量％，ホウ酸ナトリウム0.1〜10重量
％,3−ヨード−２−プロピニルブチルカーバメート0.01
〜５重量％，ウンデシレン酸0.1〜20重量％，ソルビン
酸0.1〜20重量％またはソルビン酸カリウム0.1〜20重量
％の中から選んだ防菌防黴剤とから防菌防黴清拭軟膏を
構成した。In order to achieve the above object, the present invention relates to a wiping ointment for wiping optical equipment, comprising a creamy ointment raw material,
(4-thiazolyl) benzimidazole 0.01-5% by weight, 10,10'-oxybisphenoxyarsine 10-100 PP
M, α-bromocinnamaldehyde 0.01-5% by weight, O-phenylphenol 5-30% by weight, resorcinol 1-20
% By weight, 0.01 to 5% by weight of β-thyaprisin, 0.1 to 5% by weight of 3,3,4'-trichlorocarbanilide, 0.01 to 5% by weight of decalinium chloride, and jodomethyl-p-trisulfone
0.01 to 5% by weight, methyl rosalinine chloride 0.1 to 10% by weight, tetramethyl isophthalonitrile 0.5% by weight, diclofen 0.01 to 5% by weight, p-oxybenzoic acid ester 0.
01-5% by weight, salicylic acid 0.1-20% by weight, salicylate 0.1-20% by weight, 2- {3,5-dimethylpyrazolyl} -4
-Hydroxy-6-phenylpyrimidine 0.1-5% by weight, benzoic acid 0.05-20% by weight, sodium benzoate 0.05
-20% by weight, aluminum benzoate 0.05-20% by weight, dehydroacetic acid 0.01-5% by weight, sodium dehydroacetate 0.
01-5% by weight, hexamine mandelate 0.01-5% by weight,
0.1-10% by weight of boric acid, 0.1-10% by weight of sodium borate, 3-iodo-2-propynylbutylcarbamate 0.01
The antibacterial and fungicide wiping ointment is composed of an antibacterial and fungicide selected from the group consisting of 1 to 5% by weight, 0.1 to 20% by weight of undecylenic acid, 0.1 to 20% by weight of sorbic acid or 0.1 to 20% by weight of potassium sorbate. did.
前記クリーム状軟膏原料は、油脂性軟膏，水を含まな
い乳剤性基剤からなる乳剤性軟膏または水溶性軟膏が適
している。The creamy ointment raw material is suitably an oily ointment, an emulsion ointment comprising a water-free emulsion base or a water-soluble ointment.
また、前記クリーム状軟膏原料は、乳剤性基剤と水溶
性基剤とからなる軟膏を用いてもよい。In addition, as the creamy ointment raw material, an ointment composed of an emulsion base and a water-soluble base may be used.
本発明の防菌防黴清拭軟膏に、着色剤を添加してもよ
い。A colorant may be added to the antibacterial and antifungal wiping ointment of the present invention.
さらに、上記目的を達成するために、本発明の光学機
器の清拭方法は、クリーム状軟膏原料と、２−（４−チ
アゾリル）ベンズイミダゾール0.01〜５重量％、10,1
0′−オキシビスフェノキシアルシン10〜100PPM、α−
ブロムシンナムアルデヒド0.01〜５重量％、ｏ−フェニ
ルフェノール５〜30重量％、レゾルシノール１〜20重量
％、β−ツヤプリシン0.01〜５重量％、3,3,4′−トリ
クロロカルバニリド0.1〜５重量％、塩化デカリニウム
0.01〜５重量％、ジョードメチル−ｐ−トリスルホン0.
01〜５重量％、塩化メチルロザリニン0.1〜10重量％、
テトラメチルイソフタロニトリル0.1〜５重量％、ジク
ロルフェン0.01〜５重量％、ｐ−オキシ安息香酸エチル
0.01〜５重量％、サリチル酸0.1〜20重量％、サリチル
酸塩0.1〜20重量％、２−｛3,5−ジメチルピラゾリル｝
−４−ヒドロキシ−６−フェニルピリミジン0.1〜５重
量％、安息香酸0.05〜20重量％、安息香酸ナトリウム0.
