JP2625769B2 - Double head ultrasonic vibration grinder - Google Patents
Double head ultrasonic vibration grinderInfo
- Publication number
- JP2625769B2 JP2625769B2 JP62260792A JP26079287A JP2625769B2 JP 2625769 B2 JP2625769 B2 JP 2625769B2 JP 62260792 A JP62260792 A JP 62260792A JP 26079287 A JP26079287 A JP 26079287A JP 2625769 B2 JP2625769 B2 JP 2625769B2
- Authority
- JP
- Japan
- Prior art keywords
- grinding
- ultrasonic vibration
- double
- double head
- vibration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、高脆性材料の上下両方の表面を同時に研削
する高能率、高精度の研削盤に関する。The present invention relates to a high-efficiency, high-precision grinding machine for simultaneously grinding both upper and lower surfaces of a highly brittle material.
高脆性材料の上下両方の表面を同時に研削する装置
は、従来、金属材料等の加工に用いる装置をそのまま用
い、単に砥石として高脆性材料に適合するものを選定し
て使用していた。Conventionally, as a device for simultaneously grinding both upper and lower surfaces of a highly brittle material, a device used for processing a metal material or the like has been used as it is, and only a grindstone suitable for the highly brittle material has been selected and used.
セラミックスなどの高脆性材料は硬質で脆い材料であ
り、研削しにくく、加工能率が著しく低かった。また加
工能率を上げようとすると、表面精度、例えば表面粗さ
や平面度を損なうという矛盾があり、また微細なクラッ
クを生ずるなどの問題がある。Highly brittle materials such as ceramics are hard and brittle materials, are difficult to grind, and have extremely low processing efficiency. Further, if the processing efficiency is increased, there is a contradiction that the surface accuracy, for example, surface roughness and flatness is impaired, and there is a problem that a fine crack is generated.
本発明は上記実情に鑑み開発されたもので、加工効率
が高く、加工精度が従来の装置と同等以上である両頭研
削加工装置を提供することを目的とする。SUMMARY OF THE INVENTION The present invention has been developed in view of the above circumstances, and has as its object to provide a double-head grinding apparatus having high processing efficiency and processing accuracy equal to or higher than that of a conventional apparatus.
本発明は、高脆性材料からなるワークの上下両面を同
時に研削する上下別の２軸を備えた両頭研削盤の研削板
回転駆動部に縦振動又は回転振動を与える超音波振動発
生装置をそれぞれ取付けたことを特徴とする両頭超音波
振動研削盤である。The present invention attaches an ultrasonic vibration generator that applies longitudinal vibration or rotational vibration to a grinding plate rotation drive unit of a double-head grinding machine having two upper and lower separate axes for simultaneously grinding the upper and lower surfaces of a work made of a highly brittle material. The present invention provides a double-head ultrasonic vibration grinder.
本発明は、高脆性材料の研削に用いられる加工機であ
って、超音波振動を付与しながらワークの上下表面を研
削する。この超音波振動を付与することによって、加工
効率が従来の３〜５倍に上昇し、表面精度を損なうこと
なく、高脆性材料にクラック等を生じることがなく、高
脆性材料を研削加工することができる。The present invention is a processing machine used for grinding highly brittle materials, and grinds upper and lower surfaces of a work while applying ultrasonic vibration. By applying the ultrasonic vibration, the processing efficiency is increased by 3 to 5 times as compared with the conventional method, and the high brittle material is ground without cracking or the like without deteriorating the surface accuracy. Can be.
以下本発明を実施例によって詳細に説明する。第１図
は本発明の実施例の研削盤の正面縦断面図である。Hereinafter, the present invention will be described in detail with reference to examples. FIG. 1 is a front vertical sectional view of a grinding machine according to an embodiment of the present invention.
第１図において、上下に対向する研削板１はそれぞれ
上下移動自在な回転駆動部２に支持されて水平面内を回
転し、その上下の研削板１の２面の間に研削すべきワー
クを挿入してその上下両面を研削するものである。In FIG. 1, a vertically opposed grinding plate 1 is supported by a vertically movable rotary drive unit 2 and rotates in a horizontal plane, and a workpiece to be ground is inserted between two surfaces of the upper and lower grinding plates 1. Then, the upper and lower surfaces are ground.
回転駆動部の上下の移動はウオーム12およびウオーム
ホイール13を図示しないモータによって操作することに
よって任意に変更することができ、ワークの上下面の寸
法に応じて研削板１の間隔は自動的に精密に制御され
る。The vertical movement of the rotary drive unit can be arbitrarily changed by operating the worm 12 and the worm wheel 13 by a motor (not shown). The distance between the grinding plates 1 is automatically adjusted according to the dimensions of the upper and lower surfaces of the work. Is controlled.
回転駆動部２の一実施例の縦断面図を第２図に示し
た。ケーシング３内に駆動軸４が内蔵され、この駆動軸
４には回転子５と固定子６とから成る回転モータ７が設
けられており、軸受８に支持され研削板１を回転する。
回転駆動部２に超音波振動発生装置が取付けられてい
る。この超音波振動発生装置として回転軸４に超音波振
動子９が付設されており、スリップリング10を介して給
電される。超音波振動子９は超音波振動を発生し、回転
軸４に超音波振動を与える。超音波振動子９は縦振動を
発生する装置でも回転振動を発生する装置でも何れも適
用することができる。超音波振動の振動数はほぼ20kHz
が適当である。上下の回転駆動部に附与する超音波振動
の振動数、または／および位相を変えることも任意であ
る。FIG. 2 shows a vertical cross-sectional view of one embodiment of the rotation drive unit 2. A drive shaft 4 is built in the casing 3, and the drive shaft 4 is provided with a rotation motor 7 including a rotor 5 and a stator 6, and is supported by bearings 8 to rotate the grinding plate 1.
An ultrasonic vibration generator is attached to the rotation drive unit 2. An ultrasonic vibrator 9 is attached to the rotating shaft 4 as this ultrasonic vibration generator, and power is supplied via a slip ring 10. The ultrasonic vibrator 9 generates ultrasonic vibration and applies ultrasonic vibration to the rotating shaft 4. As the ultrasonic vibrator 9, either a device that generates longitudinal vibration or a device that generates rotational vibration can be applied. Ultrasonic vibration frequency is almost 20kHz
Is appropriate. It is also optional to change the frequency and / or phase of the ultrasonic vibration applied to the upper and lower rotary drive units.
ワーク21は保持円盤22に取付けられて２枚の研削板１
の間に供給されて研削される。保持円盤22は回転自在に
フレーム23に保持されており、軸24を中心としてモータ
25により回転することができるようになっている。The work 21 is mounted on a holding disk 22 and has two grinding plates 1.
Is supplied and ground. The holding disk 22 is rotatably held by a frame 23, and a motor is
25 allows you to rotate.
フレーム23は垂直なピン継手27により水平に回動自在
な腕26によって支持されている。第３図に実施例の全体
を説明する平面図を示したように、ワーク取付位置30に
おいてワーク21をワーク保持円板23に取付け、ピン27を
中心にしてこれを矢印32に示すように回動して研削位置
31に示す保持位置に移動する。このようにして保持して
いるワーク21を２枚の研削板１の間に供給する。必要に
応じて保持円盤22を回転する。研削加工が終了すればフ
レーム23をワーク取付位置30に戻して新しいワーク21を
保持円盤22に取付ける。The frame 23 is supported by a vertically rotatable arm 26 by a vertical pin joint 27. As shown in FIG. 3 which is a plan view for explaining the whole embodiment, the work 21 is mounted on the work holding disk 23 at the work mounting position 30 and the pin 21 is turned around as shown by an arrow 32. Moving and grinding position
Move to the holding position shown in 31. The work 21 thus held is supplied between the two grinding plates 1. The holding disk 22 is rotated as necessary. When the grinding is completed, the frame 23 is returned to the work mounting position 30, and a new work 21 is mounted on the holding disk 22.
