JP2624248B2 - Measurement polishing equipment - Google Patents
Measurement polishing equipmentInfo
- Publication number
- JP2624248B2 JP2624248B2 JP62062584A JP6258487A JP2624248B2 JP 2624248 B2 JP2624248 B2 JP 2624248B2 JP 62062584 A JP62062584 A JP 62062584A JP 6258487 A JP6258487 A JP 6258487A JP 2624248 B2 JP2624248 B2 JP 2624248B2
- Authority
- JP
- Japan
- Prior art keywords
- measuring
- turret
- workpiece
- slide body
- lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q15/00—Automatic control or regulation of feed movement, cutting velocity or position of tool or work
- B23Q15/007—Automatic control or regulation of feed movement, cutting velocity or position of tool or work while the tool acts upon the workpiece
- B23Q15/013—Control or regulation of feed movement
- B23Q15/04—Control or regulation of feed movement according to the final size of the previously-machined workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
- B23Q17/20—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring workpiece characteristics, e.g. contour, dimension, hardness
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は非球面のレンズ、ミラー等の研磨装置に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a polishing apparatus for aspherical lenses, mirrors and the like.
従来のこの種の研磨装置は、加工物を測定する測定子
が研磨装置から独立した別のスライド機構上に設けられ
ていた。In a conventional polishing apparatus of this type, a probe for measuring a workpiece is provided on another slide mechanism independent of the polishing apparatus.
上述した従来のレンズ、ミラー等の研磨装置では、測
定子が研磨装置から独立した別のスライド機構上に設け
られているので、複数のスライドが必要となり、構造が
複雑になるという欠点がある。また、３本以上のスライ
ドを１つの装置に設けることは、空間スペースの制限上
からも困難である。In the above-described conventional polishing apparatus such as a lens and a mirror, the measuring element is provided on another slide mechanism independent of the polishing apparatus, so that a plurality of slides are required and there is a disadvantage that the structure becomes complicated. In addition, it is difficult to provide three or more slides in one device due to space limitations.
本発明の計測研磨装置は、上下方向に移動自在に設け
られ、上端にバランス錘が滑車を介して吊り下げられた
スライド体と、 前記スライド体の上下方向の位置を測定する測定手段
と、 前記スライド体に回転自在に設けられ、加工物の被加
工面を加工する工具及び前記スライド体の位置測定時に
前記被加工面に接触される測定子が取付けられたタレッ
トとを備えたことを特徴とする。The measuring and polishing apparatus of the present invention is provided so as to be movable in the vertical direction, a slide body having a balance weight suspended from the upper end via a pulley, and a measuring unit for measuring the vertical position of the slide body, A turret having a tool rotatably provided on the slide body for processing the work surface of the workpiece and a turret to which a measuring element is brought into contact with the work surface when measuring the position of the slide body. I do.
また、タレットに複数の工具を設けることも可能であ
る。It is also possible to provide a plurality of tools on the turret.
本発明は、１台の機械で加工および加工物の形状が測
定でき、設計値との誤差を検出して修正を行なうことの
できる装置を提供することを目的とする。SUMMARY OF THE INVENTION It is an object of the present invention to provide an apparatus capable of measuring the shape of a workpiece and a workpiece by one machine, and detecting and correcting an error from a design value.
上記のとおり構成された本発明の計測研磨装置では、
工具で被加工物の所定の部位を加工したら、加工を一旦
停止してタレットを回転させ、測定子を被加工物の加工
面に接触させる。タレットはスライド体に上下方向に移
動自在に取付けられているので、このときのスライド体
の位置を測定して加工物の加工形状と設計値とのずれを
検出し、設定値に基づいてずれを修正する。このよう
に、工具及び測定子をタレットに取付けることで、被加
工物の加工とその形状の測定が同一装置上で可能とな
る。また、スライド体の上端には、バランス錘が滑車を
介して吊り下げられているので、加工物に対する加工中
の工具の接触及び測定中の測定子は接触圧はそれぞれ一
定に保たれる。その結果、加工時には加工物は一定の除
去速度で研磨除去され、かつ、測定時には一定圧で加工
物の加工形状が測定される。さらに、複数の工具をタレ
ットに取付けることで、加工能率が向上する。In the measuring and polishing apparatus of the present invention configured as described above,
After processing a predetermined portion of the workpiece with the tool, the processing is temporarily stopped, the turret is rotated, and the measuring element is brought into contact with the processing surface of the workpiece. The turret is mounted on the slide so that it can move vertically, so the position of the slide at this time is measured to detect the deviation between the machining shape of the workpiece and the design value, and the deviation is determined based on the set value. Fix it. By attaching the tool and the measuring element to the turret in this way, processing of the workpiece and measurement of its shape can be performed on the same apparatus. Further, since the balance weight is suspended from the upper end of the slide body via the pulley, the contact pressure of the tool during processing with the workpiece and the contact pressure of the measuring element during measurement are kept constant. As a result, during processing, the workpiece is polished and removed at a constant removal rate, and during measurement, the processed shape of the workpiece is measured at a constant pressure. Further, by attaching a plurality of tools to the turret, machining efficiency is improved.
次に、本発明の実施例について図面を参照して説明す
る。Next, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の測定研磨装置の要部構造を示す説明
図、第２図は測定研磨装置全体の斜視図である。FIG. 1 is an explanatory view showing the main structure of a measuring and polishing apparatus according to the present invention, and FIG. 2 is a perspective view of the entire measuring and polishing apparatus.
上下方向のスライドガイド11上にスライド体12が上下
方向に摺動自在に設けられ、スライド体12にはタレット
板５がタレット回転中心15を軸に回転自在に取付けられ
ている。タレット板５はタレット板回転モータ17（第２
図）により駆動される。タレット板５にはモータ３によ
って駆動される研磨工具１と、測定子４が所定の角度を
なして取付けられており、測定子４は測定点に垂直に、
また、研磨工具１は加工点に対して斜めに取付けられて
いる。また、タレット板５の下方の装置本体30（第２
図）にはレンズ２を所定の角度に旋回させる旋回角度用
ロータリーエンコーダ13と加工物回転モータ18（第２
図）が回転中心14の軸線上に取付けられている。レンズ
２の中心線の延長上には、レンズ２を回転させる回転用
モータ19（第２図）が設けられている。タレット板回転
用モータ17と加工物旋回用モータ18と回転用モータ19か
らの各コード17a,18a,19aは電気ボックス20に接続され
ている。スライド体12の上部には光線の方向を180゜反
対方向に反射させる反射鏡６が取付けられている。ま
た、レーザ測長器21と、これから反射されるレーザ光８
を直角方向に反射させる反射鏡７により、スライド体12
の上下方向の位置を測定する上下方向測長ユニット16が
形成され装置本体30の上部に取付けられている。上下方
向測長ユニット16からのコード16aもまた電気ボックス2
0に接続されている。スライド体12の上端にはワイヤ9a
が取付けられ、タレット板５、研磨工具１、モータ３お
よび測定子４の総重量と匹敵する重量をもつバランス錘
10が上下方向測長ユニット16に取付けられた滑車９を介
して取付けられている。電気ボックス20にはCPUが組込
まれている。A slide body 12 is slidably provided in a vertical direction on a vertical slide guide 11, and a turret plate 5 is attached to the slide body 12 so as to be rotatable about a turret rotation center 15. The turret plate 5 is a turret plate rotation motor 17 (second
FIG. A polishing tool 1 driven by a motor 3 and a tracing stylus 4 are attached to the turret plate 5 at a predetermined angle.
The polishing tool 1 is mounted obliquely with respect to the processing point. In addition, the device main body 30 (second
FIG. 3 shows a rotary angle rotary encoder 13 for rotating the lens 2 to a predetermined angle and a workpiece rotation motor 18 (second
) Is mounted on the axis of the rotation center 14. On the extension of the center line of the lens 2, a rotation motor 19 (FIG. 2) for rotating the lens 2 is provided. The cords 17 a, 18 a, 19 a from the turret plate rotation motor 17, the workpiece rotation motor 18, and the rotation motor 19 are connected to the electric box 20. On the upper part of the slide body 12, a reflecting mirror 6 for reflecting the direction of the light beam in the opposite direction by 180 ° is mounted. Further, a laser length measuring device 21 and a laser beam 8 reflected from this
Of the slide body 12 by the reflecting mirror 7 for reflecting the
A vertical length measuring unit 16 for measuring the vertical position of the device is formed and attached to the upper part of the apparatus main body 30. The code 16a from the vertical measuring unit 16 is also
Connected to 0. Wire 9a at the upper end of slide body 12
And a balance weight having a weight equal to the total weight of the turret plate 5, the polishing tool 1, the motor 3 and the probe 4
10 is attached via a pulley 9 attached to the vertical length measuring unit 16. The electric box 20 incorporates a CPU.
いま、被加工物であるレンズ２が所定の位置にセット
されて回転用モータ19により回転され、研磨工具１がレ
ンズ２の頂点に接触するようにセットされてモータ３に
より回転が与えられると、研磨が開始される。研磨工具
１の下端が所定の深さに達したとき、モータ３の回転が
止められ、スライド体12を一旦上昇させ、タレット板回
転用モータ17によりタレット板５を回転させて測定子４
の中心線を研磨工具１の中心線と一致させる。次に、ス
ライド体12を測定子４の先端がレンズ２の被加工面に接
するまで下降させるとレーザ光測定器21によりスライド
体12の上端位置が正確に測定される。測定値は電気ボッ
クス20に組込まれたCPUのメモリに読み込まれ、設計値
との間に誤差があれば再度修正の上、正しい位置になる
まで加工される。最初の加工点の研磨が修了したときに
は旋回角度用ロータリーエンコーダ13からの信号によっ
て加工物旋回用モータ18がレンズ２の研磨位置が次の位
置になるように所定の角度だけ旋回させ、タレット板５
は研磨工具１を加工位置に位置させるように回転され
る。このようにしてレンズ２の研磨加工８順次行なわれ
ていき、その都度研磨工具１の回転が止められ、測定子
４が加工位置に移動されてスライド体12の上端位置が正
確に測定されるので、レンズ２はCPUに記憶された設計
値通りの形状に加工される。Now, when the lens 2 which is a workpiece is set at a predetermined position and rotated by the rotation motor 19, the polishing tool 1 is set so as to contact the vertex of the lens 2 and is rotated by the motor 3. Polishing is started. When the lower end of the polishing tool 1 reaches a predetermined depth, the rotation of the motor 3 is stopped, the slide body 12 is once raised, and the turret plate 5 is rotated by the
Is made to coincide with the center line of the polishing tool 1. Next, when the slide body 12 is lowered until the tip of the tracing stylus 4 comes into contact with the surface to be processed of the lens 2, the upper end position of the slide body 12 is accurately measured by the laser beam measuring device 21. The measured value is read into the memory of the CPU incorporated in the electric box 20, and if there is an error between the measured value and the designed value, the measured value is corrected again and processed until it reaches a correct position. When the polishing at the first processing point is completed, the motor 18 for turning the workpiece is turned by a predetermined angle so that the polishing position of the lens 2 becomes the next position by a signal from the rotary encoder 13 for turning angle, and the turret plate 5
Is rotated to position the polishing tool 1 at the processing position. In this manner, the polishing process 8 of the lens 2 is sequentially performed. Each time, the rotation of the polishing tool 1 is stopped, the tracing stylus 4 is moved to the processing position, and the upper end position of the slide body 12 is accurately measured. The lens 2 is processed into a shape according to the design value stored in the CPU.
ここで、スライド体12の上端には滑車９を介してバラ
ンス錘10が取付けられているので、タレット板５に加わ
る下向きの力は、バランス錘10の重量との関係で一定に
保たれる。従って、加工中においては、研磨工具１とレ
ンズ２との接触圧が一定となり、一定除去速度でレンズ
２の研磨を行うことができる。測定子４による測定中に
おいては、測定子４とレンズ２との接触圧が一定とな
り、レンズ２の形状を正確に測定することができる。Here, since the balance weight 10 is attached to the upper end of the slide body 12 via the pulley 9, the downward force applied to the turret plate 5 is kept constant in relation to the weight of the balance weight 10. Therefore, during processing, the contact pressure between the polishing tool 1 and the lens 2 becomes constant, and the lens 2 can be polished at a constant removal rate. During the measurement by the tracing stylus 4, the contact pressure between the tracing stylus 4 and the lens 2 becomes constant, and the shape of the lens 2 can be measured accurately.
上述したように、バランス錘10は、レンズ２上の加工
点と測定点に作用する圧力を一定に保つためのものであ
るが、加工圧と測定を同じにしてもよく、錘を交換して
加工圧を大きくしてもよい。スライドガイド11はスライ
ド体12をレンズ２の加工点に対し垂直になるように配置
されている。As described above, the balance weight 10 is for keeping the pressure acting on the processing point and the measurement point on the lens 2 constant. However, the processing pressure and the measurement may be the same, and the weight may be replaced. The processing pressure may be increased. The slide guide 11 is arranged so that the slide body 12 is perpendicular to the processing point of the lens 2.
タレット板５に複数の工具が取付けられる場合は、す
べての工具が加工物の同一点を加工するよう配置され
る。If a plurality of tools are mounted on the turret plate 5, all the tools are arranged to machine the same point on the workpiece.
