JP2629253B2 - Semiconductor manufacturing apparatus and semiconductor device manufacturing method - Google Patents
Semiconductor manufacturing apparatus and semiconductor device manufacturing methodInfo
- Publication number
- JP2629253B2 JP2629253B2 JP63077914A JP7791488A JP2629253B2 JP 2629253 B2 JP2629253 B2 JP 2629253B2 JP 63077914 A JP63077914 A JP 63077914A JP 7791488 A JP7791488 A JP 7791488A JP 2629253 B2 JP2629253 B2 JP 2629253B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- carrier
- groove
- orientation flat
- respect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、半導体製造におけるウエハの位置合わせ機
構に関する。Description: TECHNICAL FIELD The present invention relates to a wafer positioning mechanism in semiconductor manufacturing.
従来は、キャリヤをウエハと直角方向に上下に傾ける
ことによりウエハをキャリヤの溝の片側へ寄せる方法が
採られていた。Conventionally, a method has been adopted in which the carrier is tilted up and down in a direction perpendicular to the wafer to move the wafer to one side of the groove of the carrier.
従来のキャリヤを上下に傾けるだけの方法では第２図
の様に、ウエハの上部は片側に寄るが、キャリヤ溝巾が
広いためウエハの下部は必ずしも同一方向へは寄らず、
ウエハの位置が一定していないという課題を有してい
た。In the conventional method of simply tilting the carrier up and down, as shown in FIG. 2, the upper part of the wafer is shifted to one side, but the lower part of the wafer is not necessarily shifted in the same direction due to a wide carrier groove width.
There is a problem that the position of the wafer is not constant.
そこで、本発明は従来のこのような課題を解決するた
め、ウエハの下部もキャリヤ溝の同一方向へ寄せてキャ
リヤ内でのウエハの位置合わせ精度の向上を目的として
いる。In order to solve such a conventional problem, the present invention aims at improving the positioning accuracy of the wafer in the carrier by moving the lower portion of the wafer in the same direction of the carrier groove.
前記課題を解決するために、本発明はウェハを垂直方
向に載置する溝を有するキャリア、前記キャリア内から
前記ウェハを取り出すウェハハンドリング機構を有する
半導体製造装置において、前記キャリアは、前記ウェハ
の直角方向に対して一定角度傾けて設けられ、オリフラ
合わせローラを前記キャリアに対して横方向に傾けるウ
ェハの位置合わせ機構を有することを特徴とする。また
ウェハと直角方向に一定角度傾けられたキャリア内にウ
ェハを載置する工程、ウェハの下に設けられ、且つ前記
キャリアに対して横方向に一定角度傾けたオリフラ合わ
せローラ回転させ、前記ウェハを前記キャリアの溝の片
側に寄せる工程を有することを特徴とする。In order to solve the above-mentioned problem, the present invention provides a semiconductor manufacturing apparatus having a carrier having a groove for placing a wafer in a vertical direction, and a wafer handling mechanism for taking out the wafer from within the carrier. A wafer alignment mechanism that is provided at a fixed angle to the direction and tilts the orientation flat alignment roller in a lateral direction with respect to the carrier. A step of placing the wafer in a carrier inclined at a certain angle in a direction perpendicular to the wafer; rotating an orientation flat aligning roller provided below the wafer and inclined at a constant angle in a lateral direction with respect to the carrier; A step of moving the carrier toward one side of the groove.
以下に本発明の実施例を図面にもとづいて説明する。
第１図において、キャリヤ２及びオリフラ合わせローラ
３は、ウエハ１と直角方向に上下に傾けられており、キ
ャリヤ２の下にはオリフラ合わせローラ３がキャリヤ２
に対して横方向に傾けられて取り付けられている。キャ
リヤ２は上下に傾けられているため、第２図の様にウエ
ハ１の上部はキャリヤ溝４の一方向に寄せられる。しか
しこのままではウエハ１の下部は同一方向に寄ることは
なく、不安定である。そこでオリフラ合わせローラ３を
回転させれば、オリフラ合わせローラ３はウエハ１に対
して横方向に傾いているためにウエハ１の垂直方向に力
が働き、オリフラを合わせながらウエハ１の下部がすべ
て同一方向に寄せられ、ウエハ１の上下部ともにキャリ
ヤ溝４の同位置に位置をそろえることができる。Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In FIG. 1, the carrier 2 and the orientation flat aligning roller 3 are tilted up and down in a direction perpendicular to the wafer 1, and the orientation flat aligning roller 3 is provided below the carrier 2.
It is mounted to be tilted laterally with respect to. Since the carrier 2 is tilted up and down, the upper part of the wafer 1 is moved in one direction of the carrier groove 4 as shown in FIG. However, in this state, the lower portion of the wafer 1 does not move in the same direction and is unstable. When the orientation flat aligning roller 3 is rotated, a force acts in the vertical direction of the wafer 1 because the orientation flat aligning roller 3 is inclined in the horizontal direction with respect to the wafer 1, and all the lower portions of the wafer 1 are aligned while aligning the orientation flat. And the upper and lower portions of the wafer 1 can be aligned at the same position of the carrier groove 4.
本発明は、ウエハの下部もキャリヤ溝の同一方向へ寄
せてキャリヤ内でのウエハの位置合わせ精度が向上する
という効果を有する。The present invention has an effect that the lower part of the wafer is also moved in the same direction of the carrier groove to improve the alignment accuracy of the wafer in the carrier.
第１図（ａ）〜（ｃ）は、本発明の実施例を示す概略図
であり、（ａ）は平面図、（ｂ）は正面図、（ｃ）は側
面図、第２図はキャリヤ溝部の断面図である。 １……ウエハ ２……キャリヤ ３……オリフラ合わせローラ ４……キャリア溝1 (a) to 1 (c) are schematic views showing an embodiment of the present invention, wherein (a) is a plan view, (b) is a front view, (c) is a side view, and FIG. 2 is a carrier. It is sectional drawing of a groove part. 1. Wafer 2. Carrier 3. Orientation flat aligning roller 4. Carrier groove
Claims (2)
ャリア、前記キャリア内から前記ウェハを取り出すウェ
ハハンドリング機構を有する半導体製造装置において、
前記キャリアは、前記ウェハの直角方向に対して一定角
度傾けて設けられ、オリフラ合わせローラを前記キャリ
アに対して横方向に傾けるウェハの位置合わせ機構を有
することを特徴とする半導体製造装置。1. A semiconductor manufacturing apparatus comprising: a carrier having a groove for placing a wafer in a vertical direction; and a wafer handling mechanism for taking out the wafer from inside the carrier.
The semiconductor manufacturing apparatus according to claim 1, wherein the carrier is provided to be inclined at a predetermined angle with respect to a direction perpendicular to the wafer, and has a wafer alignment mechanism for inclining an orientation flat alignment roller in a lateral direction with respect to the carrier.
ャリア内にウェハを載置する工程、ウェハの下に設けら
れ、且つ前記キャリアに対して横方向に一定角度傾けた
オリフラ合わせローラ回転させ、前記ウェハを前記キャ
リアの溝の片側に寄せる工程を有することを特徴とする
半導体装置の製造方法。2. A step of placing a wafer in a carrier inclined at a constant angle in a direction perpendicular to the wafer, and rotating an orientation flat aligning roller provided below the wafer and inclined at a constant angle in a lateral direction with respect to the carrier. And a step of moving the wafer to one side of the groove of the carrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63077914A JP2629253B2 (en) | 1988-03-30 | 1988-03-30 | Semiconductor manufacturing apparatus and semiconductor device manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63077914A JP2629253B2 (en) | 1988-03-30 | 1988-03-30 | Semiconductor manufacturing apparatus and semiconductor device manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01248635A JPH01248635A (en) | 1989-10-04 |
| JP2629253B2 true JP2629253B2 (en) | 1997-07-09 |
Family
ID=13647342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63077914A Expired - Lifetime JP2629253B2 (en) | 1988-03-30 | 1988-03-30 | Semiconductor manufacturing apparatus and semiconductor device manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2629253B2 (en) |
-
1988
- 1988-03-30 JP JP63077914A patent/JP2629253B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01248635A (en) | 1989-10-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |