JP2633505B2 - Semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly to a semiconductor device having a plurality of mounting surfaces.

[0002]

2. Description of the Related Art In a conventional semiconductor device, as shown in FIGS. 5 and 6, an electrical wiring pattern of a single electrical wiring layer 13 connected to each signal terminal of a semiconductor element 1 by a thin metal wire 2. FIG. As shown in FIG. 7, the external terminal 13 is electrically connected to the external terminal 7 via the terminal 13a. The external terminal 7 is arranged such that a fixed surface is a mounting surface. In recent years, as shown in FIGS. 8 and 9, the electrical wiring pattern 13a connected to the signal terminal of the semiconductor element 1 is drawn out toward one narrow side surface of the package member, and its tip is exposed on the package surface. In some cases, the package is set up vertically on the wiring board to enable high-density mounting on a narrow surface by adopting a structure in which the external terminals 7 are provided (Japanese Patent Laid-Open No. Hei 5-20631).
No. 5).

[0003]

In this conventional semiconductor device, since the mounting surface is fixed, there is a need for a mounter to meet a demand such as a mounting height limitation due to high density mounting and thinning of the semiconductor device. It is necessary to separately prepare semiconductor devices having different mounting forms, and there has been a problem that a semiconductor manufacturer has to cope with a wide variety of semiconductor devices having the same function mounted with the same semiconductor element.

An object of the present invention is to provide a semiconductor device which can prevent a variety of products due to a difference in mounting form and can freely select a mounting surface.

[0005]

According to the present invention, there is provided a semiconductor device comprising:
A semiconductor element mounted on the semiconductor element mounting portion, an electric wiring pattern of a first electric wiring layer connected to a signal terminal of the semiconductor element via a thin metal wire for each signal wiring, and the electric wiring External terminals connected to the pattern and provided on four side surfaces, an electric wiring pattern of a second electric wiring layer connected to the electric wiring pattern via through holes, and connection to the electric wiring pattern. An external terminal provided on a mounting side surface, an independent electric wiring pattern of a first electric wiring layer connected to an electric wiring pattern of the second electric wiring layer via a through hole, And an external terminal provided on the mounting side surface to be connected to the static wiring pattern.

[0006]

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a sectional view of one embodiment of the present invention.
A semiconductor device according to an embodiment of the present invention includes, as shown in FIG.
The semiconductor element 1 mounted on the semiconductor element mounting portion is connected to an electric wiring pattern of a first electric wiring layer (hereinafter, referred to as an A layer) 3 via a thin metal wire 2 or the like as an electric wiring material. I have. Each signal is also independently connected to a second electric wiring layer (hereinafter, referred to as a B layer) 5 by a through hole 4 a provided in an independent wiring pattern of the A layer 3. On the other hand, the electrical wiring patterns of the B layer 5 are connected to the independent electrical wiring patterns of the A layer 3 via the through holes 4b.

FIGS. 2A and 2B respectively show A in FIG.
It is a perspective plan view of a layer and a B layer. As shown in FIGS. 2A and 2B, an independent electrical wiring pattern 3a for each signal is formed on the A layer 3 and connected to external terminals provided on each side surface in four directions. I have. On the other hand, the electric wiring pattern 3a of the A layer 3 is connected to the electric wiring pattern 5a of the B layer 5 via the through hole 4a. Further, the electric wiring pattern 5a is connected to the signal terminal of the semiconductor element 1 of the A layer 3 via the through hole 4b.
The electric wiring patterns 3a, 3b and 5a are connected to an external terminal provided on a predetermined mounting side surface 6 in an integrated manner.

FIGS. 3A and 3B are side views showing the arrangement of external terminals on a side surface other than the mounting side surface of FIG. 2 and a predetermined mounting side surface, respectively. FIGS. 4A and 4B are diagrams of FIG. It is a perspective view explaining the mounting method using an external terminal. FIG. 3 (a),
As shown in (b), the side other than the mounting side 6 has the A layer 3
An external terminal 7 connected to the electrical wiring pattern 3a is provided. On the other hand, the electrical wiring patterns 3a of the A layer 3 and the electrical wiring patterns 5 of the
By arranging two systems of external terminals 7 in which a predetermined signal wiring is divided into two paths using a through hole 4b connecting between the electrical wiring pattern 3b of the A layer 3 and the electrical wiring pattern 3b of FIG.
As shown in (a) and (b), it is possible to achieve horizontal planar mounting and vertical vertical mounting with one semiconductor device, and the semiconductor device mounter can freely select a mounting mode depending on the application. In addition, inventory management becomes easy. Further, by subdividing the signal wiring layer by adding an electric wiring layer or an external terminal or the like, the mounting side surface can be made two or more.

[0010]

As described above, according to the present invention, by providing a plurality of mounting surfaces from which a mounting form can be easily selected, a semiconductor manufacturer can be prevented from diversifying products due to differences in mounting forms. Since the mounting side can freely select the mounting mode, there is an effect that the semiconductor device components can be shared. As a result, a great effect can be expected in terms of inventory management.

[Brief description of the drawings]

FIG. 1 is a sectional view of one embodiment of the present invention.

2 (a) and 2 (b) are perspective plan views of an A layer and a B layer of FIG. 1, respectively.

FIGS. 3A and 3B are side views showing the arrangement of external terminals on a side surface other than the mounting side surface of FIG. 2 and a predetermined mounting side surface, respectively.

FIGS. 4A and 4B are perspective views illustrating a mounting mode using the external terminals of FIG. 3;

FIG. 5 is a sectional view of an example of a conventional semiconductor device.

FIG. 6 is a perspective plan view of an example of the electrical wiring pattern of FIG. 5;

FIG. 7 is a perspective view illustrating a mounting mode of the semiconductor device of FIG. 5;

FIG. 8 is a perspective plan view of another example of a conventional electric wiring pattern.

FIG. 9 is a perspective view illustrating a mounting mode of the semiconductor device of FIG. 8;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor element 2 Fine metal wire 3 A layer 3a, 3b, 5a, 13a Electrical wiring pattern 4a, 4b Through hole 5 B layer 6 Mounting side surface 7 External terminal 13 Electrical wiring layer

Claims (3)

(57) [Claims] 1. A semiconductor element mounted on a semiconductor element mounting portion, and an electric wiring pattern of a first electric wiring layer connected to a signal terminal of the semiconductor element via a thin metal wire for each signal wiring. An external terminal connected to the electric wiring pattern and provided on a side surface in four directions; an electric wiring pattern of a second electric wiring layer connected to the electric wiring pattern via a through-hole; An external terminal provided on a mounting side surface connected to the wiring pattern;
And an independent electrical wiring pattern of the first electrical wiring layer connected to the electrical wiring pattern of the first electrical wiring layer through the through-hole, and provided on the mounting side surface connected to the independent electrical wiring pattern. A semiconductor device having an external terminal. 2. The semiconductor device according to claim 1, wherein said semiconductor device has at least two mounting surfaces. 3. The semiconductor device according to claim 1, wherein an external terminal corresponding to a signal terminal of said semiconductor element has at least one terminal.