JP2613336B2 - Method for forming aramid substrate printed circuit board - Google Patents
Method for forming aramid substrate printed circuit boardInfo
- Publication number
- JP2613336B2 JP2613336B2 JP3335571A JP33557191A JP2613336B2 JP 2613336 B2 JP2613336 B2 JP 2613336B2 JP 3335571 A JP3335571 A JP 3335571A JP 33557191 A JP33557191 A JP 33557191A JP 2613336 B2 JP2613336 B2 JP 2613336B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- resin
- processing
- aramid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Laser Beam Processing (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、アラミド基材プリント
回路板の形成方法に関し、さらに詳しくはアラミド繊維
で補強した樹脂板を基板とする回路板の加工方法に関す
る。The present invention relates to a method for forming an aramid substrate printed circuit board, and more particularly to a method for processing a circuit board using a resin board reinforced with aramid fiber as a substrate.
【0002】[0002]
【従来の技術】従来、プリント回路の形成方法として
は、ドリル、ルーターなど、機械加工で穴明け、ザグリ
加工(凹部を形成すること)、外形加工などを行ってお
り、その方法はアラミド基材回路板にも適用されてき
た。しかし、最近になって、回路板が高密度化するにと
もない、ドリル径が小さくなり、微細な外形加工やザグ
リ加工が必要なことなど、従来の機械加工では対応でき
ない面が出てきた。2. Description of the Related Art Conventionally, as a method of forming a printed circuit, a drill, a router, or the like is used for drilling, counterboring (forming a concave portion), or outer shape processing by a mechanical process. It has also been applied to circuit boards. However, recently, with the increase in the density of the circuit board, the diameter of the drill has become smaller, and a surface that cannot be dealt with by conventional machining, such as the necessity of fine outer shape processing and counterboring processing, has appeared.
【0003】このような背景から、プリント回路板にレ
ーザー加工を応用する技術が開発され、炭酸ガスレーザ
ー、YAGレーザー、エキシマレーザーなどがプリント
回路板の穴明け、外形加工に適用されてきた。プリント
回路板へのレーザーの応用については『電子材料』19
91年10月号、120〜125ページ(工業調査会発
行)などにくわしく記載されている。[0003] Against this background, techniques for applying laser processing to printed circuit boards have been developed, and carbon dioxide lasers, YAG lasers, excimer lasers, and the like have been applied to drilling and external processing of printed circuit boards. For the application of lasers to printed circuit boards, see "Electronic Materials" 19
It is described in detail in the October 1991 issue, pages 120 to 125 (issued by the Industrial Research Council).
【0004】しかしながら、レーザー加工は通常のガラ
ス/エポキシ積層板に適用したとき、炭酸ガスレーザ
ー、YAGレーザーでは穴の内壁や切断面が荒れてきれ
いな面が得られなく、またエキシマレーザーを適用した
ときはエポキシ樹脂は、分解、飛散するがガラス繊維が
巣状に残存して完全な穴明けや切断などが困難である。However, when laser processing is applied to a normal glass / epoxy laminate, the inner wall or cut surface of the hole is roughened with a carbon dioxide gas laser or a YAG laser, so that a clean surface cannot be obtained, and when an excimer laser is applied. Epoxy resins are decomposed and scattered, but glass fibers remain in nests, making it difficult to completely drill or cut.
【0005】有機材料は一般にエキシマレーザーによる
加工が可能で、前述の『電子材料』記事中にはポリイミ
ドフィルムへの応用が紹介されている。アラミド繊維基
材の積層板(アラミド繊維からなる織物や紙にエポキ
シ、ポリイミドなどの樹脂を含浸、積層したもの)もエ
キシマレーザーにより加工が可能であるが、その加工面
(穴の内壁や切断面など)は溶融、炭化、分解などのた
め表面が荒れた状態になる(図1)。このためその後の
めっきなどの配線工程やアセンブリ工程で問題を起こ
し、例えば十分なスルーホール信頼性を維持できない、
などの問題があった。An organic material can be generally processed by an excimer laser, and its application to a polyimide film is introduced in the above-mentioned article "Electronic Materials". Laminates made of aramid fiber base material (woven or paper made of aramid fibers impregnated with resin such as epoxy or polyimide) can also be processed by excimer laser, but the processed surface (the inner wall of the hole or the cut surface) ) Is roughened due to melting, carbonization, decomposition, etc. (FIG. 1). For this reason, a problem occurs in a wiring process and an assembly process such as subsequent plating, and for example, sufficient through-hole reliability cannot be maintained.
There was such a problem.
【0006】したがって、レーザーにより簡単に加工で
き、かつその加工面が清浄かつ滑らかにできる加工方法
が所望されていた。[0006] Therefore, there has been a demand for a processing method which can be easily processed by a laser and has a clean and smooth processing surface.
【0007】[0007]
【発明の目的】本発明の目的は、レーザーにより簡単に
加工でき、かつプリント回路板として十分使用できる清
浄かつ滑らかな加工方法を提供し、低コストで信頼性の
高いプリント回路板を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a clean and smooth processing method which can be easily processed by a laser and can be sufficiently used as a printed circuit board, and to provide a low-cost and highly reliable printed circuit board. It is in.
【0008】[0008]
【発明の構成】すなわち、本発明はエキシマレーザーで
加工後、加熱した過マンガン酸カリ水溶液中で処理する
ことを特徴とするアラミド基材プリント回路板の形成方
法である。That is, the present invention is a method for forming an aramid substrate printed circuit board, which comprises processing with an excimer laser and then treating in a heated aqueous solution of potassium permanganate.
【0009】本発明において、アラミド(芳香族ポリア
ミド)とは、下記式で表わされる反復単位(I)式およ
び/または(II)式からなるものである。In the present invention, aramid (aromatic polyamide) is composed of a repeating unit represented by the following formula (I) and / or (II).
【0010】[0010]
【化1】 Embedded image
【0011】[0011]
【化2】 上記式中、Ar1 ,Ar2 ,Ar3 は置換された、もし
くは置換されない芳香環であって、下記の基から選ばれ
る。Embedded image In the above formula, Ar 1 , Ar 2 , and Ar 3 are substituted or unsubstituted aromatic rings, and are selected from the following groups.
【0012】[0012]
【化3】 ただし、Xは下記の2価の基などである。Embedded image However, X is the following divalent group.
【0013】[0013]
【化4】 Embedded image
【0014】Ar1 ,Ar2 ,Ar3 の芳香環への置換
基として炭素原子数1〜3のアルキル基,ハロゲン原
子,フェニル基などがある。上記反復単位(I)式の芳
香族ポリアミドのうちAr1 の15〜30モル%がThe substituents on the aromatic ring of Ar 1 , Ar 2 and Ar 3 include an alkyl group having 1 to 3 carbon atoms, a halogen atom and a phenyl group. In the aromatic polyamide of the repeating unit (I), 15 to 30 mol% of Ar 1 is
【0015】[0015]
【化5】 および/またはEmbedded image And / or
【0016】[0016]
【化6】 であり、残りがEmbedded image And the rest are
【0017】[0017]
【化7】 および/またはEmbedded image And / or
【0018】[0018]
【化8】 および/またはEmbedded image And / or
【0019】[0019]
【化9】 Embedded image
【0020】である直線あるいは平行軸結合の芳香族残
基(ただし芳香族環に直接結合している水素原子の一部
がハロゲン原子、メチル基、メトキシ基で置換されてい
てもよい)で構成される共重合物を十分に延伸して高度
に分子配向させた高モジュラス全芳香族ポリアミド共重
合体繊維がとくに良好である。A linear or parallel axis-bonded aromatic residue (however, a part of the hydrogen atom directly bonded to the aromatic ring may be substituted with a halogen atom, a methyl group or a methoxy group) A high modulus wholly aromatic polyamide copolymer fiber obtained by sufficiently stretching the copolymer to be oriented highly and highly is particularly preferable.
【0021】本発明の芳香族ポリアミド繊維の単糸繊維
は0.1〜10デニール、好ましくは0.3〜5デニー
ルである。0.1デニール未満では製糸技術上困難な点
が多い(断糸,毛羽の発生など)。一方、10デニール
を越えると機械的物性の点で実用的でなくなる。The single yarn fiber of the aromatic polyamide fiber of the present invention is 0.1 to 10 denier, preferably 0.3 to 5 denier. If the denier is less than 0.1 denier, there are many difficulties in the yarn-making technology (such as breakage and generation of fluff). On the other hand, if it exceeds 10 denier, it becomes impractical in terms of mechanical properties.
【0022】芳香族ポリアミド繊維は種々の形態をとる
ことができる。例えば、織物、長繊維不織布、短繊維不
織布、紙などのシート形態としての基材であってもよ
く、また単にエポキシ樹脂中に分散されてなる短繊維形
態としての基材であってもよい。不織布や紙などの形態
において芳香族ポリアミド繊維は短繊維あるいはフィブ
リル状パルプのいずれの形態でもよくまたこれらの任意
の組合せからなる混合物であってもよい。The aromatic polyamide fiber can take various forms. For example, it may be a base material in the form of a sheet such as a woven fabric, a long-fiber nonwoven fabric, a short-fiber nonwoven fabric, or paper, or may be a base material in the form of a short fiber simply dispersed in an epoxy resin. In the form of nonwoven fabric or paper, the aromatic polyamide fibers may be in the form of either short fibers or fibril-like pulp, or may be a mixture of any combination thereof.
【0023】短繊維の場合、繊維長は1〜60mmが好ま
しく、さらには2〜50mmが好ましい。繊維長が1mm未
満の場合、得られる不織布や紙の機械的物性が低下す
る。また繊維長が60mmを越えると得られる不織布や紙
中における短繊維の分布状態が不良となりやはり機械的
物性が低下する。短繊維を機械的剪断力によりフィブリ
ル化させたパルプは製糸困難な繊度の短繊維まで得るこ
とができ、とくに紙では短繊維の分布状態をより向上さ
せ地合を改良することができる。総じてエポキシ樹脂の
含浸性が良好で均一な地合、性能の得られる形態は紙で
ある。In the case of short fibers, the fiber length is preferably from 1 to 60 mm, more preferably from 2 to 50 mm. When the fiber length is less than 1 mm, the mechanical properties of the obtained nonwoven fabric or paper are reduced. On the other hand, if the fiber length exceeds 60 mm, the distribution of short fibers in the obtained nonwoven fabric or paper becomes poor, and the mechanical properties are also lowered. Pulp in which short fibers are fibrillated by mechanical shearing force can be obtained to short fibers having a fineness that is difficult to produce, and particularly in paper, the distribution of short fibers can be further improved to improve the formation. In general, paper is a form in which the epoxy resin has good impregnation and uniform formation and performance can be obtained.
【0024】本発明において、積層板の含浸樹脂は、熱
または/および光で硬化する樹脂(硬化型樹脂)または
熱可塑性樹脂である。熱で硬化する樹脂では、加熱によ
り化学反応が起こり、分子量の増大や橋架けを行うこと
ができる樹脂または化合物あるいはこれらの組成物をい
う。加熱によってひき起こされる反応はラジカル反応、
イオン反応、付加反応、縮合反応、置換反応、水素引き
抜き反応、酸化反応などがある。In the present invention, the impregnated resin of the laminate is a resin (curable resin) or a thermoplastic resin which is cured by heat and / or light. In the case of a resin that is cured by heat, a resin or a compound or a composition thereof capable of increasing the molecular weight or cross-linking by a chemical reaction caused by heating. The reaction caused by heating is a radical reaction,
Examples include an ionic reaction, an addition reaction, a condensation reaction, a substitution reaction, a hydrogen abstraction reaction, and an oxidation reaction.
【0025】具体的には樹脂あるいは化合物あるいはこ
れらの組成物として例示すれば、フェノール樹脂、フラ
ン樹脂、キシレン樹脂、ホルムアルデヒド/ケトン樹
脂、尿素樹脂、メラミン樹脂、アニリン樹脂、スルホン
アミド樹脂、エポキシ樹脂、ポリイミド樹脂、トリアリ
ルシアヌレート樹脂、ジアリルフタレート系樹脂、ポリ
ブタジエン樹脂、ビスマレイミド系樹脂およびこれらの
混合物、たとえばエポキシ樹脂/アクリルニトリル−ブ
タジエン共重合組成物、エポキシ樹脂/ポリアミド樹
脂、エポキシ樹脂/ポリイミド樹脂、フェノール樹脂/
ポリビニルブチラール樹脂を挙げることができる。この
中で、エポキシ樹脂、ポリイミド樹脂はもっとも汎用的
に用いられ、加工性も良好なためとくに好適に用いられ
る。Specific examples of the resin, compound or composition thereof include phenol resin, furan resin, xylene resin, formaldehyde / ketone resin, urea resin, melamine resin, aniline resin, sulfonamide resin, epoxy resin, Polyimide resin, triallyl cyanurate resin, diallyl phthalate resin, polybutadiene resin, bismaleimide resin and mixtures thereof, for example, epoxy resin / acrylonitrile-butadiene copolymer composition, epoxy resin / polyamide resin, epoxy resin / polyimide resin , Phenolic resin /
A polyvinyl butyral resin can be used. Of these, epoxy resins and polyimide resins are most commonly used, and are particularly preferably used because of good workability.
【0026】なお、基材および樹脂には、本発明の趣旨
を阻害しない範囲でシリカ、アルミナ、酸化チタンなど
の無機充填物を含むことができる。The base material and the resin may contain an inorganic filler such as silica, alumina, and titanium oxide within a range not to impair the purpose of the present invention.
【0027】このようにして得られたアラミド積層板
は、通常のサブトラクティブ法で回路板の形成を行って
もよく、またはアディティブ法や回路転写法(金属板な
どに予め回路を形成し、プリプレグを圧着して回路を転
写する方法)などで回路板を形成してもよい。The aramid laminate thus obtained may be formed into a circuit board by a conventional subtractive method, or may be formed by an additive method or a circuit transfer method (a circuit is previously formed on a metal plate or the like, and a prepreg is formed). The circuit board may be formed by, for example, a method of transferring a circuit by pressing.
【0028】いずれの方法であっても、穴明け、ザグリ
加工、切断のため、従来の機械加工に代わってエキシマ
レーザーが用いられる。これらの加工の順序は回路形成
の前でもよく、また回路形成法によっては後で行うこと
もできる。通常のサブトラクティブ法では、穴明けは回
路形成の前に行うのが通常である。In any method, an excimer laser is used for drilling, counterboring, and cutting instead of conventional machining. These processing steps may be performed before the circuit formation, or may be performed later depending on the circuit formation method. In the ordinary subtractive method, drilling is usually performed before forming a circuit.
【0029】エキシマレーザーの発振源としてはAr
F、KrF、XeClなどが用いられ、またマスク法と
してはマスクイメージ法、コンタクトマスク法、コンフ
ォーマルマスク法などを用いることができる。The oscillation source of the excimer laser is Ar
F, KrF, XeCl, or the like is used, and as a mask method, a mask image method, a contact mask method, a conformal mask method, or the like can be used.
【0030】エキシマレーザーの加工条件、すなわちエ
ネルギー密度、照射時間、スキャニングの速度などは、
加工対象の厚み、樹脂の種類などにより適宜選択され
る。The processing conditions of the excimer laser, that is, energy density, irradiation time, scanning speed, etc.
It is appropriately selected according to the thickness of the processing target, the type of the resin, and the like.
【0031】エキシマレーザーによる穴明け、ザグリ、
切断などの加工のあと、これらの加工面を清浄化し、平
滑な面を形成するため、過マンガン酸カリによるエッチ
ングを行う。Drilling with an excimer laser, counterbore,
After processing such as cutting, these processed surfaces are cleaned and etched with potassium permanganate in order to form a smooth surface.
【0032】該エッチングにおいて、アラミド基材積層
板は、加熱した過マンガン酸カリ水溶液中で処理され
る。過マンガン酸カリの濃度は20g/l以上が好まし
く、30g/l以上がさらに好ましい。処理温度は60
℃以上が好ましく、80℃以上がさらに好ましい。In the etching, the aramid substrate laminate is treated in a heated potassium permanganate aqueous solution. The concentration of potassium permanganate is preferably at least 20 g / l, more preferably at least 30 g / l. Processing temperature is 60
C. or higher, more preferably 80.degree. C. or higher.
【0033】アラミド基材プリント回路板の他の形成方
法として、過マンガン酸カリで処理するに先立ち、予め
溶剤を含むアルカリ性水溶液で処理する。処理溶剤とし
てはグリコールエーテル、n―メチルピロリドン、ジメ
チルスルフォオキシド、ジメチルフォルムアミドの群よ
り選ばれた少なくとも1種類の溶剤が好ましい。さら
に、過マンガン酸カリで処理後、酸水溶液で中和するこ
とが好ましい。As another method for forming an aramid-based printed circuit board, prior to treatment with potassium permanganate, treatment is performed with an alkaline aqueous solution containing a solvent in advance. As the treatment solvent, at least one solvent selected from the group consisting of glycol ether, n-methylpyrrolidone, dimethylsulfoxide, and dimethylformamide is preferable. Furthermore, it is preferable to neutralize with an aqueous acid solution after treating with potassium permanganate.
【0034】[0034]
【発明の効果】本発明によるプリント回路板の形成方法
は、低コストで回路基板に穴明け、ザグリ、切断加工な
どを施すことができ、これにより高密度で優れた信頼性
をもつ回路板を製造することができる。とくに多数のス
ルーホールやバイアホールをもつ高密度回路板、微小な
部品を搭載するための微小ザグリ、回路が回路板の周辺
にまで及ぶ高密度回路の周囲の切断などに用いることが
できる。According to the method for forming a printed circuit board according to the present invention, a circuit board having a high density and excellent reliability can be formed at a low cost by punching, counterboring, cutting and the like on the circuit board. Can be manufactured. In particular, it can be used for a high-density circuit board having a large number of through holes and via holes, a minute counterbore for mounting minute components, and cutting around a high-density circuit in which a circuit extends to the periphery of the circuit board.
【0035】とくに低膨脹かつマイグレーションを起こ
しにくいアラミド繊維基材銅張積層板の加工性、信頼性
を一層向上させることができる。In particular, the workability and reliability of the aramid fiber-based copper-clad laminate having low expansion and hardly causing migration can be further improved.
【0036】[0036]
【実施例】高純度のテレフタル酸クロライド100モル
%、パラフェニレンジアミン50モル%、3,4′−ジ
アミノジフェニルエーテル50モル%を共重合させてな
る全芳香族ポリエーテルアミド(ポリパラフェニレン
3,4′−ジアミノジフェニルエーテルテレフタルアミ
ド)を湿式紡糸し、さらに製糸条件の変更により平衡水
分率、含有ナトリウム、抽出ナトリウム、抽出塩素量を
低減させた単糸繊度が1.5デニールの繊維を作成し
た。得られた全芳香族ポリエーテルアミド繊維を3mm長
にカットしこれを水に分散させ秤量55g/m2 の紙を
抄紙した。バインダとしては、水分散型エポキシ樹脂組
成物を用い、抄紙後スプレー法により添加、乾燥した。
バインダ付着量は約5重量%であった。該紙状物を表面
温度190℃の金属ロールを有する一対の金属ロールカ
レンダを用いて200kg/cm、5m/分の条件で熱圧加
工を行った。EXAMPLE A wholly aromatic polyetheramide (polyparaphenylene 3,4) prepared by copolymerizing 100 mol% of high-purity terephthalic acid chloride, 50 mol% of paraphenylenediamine, and 50 mol% of 3,4'-diaminodiphenyl ether. '-Diaminodiphenyl ether terephthalamide) was wet-spun and a fiber having a denier of 1.5 denier was prepared by changing the spinning conditions to reduce the equilibrium moisture content, the amount of sodium contained, the amount of extracted sodium, and the amount of extracted chlorine. The obtained wholly aromatic polyetheramide fiber was cut into a length of 3 mm, which was dispersed in water to make a paper weighing 55 g / m 2 . A water-dispersed epoxy resin composition was used as a binder, added by a spray method after papermaking, and dried.
The amount of the binder attached was about 5% by weight. The paper was hot-pressed at 200 kg / cm and 5 m / min using a pair of metal roll calenders having a metal roll having a surface temperature of 190 ° C.
【0037】次に、ビスフェノールAとホルムアルデヒ
ドとの重縮合物のグリシジルエーテル化物(エポキシ当
量208)80重量部、ビスフェノールA型エポキシ樹
脂(エポキシ当量187)20重量部およびテトラブロ
モビスフェノールA30重量部をジメチルイミダゾール
0.03重量部の存在下で反応させてエポキシ当量34
2、ブロム含有量23重量%のエポキシ樹脂a−1を得
た。Next, 80 parts by weight of a glycidyl etherified product of a polycondensate of bisphenol A and formaldehyde (epoxy equivalent 208), 20 parts by weight of a bisphenol A type epoxy resin (epoxy equivalent 187) and 30 parts by weight of tetrabromobisphenol A The reaction was carried out in the presence of 0.03 parts by weight of imidazole to give an epoxy equivalent of 34.
2. An epoxy resin a-1 having a bromine content of 23% by weight was obtained.
【0038】次にビスフェノールAとホルムアルデヒド
との重縮合物である硬化剤b−1を得た。Next, a curing agent b-1 which is a polycondensate of bisphenol A and formaldehyde was obtained.
【0039】エポキシ樹脂a―1を56重量部、ブロム
化ビスフェノールA型エポキシ樹脂(エポキシ当量47
0,ブロム含有量48部重量%)を29重量部、硬化剤
b−1を24重量部配合しこれに2−エチル−4−メチ
ルイミダゾール0.04重量部からなるエポキシ樹脂組
成物にメチルエチルケトン/エチレングリコールモノメ
チルエーテル混合溶剤(混合重量比1/1)を加えて不
揮発分60重量%、ブロム含有量22.5重量%(固形
分対比)のワニスを調整した。56 parts by weight of the epoxy resin a-1 was added to a brominated bisphenol A type epoxy resin (epoxy equivalent: 47).
29 parts by weight), and 24 parts by weight of the curing agent b-1. To the epoxy resin composition consisting of 0.04 parts by weight of 2-ethyl-4-methylimidazole was added methyl ethyl ketone / A mixed solvent of ethylene glycol monomethyl ether (mixing ratio by weight: 1/1) was added to prepare a varnish having a nonvolatile content of 60% by weight and a bromo content of 22.5% by weight (relative to the solid content).
【0040】上述の紙状物に該ワニスを含浸させ、10
0℃で3分間乾燥しエポキシ樹脂組成物固形分含有量が
70重量%のプリプレグを得た。次に厚み35μmの電
解銅箔2枚と該プリプレグ5枚を積層しホットプレスに
て170℃,40kg/cm2 の条件で1時間プレスを行い
銅張積層板を作成した。該積層板中のエポキシ樹脂の組
成物の体積比率は約60%,樹脂層の厚みは0.5mmで
あった。樹脂層の温度膨張係数をTMA(熱力学分析
機)で測定すると、6ppm/℃であった。The varnish is impregnated into the above-mentioned paper-like material, and
After drying at 0 ° C. for 3 minutes, a prepreg having an epoxy resin composition solid content of 70% by weight was obtained. Next, two 35 μm-thick electrolytic copper foils and five prepregs were laminated and pressed with a hot press at 170 ° C. and 40 kg / cm 2 for 1 hour to prepare a copper-clad laminate. The volume ratio of the epoxy resin composition in the laminate was about 60%, and the thickness of the resin layer was 0.5 mm. When the coefficient of thermal expansion of the resin layer was measured by TMA (thermodynamic analyzer), it was 6 ppm / ° C.
【0041】このようにして得られた積層板(図3A)
に感光性レジストを両面にコーティングした(図3B)
のち、片面のみ紫外線で露光後アルカリで現像して径
0.1mmのオープニング(レジストをコーティングして
いない部分(図3C)を1000個もつ基板(幅4.5
cm、長さ10cm))を得た。裏面はレジストを全面にコ
ーティングしたまま、表面から塩化第2銅をスプレーし
てオープニング部分に露出している銅箔をエッチングし
た(図3D)。表面のレジストはアルカリで全面剥離
し、裏面はそのまま残した。The laminate thus obtained (FIG. 3A)
Coated with photosensitive resist on both sides (Fig. 3B)
After that, only one side is exposed to ultraviolet rays and then developed with an alkali to develop an opening having a diameter of 0.1 mm (a substrate having a resist-coated portion (FIG. 3C) having 1,000 pieces (width 4.5).
cm, length 10 cm)). While the resist was coated on the entire back surface, cupric chloride was sprayed from the front surface to etch the copper foil exposed at the opening (FIG. 3D). The resist on the front surface was completely peeled off with alkali, and the back surface was left as it was.
【0042】このようにして得られた銅箔のオープニン
グ部分をもつ積層板の表面に、KrFのエキシマレーザ
ー(波長248nm、エネルギー密度1.6J/cm2 )
を幅約100μm、長さ5cmにレンズで絞ったのち10
cm/分の速度でスキャニングした。エキシマレーザーは
アブレージョンを起こし、銅箔のオープニング部分の樹
脂層はエッチングされた(図3E)が、その壁面は溶融
物が表面を覆い、炭化物が付着していた。A KrF excimer laser (wavelength: 248 nm, energy density: 1.6 J / cm 2 ) was applied to the surface of the laminate having the opening portion of the copper foil thus obtained.
Is squeezed with a lens to a width of about 100 μm and a length of 5 cm.
Scanning was performed at a speed of cm / min. The excimer laser caused abrasion, and the resin layer in the opening portion of the copper foil was etched (FIG. 3E), but the wall surface was covered with the molten material, and the carbide was adhered.
【0043】さらに裏面の銅箔をエッチングするため、
表面の銅箔に再度エッチングレジストをコーティングし
た後、表面に塩化第2鉄を噴射し、レーザーで穴明けさ
れた部分の銅箔をエッチングした(図3F)のち、両面
のレジストをアルカリで剥離した(図3G)。Further, in order to etch the copper foil on the back surface,
After coating the etching resist on the copper foil on the surface again, ferric chloride was sprayed on the surface to etch the copper foil in the portion perforated with a laser (FIG. 3F), and then the resist on both surfaces was peeled off with alkali. (FIG. 3G).
【0044】さらに、次に示す条件で穴の内壁を処理し
た。 [前処理] 処理剤 脱イオン水 80容量% ジエチレングリコール 10容量% カセイソーダ (水溶液のpHが1.0になるまで添加) 処理条件 70℃,5分Further, the inner wall of the hole was treated under the following conditions. [Pretreatment] Treatment agent Deionized water 80% by volume Diethylene glycol 10% by volume Caustic soda (added until the pH of the aqueous solution becomes 1.0) Treatment conditions 70 ° C, 5 minutes
【0045】 [過マンガン酸カリ処理] 処理剤 脱イオン水 過マンガン酸カリ 50g/l 処理条件 70℃,5分間[Potassium permanganate treatment] Treatment agent Deionized water Potassium permanganate 50 g / l Treatment conditions 70 ° C, 5 minutes
【0046】 [中和] 処理剤 脱イオン水 濃硫酸 (水溶液のpHが1.0以下になるまで添加) 処理条件 45℃,3分間[Neutralization] Treatment agent Deionized water Concentrated sulfuric acid (added until the pH of the aqueous solution becomes 1.0 or less) Treatment conditions 45 ° C., 3 minutes
【0047】得られた穴の内壁は、溶融物も炭化物もき
れいにエッチングされ、繊維と樹脂が明確に分離されて
いた。この状況を図1(処理前)と図2(処理後)に示
す。さらに、得られた穴あき板に通常のめっき工程を通
して厚み約20μmのめっきをつけ(図3H)、エッチ
ングによりスルーホール信頼性のための回路を形成した
のち熱衝撃試験にかけた。試験法はMIL―P―551
10法(−65℃、15分間と150℃、15分間)に
従った。断線に至る熱衝撃回数は1500回であった。On the inner wall of the obtained hole, both the melt and the carbide were etched cleanly, and the fiber and the resin were clearly separated. This situation is shown in FIG. 1 (before processing) and FIG. 2 (after processing). Further, the obtained perforated plate was plated through an ordinary plating process to a thickness of about 20 μm (FIG. 3H), and a circuit for through-hole reliability was formed by etching, and then subjected to a thermal shock test. The test method was MIL-P-551.
Ten methods (-65 ° C, 15 minutes and 150 ° C, 15 minutes) were followed. The number of thermal shocks leading to disconnection was 1500 times.
【図1】エキシマレーザーで穴明けされ、加熱した過マ
ンガン酸カリ水溶液で処理する前のアラミド基材プリン
ト回路板の側断面図FIG. 1 is a side cross-sectional view of an aramid-based printed circuit board drilled with an excimer laser and before being treated with a heated aqueous potassium permanganate solution.
【図2】エキシマレーザーで穴明けされ、加熱した過マ
ンガン酸カリ水溶液で処理した後のアラミド基材プリン
ト回路板の側断面図FIG. 2 is a cross-sectional side view of an aramid-based printed circuit board after being treated with a heated potassium permanganate aqueous solution drilled with an excimer laser.
【図3】本発明の方法でアラミド基材プリント回路板を
形成する際の各段階における概略図(側断面図)FIG. 3 is a schematic view (side sectional view) at each stage when an aramid-based printed circuit board is formed by the method of the present invention.
1 基板 2 銅箔 3 レジスト A 銅張アラミド基材プリント回路板概略図 B レジストをコーティングしたのち現像したプリント
回路板概略図 C 銅箔をエッチングしたプリント回路板概略図 D レーザー加工後のプリント回路板概略図 E 樹脂層をエッチングしたプリント回路板概略図 F エッチングレジストを再度表面にコーティングし、
裏面の銅箔をエッチングしたプリント回路板概略図 G レジストを剥離したプリント回路板概略図 H 加熱した過マンガン酸カリ水溶液で処理したのちス
ルーホールめっきを施したプリント回路板概略図DESCRIPTION OF SYMBOLS 1 Substrate 2 Copper foil 3 Resist A Schematic diagram of copper-clad aramid substrate printed circuit board B Schematic diagram of printed circuit board developed after coating with resist C Schematic diagram of printed circuit board etched with copper foil D Printed circuit board after laser processing Schematic diagram E Schematic diagram of printed circuit board with resin layer etched F Coating etching resist on the surface again,
Schematic diagram of printed circuit board with copper foil etched on the back side G Schematic diagram of printed circuit board with resist stripped H Schematic diagram of printed circuit board with through-hole plating after treatment with heated potassium permanganate aqueous solution
Claims (3)
ンガン酸カリ水溶液中で処理することを特徴とするアラ
ミド基材プリント回路板の形成方法。1. A method for forming an aramid substrate printed circuit board, comprising: processing with an excimer laser, followed by treatment in a heated aqueous solution of potassium permanganate.
グリ加工したのち加熱した過マンガン酸カリ水溶液中で
処理することを特徴とするアラミド基材プリント回路板
の形成方法。2. A method for forming an aramid-based printed circuit board, comprising: drilling, cutting or counterboring with an excimer laser and treating in a heated potassium permanganate aqueous solution.
ルカリ性水溶液で処理したのち加熱した過マンガン酸カ
リ水溶液中で処理することを特徴とするアラミド基材プ
リント回路板の形成方法。3. A method for forming an aramid substrate printed circuit board, comprising: processing with an excimer laser, treating with an alkaline aqueous solution containing a solvent, and then treating in a heated aqueous solution of potassium permanganate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3335571A JP2613336B2 (en) | 1991-11-26 | 1991-11-26 | Method for forming aramid substrate printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3335571A JP2613336B2 (en) | 1991-11-26 | 1991-11-26 | Method for forming aramid substrate printed circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH05160568A JPH05160568A (en) | 1993-06-25 |
JP2613336B2 true JP2613336B2 (en) | 1997-05-28 |
Family
ID=18290075
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3335571A Expired - Fee Related JP2613336B2 (en) | 1991-11-26 | 1991-11-26 | Method for forming aramid substrate printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2613336B2 (en) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3638630A1 (en) * | 1986-11-11 | 1988-05-26 | Schering Ag | METHOD FOR REMOVING RESIN POLLUTION IN DRILL HOLES FROM CIRCUIT BOARDS |
JPH0354885A (en) * | 1989-07-24 | 1991-03-08 | Canon Inc | Forming method for hole in printed board |
-
1991
- 1991-11-26 JP JP3335571A patent/JP2613336B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH05160568A (en) | 1993-06-25 |
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