05〜20重量％、安息香酸アルミニウム0.05〜20重量％、
デヒドロ酢酸0.01〜５重量％、デヒドロ酢酸ナトリウム
0.01〜５重量％、マンデル酸ヘキサミン0.01〜５重量
％、ホウ酸0.1〜10重量％、ホウ酸ナトリウム0.1〜10重
量％、３−ヨード−２−プロピニルブチルカーバメート
0.01〜５重量％、ウンデシレン酸0.1〜20重量％、ソル
ビン酸0.1〜20重量％またはソルビン酸カリウム0.1〜20
重量％の中から選んだ防菌防黴剤とからなる防菌防黴清
拭軟膏により光学機器を清拭する。Furthermore, in order to achieve the above object, a method for wiping an optical instrument according to the present invention comprises a creamy ointment raw material, 0.01 to 5% by weight of 2- (4-thiazolyl) benzimidazole,
0'-oxybisphenoxyarsine 10-100 PPM, α-
Bromcinnamaldehyde 0.01-5% by weight, o-phenylphenol 5-30% by weight, resorcinol 1-20% by weight, β-thyaprisin 0.01-5% by weight, 3,3,4'-trichlorocarbanilide 0.1-5% by weight %, Decalinium chloride
0.01-5% by weight, Jodomethyl-p-trisulfone 0.
01-5% by weight, methylrosalinine chloride 0.1-10% by weight,
Tetramethylisophthalonitrile 0.1-5% by weight, dichlorphene 0.01-5% by weight, ethyl p-oxybenzoate
0.01-5% by weight, salicylic acid 0.1-20% by weight, salicylate 0.1-20% by weight, 2- {3,5-dimethylpyrazolyl}
-4-hydroxy-6-phenylpyrimidine 0.1-5% by weight, benzoic acid 0.05-20% by weight, sodium benzoate 0.1%
05-20% by weight, aluminum benzoate 0.05-20% by weight,
0.01-5% by weight of dehydroacetic acid, sodium dehydroacetate
0.01-5 wt%, hexamine mandelate 0.01-5 wt%, boric acid 0.1-10 wt%, sodium borate 0.1-10 wt%, 3-iodo-2-propynylbutylcarbamate
0.01-5% by weight, undecylenic acid 0.1-20% by weight, sorbic acid 0.1-20% by weight or potassium sorbate 0.1-20%
The optical device is wiped with a germicidal and fungicide wiping ointment comprising a germicidal and fungicide selected from the weight%.
添加する防菌防黴剤の量を上記各範囲としたのは、上
記各範囲より少ないと、所定の防菌防黴効果が得られ
ず、また上記各範囲より多いと、作業上の安全性確保が
困難になる。When the amount of the antibacterial and fungicide to be added is set to each of the above ranges, if the amount is less than the above range, a predetermined antibacterial and fungicidal effect cannot be obtained. It becomes difficult to secure.
本発明は、光学素子周辺部に起きる清拭軟膏の拭き残
りに着目し、これをレンズかび再発防止に役立てようと
するものである。すなわち、清拭軟膏に所定量の防かび
剤を添加して清拭軟膏を防菌防黴剤として活用し、周辺
部の拭き残りが防菌防黴剤としての効果を生じるように
する。The present invention focuses on the remaining wiping of the wiping ointment that occurs around the optical element, and uses the wiping ointment to prevent lens mold recurrence. That is, a predetermined amount of a fungicide is added to the wiping ointment, and the wiping ointment is used as a bactericidal and fungicide so that the remaining wiping in the peripheral portion has an effect as a bactericidal and fungicide.
（第１実施例） 軟膏原料としてのラノリンに、防菌防黴剤（薬剤）と
して２−（４−チアゾリル）ベンズイミダゾールを0.5
重量％投入し、よく撹拌して均質にし、防菌防黴清拭軟
膏を作製した。(First Example) 0.5% of 2- (4-thiazolyl) benzimidazole was added to lanolin as a raw material for ointment and bactericide and fungicide (drug) to lanolin as an ointment raw material.