実施例の両頭超音波振動研削盤は、上下２枚の研削板
に超音波振動を付与することによって高脆性加工物の平
行２面の研削加工において従来に比べ加工効率が３〜５
倍に上昇した。The double-headed ultrasonic vibration grinding machine of the embodiment has a machining efficiency of 3 to 5 as compared with the conventional one in grinding two parallel surfaces of a highly brittle workpiece by applying ultrasonic vibration to the upper and lower two grinding plates.
Rose twice.
本発明は上記のように構成されているので、高脆性材
料の研削能率が飛躍的に向上し、材料に微細なクラック
等が生じることがなく、セラミックス等の平行両面の研
削加工が極めて容易になった。Since the present invention is configured as described above, the grinding efficiency of a highly brittle material is dramatically improved, and fine cracks and the like do not occur in the material. became.
第１図は本発明の実施例の研削盤の正面縦断面図、第２
図はその回転駆動部の縦断面図、第３図はその全体平面
図である １……研削板、２……回転駆動部 ３……ケーシング、４……駆動軸 ５……回転子、６……固定子 ７……回転モータ、８……軸受 ９……超音波振動子、21……ワーク 22……保持円盤、23……フレーム 24……軸、25……モータ 26……腕、27……ピン 30……ワーク取付位置 31……研削位置、32……矢印FIG. 1 is a front vertical sectional view of a grinding machine according to an embodiment of the present invention, FIG.
The figure is a longitudinal sectional view of the rotation drive unit, and FIG. 3 is an overall plan view thereof. 1. Grinding plate, 2. Rotation drive unit 3, Casing 4, Drive shaft 5, Rotor, 6 ………………………………………………………………………………………………………………………………………………………………………… 腕 22 22 22 腕 腕 腕 腕 腕 腕 腕 モ ー タ モ ー タ モ ー タ 26 モ ー タ モ ー タ モ ー タ モ ー タ 25 26 26 27 ... Pin 30 ... Workpiece mounting position 31 ... Grinding position 32 ... Arrow
Claims (1)
時に研削する上下別の２軸を備えた両頭研削盤の研削板
回転駆動部に縦振動又は回転振動を与える超音波振動発
生装置をそれぞれ取付けたことを特徴とする両頭超音波
振動研削盤。An ultrasonic vibration generator for applying longitudinal vibration or rotational vibration to a grinding plate rotation drive unit of a double-headed grinding machine having two upper and lower separate axes for simultaneously grinding the upper and lower surfaces of a work made of a highly brittle material. A double-head ultrasonic vibration grinding machine characterized by being attached.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62260792A JP2625769B2 (en) | 1987-10-17 | 1987-10-17 | Double head ultrasonic vibration grinder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62260792A JP2625769B2 (en) | 1987-10-17 | 1987-10-17 | Double head ultrasonic vibration grinder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01103254A JPH01103254A (en) | 1989-04-20 |
| JP2625769B2 true JP2625769B2 (en) | 1997-07-02 |
Family
ID=17352801
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62260792A Expired - Lifetime JP2625769B2 (en) | 1987-10-17 | 1987-10-17 | Double head ultrasonic vibration grinder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2625769B2 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61252056A (en) * | 1985-04-30 | 1986-11-10 | Canon Inc | Method of vibration polishing |
| JPS6239167A (en) * | 1985-08-12 | 1987-02-20 | Hitachi Zosen Corp | Mirror surface processing device for disc-shaped workpiece |
-
1987
- 1987-10-17 JP JP62260792A patent/JP2625769B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01103254A (en) | 1989-04-20 |
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