JPH0228365U - - Google Patents
Info
- Publication number
- JPH0228365U JPH0228365U JP10384488U JP10384488U JPH0228365U JP H0228365 U JPH0228365 U JP H0228365U JP 10384488 U JP10384488 U JP 10384488U JP 10384488 U JP10384488 U JP 10384488U JP H0228365 U JPH0228365 U JP H0228365U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- air passage
- nozzle tip
- melted
- removal device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例の横断面図、第２図
は第１図の―断面図、第３図は第１図の―
断面図、第４図は同上の有底筒状体の拡大図、
第５図〜第７図は有底筒状体の他の具体例を示す
図、第８図Ａは従来の半田除去装置の斜視図、第
８図Ｂはノズルチツプの単体斜視図、第９図は従
来の半田除去装置の他の例を示す斜視図である。
１６…ヒータ、１７…ノズルチツプ、１７ａ…
貫通孔、１９…有底筒状体収納部材、２０…有底
筒状体、２１…キヤツプ部材、２４…シリンダ装
置。
Figure 1 is a cross-sectional view of an embodiment of the present invention, Figure 2 is a cross-sectional view of Figure 1, and Figure 3 is a cross-sectional view of Figure 1.
A sectional view, FIG. 4 is an enlarged view of the bottomed cylindrical body as above,
5 to 7 are views showing other specific examples of the bottomed cylindrical body, FIG. 8A is a perspective view of a conventional solder removal device, FIG. 8B is a perspective view of a nozzle tip, and FIG. 9 FIG. 2 is a perspective view showing another example of a conventional solder removal device. 16... Heater, 17... Nozzle chip, 17a...
Through hole, 19... Bottomed cylindrical body storage member, 20... Bottomed cylindrical body, 21... Cap member, 24... Cylinder device.
Claims (1)
記ノズルチツプ部により溶解された半田を、前記
ノズルチツプ部に形成した貫通孔からポンプ部の
吸引力により空気と共に空気通路に吸い込み、前
記空気通路に設けた半田除去手段により前記溶解
半田を分離除去する半田除去装置において、前記
半田除去手段を前記ノズルチツプ部付近の空気通
路に設けると共に、有底筒状体をその底部を下流
側に向けて前記空気通路に遊挿しかつ前記空気通
路から取り出し自在にしてなることを特徴とする
半田除去装置。 The solder melted by the nozzle tip is heated by a heating means, and the solder melted by the nozzle tip is sucked into the air passage along with air by the suction force of the pump part through the through hole formed in the nozzle tip, and the solder provided in the air passage is removed. In the solder removal device for separating and removing the melted solder by a means, the solder removing means is provided in the air passage near the nozzle tip, and a bottomed cylindrical body is loosely inserted into the air passage with its bottom facing downstream. A solder removal device characterized in that it can be freely taken out from the air passage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10384488U JPH0228365U (en) | 1988-08-05 | 1988-08-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10384488U JPH0228365U (en) | 1988-08-05 | 1988-08-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0228365U true JPH0228365U (en) | 1990-02-23 |
Family
ID=31335034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10384488U Pending JPH0228365U (en) | 1988-08-05 | 1988-08-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0228365U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0655262A (en) * | 1990-06-14 | 1994-03-01 | William S Fortune | Station for module type soldering and for removing solder |
| JPH081321A (en) * | 1994-06-10 | 1996-01-09 | Taiyo Denki Sangyo Kk | Nozzle for solder suction tool and manufacture thereof |
| JPH08201950A (en) * | 1995-01-23 | 1996-08-09 | Fuji Photo Film Co Ltd | Silver halide photographic sensitive material |
| JP2005288547A (en) * | 2004-03-31 | 2005-10-20 | Hakko Kk | Solder removing tool |
-
1988
- 1988-08-05 JP JP10384488U patent/JPH0228365U/ja active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0655262A (en) * | 1990-06-14 | 1994-03-01 | William S Fortune | Station for module type soldering and for removing solder |
| JPH081321A (en) * | 1994-06-10 | 1996-01-09 | Taiyo Denki Sangyo Kk | Nozzle for solder suction tool and manufacture thereof |
| JPH08201950A (en) * | 1995-01-23 | 1996-08-09 | Fuji Photo Film Co Ltd | Silver halide photographic sensitive material |
| JP2005288547A (en) * | 2004-03-31 | 2005-10-20 | Hakko Kk | Solder removing tool |
| JP2005288545A (en) * | 2004-03-31 | 2005-10-20 | Hakko Kk | Solder handling tool |
| JP4579748B2 (en) * | 2004-03-31 | 2010-11-10 | 白光株式会社 | Desoldering equipment |
| JP4598585B2 (en) * | 2004-03-31 | 2010-12-15 | 白光株式会社 | Desoldering equipment |