% By weight, stirred well, and homogenized to prepare a germicidal and antifungal wiping ointment.
上記本実施例の軟膏を使って、ガラス板を清拭した。
そして、薬剤未投入の軟膏で清拭したガラス板と比較培
養を実施して効果を確認した。培養には、実際にレンズ
かびの発生した部材を使用した。Using the ointment of this example, the glass plate was wiped.
Then, comparative cultivation was performed with a glass plate that had been wiped with an ointment containing no drug, and the effect was confirmed. For the culture, a member actually having lens mold was used.
・培養条件:30℃85％RH−３ヵ月 ・培養結果 表１から判るように、薬剤添加、無添加での差は明確
であり、本実施例ではレンズかびの再発防止効果が顕著
であった。・ Culture conditions: 30 ℃ 85% RH-3 months ・ Culture results As can be seen from Table 1, the difference between the addition and the non-addition of the drug was clear, and in this example, the effect of preventing the recurrence of lens mold was remarkable.
（第２実施例） 軟膏原料としての白色ワセリンに、薬剤として10,1
0′−オキシビスフェノキシアルシンを50PPM投入し、良
く攪拌して均質にして、防菌防黴清拭軟膏を作製した。(Second Example) White vaseline as an ointment raw material and 10,1 as a drug
0′-Oxybisphenoxyarsine was charged at 50 PPM, and the mixture was thoroughly stirred and homogenized to prepare an antibacterial and antifungal wiping ointment.
上記本実施例の軟膏を使ってガラス板を清拭した。そ
して、薬剤末投入の軟膏で清拭したガラス板と比較培養
を実施して効果を確認した。培養には、実際にレンズか
びの発生した部材を使用した。The glass plate was wiped with the ointment of this example. Then, comparative cultivation was performed with a glass plate that had been wiped with an ointment charged with a drug powder, and the effect was confirmed. For the culture, a member actually having lens mold was used.
・培養条件:30℃85％RH−３ヵ月 ・培養結果 表２から判るように、薬剤添加、無添加での差は明確
であり、本実施例ではレンズかびの再発防止効果が顕著
であった。・ Culture conditions: 30 ℃ 85% RH-3 months ・ Culture results As can be seen from Table 2, the difference between the addition and the non-addition of the drug was clear, and in this example, the effect of preventing the recurrence of lens mold was remarkable.
（第３実施例） 軟膏原料としての脂肪油（オレイン酸のグリセリンエ
ステル）に、α−ブロムシンナムアルデヒドを1.0重量
％投入し、よく攪拌して均質にし、防菌防黴清拭軟膏を
作製した。(Third Example) To a fatty oil (glycerin ester of oleic acid) as an ointment raw material, 1.0% by weight of α-bromocinnamaldehyde was added, and the mixture was stirred well to homogenize to prepare a germicidal and fungicide wiping ointment. .
上記本実施例の軟膏を使って、ガラス板を清拭した。
そして、薬剤未投入の軟膏で清拭したガラス板と比較培
養を実施して効果を確認した。培養には、実際にレンズ
かびの発生した部材を使用した。Using the ointment of this example, the glass plate was wiped.
Then, comparative cultivation was performed with a glass plate that had been wiped with an ointment containing no drug, and the effect was confirmed. For the culture, a member actually having lens mold was used.
・培養条件:30℃85％RH−３ヵ月 ・培養結果 表３から判るように、薬剤添加、無添加での差は明確
であり、本実施例ではレンズかびの再発防止効果が顕著
であった。・ Culture conditions: 30 ℃ 85% RH-3 months ・ Culture results As can be seen from Table 3, the difference between the addition and the non-addition of the drug was clear, and in this example, the effect of preventing the recurrence of lens mold was remarkable.
（第４実施例） 軟膏原料としての高級アルコール（メリシルアルコー
ル）に、薬剤ｏ−フェニルフェノールを10重量％投入
し、よく攪拌して均質にし、防菌防黴清拭軟膏を作製し
た。Fourth Example 10% by weight of a drug o-phenylphenol was added to a higher alcohol (melisyl alcohol) as an ointment raw material, and the mixture was thoroughly stirred to homogenize to prepare a germicidal and antifungal wiping ointment.
上記本実施例の軟膏を使って、ガラス板を清拭した。
そして、薬剤未投入の軟膏で清拭したガラス板と比較培
養を実施して効果を確認した。培養には、実際にレンズ
かびの発生した部材を使用した。Using the ointment of this example, the glass plate was wiped.
Then, comparative cultivation was performed with a glass plate that had been wiped with an ointment containing no drug, and the effect was confirmed. For the culture, a member actually having lens mold was used.
・培養条件:30℃85％RH−３ヵ月 ・培養結果 表４から判るように、薬剤添加、無添加での差は明確
であり、本実施例ではレンズかびの再発防止効果が顕著
であった。・ Culture conditions: 30 ℃ 85% RH-3 months ・ Culture results As can be seen from Table 4, the difference between the addition and the non-addition of the drug was clear, and in this example, the effect of preventing the recurrence of lens mold was remarkable.
（第５〜28実施例） 軟膏原料としてのラノリンに、薬剤としてレゾルシノ
ール３重量％、β−ツヤプリシン0.5重量％、3,3,4′−
トリクロロカルバニリド0.6重量％、塩化デカリニウム
0.5重量％、ジヨードメチル−ｐ−トリスルホン0.7重量
％，塩化メチルロザリニン1.0重量％，テトラメチルイ
ソフタロニトリル0.5重量％，ジクロルフェン0.6重量
％,p−オキシ安息香酸エチル0.5重量％，サリチル酸５
重量％，サリチル酸塩７重量％,2−｛3,5−ジメチルピ
ラゾリル｝−４−ヒドロキシ−６−フェニルピリミジン
0.7重量％，安息香酸1.0重量％，安息香酸ナトリウム５
重量％，安息香酸アルミニウム５重量％，デヒドロ酢酸
0.5重量％，デヒドロ酢酸ナトリウム0.6重量％，マンデ
ル酸ヘキサン0.5重量％，ホウ酸0.3重量％，ホウ酸ナト
リウム0.5重量％,3−ヨード−２−プロピニルブチルカ
ーバメート0.1重量％，ウンデシレン酸５重量％，ソル
ビン酸0.8重量％，ソルビン酸カリウム0.5重量％をそれ
ぞれ投入し、よく攪拌して均質にし、防菌防黴清拭軟膏
を作製した。(Examples 5 to 28) To lanolin as an ointment raw material, resorcinol 3% by weight, β-thyaprisin 0.5% by weight, 3,3,4'-
0.6% by weight of trichlorocarbanilide, decalinium chloride
0.5% by weight, diiodomethyl-p-trisulfone 0.7% by weight, methylrosalinine chloride 1.0% by weight, tetramethylisophthalonitrile 0.5% by weight, dichlorophene 0.6% by weight, ethyl p-oxybenzoate 0.5% by weight, salicylic acid 5
% By weight, 7% by weight of salicylate, 2- {3,5-dimethylpyrazolyl} -4-hydroxy-6-phenylpyrimidine
0.7% by weight, benzoic acid 1.0% by weight, sodium benzoate 5
Wt%, aluminum benzoate 5 wt%, dehydroacetic acid
0.5 wt%, sodium dehydroacetate 0.6 wt%, hexane mandelic acid 0.5 wt%, boric acid 0.3 wt%, sodium borate 0.5 wt%, 3-iodo-2-propynylbutylcarbamate 0.1 wt%, undecylenic acid 5 wt%, 0.8% by weight of sorbic acid and 0.5% by weight of potassium sorbate were added, respectively, and stirred well to homogenize to prepare a germicidal and antifungal wiping ointment.
上記各実施例の軟膏を使って、ガラス板を清拭し、第
１〜４実施例と同様の培養試験を行ったところ３ヶ月経
過しても、レンズかびの発生は見られなかった。Using the ointment of each of the above examples, the glass plate was wiped, and the same culture test as in the first to fourth examples was performed. No lens mold was found even after 3 months.
なお、軟膏原料は、上記実施例のものに限定されず、
油脂性軟膏、水を含まない乳剤性基剤からなる乳剤性軟
膏、水溶性基剤からなる水溶性軟膏、または乳剤性基剤
と水溶性基剤とからなる軟膏を適宜用いても同様の効果
が得られる。In addition, the ointment raw material is not limited to those in the above examples,
Similar effects can be obtained by appropriately using an oil-based ointment, an emulsion ointment comprising an emulsion base containing no water, a water-soluble ointment comprising a water-soluble base, or an ointment comprising an emulsion base and a water-soluble base. Is obtained.
また、着色剤を添加することにより、光学系への影響
をより少なくできる。Further, by adding a coloring agent, the influence on the optical system can be further reduced.
以上のように、本発明の防菌防黴清拭軟膏および光学
機器の清拭方法によれば、清拭軟膏にレンズかび再発防
止の機能を付加することができ、十分な防菌防黴効果を
発揮できる。As described above, according to the germicidal and antifungal wiping ointment and the method for wiping optical equipment of the present invention, a function of preventing lens mold recurrence can be added to the wiping ointment, and a sufficient antibacterial and antifungal effect can be obtained. Can be demonstrated.
軟膏原料の入手が困難な場合、市販の軟膏やスキンク
リームとよばれるもので代用することも当然可能であ
る。なお、市販品をそのまま使用した場合、本発明のよ
うな効果が得られないことはいうまでもない。When it is difficult to obtain ointment raw materials, it is naturally possible to substitute commercially available ointments and skin creams. Needless to say, when a commercially available product is used as it is, the effect of the present invention cannot be obtained.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭61−228412（ＪＰ，Ａ) 特開 昭61−228413（ＪＰ，Ａ) 特開 昭61−291503（ＪＰ，Ａ) 特開 昭61−221357（ＪＰ，Ａ) ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-61-228412 (JP, A) JP-A-61-228413 (JP, A) JP-A-61-291503 (JP, A) JP-A-61-291503 221357 (JP, A)
Claims (4)
リーム状軟膏原料と、２−（４−チアゾリル）ベンズイ
ミダゾール0.01〜５重量％、10,10′−オキシビスフェ
ノキシアルシン10〜100PPM、α−ブロムシンナムアルデ
ヒド0.01〜５重量％、ｏ−フェニルフェノール５〜30重
量％、レゾルシノール１〜20重量％、β−ツヤプリシン
0.01〜５重量％、3,3,4′−トリクロロカルバニリド0.1
〜５重量％、塩化デカリニウム0.01〜５重量％、ジョー
ドメチル−ｐ−トリスルホン0.01〜５重量％、塩化メチ
ルロザリニン0.1〜10重量％、テトラメチルイソフタロ
ニトリル0.1〜５重量％、ジクロルフェン0.01〜５重量
％、ｐ−オキシ安息香酸エチル0.01〜５重量％、サリチ
ル酸0.1〜20重量％、サリチル酸塩0.1〜20重量％、２−
｛3,5−ジメチルピラゾリル｝−４−ヒドロキシ−６−
フェニルピリミジン0.1〜５重量％、安息香酸0.05〜20
重量％、安息香酸ナトリウム0.05〜20重量％、安息香酸
アルミニウム0.05〜20重量％、デヒドロ酢酸0.01〜５重
量％、デヒドロ酢酸ナトリウム0.01〜５重量％、マンデ
ル酸ヘキサミン0.01〜５重量％、ホウ酸0.1〜10重量
％、ホウ酸ナトリウム0.1〜10重量％、３−ヨード−２
−プロピニルブチルカーバメート0.01〜５重量％、ウン
デシレン酸0.1〜20重量％、ソルビン酸0.1〜20重量％ま
たはソルビン酸カリウム0.1〜20重量％の中から選んだ
防菌防黴剤とからなることを特徴とする防菌防黴清拭軟
膏。1. A cleaning ointment for wiping optical equipment, comprising a creamy ointment raw material, 0.01 to 5% by weight of 2- (4-thiazolyl) benzimidazole, and 10,10'-oxybisphenoxyarsine. 100 ppm, 0.01 to 5% by weight of α-bromocinnamaldehyde, 5 to 30% by weight of o-phenylphenol, 1 to 20% by weight of resorcinol, β-thyaprisin
0.01 to 5% by weight, 3,3,4'-trichlorocarbanilide 0.1
-5% by weight, decalinium chloride 0.01-5% by weight, iodomethyl-p-trisulfone 0.01-5% by weight, methylrosalinine chloride 0.1-10% by weight, tetramethylisophthalonitrile 0.1-5% by weight, dichlorphen 0.01- 5% by weight, 0.01 to 5% by weight of ethyl p-oxybenzoate, 0.1 to 20% by weight of salicylic acid, 0.1 to 20% by weight of salicylate, 2-
{3,5-dimethylpyrazolyl} -4-hydroxy-6-
Phenylpyrimidine 0.1-5% by weight, benzoic acid 0.05-20
Wt%, sodium benzoate 0.05-20 wt%, aluminum benzoate 0.05-20 wt%, dehydroacetic acid 0.01-5 wt%, sodium dehydroacetate 0.01-5 wt%, hexamine mandelate 0.01-5 wt%, boric acid 0.1 -10% by weight, sodium borate 0.1-10% by weight, 3-iodo-2
-A fungicide and / or fungicide selected from 0.01 to 5% by weight of propynylbutyl carbamate, 0.1 to 20% by weight of undecylenic acid, 0.1 to 20% by weight of sorbic acid or 0.1 to 20% by weight of potassium sorbate. Antibacterial and antifungal wiping ointment.
水を含まない乳剤性基剤からなる乳剤性軟膏または水溶
性基剤からなる水溶性軟膏であることを特徴とする請求
項１記載の防菌防黴清拭軟膏。2. The creamy ointment raw material is an oily ointment,
2. The germicidal and fungicidal wiping ointment according to claim 1, which is an emulsion ointment comprising a water-free emulsion base or a water-soluble ointment comprising a water-soluble base.
水溶性基剤とからなる軟膏であることを特徴とする請求
項１記載の防菌防黴清拭軟膏。3. The ointment according to claim 1, wherein said creamy ointment raw material is an ointment comprising an emulsion base and a water-soluble base.
リル）ベンズイミダゾール0.01〜５重量％、10,10′−
オキシビスフェノキシアルシン10〜100PPM、α−ブロム
シンナムアルデヒド0.01〜５重量％、ｏ−フェニルフェ
ノール５〜30重量％、レゾルシノール１〜20重量％、β
−ツヤプリシン0.01〜５重量％、3,3,4′−トリクロロ
カルバニリド0.1〜５重量％、塩化デカリニウム0.01〜
５重量％、ジョードメチル−ｐ−トリスルホン0.01〜５
重量％、塩化メチルロザリニン0.1〜10重量％、テトラ
メチルイソフタロニトリル0.1〜５重量％、ジクロルフ
ェン0.01〜５重量％、ｐ−オキシ安息香酸エステル0.01
〜５重量％、サリチル酸0.1〜20重量％、サリチル酸塩
0.1〜20重量％、２−｛3,5−ジメチルピラゾリル｝−４
−ヒドロキシ−６−フェニルピリミジン0.1〜５重量
％、安息香酸0.05〜20重量％、安息香酸ナトリウム0.05
〜20重量％、安息香酸アルミニウム0.05〜20重量％、デ
ヒドロ酢酸0.01〜５重量％、デヒドロ酢酸ナトリウム0.
01〜５重量％、マンデル酸ヘキサミン0.01〜５重量％、
ホウ酸0.1〜10重量％、ホウ酸ナトリウム0.1〜10重量
％、３−ヨード−２−プロピニルブチルカーバメート0.
01〜５重量％、ウンデシレン酸0.1〜20重量％、ソルビ
ン酸0.1〜20重量％またはソルビン酸カリウム0.1〜20重
量％の中から選んだ防菌防黴剤とからなる防菌防黴清拭
軟膏により光学機器を清拭することを特徴とする光学機
器の清拭方法。4. A creamy ointment raw material, 0.01 to 5% by weight of 2- (4-thiazolyl) benzimidazole, 10,10'-
Oxybisphenoxyarsine 10-100 ppm, α-bromocinnamaldehyde 0.01-5% by weight, o-phenylphenol 5-30% by weight, resorcinol 1-20% by weight, β
-Tyaprisin 0.01-5% by weight, 3,3,4'-trichlorocarbanilide 0.1-5% by weight, decalinium chloride 0.01-
5% by weight, 0.01 to 5 of jodmethyl-p-trisulfone
% By weight, 0.1 to 10% by weight of methylrosalinine chloride, 0.1 to 5% by weight of tetramethylisophthalonitrile, 0.01 to 5% by weight of dichlorophen, 0.01% of p-oxybenzoate
-5% by weight, salicylic acid 0.1-20% by weight, salicylate
0.1-20% by weight, 2- {3,5-dimethylpyrazolyl} -4
-Hydroxy-6-phenylpyrimidine 0.1-5% by weight, benzoic acid 0.05-20% by weight, sodium benzoate 0.05
-20% by weight, aluminum benzoate 0.05-20% by weight, dehydroacetic acid 0.01-5% by weight, sodium dehydroacetate 0.
01-5% by weight, hexamine mandelate 0.01-5% by weight,
0.1-10% by weight of boric acid, 0.1-10% by weight of sodium borate, 3-iodo-2-propynylbutyl carbamate 0.1%
An antibacterial and antifungal wiping ointment comprising an antibacterial and antifungal agent selected from 01 to 5% by weight, undecylenic acid 0.1 to 20% by weight, sorbic acid 0.1 to 20% by weight or potassium sorbate 0.1 to 20% by weight. A method for wiping an optical device, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2160282A JP2634483B2 (en) | 1990-06-18 | 1990-06-18 | Antibacterial and antifungal wiping ointment and wiping method for optical equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2160282A JP2634483B2 (en) | 1990-06-18 | 1990-06-18 | Antibacterial and antifungal wiping ointment and wiping method for optical equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0449207A JPH0449207A (en) | 1992-02-18 |
| JP2634483B2 true JP2634483B2 (en) | 1997-07-23 |
Family
ID=15711621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2160282A Expired - Fee Related JP2634483B2 (en) | 1990-06-18 | 1990-06-18 | Antibacterial and antifungal wiping ointment and wiping method for optical equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2634483B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2181696B1 (en) | 2008-10-30 | 2017-04-12 | Henkel AG & Co. KGaA | Anti-spot skin treatment |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10046265A1 (en) * | 2000-09-19 | 2002-03-28 | Bayer Ag | Synergistic mixtures protecting animal hides or leather against microbial attack comprise phenols and fungicides such as mercaptobenzothiazole or chlorthalonil |
| WO2002069716A1 (en) * | 2001-03-01 | 2002-09-12 | Lonza Inc. | Combination of an iodopropynyl derivative with a ketone acid or its salt and/or with an aromatic carboxylic acid or its salt |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61228413A (en) * | 1985-04-01 | 1986-10-11 | Nippon Kogaku Kk <Nikon> | Fats and oils controlling growth of mold for optical instrument use and optical instrument utilizing same |
| JPS61228412A (en) * | 1985-04-01 | 1986-10-11 | Nippon Kogaku Kk <Nikon> | Mold growth controlled optical instrument |
-
1990
- 1990-06-18 JP JP2160282A patent/JP2634483B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2181696B1 (en) | 2008-10-30 | 2017-04-12 | Henkel AG & Co. KGaA | Anti-spot skin treatment |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0449207A (en) | 1992-02-18 |
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