JP2618201B2 - Method of manufacturing nozzle for solder desoldering machine - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder sucker, and more particularly to an improvement in a solder sucker nozzle installed at a tip of a solder sucker.

[0002]

2. Description of the Related Art For example, solder is generally used for mounting components such as semiconductor elements such as diodes and transistors on a printed circuit board. And when it becomes necessary to replace parts etc. once soldered,
As an apparatus for removing solder, a solder sucker is used.

FIG. 1 shows an example of a solder sucker. This solder sucker is of a hand-held type, and a motor 2 is provided in a grip portion 1 thereof, and a switch 3 for turning on / off the motor is provided on the tip side of the grip portion 1. The motor 2 is connected to a vacuum pump 5 via a power transmission mechanism 4 including a shaft and gears, and the suction port of the vacuum pump 5 is connected to a filter 7 from a base end via a tube 6. The power transmission mechanism 4, the vacuum pump 5, the tube 6, and the filter unit 7 are all housed in a casing 1 a integrally formed with the holding unit 1.

[0004] A cylindrical support cylinder 8 is fixed to the distal end of the filter section 7 so as to protrude from the distal end surface of the casing 1a toward the distal end. Further, a cylindrical heater 9 is fixed in the support tube 8 so as to be coaxial with the support tube 8.

On the other hand, a nozzle 10 for a solder sucker (hereinafter simply referred to as a nozzle) is inserted into the support cylinder 8 from the tip end side of the support cylinder 8. The shape of the nozzle 10 is shown in FIG.
Shown in The nozzle 10 has cylindrical pipes 11, 11
a, a heat receiving portion 12 which also has a cylindrical shape and covers the periphery of the pipe 11 at the distal end side of the pipe 11, and a suction port 13 engaged with the distal end of the pipe 11.

[0006] The pipe 11 and the heat receiving section 12 are coaxial,
Further, the heat receiving section 12 is fixed to the pipe 11 at a distal end thereof by a method such as brazing. On the other hand, the suction port 13
The diameter is gradually reduced toward the distal end side, and has a conical shape as a whole. The nozzle 10 is screwed into the support tube 8 by screwing a screw 13 a screwed on the outer peripheral surface of the base end portion of the suction port 13 and a screw 8 a screwed on the inner peripheral surface of the distal end portion of the support tube 8. , And is detachably supported so as to be coaxial with the support cylinder 8.

Here, in a state where the nozzle 10 is supported in the support cylinder 8, the base end of the pipe 11 is connected to the filter unit 7 via a sealing member 14 provided at the tip end of the filter unit 7. The suction port 13 protrudes from the tip of the support tube 8. The outer diameter of the heat receiving section 12 is slightly smaller than the inner diameter of the heater 9, and as a result, the nozzle 10
Is supported, the outer surface of the heat receiving portion 12 and the inner surface of the heater 9 face each other via a gap S having a predetermined width.

When removing the solder, first, the heater 9 is operated to heat the nozzle 10 through the heat receiving section 12. Next, the solder is brought into contact with the suction port 13, the solder is melted by the heat of the suction port 13, and the switch 2 is pressed to operate the motor 2.

The rotation of the motor 2 is transmitted to the vacuum pump 5 via the power transmission mechanism 4, and as a result, the air in the filter section 7 is sucked into the vacuum pump 5 via the tube 6.
Further, the filter unit 7 is connected to the pipe 11 through the sealing material 14.
, The air on the tip side of the suction port 13 is sucked into the filter unit 7 via the pipe 11 and the sealing material 14. As a result, the molten solder located on the distal end side of the suction port 13 is sucked from the suction port 13 into the filter unit 7, and the solder is removed.

The solder sucked into the filter unit 7 stays in the filter unit 7, and a predetermined amount of solder is removed from the filter unit 7.
It is collected when it is stored inside. If the nozzle 10 becomes dirty or clogged, the screw 13a
The nozzle 10 is pulled out of the support cylinder 8 by unscrewing the screw 10a and the screw 8a, and the nozzle 10 is replaced.

[0011]

However, in the above-mentioned conventional solder sucker, the thickness of the heat receiving portion 12 gradually increases due to repeated heating and cooling of the nozzle 10 accompanying several uses, and finally the heat receiving portion 12 In some cases, the outer surface is press-fitted into the inner surface of the heater 9 to cause seizure between the heat receiving portion 12 and the heater 9, resulting in a problem that the nozzle 10 cannot be removed from the support cylinder 8.

Further, according to the study of the present inventors, the cause was presumed to be as follows. Usually, the surface of the nozzle 10 is plated with iron having a thickness of about 0.2 to 0.3 mm. On the other hand, the material of the heat receiving section 12 main body is brass. However, since the thermal expansion coefficients of iron and brass are different, when the heat receiving section 12 is heated to about 500 ° C. by the heater 9, the heat receiving section 12 expands in diameter, for example, as indicated by the symbol A in FIG. . Here, the diameter of the heat receiving portion 12 is significantly increased at the base end portion.
The reason why the diameter increases in a trumpet shape toward the base end side is that the heat receiving portion 12
Is fixed to the pipe 11 and the diameter thereof is relatively difficult to expand.

The heat-receiving portion 12 whose diameter has been increased returns to its original state with cooling. However, when heating and cooling are repeated about 100 times, the thickness of the heat-receiving portion 12 gradually returns from the position indicated by the symbol A in FIG. Disappears. This is because the brass forming the heat receiving portion 12 main body is firmly adhered to the iron plating layer, and thus, when heated, the brass having a relatively large thermal expansion coefficient is pulled in the direction of extension to the iron plating layer, resulting in the iron plating layer. Due to the tensile stress and the compressive stress generated in the heat receiving portion 12 as a result of being pulled in the contraction direction by iron having a relatively small coefficient of thermal expansion, the heat receiving portion 1
This is because plastic deformation such as increasing the thickness occurs in 2 and gradually accumulates due to repetition of heating and cooling.

The present invention has been made in view of the above circumstances, and includes a heat receiving portion 12 and a heater 9 which are used in connection with the use of a solder sucker.
It is an object of the present invention to easily obtain the nozzle 10 in which the seizure of the nozzle 10 is prevented and the nozzle 10 in the solder sucker can always be replaced.

[0015]

According to the present invention, there is provided a pipe having a cylindrical shape, a heat receiving portion which is also formed in a cylindrical shape, is fixed to the pipe so as to be coaxial with the pipe, and covers a periphery of the pipe; A suction port that is fitted to the end of the pipe, the solder suction device is detachably supported so that the suction port protrudes from the tip of the solder suction device, and the heat receiving unit is heated from the surroundings. The present invention relates to a method for manufacturing a nozzle for a solder sucker for sucking molten solder from the suction port in a state, and more particularly to a method for manufacturing a nozzle for a solder sucker for forming the heat receiving portion with a metal having the same composition.

That is, according to the present invention, in order to form the heat receiving portion from a metal having the same composition, in the manufacture of the nozzle, (1) after applying iron plating to the suction port, the pipe and the heat receiving portion are fixed. (2) After assembling the nozzle, apply iron plating to the nozzle, and further remove only the iron plating applied to the surface of the heat receiving unit. (3) After assembling the nozzle, apply the iron plating to the surface of the heat receiving unit. Either of masking and then iron plating of the nozzle is employed.

[0017]

In the nozzle manufactured by the method of the present invention, since the heat receiving portion is made of a metal having the same composition, there is no iron plating layer on the surface of the heat receiving portion. Therefore, the diameter of the heat receiving portion due to the repeated heating and cooling of the nozzle due to the presence of the iron plating layer is prevented.

[0018]

Embodiments of the present invention will be described below. Since the present invention has a feature in a method for manufacturing a nozzle having a heat receiving portion having a specific structure, the shape of the nozzle is not different from that of the conventional nozzle. Therefore, in the following description, the names and reference numerals of the nozzles and the respective parts of the solder sucker refer to the above-mentioned conventional ones, and the description thereof is omitted.

In the case of the nozzle 10 obtained by the manufacturing method according to the present invention, the pipes 11, 11a, the heat receiving portion 12, and the suction port 13 are made of stainless steel, brass, and copper, respectively. The surfaces of the pipes 11 and 11a and the suction port 13 are plated with iron, but the surface of the heat receiving section 12 is not plated with iron. That is,
The heat receiving section 12 is made of a metal having the same composition .

The nozzle 10 includes a screw 13a and a support cylinder 8
The screw 8a is detachably supported in the support tube 8 by screwing. Then, by heating the heat receiving section 12 by the heater 9 and pressing the switch 3, the molten solder is sucked into the filter section 7 from the suction port 13.

In the nozzle 10, there is no iron plating layer on the surface of the heat receiving portion 12, and the heat receiving portion 12 is made of a metal (brass) having the same composition. Therefore, even when the heat receiving section 12 is heated by the heater 9, the diameter of the heat receiving section 12 due to the difference in the thermal expansion coefficient between iron and brass due to the presence of the iron plating layer is prevented.

Therefore, even if heating and cooling of the nozzle 10 are repeated by using several times, the thickness of the heat receiving portion 12 does not change. Therefore, the outer surface of the expanded heat receiving portion 12 is press-fitted into the inner surface of the heater 9 to cause the heat receiving portion 12 and the heater 9 to seize, and the nozzle 10 does not come off from the support cylinder 8. The tube 8 is supported so as to be able to be always pulled out. That is, by using the nozzle according to the present invention, the nozzle 10 in the solder sucker can be used.
Exchange is always possible.

As a method of manufacturing the nozzle 10 having the above-described configuration, there are various methods shown in the following (1) to (3).

(1) After the suction port 13 is plated with iron,
The heat receiving part 12 is fixed to the pipe 11, and then the pipe 11,
Assemble 11a. (2) After assembling the nozzle 10, the nozzle 10 is subjected to iron plating, and only the iron plating applied to the surface of the heat receiving unit 12 is removed. (3) After assembling the nozzle 10, the surface of the heat receiving section 12 is masked, and then the nozzle 10 is plated with iron. After the completion of the iron plating, the masking is removed.

[0025]

As described above, according to the present invention, the diameter of the heat receiving portion is prevented from increasing due to the repetition of heating and cooling of the nozzle. A nozzle capable of performing the above can be easily obtained.

[Brief description of the drawings]

FIG. 1 is a view showing an example of the structure of a hand-held solder sucker.

FIG. 2 is a view showing an example of a structure of a nozzle for a solder sucker.

[Description of Signs] 1 Gripping part 1a Casing 2 Motor 3 Switch 4 Power transmission mechanism 5 Vacuum pump 6 Tube 7 Filter part 8 Support cylinder 8a, 13a Screw 9 Heater 10 Nozzle (solder suction nozzle) 11, 11a Pipe 12 Heat receiving part 13 suction port 14 sealing material

Claims (3)

(57) [Claims] 1. A pipe having a cylindrical shape, a heat receiving portion which also has a cylindrical shape, is fixed to the pipe so as to be coaxial with the pipe, and covers a periphery of the pipe, and is engaged with a tip of the pipe. A suction port, wherein the solder suction port is detachably supported so that the suction port protrudes from the tip of the solder suction device, and the heat-receiving portion is heated from the surroundings, and the molten solder is removed. In the method for manufacturing a nozzle for a solder sucker that sucks from a suction port, after applying iron plating to the suction port, a heat receiving portion is provided to the pipe.
A method for manufacturing a nozzle for a solder sucker, comprising fixing a nozzle. A pipe forming the 2. A cylindrical, like a cylindrical shape, and a heat receiving portion which is fixed so as to form the pipe and coaxially with the pipe covering the periphery of the pipe, which is engaged with the front end of the pipe A suction port, wherein the solder suction port is detachably supported so that the suction port protrudes from the tip of the solder suction device, and the heat-receiving portion is heated from the surroundings, and the molten solder is removed. A method of manufacturing a nozzle for a solder sucker that sucks from a suction port, wherein after assembling the nozzle, the nozzle is subjected to iron plating, and further, only the iron plating applied to the surface of the heat receiving unit is removed. A method for manufacturing a nozzle for a solder sucker. A pipe forming the 3. A cylindrical, like a cylindrical shape, and a heat receiving portion which is fixed so as to form the pipe and coaxially with the pipe covering the periphery of the pipe, which is engaged with the front end of the pipe A suction port, wherein the solder suction port is detachably supported so that the suction port protrudes from the tip of the solder suction device, and the heat-receiving portion is heated from the surroundings, and the molten solder is removed. A method of manufacturing a nozzle for a solder sucker for suctioning from a suction port, comprising: after assembling the nozzle, performing masking on a surface of the heat receiving portion, and then applying iron plating to the nozzle. .