以上説明したように本発明は、１個ないし複数個の工
具及び測定子を、上下方向に移動可能なスライド体に設
けられたタレットに取付け、測定子を工具と同一位値に
移動させてスライド体の位置を測定することにより、加
工と測定が同一装置で可能となる。しかも、スライド体
の上端にはバランス錘が滑車を介して吊り下げられてい
るので、加工中及び測定中の加工物との接触圧を一定に
保つことができる。従って、高精度、高能率の加工がで
きるようになる。また、単一スライド構成の装置となる
ため装置の構造が簡単になって低価格の設備が得られる
という効果がある。As described above, the present invention attaches one or more tools and a tracing stylus to a turret provided on a vertically movable slide, and moves the stylus to the same value as the tool and slides it. By measuring the position of the body, processing and measurement can be performed with the same device. Moreover, since the balance weight is suspended from the upper end of the slide body via the pulley, the contact pressure with the workpiece during processing and measurement can be kept constant. Therefore, high-precision and high-efficiency processing can be performed. In addition, since the apparatus has a single slide structure, the structure of the apparatus is simplified, and there is an effect that low-cost equipment can be obtained.
【図面の簡単な説明】 第１図は本発明の計測研磨装置の一実施例の要部構造
図、第２図は装置全体の斜視図である。 １……研磨工具、２……レンズ、 ３……モータ、４……測定子、 ５……タレット板、6,7……反射鏡、 ８……レーザ光、９……滑車、 9a……ワイヤ、10……バランス錘、 11……スライドガイド、12……スライド体、 13……旋回角度用ロータリーエンコーダ、 14……回転中心、15……タレット回転中心、 16……上下方向測長ユニット、 17……タレット板回転用モータ、 18……加工物旋回用モータ、 19……回転用モータ、20……電気ボックス、 21……レーザ測長器、30……装置本体。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a structural view of a main part of an embodiment of a measuring and polishing apparatus according to the present invention, and FIG. 2 is a perspective view of the entire apparatus. 1 polishing tool, 2 lens, 3 motor, 4 measuring element, 5 turret plate, 6, 7 reflecting mirror, 8 laser beam, 9 pulley, 9a ... Wire, 10 Balance weight, 11 Slide guide, 12 Slide body, 13 Rotary encoder for turning angle, 14 Rotation center, 15 Turret rotation center, 16 Vertical measurement unit , 17: Turret plate rotation motor, 18: Workpiece rotation motor, 19: Rotation motor, 20: Electric box, 21: Laser length measuring device, 30: Device body.
Claims (2)
ランス錘が滑車を介して吊り下げられたスライド体と、 前記スライド体の上下方向の位置を測定する測定手段
と、 前記スライド体に回転自在に設けられ、加工物の被加工
面を加工する工具及び前記スライド体の位置測定時に前
記被加工面に接触される測定子が取付けられたタレット
とを備えたことを特徴とする計測研磨装置。1. A slide body movably provided in a vertical direction and having a balance weight suspended from a top end thereof via a pulley; a measuring means for measuring a vertical position of the slide body; A measurement polisher provided rotatably and having a tool for processing a surface to be processed of a workpiece and a turret to which a measuring element is brought into contact with the surface to be processed when measuring the position of the slide body. apparatus.
特許請求の範囲第１項記載の計測研磨装置。2. A turret, wherein a plurality of tools are provided on the turret.
The measuring and polishing apparatus according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62062584A JP2624248B2 (en) | 1987-03-19 | 1987-03-19 | Measurement polishing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62062584A JP2624248B2 (en) | 1987-03-19 | 1987-03-19 | Measurement polishing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63232960A JPS63232960A (en) | 1988-09-28 |
| JP2624248B2 true JP2624248B2 (en) | 1997-06-25 |
Family
ID=13204515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62062584A Expired - Fee Related JP2624248B2 (en) | 1987-03-19 | 1987-03-19 | Measurement polishing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2624248B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6203644B1 (en) * | 1996-12-06 | 2001-03-20 | Yoshiaki Nagaura | Method and apparatus for manufacture of quartz oscillator |
| JP2009125856A (en) * | 2007-11-22 | 2009-06-11 | Murata Mach Ltd | Machine tool, sensor module, and measuring method |
| JP2009125852A (en) * | 2007-11-22 | 2009-06-11 | Murata Mach Ltd | Machine tool and sensor module |
| US10675689B2 (en) * | 2017-10-31 | 2020-06-09 | Mackay Manufacturing, Inc. | Metal lathe and tooling calibration |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60123259A (en) * | 1983-12-02 | 1985-07-01 | Nippon Kogaku Kk <Nikon> | Lens peripheral edge machining device |
-
1987
- 1987-03-19 JP JP62062584A patent/JP2624248B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63232960A (en) | 1988-09-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |